Wafer drying equipment and system for wafer drying

Abstract

The invention discloses wafer drying equipment and a system used for wafer drying, the wafer drying equipment comprises a drying static pressure cavity and a drying tunnel structure, the drying tunnel structure comprises a drying tunnel formed by two boiling wallboards with strip-shaped air inlets and two corresponding tunnel clamping plates, and the boiling wallboards are provided with strip-shaped air inlets. The drying static pressure cavity is divided into an upper air cavity and a lower air cavity by the air blocking transverse partition plate in the drying tunnel structure, so that the dry airflow entering the first air cavity above is refracted, reflected and mixed to form a positive pressure static pressure cavity, and the positive pressure dry airflow can overflow into the drying tunnel through the strip-shaped air inlets in the drying tunnel; according to the utility model, the wafer and the clamping arm in the drying tunnel are dried, and the negative pressure laminar flow of the second air cavity below is extracted, so that the surface of the wafer and the surface of the clamping arm can be subjected to negative pressure laminar flow drying, and therefore, in the wafer production process, the wafer and the clamping arm can be further rapidly dried, and the wafer production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to wafer drying equipment and a system for wafer drying. Background Art

[0002] With the development of science and technology, semiconductor products have received more and more attention, and the degree of automation in semiconductor product manufacturing has also become higher and higher. Semiconductor wafers refer to the substrate silicon wafers used in the production of silicon semiconductor integrated circuits. Because of their round shape, they are called wafers. In semiconductor manufacturing, wafer manufacturing is one of the core links, and its quality directly determines the performance and reliability of the final product.

[0003] In the production process of wafers, there is a process that requires wafers to be unloaded into a pure water environment for cleaning, and the cleaned wafers need to be dried before the subsequent manufacturing process can be carried out. Therefore, after the wafers are cleaned, rapid drying becomes an indispensable quality control method. At present, after taking the wafers out of the unloading water tank, they are generally left to dry naturally, or manually blown dry with a nitrogen gun. However, the long waiting time for drying results in low production efficiency, and it is easily affected by human factors, including: traces of touch residues on the wafers caused by manual operation and possible damage to the wafers, etc., which leads to instability and uncertainty in the drying effect of the wafers. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a wafer drying device and a system for wafer drying. The technical problem to be solved by the present invention is achieved through the following technical solutions: A first aspect of an embodiment of the present invention provides a wafer drying device, comprising: a drying static pressure chamber and a drying tunnel structure, wherein: The drying tunnel structure is located in the drying static pressure chamber, and the wind-blocking diaphragm of the drying tunnel structure divides the drying static pressure chamber into two upper and lower wind chambers; two parallel boiling wall panels with strip air inlets are vertically inserted into the wind-blocking diaphragm, and form a drying tunnel with two tunnel plywoods; The upper opening of the drying tunnel is located in the first air cavity at the upper part of the drying plenum chamber and is seamlessly connected to the material inlet of the upper cover plate of the drying plenum chamber. The lower opening is located in the second air cavity at the lower part of the drying plenum chamber, so that the clamping arm clamping the wafer passes through the material inlet and is located in the drying tunnel. The drying tunnel divides the first air cavity into two left and right chambers, and the strip air inlets correspond to the left and right chambers respectively. After the dry air flow beam entering the first air cavity is refracted, reflected, and mixed, a positive pressure static pressure cavity is formed, so that the positive pressure dry air flow overflows through the strip air inlet into the drying tunnel to dry the wafers and clamping arms in the drying tunnel; The exhaust mechanism located below the drying static pressure chamber is configured to extract the gas in the second air chamber through negative pressure laminar flow and dry the wafer and the surface of the clamping arm through negative pressure laminar flow.

[0005] A second aspect of an embodiment of the present invention provides a system for wafer drying, comprising: the above-mentioned wafer drying device, an air intake device and an air exhaust device, wherein: An air inlet device is connected to a first air chamber of a drying static pressure chamber in a wafer drying device, and is configured to input a dry airflow into the first air chamber when in a startup state, wherein the dry airflow overflows through the strip air inlet of the boiling wall panel into a drying tunnel of the wafer drying device to dry the wafers and the clamping arms in the drying tunnel; The exhaust device is connected to the exhaust mechanism below the drying static pressure chamber in the wafer drying device, is in a normally open state, and is configured to extract the airflow flowing through the drying tunnel structure and the second air chamber of the drying static pressure chamber.

[0006] Beneficial effects of the present invention: The wafer drying equipment includes: a drying static pressure chamber and a drying tunnel structure, wherein the drying tunnel structure includes a drying tunnel, and the drying static pressure chamber is divided into two upper and lower wind chambers, so that the dry airflow entering the upper first wind chamber can overflow into the drying tunnel through the strip air inlet on the drying tunnel, so as to dry the wafers and clamping arms in the drying tunnel, and the negative pressure laminar flow of the lower second wind chamber is extracted, so that the surface of the wafer and the clamping arm can be dried by negative pressure laminar flow, so that the wafer and the clamping arm can be quickly dried during the wafer production process, thereby improving the wafer production efficiency, reducing the influence of human factors on the wafer, and improving the stability and certainty of the wafer drying effect.

[0007] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the written description and the accompanying drawings.

[0008] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic structural diagram of a wafer drying device provided by an embodiment of the present invention; Figure 2 A schematic diagram of the structure of a drying static pressure chamber provided by an embodiment of the present invention; Figure 3 A schematic structural diagram of a drying tunnel structure provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of an air knife bracket provided in an embodiment of the present invention; Figure 5 A schematic diagram of the direction of a drying airflow in a wafer drying device provided by an embodiment of the present invention; Figure 6 A schematic diagram of the architecture of a system for wafer drying provided by an embodiment of the present invention.

[0010] In the attached drawings: 1, drying static pressure chamber; 101, upper mounting plate; 102, side vertical plate; 103, end vertical plate; 104, bottom groove plate; 105, negative pressure chamber bottom plate; 106, negative pressure chamber side vertical plate; 107, wind knife support plate; 108, positive pressure partition support plate; 109, side laminar flow cover plate; 110, bottom laminar flow cover plate; 111, exhaust connecting plate; 112, exhaust straight pipe; 113, exhaust elbow; 114, union joint; 2. Low-pressure air knife; 201. Air knife; 202. Clean joint; 3. Air knife bracket; 301. Bracket bottom plate; 302. Air knife shaft; 303. Air knife support plate; 304. Shaft pressure plate; 4. Drying tunnel structure; 401. Boiling wall panel; 402. Tunnel plywood; 403. Tunnel middle cover; 404. Wind-blocking diaphragm; 6. Wafer clamping arm; 601. Detection clamping arm; 602. Clamping arm; 603. Receiving sensor bracket; 604. Receiving sensor cover; 608. Clamping finger; 5. Negative pressure regulating valve; 7. Start-stop shooting sensor; 8. Wafer; 9. Upper cover; 10. Start-stop solenoid valve; 11. Air control valve; 12. PFA connector; 13. Flow regulating valve. DETAILED DESCRIPTION

[0011] The present invention is further described in detail below with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0012] With the development of science and technology, the degree of automation in the manufacture of semiconductor products is getting higher and higher. During the production process of wafers, the wafers need to be placed in a circular wet process environment. After the wafers are pulled up from the circular wet process environment, the wafers need to be dried before the subsequent manufacturing process can be carried out. In an embodiment of the present invention, the wafer drying equipment includes: a drying static pressure chamber and a drying tunnel structure, wherein the drying tunnel structure includes a drying tunnel, and the drying static pressure chamber is divided into two upper and lower wind chambers, so that after the dry air flow beam entering the upper first wind chamber is refracted, reflected, and mixed to form two positive pressure static pressure chambers inside the chamber, the positive pressure dry air flow can overflow into the drying tunnel through the strip air inlet on the drying tunnel, and the wafers and clamping arms in the drying tunnel are dried, and the negative pressure laminar flow of the lower second wind chamber is extracted, so that the surface of the wafer and the clamping arm can be dried by negative pressure laminar flow, so that the wafer and the clamping arm can be quickly dried during the production process of the wafer, the production efficiency of the wafer can be improved, the influence of human factors on the wafer can be reduced, and the stability and certainty of the effect of wafer drying can be improved. In addition, the wafer drying equipment also includes: an air knife mechanism, which can cut the dry airflow entering the first air chamber to generate a high-speed airflow, which is cut and blown into the drying tunnel through the strip air inlet on the boiling wall panel, and repeatedly reflected and scattered in the tunnel. The wind curtain formed stimulates the boiling of water vapor on the surface of the arms and wafers in the drying tunnel to stimulate atomization and gasification. In addition, the drying tunnel can extract the atomized water vapor by negative pressure laminar flow, and at the same time perform negative pressure laminar flow drying on the arms and wafer surfaces, further accelerating the efficiency of wafer drying. Furthermore, the drying static pressure chamber can also include a side laminar cover plate and a bottom laminar cover plate with air-guiding holes, as well as a two-stage static pressure exhaust structure formed by an outer plate, thereby stabilizing the negative pressure environment, improving the efficiency of gas extraction, and further improving the efficiency and stability of wafer drying.

[0013] A first aspect of an embodiment of the present invention provides a wafer drying device, such as Figure 1 , Figure 2 , Figure 3 As shown, the wafer drying equipment includes: a drying static pressure chamber 1 and a drying tunnel structure 4, wherein the drying tunnel structure 4 is located in the drying static pressure chamber 1, and the wind-blocking baffle 404 of the drying tunnel structure 4 divides the drying static pressure chamber 1 into two upper and lower wind chambers; two parallel boiling wall panels 401 carrying strip air inlets are vertically inserted into the wind-blocking baffle 404, and form a drying tunnel with two tunnel cover plates 403.

[0014] The upper opening of the drying tunnel is located in the first air cavity at the top of the drying static pressure chamber 1, and is seamlessly connected to the material inlet of the upper cover plate 9 of the drying static pressure chamber 1. The lower opening is located in the second air cavity at the bottom of the drying static pressure chamber 1, so that the clamping arm 6 clamping the wafer 8 passes through the material inlet and is located in the drying tunnel.

[0015] The boiling wall panel 401 divides the first air cavity into two left and right chambers, and the strip air inlets correspond to the left and right chambers respectively, so that the dry airflow entering the first air cavity overflows into the drying tunnel through the strip air inlets, thereby drying the wafers 8 and the clamping arms 6 in the drying tunnel; the exhaust mechanism located below the drying static pressure chamber 1 is configured to extract the gas in the second air cavity through negative pressure laminar flow, and dry the surfaces of the wafers 8 and the clamping arms 6 by negative pressure laminar flow.

[0016] like Figure 3 As shown, in the drying tunnel structure 4, two boiling wall panels 401 with strip-shaped air inlets and corresponding two tunnel clamps 402 can enclose a hollow drying tunnel, and the drying tunnel is vertically inserted into the wind-blocking baffle 404. Of course, the drying tunnel structure 4 can also include a tunnel cover 403, so that the clamping arm can enter the drying tunnel after clamping the wafer, or the clamping arm can clamp the wafer and take it out of the drying tunnel.

[0017] like Figure 1 and Figure 2 As shown, the drying static pressure chamber 1 includes: an upper mounting plate 101, a side vertical plate 102, an end vertical plate 103, a bottom groove plate 104, and an upper cover plate 9, etc., so as to form a box shape, and the wind blocking diaphragm 404 in the drying tunnel structure 4 can divide the box-shaped drying static pressure chamber 1 into two upper and lower air chambers, namely, the upper first air chamber and the lower second air chamber. The upper cover plate 9 has a material inlet, the size of which can match the upper opening of the drying tunnel in the drying tunnel structure 4, that is, the upper opening of the drying tunnel is seamlessly connected to the material inlet of the upper cover plate 9, and the lower opening is located in the second air chamber and is still some distance away from the bottom groove plate 104 of the drying static pressure chamber 1.

[0018] The drying tunnel divides the first air cavity into two left and right chambers, and the strip-shaped air inlets in the boiling wall panel 401 correspond to the left and right chambers respectively. The airflow used for wafer drying, that is, the dry airflow can be a positive pressure airflow, which enters the left and right chambers respectively, and after being filled with dry gas, forms two positive pressure static pressure chambers inside the chambers through refraction, reflection, and mixing of the dry airflow beam, that is, the first air cavity can be a positive pressure static pressure chamber, so that the positive pressure dry airflow can overflow from the strip-shaped air inlet into the drying tunnel. In this way, when there are wafers and their corresponding clamping arms in the drying tunnel, the positive pressure dry airflow can dry the wafers and their corresponding clamping arms on both sides, which speeds up the drying of the wafers and improves the efficiency of wafer generation.

[0019] In addition, the drying static pressure chamber 1 also includes an exhaust mechanism, which is connected to the exhaust device through the exhaust mechanism. In this way, when the exhaust device is working, the gas in the second air chamber can be extracted through negative pressure laminar flow, which speeds up the air flow speed, thereby further speeding up the wafer drying speed, and can also make the wafer and the clamping arm surface dry with negative pressure laminar flow. Figure 1and Figure 2 As shown, the exhaust connecting plate 111, the exhaust straight pipe 112 and the exhaust elbow 113 are connected to the bottom groove plate 104, and there is also a union joint 114 connecting the exhaust elbow 113 and the exhaust device. In this way, the exhaust device is connected to the union joint 114. When the exhaust device is working, the second wind chamber in the drying static pressure chamber 1 can be a negative pressure static pressure chamber, and the atomized water vapor is extracted through the lower opening of the drying tunnel, and the dry airflow in the drying tunnel is extracted at the same time, so as to perform negative pressure laminar flow drying on the arm and the wafer surface.

[0020] Since there is a material inlet on the upper cover plate, in order to keep the wafer drying equipment in a clean state, in the disclosed embodiment of the present invention, the exhaust device can be kept in a normally open state, and the wafer drying equipment is always in a negative pressure extraction state. In order to reduce energy consumption, the exhaust device can be maintained at a relatively low flow rate. In order to take into account both drying efficiency and energy consumption, in some embodiments, the wafer drying equipment may also include: a negative pressure regulating valve, which can be respectively connected to the exhaust mechanism and the exhaust device of the wafer drying equipment. In this way, when there are wafers and their corresponding clamping arms in the drying tunnel of the wafer drying equipment, the negative pressure regulating valve can increase the exhaust flow of the exhaust device, and if there are no wafers and their corresponding clamping arms in the drying tunnel of the wafer drying equipment, the negative pressure regulating valve can reduce the exhaust flow of the exhaust device, that is, the negative pressure regulating valve connected to the exhaust mechanism is configured to adjust the flow rate of gas extracted from the wafer drying equipment. Figure 1 As shown, the negative pressure regulating valve 5 is connected to the exhaust mechanism by a control joint 114, and the flow rate of the gas extracted from the wafer drying equipment can be adjusted manually or automatically.

[0021] The air knife is an instrument used for cleaning, air drying and drying precision devices. In some embodiments, the wafer drying equipment may also include an air knife mechanism and an air knife bracket. The air knife mechanism and the air knife bracket are both located in the first air chamber. Figure 4 and Figure 5 As shown, the wind knife mechanism 2 includes: a wind knife 201 and a corresponding clean joint 202, and the wind knife bracket 3 includes: a bracket bottom plate 301, a wind knife rotating shaft 302, a wind knife support plate 303, a rotating shaft pressure plate 304, etc. In this way, the wind knife mechanism 2 is installed on the wind knife bracket 3 located above the wind blocking diaphragm 404, and the wind knives (201) in the wind knife mechanism 2 are symmetrically located in the left and right chambers respectively, and the dry airflow entering the first air cavity through the clean joint 202 on each wind knife 201 is cut and blown into the drying tunnel through the strip air inlet on the boiling wall plate 401. Among them, the wind knife rotating shaft (302) can be configured to drive the corresponding wind knife 201 to rotate, so that the blade of the wind knife 201 matches the position of the strip air inlet on the boiling wall plate 401.

[0022] like Figure 5As shown, by adjusting the wind knife shaft 302, the air outlet of the wind knife 201 can be tilted toward the boiling wall panel 401. After the length direction of the strip air inlet corresponds to the wafer, the dry airflow enters the wafer drying equipment through the clean joint 202. The first wind chamber, the wind knife mechanism 2, the wind knife bracket 3, and the drying tunnel structure 4 form a positive pressure static pressure chamber. The wind knife 202 of the positive pressure static pressure chamber scatters the airflow and sputters around the jet outlet of the positive pressure static pressure chamber. The internal reflection mixed flow forms a positive pressure static pressure environment. The overflow outlet of the positive pressure static pressure chamber overflows the static pressure airflow to the outside. In the positive pressure static pressure chamber, the wind knife drying air curtain is shielded by the static pressure positive pressure compression and is not scattered. Through the overflow outlet, the dry laminar wind shears and sweeps the drying tunnel space. At this time, the clamping arm clamping the wafer is located in the drying tunnel, and the drying air curtains on both sides stimulate the boiling of water vapor on the surface of the arm 6 and the wafer 8 to stimulate atomization and gasification separation. In addition, due to the operation of the exhaust equipment, the negative pressure laminar flow in the drying tunnel extracts the atomized water vapor, and at the same time, the negative pressure laminar flow on the arm and the wafer surface is dried. That is, in the wafer production process, the wafer and the clamping arm are dried quickly, which improves the wafer production efficiency, reduces the influence of human factors on the wafer, and improves the stability and certainty of the wafer drying effect.

[0023] Of course, the drying gas generally used in industry may be nitrogen, but the embodiments of the present invention are not limited thereto, and other gases applicable to drying may also be applied here.

[0024] like Figure 2 and Figure 5 As shown, the drying static pressure chamber 1 also includes: two side laminar flow covers 109 and a bottom flow cover 110 located in the second air cavity, wherein the bottom flow cover 110 is located below the lower opening of the drying tunnel and is parallel to the wind-blocking baffle 404, and the side laminar flow covers 109 are respectively located on both sides of the drying tunnel and vertically connect the bottom flow cover 110 and the wind-blocking baffle 404; the side laminar flow covers 109 and the bottom flow cover 110 are distributed with air-guiding holes, so that the gas extracted from the negative pressure laminar flow in the drying tunnel structure 4 passes through the two-stage static pressure exhaust structure formed by the side laminar flow cover 109, the bottom flow cover 110, and the outer plate of the drying static pressure chamber 1, and is extracted after passing through the exhaust mechanism.

[0025] There are air-guiding holes on the side laminar flow cover plate 109 and the bottom flow cover plate 110. Of course, the bottom slot plate 104 also has air-guiding holes. In this way, the wind extracted from the drying tunnel structure can be divided into three paths, namely two side paths and one middle path. After entering the space formed by the bottom flow cover plate 110 and the bottom slot plate 104, it is extracted through the exhaust mechanism. In this way, the second air cavity and the space formed by the bottom flow cover plate 110 and the bottom slot plate 104 form a two-stage static pressure exhaust structure. The two-stage static pressure exhaust structure stabilizes the negative pressure static pressure environment of the second air cavity. Therefore, the negative pressure laminar flow corresponding to the lower opening of the drying tunnel can stabilize the negative pressure laminar flow drying of the wafer 8 and the surface of the clamping arm 6, further improving the wafer drying efficiency and effect.

[0026] To improve the automation and intelligence of wafer drying equipment, such as Figure 1 , Figure 5 As shown, in some embodiments, the wafer drying device further includes: a start-stop shooting sensor 7 located on the upper cover plate 9 of the drying static pressure chamber 1, which is configured to detect whether the clamping arm 6 holding the wafer 8 is located in the drying tunnel. That is, the transmitting end of the start-stop shooting sensor 7 emits light. If the receiving end receives the light, it can be determined that the clamping arm 6 holding the wafer 8 is not located in the drying tunnel, and the wafer drying device does not need to dry the wafer, and only needs to keep the device clean. If the receiving end does not receive the light, it can be determined that the clamping arm 6 holding the wafer 8 is located in the drying tunnel, and a dry airflow can be input into the wafer drying device to dry the corresponding wafer. Therefore, the start-stop shooting sensor 7 is configured to generate a start command when it is determined that the clamping arm 8 holding the wafer 8 is located in the drying tunnel, and generate a stop command when it is determined that the clamping arm 8 holding the wafer 8 is not located in the drying tunnel.

[0027] It can be seen that the above-mentioned wafer drying device can cooperate with the air inlet device and the air exhaust device to achieve the drying of the wafer. Therefore, the first aspect of the embodiment of the present invention provides a system for wafer drying, including: an air inlet device, an air exhaust device and the above-mentioned wafer drying device.

[0028] The air inlet device is connected to the first air chamber of the drying static pressure chamber 1 in the wafer drying equipment, and is configured to input dry airflow into the first air chamber when in the startup state, wherein the dry airflow overflows through the strip air inlet of the boiling wall panel 401 into the drying tunnel of the wafer drying equipment, thereby drying the wafers 8 and the clamping arms 6 in the drying tunnel.

[0029] The exhaust device is connected to the exhaust mechanism below the drying static pressure chamber 1 in the wafer drying equipment, is in a normally open state, and is configured to extract the airflow flowing through the drying tunnel structure 4 and the second air chamber of the drying static pressure chamber 1.

[0030] In some embodiments, Figure 6 As shown, the air intake device includes: a flow regulating valve 13 connected to a semiconductor nitrogen source, an air control valve 11 connected to the flow regulating valve 13, and a start-stop solenoid valve 10, wherein the air control valve 11 is connected to the first air chamber of the drying static pressure chamber 1 in the wafer drying equipment, and is connected or disconnected with the semiconductor nitrogen source in a normally open state through the flow regulating valve 13 under the control of the start-stop solenoid valve 10.

[0031] The start solenoid valve 10 can be controlled manually. For example, when it is determined that the clamping arm 6 holding the wafer 8 is located in the drying tunnel of the drying tunnel structure 4, the start solenoid valve 10 can be manually controlled to generate a start signal to open the gas control valve 11, so that the dry gas generated by the semiconductor nitrogen source can enter the dry static pressure chamber 1 in the wafer drying equipment to dry the wafer 8 and the clamping arm 6. Of course, if it is determined that the clamping arm 6 holding the wafer 8 is not located in the drying tunnel of the drying tunnel structure 4, the start solenoid valve 10 can be manually controlled to generate a stop signal, and then the gas control valve 11 is closed, so that the dry gas generated by the semiconductor nitrogen source cannot enter the dry static pressure chamber 1 in the wafer drying equipment, saving energy.

[0032] Of course, since the wafer drying equipment can be configured with a start-stop beam sensor 7, in some embodiments, the start-stop solenoid valve 10 can be connected to the start-stop beam sensor 7 in the wafer drying equipment, and is configured to control the air control valve 11 to be connected to the normally open semiconductor nitrogen source through the flow regulating valve 13 when receiving a start command sent by the start-stop beam sensor 7, wherein the start command is sent by the start-stop beam sensor 7 when it determines that the clamping arm 6 clamping the wafer 8 is located in the drying tunnel.

[0033] In this way, the start-stop shooting sensor 7 detects whether the clamping arm 6 holding the wafer 8 is located in the drying tunnel. When it is determined that the clamping arm 8 holding the wafer 8 is located in the drying tunnel, the start-stop shooting sensor 7 generates a start command, so that the start solenoid valve 10 can open the gas control valve 11, and the dry gas generated by the semiconductor nitrogen source can enter the dry static pressure chamber 1 in the wafer drying equipment to dry the wafer 8 and the clamping arm 6. Of course, when it is determined that the clamping arm 8 holding the wafer 8 is not located in the drying tunnel, the start-stop shooting sensor 7 generates a stop command, and the start solenoid valve 10 can close the gas control valve 11, so that the dry gas generated by the semiconductor nitrogen source cannot enter the dry static pressure chamber 1 in the wafer drying equipment, saving energy.

[0034] Similarly, the negative pressure regulating valve 5 in the wafer drying equipment can be controlled manually or automatically. If it is determined that the clamping arm 6 holding the wafer 8 is located in the drying tunnel of the drying tunnel structure 4, the negative pressure regulating valve 5 can be manually adjusted to put the valve in the first gear. At this time, the gas flow rate can be increased, that is, the flow rate corresponding to the first gear is larger, which can speed up the drying speed of the wafer. When it is determined that the clamping arm 6 holding the wafer 8 is not located in the drying tunnel of the drying tunnel structure 4, the negative pressure regulating valve 5 can be manually adjusted to put the valve in the second gear. At this time, it is only necessary to keep the wafer drying equipment clean, that is, the flow rate corresponding to the second gear is smaller, which can further save resources and energy consumption.

[0035] In some embodiments, the negative pressure regulating valve 5 is connected to the start-stop shooting sensor 7 in the wafer drying equipment, and is configured to place the valve in the first gear when receiving a start command sent by the start-stop shooting sensor 7, and to place the valve in the second gear when receiving a stop command sent by the start-stop shooting sensor 7, wherein the flow rate corresponding to the first gear is greater than the flow rate corresponding to the second gear, and the start command is sent by the start-stop shooting sensor 7 when it determines that the clamping arm 6 clamping the wafer 8 is located in the drying tunnel, and the stop command is sent by the start-stop shooting sensor 7 when it determines that the clamping arm 6 clamping the wafer 8 is not located in the drying tunnel.

[0036] If it is determined that the clamping arm 6 holding the wafer 8 is located in the drying tunnel of the drying tunnel structure 4, the start-stop shooting sensor 7 generates a start command, so that the negative pressure regulating valve 5 can automatically put the valve in the first gear according to the start command. If it is determined that the clamping arm 6 holding the wafer 8 is not located in the drying tunnel of the drying tunnel structure 4, the start-stop shooting sensor 7 generates a stop command, so that the negative pressure regulating valve 5 can automatically put the valve in the second gear according to the stop command. The automation of valve adjustment is realized, the automation of the wafer drying system is further improved, and the drying efficiency and energy saving are also taken into account.

[0037] It can be seen that in the embodiment of the present invention, the wafer drying device includes: a drying static pressure chamber and a drying tunnel structure, wherein the drying tunnel structure includes a drying tunnel, and the drying static pressure chamber is divided into two upper and lower air chambers, so that the air inlet device used in the wafer drying system can automatically input dry airflow to the drying static pressure chamber or cut off the input dry airflow according to the presence or absence of wafers in the drying tunnel, and the flow rate of the exhaust airflow corresponding to the exhaust device can also be automatically switched according to the presence or absence of wafers in the drying tunnel, thereby improving the automation and intelligence of the wafer drying system. At the same time, when there are wafers in the drying tunnel, the dry airflow entering the drying static pressure chamber can overflow into the drying tunnel through the strip air inlet on the drying tunnel, and the wafers and clamping arms in the drying tunnel are dried, and the negative pressure laminar flow of the second air chamber below is extracted, so that the surface of the wafer and the clamping arm can be dried by negative pressure laminar flow, so that the wafer and the clamping arm can be quickly dried during the wafer production process, thereby improving the wafer production efficiency, reducing the influence of human factors on the wafer, and improving the stability and certainty of the wafer drying effect. When there are no wafers in the drying tunnel, the drying airflow entering the drying static pressure chamber is cut off, and a small flow of negative pressure laminar extraction is used to keep the wafer drying equipment clean and dry, and maintain a working readiness state, thereby saving resources while ensuring wafer production efficiency.

[0038] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0039] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0040] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0041] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A wafer drying device, characterized in that: include: A drying static pressure chamber (1) and a drying tunnel structure (4), wherein: The drying tunnel structure (4) is located in the drying static pressure chamber (1), and the wind blocking diaphragm (404) of the drying tunnel structure (4) divides the drying static pressure chamber (1) into two upper and lower wind chambers; two parallel boiling wall panels (401) with strip-shaped air inlets are vertically inserted into the wind blocking diaphragm (404) and form a drying tunnel together with two tunnel clamping plates (402); The upper opening of the drying tunnel is located in a first air cavity located at the top of the drying plenum chamber (1) and is seamlessly connected to a material inlet of an upper cover plate (9) of the drying plenum chamber (1); the lower opening is located in a second air cavity located at the bottom of the drying plenum chamber (1), so that a clamping arm (6) clamping a wafer (8) passes through the material inlet and is located in the drying tunnel; The drying tunnel divides the first air cavity into two left and right chambers, and the strip-shaped air inlets correspond to the left and right chambers respectively. After the dry air flow beam entering the first air cavity is refracted, reflected, and mixed, a positive pressure static pressure cavity is formed, so that the positive pressure dry air flow overflows through the strip-shaped air inlet into the drying tunnel, thereby drying the wafers (8) and the clamping arms (6) in the drying tunnel; The exhaust mechanism located below the drying static pressure chamber (1) is configured to extract the gas in the second air chamber through negative pressure laminar flow, and to dry the surface of the wafer (8) and the clamping arm (6) through negative pressure laminar flow.

2. The wafer drying device according to claim 1, characterized in that: Also includes: The wind knife mechanism (2) and the wind knife support (3) are provided, wherein: The wind knife mechanism (2) is mounted on a wind knife bracket (3) located above the wind-blocking diaphragm (404), and the wind knives (201) in the wind knife mechanism (2) are symmetrically located in the left and right chambers, respectively, to cut the dry airflow entering the first air cavity through the clean joint (202) on each wind knife (201) and then cut and blown into the drying tunnel through the strip-shaped air inlet on the boiling wall panel (401).

3. The wafer drying device according to claim 2, characterized in that: The wind knife support (3) comprises: a wind knife rotating shaft (302) configured to drive the corresponding wind knife (201) to rotate, so that the blade of the wind knife (201) matches the position of the strip-shaped air inlet on the boiling wall panel (401).

4. The wafer drying device according to claim 1, characterized in that: The drying static pressure chamber (1) further comprises: two side laminar flow cover plates (109) and a bottom laminar flow cover plate (110) located in the second air chamber, wherein: The bottom flow cover plate (110) is located below the lower opening of the drying tunnel and is parallel to the wind blocking transverse partition (404); the side laminar flow cover plates (109) are respectively located on both sides of the drying tunnel and vertically connect the bottom flow cover plate (110) and the wind blocking transverse partition (404); The side laminar flow cover plate (109) and the bottom flow cover plate (110) are both provided with holes for guiding air, so that the gas extracted from the negative pressure laminar flow in the drying tunnel structure (4) passes through the two-stage static pressure exhaust structure formed between the side laminar flow cover plate (109), the bottom flow cover plate (110), and the outer plate of the drying static pressure chamber (1), and then is extracted after passing through the exhaust mechanism.

5. The wafer drying device according to claim 1, characterized in that: Also includes: The negative pressure regulating valve (5) connected to the exhaust mechanism is configured to adjust the flow rate of gas extracted from the wafer drying equipment.

6. The wafer drying device according to claim 1, characterized in that: It also includes: a start-stop matching sensor (7) located on an upper cover plate (9) of the drying static pressure chamber (1), configured to generate a start command when it is determined that the clamping arm (6) clamping the wafer (8) is located in the drying tunnel, and to generate a stop command when it is determined that the clamping arm (6) clamping the wafer (8) is not located in the drying tunnel.

7. A system for wafer drying, characterized in that: include: The wafer drying device, air intake device and air exhaust device according to any one of claims 1 to 6, wherein: An air inlet device connected to a first air chamber of a drying static pressure chamber (1) in a wafer drying device, and configured to input a dry air flow into the first air chamber when in a startup state, wherein the dry air flow overflows through the strip-shaped air inlet of the boiling wall panel (401) into a drying tunnel of the wafer drying device, thereby drying the wafers (8) and the clamping arms (6) in the drying tunnel; The exhaust device is connected to the exhaust mechanism below the drying static pressure chamber (1) in the wafer drying device, is in a normally open state, and is configured to extract the airflow that flows through the drying tunnel structure (4) and the second air chamber of the drying static pressure chamber (1).

8. The system according to claim 7, characterized in that The air inlet device comprises: a flow regulating valve (13) connected to a semiconductor nitrogen source, an air control valve (11) connected to the flow regulating valve (13), and a start-stop solenoid valve (10), wherein: The air control valve (11) is connected to the first air chamber of the drying static pressure chamber (1) in the wafer drying equipment, and is connected to or disconnected from the normally open semiconductor nitrogen source through the flow regulating valve (13) under the control of the start-stop solenoid valve (10).

9. The system according to claim 8, characterized in that The start-stop solenoid valve (10) is connected to a start-stop opposing beam sensor (7) in the wafer drying equipment and is configured to control the air control valve (11) to communicate with a normally open semiconductor nitrogen source through a flow regulating valve (13) when receiving a start command sent by the start-stop opposing beam sensor (7), wherein the start command is sent when the start-stop opposing beam sensor (7) determines that a clamping arm (6) clamping a wafer (8) is located in a drying tunnel.

10. The system according to claim 7, characterized in that The negative pressure regulating valve (5) is connected to the start-stop opposing beam sensor (7) in the wafer drying equipment, and is configured to place the valve in a first gear position when receiving a start command sent by the start-stop opposing beam sensor (7), and to place the valve in a second gear position when receiving a stop command sent by the start-stop opposing beam sensor (7), wherein the flow rate corresponding to the first gear position is greater than the flow rate corresponding to the second gear position, the start command is sent when the start-stop opposing beam sensor (7) determines that the clamping arm (6) clamping the wafer (8) is located in the drying tunnel, and the stop command is sent when the start-stop opposing beam sensor (7) determines that the clamping arm (6) clamping the wafer (8) is not located in the drying tunnel.

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