Temperature sensor, temperature measuring device, system and method

Abstract

The invention relates to the technical field of temperature detection, and provides a temperature sensor, a temperature measuring device, a temperature measuring system and a temperature measuring method, the temperature sensor comprises a packaging structure, a thermopile assembly, an MCU element and a signal output assembly, and the packaging structure is provided with an accommodating space; the thermopile assembly is packaged in the accommodating space; the MCU element is packaged in the accommodating space, and the input end of the MCU element is electrically connected with the output end of the thermopile assembly; and the signal output assembly is packaged in the accommodating space, and the input end of the signal output assembly is electrically connected with the output end of the MCU. When the temperature sensor measures the temperature of an object to be measured, the thermopile assembly converts a temperature signal into an electric signal and transmits the electric signal to the MCU element, a temperature threshold value can be preset in the MCU element, and when the temperature is higher than or equal to the current temperature threshold value, the MCU element outputs a control signal with a certain frequency through the signal output assembly. Corresponding control elements do not need to be additionally arranged, and the timeliness of temperature decision making is greatly enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of temperature detection, and in particular to a temperature sensor, a temperature measuring device, a temperature measuring system, and a temperature measuring method. Background Art

[0002] A temperature sensor is a device used to measure temperature and convert temperature changes into electrical signals for further processing. For example, it can detect ambient temperature or body temperature, and transmit the temperature information to a control system, instrument or other equipment through an electrical signal (such as voltage, current or data signal).

[0003] However, the temperature sensor in the related art only converts the corresponding temperature signal into an electrical signal, which needs to be processed and analyzed by the control terminal. This makes it difficult to use the temperature sensor independently and greatly weakens the timeliness of temperature decision-making. Summary of the invention

[0004] The purpose of the present invention is to provide a temperature sensor, a temperature measuring device and a temperature measuring system, aiming to solve the problem that the existing temperature sensors lack the ability of self-determination.

[0005] To achieve the above object, the technical solution adopted by the present invention is: In a first aspect, an embodiment of the present application provides a temperature sensor, including: A packaging structure, wherein the packaging structure has a containing space; A thermopile assembly, wherein the thermopile assembly is packaged in the accommodating space; An MCU component, wherein the MCU component is packaged in the accommodating space, and an input end of the MCU component is electrically connected to an output end of the thermopile assembly; and A signal output component is packaged in the accommodating space, and an input end of the signal output component is electrically connected to an output end of the MCU.

[0006] Beneficial effects of the present invention: The temperature sensor provided by the present invention adds an MCU and a signal output component inside. When the temperature sensor measures the temperature of the object to be measured, the thermopile component converts the temperature signal into an electrical signal and transmits it to the MCU component. A temperature threshold can be preset in the MCU component. When the temperature is higher than or equal to the current temperature threshold, the MCU component outputs a control signal of a certain frequency through the signal output component. Then, the peripheral device can perform corresponding actions according to the control signal without adding corresponding control components, which greatly enhances the timeliness of temperature decision-making.

[0007] In some embodiments, the temperature sensor further includes a thermistor, which is packaged in the accommodating space and electrically connected to the MCU component.

[0008] In some embodiments, the temperature sensor further includes a filter component, the filter component is encapsulated in the accommodating space, an input end of the filter component is electrically connected to the thermopile component, and an output end of the filter component is electrically connected to an input end of the MCU element.

[0009] In some embodiments, the temperature sensor further includes a PCB board, the PCB board is packaged in the accommodating space, the thermistor is disposed on the PCB board, and the MCU element is electrically connected to the thermistor through the PCB board.

[0010] In some embodiments, the temperature sensor further includes a PCB board, the PCB board is packaged in the accommodating space, the filter component is disposed on the PCB board, and the MCU element is electrically connected to the filter component through the PCB board.

[0011] In some embodiments, the signal output component includes a wireless communication component; and / or, The signal output assembly includes a wired communication element.

[0012] In some embodiments, the wireless communication component includes a wireless communication element and an antenna electrically connected to the wireless communication element, and the wireless communication element is electrically connected to the MCU element.

[0013] In some embodiments, the packaging structure includes a base and a packaging cover which is arranged on the base and encloses the base to form a accommodating space, the base is provided with a power conductive part, one end of the power conductive part is electrically connected to the MCU component, and the other end of the power conductive part is electrically connected to the external power supply.

[0014] In some embodiments, the temperature sensor further includes a signal input component, and the signal input component is used to be electrically connected to the MCU element.

[0015] In a second aspect, the present application also provides a temperature measurement device, comprising the temperature sensor described above.

[0016] In a third aspect, the present application further provides a temperature measurement system, comprising the temperature sensor and a terminal as described above in claim 1, wherein the terminal is electrically connected to the temperature sensor.

[0017] It can be understood that the beneficial effects of the second and third aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here.

[0018] In a fourth aspect, the present application further provides a temperature measurement method, which is applicable to the temperature sensor described above, and the temperature measurement method includes: Measuring the temperature of the object to be measured by the temperature sensor, and converting the temperature signal into an electrical signal through the thermopile assembly and transmitting it to the MCU element; The MCU component is preset with a temperature threshold. When the temperature is higher than or equal to the current temperature threshold, the MCU component outputs a control signal of a certain frequency through a signal output component, and the peripheral device performs a corresponding action according to the control signal.

[0019] Beneficial effects of the present invention: The temperature measurement method provided by the present invention can save the cost of setting up control elements of peripheral equipment, and can greatly enhance the timeliness of temperature decision-making.

[0020] In some embodiments, the temperature measurement method further includes: adjusting a temperature threshold of the MCU element, and communicating with the MCU element via a signal input component to adjust a temperature threshold parameter. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A cross-sectional view of a temperature sensor provided in Embodiment 1 of the present invention; Figure 2 An exploded diagram of the temperature sensor provided in the first embodiment of the present invention; Figure 3 A schematic diagram of the structure of a temperature sensor provided in Embodiment 2 of the present invention; Figure 4 The present invention provides a flow chart of a temperature measurement method.

[0023] Among them, the reference numerals in the figure are: 100. Temperature sensor; 10. packaging structure; 10a. accommodating space; 11. base; 12. packaging cover; 13. power conducting part; 20. Thermopile assembly; 30. MCU components; 31. ADC components; 40. signal output component; 41. wireless communication component; 411. wireless communication element; 412. antenna; 50. Thermistor; 60. Filter components; 70. PCB board; 80. Signal input component. DETAILED DESCRIPTION

[0024] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0025] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the relevant technical field, a temperature sensor is a device used to measure temperature and convert temperature changes into electrical signals for further processing. That is, the temperature sensor converts the temperature signal into an electrical signal through a thermistor, thermocouple or other thermal sensitive element, and the peripheral device makes a judgment based on the electrical signal. If the temperature corresponding to the electrical signal is higher than or equal to the preset temperature, the control element of the peripheral device sends a corresponding execution signal to ensure that the peripheral device performs the corresponding action.

[0029] However, this is not friendly to some usage scenarios. For example, in the field of laser welding and new energy battery protection, temperature sensors are required to have certain self-decision-making capabilities to reduce the computing power and cost issues of the terminal.

[0030] In view of this, an embodiment of the present application provides a temperature sensor, in which an MCU and a signal output component are added internally. When the temperature sensor measures the temperature of the object to be measured, the thermopile component converts the temperature signal into an electrical signal and transmits it to the MCU component. A temperature threshold can be preset in the MCU component. When the temperature is higher than or equal to the current temperature threshold, the MCU component outputs a control signal of a certain frequency through the signal output component. Then, the peripheral device can perform corresponding actions according to the control signal without adding corresponding control components, which greatly enhances the timeliness of temperature decisions.

[0031] First, please refer to Figures 1 to 3 An embodiment of the present application provides a temperature sensor 100 , including a packaging structure 10 , a thermopile assembly 20 , an MCU element 30 , and a signal output assembly 40 .

[0032] Among them, the packaging structure 10 has a accommodating space 10a; a thermopile component 20, which is packaged in the accommodating space 10a; an MCU component 30 is packaged in the accommodating space 10a, and the input end of the MCU component 30 is electrically connected to the output end of the thermopile component 20; and a signal output component 40, and the input end of the signal output component 40 is electrically connected to the output end of the MCU.

[0033] It can be understood that the packaging structure 10 is used to provide support and protection for the thermopile assembly 20, the MCU element 30 and the signal output assembly 40, and can be used to electrically connect the MCU element 30 to the power supply when the temperature sensor 100 needs to be connected to the power supply externally, so that the power supply provides electrical energy to the MCU element 30. Of course, the packaging structure 1010 can also be used to electrically connect the MCU element 30 to an external circuit or element. The accommodating cavity is a sealed cavity to prevent the external environment from affecting the components such as the thermopile assembly 20, the MCU element 30, the signal output assembly 40, etc. encapsulated therein, and the accommodating space 10a can be filled with nitrogen for protection.

[0034] The thermopile assembly 20 may be a thermopile chip, which includes a plurality of thermocouples for receiving infrared radiation or infrared light from the object to be measured and generating and outputting a voltage signal.

[0035] The MCU element 30 is a microcontroller unit, which can be an MCU chip, and the full name of MCU is Microcontroller Unit; the input end of the MCU element 30 is electrically connected to the output end of the thermopile assembly 20, and is used to process the output signal of the thermopile assembly 20 to obtain a temperature value; wherein the MCU element 30 can have a built-in temperature algorithm, and the temperature algorithm can be to calculate the average value according to the measured temperature value of the object to be measured, and to perform compensation calculation according to the compensation calculation formula; wherein the MCU element 30 can be integrated with an operational amplifier to achieve the effect of amplifying the signal output by the thermopile assembly 20, and of course, the operational amplifier can also be set independently of the MCU element 30. The MCU element 30 is a 16-bit MCU element 30, a 32-bit MCU element 30 or a 64-bit MCU element 30, which can improve the computing performance, facilitate the processing of complex data, and improve the measurement accuracy. Preferably, the MCU element 30 is a 32-bit MCU element 30, which can have a relatively moderate cost while ensuring high computing performance. It should be noted that, according to actual use requirements, the MCU element 30 can also be a 4-bit MCU element 30 or an 8-bit MCU element 30.

[0036] Please refer to Figure 3 , an ADC element 31 may also be provided in the MCU element 30, and the ADC element 31 may be an ADC chip, which is an analog-to-digital converter. The full name of ADC is Analog-to-digital converter. The input end of the ADC element 31 is electrically connected to the output end of the thermopile assembly 20, and is used to perform analog-to-digital conversion on the output signal of the thermopile assembly 20, and can convert the analog signal output by the thermopile assembly 20 into a digital signal and output it. Among them, the ADC element 31 can be electrically connected to the thermopile assembly 20 through wire bonding. Among them, the ADC element 31 can be integrated with an operational amplifier to achieve the effect of amplifying the signal output by the thermopile assembly 20. Of course, the operational amplifier can also be set independently of the ADC element 31.

[0037] Among them, the MCU component 30 and the ADC component 31 can be integrated into the same chip, or can be two separate chips. When the MCU component 30 and the ADC component 31 are separately set, the two can be electrically connected through a PCB board or a metal wire, for example, they can be electrically connected through wire bonding; the ADC component 31 and the MCU component 30 are both integrated in the packaging structure 10, which can improve the integration level, so that the temperature sensor 100 itself can perform temperature calculations and then directly output the temperature value.

[0038] The signal output component 40 is electrically connected to the MCU element 30, so that the MCU element 30 can transmit the temperature data to the external device through the signal output component 40, thereby enabling the temperature sensor 100 to wirelessly communicate and / or wiredly communicate with the external device through the signal output component 40; wherein, the external device can be a mobile phone, so that the temperature sensor 100 can send the temperature data to the mobile phone, and the temperature can be queried or displayed through the mobile phone APP. Of course, the external device can also be a notebook, tablet computer, desktop computer or other device capable of wireless communication connection.

[0039] Specifically, the temperature sensor 100 can be directly wirelessly connected to an external device through the signal output component 40, or it can be wirelessly connected to an intermediate device (such as a gateway) through the signal output component 40 and then wirelessly connected to an external device; wherein the signal output component 40 can be a wireless communication component that adopts any existing wireless communication technology that can realize data transmission, for example, it can be a wireless communication component that adopts Bluetooth, wifi (Wireless-Fidelity, wireless broadband, wireless network), Zig Bee (low-power local area network protocol based on IEEE 802.15.4 standard), LPWAN (low-power Wide-Area Network), Z-Wave (Z-wave Alliance, wireless networking specification), GPRS (General Packet Radio Service, general packet radio service technology), NB-IoT (Narrow Band Internet of Things), NFC (Near Field Communication), 2.4G, 3G, 4G or 5G and other wireless communication technologies, but not limited to this; the signal output component 40 may include a wireless communication chip that adopts the corresponding wireless communication technology.

[0040] The temperature sensor 100 provided by the present invention has an MCU and a signal output component 40 added inside. When the temperature sensor 100 measures the temperature of the object to be measured, the thermopile component 20 converts the temperature signal into an electrical signal and transmits it to the MCU component 30. A temperature threshold can be preset in the MCU component 30. When the temperature is higher than or equal to the current temperature threshold, the MCU component 30 outputs a control signal of a certain frequency to the outside through the signal output component 40. Then, the peripheral device can perform corresponding actions according to the control signal without adding corresponding control components, which greatly enhances the timeliness of temperature decision-making.

[0041] In one embodiment, see Figure 1 and Figure 2The temperature sensor 100 further includes a thermistor 50, which is packaged in the accommodation space 10a. The thermistor 50 is electrically connected to the MCU component 30. For example, the MCU component 30 and the thermistor 50 can be electrically connected through a metal wire, and the thermistor 50 can also be electrically connected to the MCU component 30 through an ADC component 31. The thermistor 50 is used to measure the ambient temperature of the thermopile component 20, so that the MCU component 30 can process the temperature of the object to be measured measured by the thermopile component 20 and the ambient temperature of the thermopile component 20 to obtain an accurate actual temperature of the object to be measured. The thermistor 50 can be a high-precision thermistor 50, such as an NTC (Negative Temperature Coefficient) thermistor 50, but is not limited thereto.

[0042] In one embodiment, see Figure 1 and Figure 2 The temperature sensor 100 also includes a filter component 60. The filter component 60 is an anti-interference component and can be a filter circuit. It usually includes several of capacitors, resistors, and inductors. It can be a combination of inductors and capacitors, a combination of capacitors and resistors, or a combination of operational amplifiers, capacitors, and resistors. The existing filter circuit can be used, and it can also be adaptively set according to actual usage requirements. The thermopile component 20 is electrically connected to the filter component 60, and the filter component 60 is electrically connected to the MCU element 30, that is, the output end of the thermopile component 20 is electrically connected to the input end of the filter component 60, and the output end of the filter component 60 is electrically connected to the input end of the MCU element 30. The filter component 60 can filter the output signal of the thermopile component 20 to remove the interference signal, and then output it to the MCU element 30.

[0043] In one embodiment, see Figure 1 and Figure 2 , the temperature sensor 100 also includes a PCB board 70, the PCB board 70 is packaged in the accommodation space 10a, and the filter component 60 is arranged on the PCB board 70. Such a configuration not only facilitates the connection of the capacitor of the filter component 60 to the PCB board 70, but also facilitates the electrical connection of the MCU component 30 with the filter component 60 through the PCB board 70, facilitates the electrical connection of the thermopile component 20 with the filter component 60 through the PCB board 70, and also facilitates the electrical connection of the wireless communication component 80 with the MCU component 30 through the PCB board 70; wherein, the size of the PCB board 70 can be adapted to the size of the temperature sensor 100, so as to be miniaturized and packaged in the accommodation space 10a. Of course, the PCB board 70 may not be provided, for example, the filter component 60 may be integrated with the MCU component 30 in the same chip.

[0044] Alternatively, in one embodiment, the temperature sensor 100 further includes a PCB board 70, the PCB board 70 is packaged in the accommodation space 10a, and the thermistor 50 is arranged on the PCB board 70. Such an arrangement not only facilitates the connection of the capacitor of the thermistor 50 to the PCB board 70, but also facilitates the electrical connection of the MCU component 30 with the thermistor 50 through the PCB board 70, facilitates the electrical connection of the thermopile assembly 20 with the thermistor 50 through the PCB board 70, and also facilitates the electrical connection of the wireless communication component 80 with the MCU component 30 through the PCB board 70; wherein, the size of the PCB board 70 can be adapted to the size of the temperature sensor 100, so as to be miniaturized and packaged in the accommodation space 10a. Of course, the PCB board 70 may not be provided, for example, the filter component 60 may be integrated with the MCU component 30 in the same chip.

[0045] In some embodiments, the signal output component 40 includes a wireless communication component 41; and / or, the signal output component 40 includes a wired communication element.

[0046] The signal output component 40 may only include the wireless communication component 41, or the signal output component 40 may only include the wired communication element; or the signal output component 40 may include both the wireless communication component 41 and the wired communication element.

[0047] Among them, please refer to Figure 3 The wireless communication component 41 includes a wireless communication element 411 and an antenna 412. The wireless communication element 411 can be packaged in the accommodating space 10a, and the antenna 412 can also be packaged in the accommodating space 10a. At this time, the packaging structure 10 should be at least partially non-metallic to prevent the antenna 412 from being shielded. The antenna 412 can be printed on the packaging structure 10. Of course, when the packaging structure 10 is entirely made of metal, the antenna 412 can also be partially extended to the outside of the accommodating space 10a to prevent the antenna 412 from being shielded. The antenna 412 can also be embedded in the packaging structure 10 and can communicate normally with external devices. It can be understood that the packaging structure 10 should not affect the normal operation of the antenna 412; the wireless communication element 411 is electrically connected to the MCU element 30, and the antenna 412 is electrically connected to the wireless communication element 411. The wireless communication element 411 can be a radio frequency chip for processing radio frequency protocols, wherein the wireless communication element 411 can be a chip using any of the above-mentioned wireless communication technologies, and the antenna 412 is an antenna 412 corresponding to the wireless communication element 411, and is used to establish a communication connection with an external device; the MCU element 30 can be wirelessly connected to an external device through the wireless communication element 411 and the antenna 412.

[0048] In some embodiments, see Figure 1 and Figure 2The packaging structure 10 includes a base 11 and a packaging cover 12, the power conducting portion 13 includes a plurality of pins, the base 11 can be a metal TO packaging chassis seat, the thermopile assembly 20, the MCU component 30, and the PCB board 70 can be arranged on the base 11; the packaging cover 12 can be a metal shell, and of course it can also be a ceramic shell or a plastic shell, etc. The packaging cover 12 is sealed and connected to the base 11 to form an accommodating space 10a between the packaging cover 12 and the base 11, and a first light-transmitting portion for infrared light to pass through is provided on the packaging cover 12, so that the infrared light or infrared radiation of the object to be tested can pass through the first light-transmitting portion and enter the accommodating space 10a and irradiate the thermopile assembly 20, the first A light-transmitting portion includes a first light-transmitting through hole opened on the packaging cover 12 and a first light-transmitting member sealed at the first light-transmitting through hole. The first light-transmitting member can be a lens or a filter, which can be fixed at the first light-transmitting through hole by dispensing glue; the pins are all arranged in the base 11, and one end of each pin extends into the accommodating space 10a and is electrically connected to the MCU component 30, and the other end of each pin extends to the outside of the accommodating space 10a to form a power connection end to facilitate electrical connection with the power supply, external circuit or component. The pin can be connected to the MCU component 30 through wire bonding, or connected to the PCB board 70 through wire bonding and then connected to the MCU component 30 through wire bonding. The number of pins can be set according to actual use requirements and is not limited here.

[0049] In some embodiments, see Figure 2 The temperature sensor 100 further includes a signal input component 80 , and the signal input component 80 is used to be electrically connected to the MCU component 30 .

[0050] It can be understood that the signal input component 80 can be a serial data line or a clock data line, wherein the serial data line is a signal line in the I2C (Inter-Integrated Circuit) bus protocol. The clock signal line is used to synchronize various parts in the circuit or communication system, usually a pulse signal in a digital circuit, for providing timing control.

[0051] In summary, the temperature threshold parameters in the MCU element 30 can be adjusted through the signal input component 80 to adapt to the use of different scenarios.

[0052] In the second aspect, the embodiment of the present application further provides a temperature measuring device, the temperature measuring device includes the temperature sensor 100 of any of the above embodiments, and the temperature sensor 100 is used to measure the temperature of a person, an animal or other object. The temperature measuring device can be a non-contact temperature measuring device, such as an ear thermometer, a forehead thermometer, a pressure test device, an infant incubator, etc., but not limited to this. At this time, the ear thermometer, the forehead thermometer, the pressure test device, the infant incubator and other temperature measuring devices do not need to be provided with components such as a main board and a display screen, for example, the temperature data of the temperature sensor 100 can be received and displayed through a mobile phone, and the temperature measuring device can also be a device that needs to measure temperature, such as a temperature measuring gun, a transformer box, a charging overheating protection device, a microwave oven, an induction cooker, a stove, a hair dryer, a dryer, an air conditioner, an electric fan, a smart wearable device, a smart access control, a POS machine, a water cup, a milk bottle, etc., but not limited to this. At this time, the above-mentioned device that needs to measure temperature can also be provided without components such as a main board and a display screen, for example, the temperature data of the temperature sensor 100 can be received and displayed through a mobile phone. The temperature measuring device can also be a minimalist temperature measuring device. For example, the temperature measuring device includes a fixed structure and a temperature sensor 100. The fixed structure is used to fix and support the temperature sensor 100. For example, it can be an adhesive structure, a suspension structure, a shell structure, etc., which can fix the temperature sensor 100 on the object to be measured or fix it at a specific position to measure the temperature of the object to be measured.

[0053] In the third aspect, the embodiment of the present application also provides a temperature measurement system, which includes a terminal and a temperature sensor 100 of any of the above embodiments, and the terminal is wirelessly connected to the temperature sensor 100 to receive temperature data measured by the temperature sensor 100. Since the temperature measurement system provided by the embodiment of the present application adopts the temperature sensor 100 of the above embodiment, it also has the technical effect brought by the technical solution of the temperature sensor 100 of the above embodiment, greatly shortens the development cost and development cycle of the temperature measurement system, and can achieve a very simplified temperature measurement method. Temperature measurement and wireless reception and display of temperature data can be achieved through a temperature sensor 100 and a terminal. There is no need to set up other structures or components for the temperature sensor 100. The temperature sensor 100 can be placed at any desired position to measure the temperature of a person, animal or other object. The temperature sensor 100 can wirelessly transmit the measured temperature value to the terminal, which is received and displayed by the terminal.

[0054] Specifically, the terminal is a mobile phone, and the mobile phone has an APP compatible with the temperature sensor 100. The temperature value measured by the temperature sensor 100 can be displayed through the mobile phone APP. With this arrangement, because the mobile phone is a basic configuration for modern people, it is extremely convenient to receive temperature data and display it through wireless communication between the mobile phone and the temperature sensor 100. Specifically, the APP can have a forehead temperature mode, a wrist mode, and an object temperature mode, so as to display the temperature of the forehead, wrist, and object measured by the temperature sensor 100 respectively. Of course, the APP can also have other modes, such as modes corresponding to other measurement parts of the human body, animal modes, etc., but it is not limited to this.

[0055] Fourth, please refer to Figure 4 , the embodiment of the present application provides a temperature measurement method, the temperature measurement method uses the temperature sensor 100 mentioned above. Specifically, the temperature measurement method includes the following steps: S001 , measuring the temperature of the object to be measured by the temperature sensor 100 , and converting the temperature signal into an electrical signal through the thermopile assembly 20 and transmitting it to the MCU element 30 .

[0056] It can be understood that in the step, the temperature signal measured by the thermopile assembly 20 is converted into an electrical signal and transmitted to the MCU element 30, rather than directly transmitted to the peripheral device, that is, the MCU element 30 processes the electrical signal of the relevant temperature.

[0057] S002, the MCU component 30 is preset with a temperature threshold. When the temperature is higher than or equal to the current temperature threshold, the MCU component 30 outputs a control signal of a certain frequency through the signal output component 40, and the peripheral device performs corresponding actions according to the control signal.

[0058] It can be understood that a temperature threshold is set on the MCU element 30, and the temperature threshold corresponds to the electrical signal converted from the corresponding temperature signal, that is, when the temperature is higher than or equal to the current temperature threshold, the MCU element 30 outputs a control signal of a certain frequency through the signal output component 40. Here, the control signal can be a high-frequency signal, a low-frequency signal, or a signal of a specific frequency, and the peripheral device directly performs the corresponding action according to the control signal. For example, in the field of laser welding, when the welding temperature is higher than or equal to the temperature threshold, the laser welding equipment stops the welding action when receiving the control signal, or, in the field of new energy battery protection, when the operating temperature of the battery is higher than or equal to the temperature threshold, the safety protection measures are activated.

[0059] In some embodiments, the temperature measurement method further comprises: The temperature threshold of the MCU component is adjusted, and the signal input component is communicated with the MCU component to adjust the temperature threshold parameter.

[0060] It can be understood that when setting at the factory, the temperature threshold parameters of the MCU component are fixed. When the temperature in some usage scenarios changes and the current temperature threshold is difficult to adapt, the temperature threshold parameters can be adjusted by communicating with the MCU component through the signal input component.

[0061] For example, when the temperature sensor of the present application is applied in the field of fire protection, the temperature threshold parameters of the MCU component can be adjusted when facing different scenarios, thereby greatly improving the convenience of using the temperature sensor.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A temperature sensor, characterized in that: include: A packaging structure, wherein the packaging structure has a containing space; A thermopile assembly, wherein the thermopile assembly is packaged in the accommodating space; An MCU component, wherein the MCU component is packaged in the accommodating space, and an input end of the MCU component is electrically connected to an output end of the thermopile assembly; as well as, A signal output component is packaged in the accommodating space, and an input end of the signal output component is electrically connected to an output end of the MCU.

2. The temperature sensor according to claim 1, characterized in that: The temperature sensor further includes a thermistor, which is packaged in the accommodating space and is electrically connected to the MCU component.

3. The temperature sensor according to claim 1, characterized in that: The temperature sensor further includes a filter component, which is packaged in the accommodating space, an input end of the filter component is electrically connected to the thermopile component, and an output end of the filter component is electrically connected to an input end of the MCU element.

4. The temperature sensor according to claim 2, characterized in that: The temperature sensor further includes a PCB board, the PCB board is packaged in the accommodating space, the thermistor is arranged on the PCB board, and the MCU element is electrically connected to the thermistor through the PCB board.

5. The temperature sensor according to claim 3, characterized in that: The temperature sensor further includes a PCB board, the PCB board is packaged in the accommodating space, the filter assembly is arranged on the PCB board, and the MCU element is electrically connected to the filter assembly through the PCB board.

6. The temperature sensor according to any one of claims 1 to 5, characterized in that: The signal output component includes a wireless communication component; and / or, The signal output assembly includes a wired communication element.

7. The temperature sensor according to claim, characterized in that: The wireless communication component includes a wireless communication element and an antenna electrically connected to the wireless communication element, and the wireless communication element is electrically connected to the MCU element.

8. The temperature sensor according to any one of claims 1 to 5, characterized in that: The packaging structure includes a base and a packaging cover which is arranged on the base and encloses the base to form a accommodating space. The base is provided with a power conductive part, one end of the power conductive part is electrically connected to the MCU component, and the other end of the power conductive part is electrically connected to the external power supply.

9. The temperature sensor according to any one of claims 1 to 5, characterized in that: The temperature sensor also includes a signal input component, and the signal input component is used to be electrically connected to the MCU element.

10. A temperature measuring device, characterized in that: Comprising the temperature sensor according to any one of claims 1 to 9.

11. A temperature measurement system, characterized in that: The method comprises a temperature sensor as claimed in any one of claims 1 to 9 and a terminal, wherein the terminal is electrically connected to the temperature sensor.

12. A temperature measurement method, characterized in that: The temperature measurement method is applicable to the temperature sensor according to any one of claims 1 to 8, and the temperature measurement method comprises: Measuring the temperature of the object to be measured by the temperature sensor, and converting the temperature signal into an electrical signal through the thermopile assembly and transmitting it to the MCU element; The MCU component is preset with a temperature threshold. When the temperature is higher than or equal to the current temperature threshold, the MCU component outputs a control signal of a certain frequency through a signal output component, and the peripheral device performs a corresponding action according to the control signal.

13. The temperature measurement method according to claim 12, characterized in that: The temperature measurement method further comprises: The temperature threshold of the MCU element is adjusted, and a communication connection is established with the MCU element via a signal input component to adjust the temperature threshold parameter.

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