Slide glass mechanism, transfer mechanism and semiconductor production process equipment

Abstract

The invention discloses a slide glass mechanism, a transfer mechanism and semiconductor production process equipment, and the slide glass mechanism is used for bearing a wafer, and comprises a frame structure which comprises a first frame plate and a second frame plate; the stand column structure is connected with the first frame plate and the second frame plate, the stand column structure comprises a plurality of stand columns and a plurality of first cantilevers, the stand columns, the first frame plate and the second frame plate define a containing space, the first cantilevers extend towards the containing space from the stand columns, and bearing parts are arranged at the ends, away from the stand columns, of the first cantilevers; the bearing parts of the first cantilevers on the same plane form a supporting carrying table used for bearing at least one wafer, and the supporting carrying tables are arranged at an average interval. According to the wafer carrying mechanism provided by the embodiment of the invention, the wafer is contained through the containing space, the stable supporting carrying table is defined to bear the wafer, meanwhile, the average distance can be matched with the wafer distance between the wafers in the previous working procedure, batch wafer feeding is achieved, the labor intensity is low, and the product yield and the yield are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor processing technology, and in particular to a wafer carrier mechanism, a transfer mechanism, and semiconductor production process equipment. Background Art

[0002] In the existing semiconductor production process, the operator needs to place the wafer with deposited glass powder from the wafer basket into a quartz fixture, and then place the quartz fixture and the wafer on a cantilever paddle and send them into a diffusion tube to perform a sintering process on the glass powder on the wafer.

[0003] However, in the prior art, operators need to use air tweezers to take the wafers one by one from the wafer basket, and then use air tweezers to load the wafers one by one into the quartz fixture. This has high labor intensity for operators, and it is difficult to guarantee product yield and output. Summary of the invention

[0004] The embodiments of the present application provide a wafer loading mechanism, a transfer mechanism, and semiconductor production process equipment, which can realize batch loading of wafers in the wafer loading mechanism.

[0005] In the first aspect, according to an embodiment of the present application, a wafer carrier mechanism is provided for carrying wafers, comprising: a frame structure, comprising a first frame plate and a second frame plate arranged opposite to each other in a second direction; a column structure, connected to the first frame plate and the second frame plate, the column structure comprising a plurality of columns and a plurality of first cantilevers arranged on each column, the plurality of columns all extend along the second direction and are arranged at intervals from each other, the plurality of columns and the first frame plate and the second frame plate define a accommodating space, each first cantilever extends from the column toward the accommodating space, and a bearing portion is provided at the end of each first cantilever away from the column, the bearing portions of the first cantilevers on each column and located in the same plane jointly form a supporting platform for carrying at least one wafer, and there is an average spacing between each supporting platform.

[0006] According to one aspect of the embodiment of the present application, the average spacing between the supporting platforms is 8.95 mm to 9.52 mm.

[0007] According to one aspect of an embodiment of the present application, a line connecting the orthographic projections of a plurality of columns on the first frame plate along the second direction is in the form of a triangle or a polygon, a distance between at least two adjacent columns is greater than a radial dimension of the wafer, and the orthographic projections of the plurality of columns on the first frame plate along the second direction are located on the same first circular arc line, and the radial dimension of the first circular arc line is greater than a radial dimension of the wafer to be carried.

[0008] According to one aspect of an embodiment of the present application, the connecting line between the bearing parts located on the same supporting platform is in the form of a triangle or a polygon, the bearing parts are located on the same second arc line, and after the supporting platform carries the wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the bearing parts, and the second arc line with the maximum radial dimension is tangent to the flat edge of the wafer.

[0009] According to one aspect of an embodiment of the present application, the first cantilever arranged on the same column extends from the column toward the accommodating space in the same direction, the first cantilevers arranged on two of the columns extend toward each other, and the first cantilevers on the other columns are staggered with the perpendicular midline of the line connecting the two columns extending toward each other.

[0010] According to one aspect of the embodiment of the present application, the bearing portion is a sphere, and the radial dimension of the bearing portion does not exceed 5 mm.

[0011] According to one aspect of the embodiment of the present application, the first frame plate further includes a first air vent disposed through the first frame plate, and / or the second frame plate further includes a second air vent disposed through the first frame plate.

[0012] According to one aspect of an embodiment of the present application, the first frame plate also includes a first main body portion and a plurality of first protrusions arranged on a side of the first main body portion close to the second frame plate, the connecting line between the first protrusions is a triangle or a polygon, the first protrusions are located on the same second arc line, and after the first protrusions carry a wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the first protrusions, and the second arc line of the maximum radial dimension is tangent to the flat edge of the wafer, and / or the second frame plate also includes a second main body portion and a plurality of second protrusions arranged on a side of the second main body portion close to the first frame plate, the connecting line between the second protrusions is a triangle or a polygon, the second protrusions are located on the same second arc line, and after the second protrusions carry a wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the second protrusions, and the second arc line of the maximum radial dimension is tangent to the flat edge of the wafer.

[0013] According to one aspect of an embodiment of the present application, the first frame plate also includes a first main body portion and a first ground foot arranged on a side of the first main body portion away from the second frame plate, and / or the second frame plate also includes a second main body portion and a second ground foot arranged on a side of the second main body portion away from the first frame plate.

[0014] According to one aspect of an embodiment of the present application, the first frame plate also includes a first main body portion and a first clamping portion extending on one side of the first main body portion along a first direction parallel to the plane of the frame structure, and / or the second frame plate also includes a second main body portion and a second clamping portion extending on one side of the second main body portion along the first direction.

[0015] In the second aspect, according to an embodiment of the present application, a transfer mechanism is provided for transferring wafers in a wafer basket structure to a wafer carrier mechanism, comprising: a wafer basket structure, comprising a wafer basket body and a wafer basket groove, the wafer basket groove is arranged on the inner side wall of the wafer basket body, and the wafer is embedded in the wafer basket body through the wafer basket groove; the wafer carrier mechanism provided by any one of the embodiments of the first aspect of the present application, the wafer carrier mechanism is fixedly connected to the wafer basket structure, and the ratio between the average spacing between each supporting platform and the spacing between any two adjacent wafer basket grooves along the second direction is n:1.

[0016] According to one aspect of an embodiment of the present application, the first frame plate of the film carrier mechanism also includes a first main body portion and a first clamping portion extending on one side of the first main body portion along a first direction parallel to the plane of the frame structure, and / or the second frame plate also includes a second main body portion and a second clamping portion extending on one side of the second main body portion along the first direction; the film carrier mechanism is clamped and connected to the film basket structure via the first clamping portion, and / or the second clamping portion.

[0017] According to one aspect of the embodiment of the present application, it also includes a base, which includes a slide groove and a film pusher arranged throughout the base, the film pusher is protruding from the surface of the slide groove, and the film carrier mechanism and the film basket structure are installed on the base and are slidably connected to the slide groove.

[0018] According to one aspect of an embodiment of the present application, the pusher also includes a protruding body and a pushing head arranged on one side of the protruding body, the cross-section of the pusher head along the first direction parallel to the plane of the frame structure is an arc shape, the width dimension of the pusher head is greater than the length dimension of the flat edge of the wafer, the radial dimension of the pusher head is the same as the radial dimension of the wafer, and the pusher head also includes a positioning groove arranged along the first direction through itself.

[0019] In a third aspect, according to an embodiment of the present application, a semiconductor production process equipment is provided, comprising: a furnace tube; a furnace paddle mechanism, comprising a second cantilever and a transmission structure arranged on the side of the second cantilever away from the furnace tube, the transmission structure pushing the second cantilever into the inner cavity of the furnace tube and pulling the second cantilever out of the inner cavity of the furnace tube; the wafer carrier mechanism provided in any one of the embodiments of the first aspect of the present application is fixedly connected to the second cantilever.

[0020] According to one aspect of an embodiment of the present application, the first frame plate of the carrier mechanism further includes a first main body portion and a first foot disposed on a side of the first main body portion away from the second frame plate, and / or the second frame plate further includes a second main body portion and a second foot disposed on a side of the second main body portion away from the first frame plate; the carrier mechanism is connected to the second cantilever by means of the first foot and / or the second foot.

[0021] The embodiments of the present application provide a wafer carrier mechanism, a transfer mechanism, and a semiconductor production process equipment. The wafer carrier mechanism accommodates wafers through the accommodation space determined by the columns in the column structure, and defines a stable support platform for carrying wafers through the bearing portion on the first cantilever in the column structure. At the same time, the average spacing between the support platforms can be adapted to the wafer spacing between the wafers in the bearing device in the previous process, so that multiple wafers can be loaded in batches in the wafer carrier mechanism, the labor intensity of operators is reduced, and the product yield and output are improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0023] Figure 1 It is a schematic diagram of the overall structure of a slide carrier mechanism provided by an embodiment of the first aspect of the present application;

[0024] Figure 2 yes Figure 1 A schematic diagram of the overall structure after the wafer carrier mechanism carries the wafer;

[0025] Figure 3 yes Figure 2 The upward structural diagram of

[0026] Figure 4 yes Figure 1 A magnified structural diagram of the middle A area;

[0027] Figure 5 yes Figure 1 A magnified structural diagram of the middle B area;

[0028] Figure 6 It is a schematic diagram of the overall structure of a transfer mechanism provided by an embodiment of the second aspect of the present application;

[0029] Figure 7 is a schematic diagram of the overall structure of another transfer mechanism provided by an embodiment of the second aspect of the present application;

[0030] Figure 8 is a schematic diagram of the overall structure of another transfer mechanism provided by an embodiment of the second aspect of the present application;

[0031] Fig. 9 yes Figure 6 The enlarged structure of the middle C area;

[0032] Fig.10 yes Figure 6 The enlarged structure diagram of the pusher head and wafer in the figure;

[0033] Fig.11 It is a schematic diagram of the overall structure of a semiconductor production process equipment provided in an embodiment of the third aspect of the present application.

[0034] in:

[0035] 100-slide carrier mechanism;

[0036] 10-frame structure; 11-first frame plate; 111-first main body; 112-first vent hole; 113-first protrusion; 114-first foot; 115-first clamping part; 12-second frame plate; 121-second main body; 122-second vent hole; 123-second protrusion; 124-second foot; 125-second clamping part;

[0037] 20-column structure; 21-first cantilever; 22-column; 211-bearing part;

[0038] S0-accommodation space; P0-support platform; D1-average spacing;

[0039] R1-first arc line; R2-second arc line;

[0040] 200-wafer; 210-flat edge;

[0041] 300-sheet basket structure; 310-sheet basket body; 320-sheet basket slot; D2-distance between sheet basket slots;

[0042] 400-base; 410-slideway; 420-piece pusher; 421-protruding body; 422-push head; 422a-positioning groove;

[0043] 500-furnace tube;

[0044] 600-furnace paddle mechanism; 610-second cantilever; 620-transmission structure;

[0045] 1000-transfer mechanism;

[0046] 2000-Semiconductor production process equipment;

[0047] X-first direction; Y-second direction.

[0048] In the drawings, the same reference numerals are used for the same components. The drawings are not drawn to scale. DETAILED DESCRIPTION

[0049] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0050] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the wafer carrier mechanism, transfer mechanism and semiconductor production process equipment of this application. In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0051] Figure 1 The overall structure of a wafer carrier mechanism 100 provided in an embodiment of the first aspect of the present application is shown.

[0052] See also Figure 1 In a first aspect, an embodiment of the present application provides a wafer carrier mechanism 100 for carrying a wafer 200 . The wafer carrier mechanism 100 includes a frame structure 10 and a column structure 20 .

[0053] The frame structure 10 includes a first frame plate 11 and a second frame plate 12 which are arranged opposite to each other in the second direction Y.

[0054] The column structure 20 is connected to the first frame plate 11 and the second frame plate 12, and the column structure 20 includes a plurality of columns 22 and a plurality of first cantilevers 21 arranged on each column 22. The plurality of columns 22 extend along the second direction Y and are arranged at intervals from each other. The plurality of columns 22 and the first frame plate 11 and the second frame plate 12 define a accommodating space S0. Each first cantilever 21 extends from the column 22 toward the accommodating space S0, and a bearing portion 211 is provided at an end of each first cantilever 21 away from the column 22. The bearing portions 211 of the first cantilevers 21 on each column 22 and located on the same plane jointly form a supporting platform P0 for carrying at least one wafer 200, and an average spacing D1 is provided between each supporting platform P0.

[0055] On the one hand, the wafer carrier mechanism 100 provided in the embodiment of the present application accommodates the wafer 200 through the accommodating space S0 determined by the column 22 in the column structure 20, and defines a stable supporting platform P0 for carrying the wafer 200 through the supporting portion 211 on the first cantilever 21 in the column structure 20. At the same time, the average spacing D1 between the supporting platforms P0 can be adapted to the wafer spacing between the wafers 200 in the supporting device in the previous process, so that multiple wafers 200 can be loaded in batches in the wafer carrier mechanism 100, the labor intensity of the operator is reduced, and the product yield and output are improved.

[0056] The distance between the first frame plate 11 and the second frame plate 12 in the frame structure 10 can be adjusted according to actual needs such as the number of wafers 200 to be carried and the average spacing D1 between the supporting platforms P0, and the manufacturing and adjustment are flexible.

[0057] At the same time, due to the use of a batch loading method, the average spacing D1 between the supporting platforms P0 of the wafer loading mechanism 100 provided in the first aspect of the present application can be further reduced compared to the spacing between adjacent chips in the quartz fixture in which the operator manually loads the wafers in the related art. Therefore, the distance dimension between the first frame plate 11 and the second frame plate 12 of the wafer loading mechanism 100 provided in the first aspect of the present application can be further reduced compared to the height dimension in the quartz fixture in which the operator manually loads the wafers in the related art.

[0058] Therefore, in the case of a wafer carrier 100 of the same size, the wafer carrier 100 provided in the first aspect of the present application can carry a greater number of wafers 200 , and the yield and production efficiency of the wafers 200 can be improved.

[0059] In the subsequent process flow, the wafer carrier mechanism 100 provided in the first aspect of the present application has a smaller chance of interfering with other equipment structures, further reducing the labor intensity of operators, and can reduce the chance of glass powder deposited on the wafer 200 falling off, thereby further improving product yield.

[0060] The beneficial effects brought about by the reduction in size of the wafer carrier mechanism 100 will be further described in subsequent embodiments of other aspects and will not be elaborated here.

[0061] While the frame structure 10 determines the overall size of the wafer carrier 100, the plurality of columns 22 in the column structure 20 determine the accommodation space S0 for accommodating the wafer 200. The arrangement of the plurality of columns 22 should satisfy the requirement that the wafer 200 can enter the accommodation space S0 from between two columns 22 on one side, and the size of the accommodation space S0 itself can accommodate the size of the wafer 200, and the columns 22 can also protect the wafer 200 and prevent the wafer 200 from sliding off one side of the columns 22.

[0062] The size of the accommodation space S0 and the arrangement of the plurality of columns 22 can be adjusted according to the size of the wafer 200 to be accommodated in the actual accommodation space S0, and the manufacturing and adjustment are flexible.

[0063] Optionally, the arrangement of the plurality of pillars 22 and the size of the accommodation space S0 can allow wafers 200 of various sizes to enter the accommodation space S0 at the same time, thus providing better compatibility.

[0064] The arrangement of the plurality of columns 22 and the size of the accommodation space S0 will be further described in subsequent embodiments and will not be repeated here.

[0065] At the same time, the multiple first cantilevers 21 located in the same plane in the column structure 20 and the bearing part 211 on the first cantilever 21 are used to determine the supporting platform P0 that supports the wafer 200. The supporting platform P0 needs to achieve stable support for the wafer 200 after the wafer 200 enters the accommodating space S0.

[0066] The support stage P0 needs to make the center of gravity of the wafer 200 fall within the support stage P0 , while each of the supporting parts 211 on the support stage P0 is in contact with the wafer 200 , so as to maximize the stable support of the wafer 200 .

[0067] The size of the support stage P0 and the arrangement of the multiple carrying parts 211 can be adjusted according to the actual size of the wafer 200 to be carried by the support stage P0, and the production and adjustment are flexible.

[0068] Optionally, the arrangement of the multiple carrying parts 211 and the size of the supporting platform P0 can enable the supporting platform P0 to be compatible with and carry wafers 200 of various sizes at the same time, thereby achieving better compatibility.

[0069] The arrangement of the multiple carrying parts 211 and the size of the supporting platform P0 will be further described in subsequent embodiments and will not be repeated here.

[0070] Optionally, the arrangement of the accommodating space S0 and the supporting platform P0 also needs to be compatible with other equipment structures that need to temporarily enter the wafer carrier mechanism 100 during the process, so that the wafer carrier mechanism 100 does not interfere with these equipment structures, leaving some space for these equipment structures.

[0071] The configuration of the accommodating space S0 and the supporting platform P0 will be further described in subsequent embodiments and will not be repeated here.

[0072] The average spacing D1 between the supporting platforms P0 determined by the supporting part 211 on the same plane can be adapted according to the spacing between the wafers 200 in other structures that support the wafers 200, so that the wafers 200 can be directly loaded into the wafer carrier mechanism 100 in batches from the supporting structure in the previous process.

[0073] Compared with the manual wafer loading method, the batch loading method can reduce the number of operations on the wafer 200 and keep the final positions of the wafers 200 on different supporting platforms P0 consistent, avoiding the risk of different wafers 200 positions being offset to varying degrees due to manual wafer loading, and reducing the probability of interference between the wafer 200 and the equipment structure in subsequent processes, thereby reducing the probability of glass powder deposited on the wafer 200 falling off, thereby improving product yield.

[0074] In some embodiments, the average distance D1 between the supporting platforms P0 is 8.95 mm to 9.52 mm.

[0075] In these embodiments, the average spacing D1 can be set to match the standard wafer basket of 5-inch wafers 200, which is twice the spacing between wafers 200 in the standard wafer basket of 5-inch wafers 200, that is, 8.95 mm to 9.52 mm, further improving the yield and production efficiency.

[0076] The average spacing D1 is set to twice the spacing between the wafers 200 in the standard basket of 5-inch wafers 200. When the carrying capacity of the wafers 200 in the standard basket of 5-inch wafers 200 is half of the standard number, and each wafer 200 is loaded in layers, that is, one wafer 200 is arranged in a layer with a layer in between, the arrangement of the wafers 200 matches the loading mechanism 100, and all the wafers 200 can be loaded in batches at one time.

[0077] Optionally, when the carrying capacity of wafers 200 in a standard basket of 5-inch wafers 200 is a standard number, the wafers 200 in the standard basket of 5-inch wafers 200 can enter two wafer loading mechanisms 100 by pushing the wafers twice to achieve batch loading, that is, first push the odd-numbered wafers 200 in the standard basket of 5-inch wafers into one wafer loading mechanism 100, and then push the even-numbered wafers 200 into another wafer loading mechanism 100, to achieve batch loading of all wafers 200 by pushing the wafers twice.

[0078] Optionally, when the wafer 200 carrying capacity in the standard wafer basket of 5-inch wafers 200 is less than the standard quantity, and the wafers 200 are arranged in random rows at intervals, all wafers 200 can also be loaded in batches by pushing the wafers twice at most.

[0079] Figure 2 Shows Figure 1The overall structure after the wafer carrier 100 carries the wafer 200, Figure 3 Shows Figure 2 The upward-looking structure.

[0080] See also Figure 2 and Figure 3 In some embodiments, the line connecting the orthographic projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y is triangular or polygonal, the distance between at least two adjacent columns 22 is greater than the radial dimension of the wafer 200, the orthographic projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y are located on the same first circular arc line R1, and the radial dimension of the first circular arc line R1 is greater than the radial dimension of the wafer 200 to be carried.

[0081] In these embodiments, the wafer 200 can enter the accommodating space S0 from between at least two adjacent pillars 22, and the accommodating space S0 can accommodate the wafer 200. At the same time, the setting of the pillars 22 can avoid the risk of the wafer 200 sliding off one side of the pillars 22 when the wafer carrier mechanism 100 is moved, thereby further improving the product yield.

[0082] The connecting line of the positive projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y is a triangle or a polygon, providing at least three-point support for the frame plate structure, and the planes where the first frame plate 11 and the second frame plate 12 are located can remain parallel, making the accommodating space S0 and the entire carrier mechanism 100 more stable.

[0083] The distance between at least two adjacent pillars 22 is greater than the radial dimension of the wafer 200 , so that the wafer 200 can enter the accommodation space S0 from one side between at least two pillars 22 without interfering with the pillars 22 .

[0084] At the same time, the direct projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y are located on the same first circular arc line R1, and the radial dimension of the first circular arc line R1 is larger than the radial dimension of the wafer 200 to be carried, so that the size of the accommodating space S0 is sufficient to accommodate the wafer 200.

[0085] Therefore, optionally, when the line connecting the positive projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y is a polygon, the polygon is a convex polygon, which further makes the accommodating space S0 and the entire wafer carrier mechanism 100 more stable.

[0086] Optionally, when the pillars 22 are all cylindrical and have the same radial dimensions, the sum of the radial dimensions of the first arc line R1 and the pillar 22 should also be larger than the radial dimensions of the wafer 200 to be carried, further ensuring that the size of the accommodating space S0 is sufficient to accommodate the wafer 200 .

[0087] Optionally, the radial dimension of the first arc line R1 is greater than 125 mm, and the radial dimension of the 5-inch wafer 200 is 125 mm.

[0088] Please continue reading Figure 2 and Figure 3 In some embodiments, the connecting line between the bearing parts 211 located on the same supporting platform P0 is in the shape of a triangle or a polygon, the bearing parts 211 are located on the same second arc line R2, and after the supporting platform P0 carries the wafer 200, the center of the wafer 200 is located within the triangle or polygon determined by the connecting line between the bearing parts 211, and the second arc line R2 with the maximum radial dimension is tangent to the flat edge 210 of the wafer 200.

[0089] In these embodiments, regardless of the placement position of the wafer 200 , at least three carrying portions 211 in the support stage P0 can stably contact the carried wafer 200 , and the support stage P0 can stably carry the wafer 200 .

[0090] The connecting lines between the multiple carrying parts 211 located on the same supporting platform P0 are triangular or polygonal, providing at least three-point support for the wafer 200, thereby achieving stable support of the supporting platform P0 for the wafer 200.

[0091] When the support platform P0 carries the wafer 200, that is, the center of the wafer 200 coincides with the center of the second arc line R2, the center of the wafer 200 is located within the triangle or polygon determined by the connecting lines between the supporting parts 211, so that the center of gravity of the wafer 200 can fall within the triangle or polygon, further realizing the stable support of the wafer 200 by the support platform P0.

[0092] At the same time, the supporting portion 211 is located on the same second arc line R2, and the second arc line R2 with the largest radial dimension is tangent to the flat edge 210 of the wafer 200, so that the supporting portion 211 can contact the wafer 200 regardless of the position of the flat edge 210 of the wafer 200, further realizing the stable support of the wafer 200 by the supporting platform P0.

[0093] The flat edge 210 of the wafer 200 is a structure provided in the previous process step for positioning the wafer 200 , that is, a cut is left on one side of the complete wafer 200 for positioning the wafer 200 .

[0094] However, in the related art, in the previous process of transferring to the wafer carrier mechanism 100, the placement positions of the wafers 200 and the orientations of the flat edges 210 are different. Therefore, by arranging the supporting parts 211 to be located on the second arc line, and the second arc line R2 with the maximum radial dimension is tangent to the flat edge 210 of the wafer 200, the supporting parts 211 on the same supporting platform P0 can be in contact with the wafer 200, so that the flat edge 210 of the wafer 200 can be reliably supported in any orientation.

[0095] Optionally, when a line connecting the orthographic projections of the plurality of columns 22 on the first frame plate 11 along the second direction Y is a polygon, the polygon is a convex polygon, which further enables the support stage P0 to stably support the wafer 200 .

[0096] Optionally, the maximum radial dimension of the second arc profile is 121 mm, and the length of a chord in the 5-inch wafer 200 that is perpendicular to the flat edge 210 and passes through the center of the wafer 200 is 121 mm.

[0097] Please continue reading Figure 2 and Figure 3 In some embodiments, the first cantilever 21 arranged on the same column 22 extends from the column 22 toward the accommodating space S0 in the same direction, the first cantilevers 21 arranged on two of the columns 22 extend toward each other, and the first cantilevers 21 on the other columns 22 are offset from the perpendicular midline of the line connecting the two columns 22 extending toward each other.

[0098] In these embodiments, the provision of the first cantilever 21 can reserve space for the film pushing mechanism or the operator, thereby facilitating the film pushing operation.

[0099] The first cantilevers 21 arranged on the same column 22 extend in the same direction to avoid the risk that the first cantilevers 21 located on the bearing parts 211 in different supporting platforms P0 extend in different directions, and no space is reserved for the film pushing mechanism or the operator.

[0100] At the same time, the first cantilevers 21 of the two columns 22 extend toward each other, and the midpoint of the connecting line of the two columns 22 is used to reserve space for the film pushing mechanism or the operator.

[0101] Therefore, the first cantilever 21 of the other column 22 and the perpendicular midline of the line connecting the two columns 22 extending toward each other from the first cantilever 21 are staggered to facilitate the film pushing operation.

[0102] The operator can operate other film pushing mechanisms to complete film pushing, or manually complete batch loading of films. The setting of the first cantilever 21 on the column 22 reserves operating space for the film pushing operation.

[0103] Figure 4 Shows Figure 1The enlarged structure of region A in the middle.

[0104] In some embodiments, see Figure 4 The bearing portion 211 is a sphere, and the radial dimension of the bearing portion 211 does not exceed 5 mm.

[0105] In these embodiments, the spherical design of the supporting portion 211 can compensate for the warping of the wafer 200 while avoiding scratching the wafer 200 , thereby improving product yield.

[0106] In the related art, the characteristics of the wafer 200 make it easy for the surface of the wafer 200 to warp to a certain extent during the previous process. When the wafer 200 is pushed from the wafer basket into the wafer loading mechanism 100, the warping of the wafer 200 may cause interference between the wafer 200 and the supporting part 211, making it impossible to push the wafer smoothly.

[0107] The supporting portion 211 is spherical in design, and the radial dimension of the supporting portion 211 does not exceed 5 mm. When the wafer 200 warps toward the side close to the supporting stage P0, the wafer 200 contacts the side of the supporting portion 211 close to the center of the supporting stage P0, which can compensate for the warping of the wafer 200 to a certain extent and reduce the probability of glass powder deposited on the wafer 200 falling off, thereby improving the product yield.

[0108] Optionally, when the wafer 200 warps toward the side away from the support platform P0, the wafer 200 contacts the side of the carrying part 211 away from the center of the support platform P0, which can compensate for the warping of the wafer 200 to a certain extent and reduce the probability of glass powder deposited on the wafer 200 falling off, thereby improving the product yield.

[0109] At the same time, the spherical design of the supporting part 211 can prevent the wafer 200 from being stuck by the supporting part 211 during the pushing process, causing interference and preventing the wafer from being pushed smoothly, and at the same time avoid scratching the wafer 200, thereby reducing production difficulty and improving product yield.

[0110] Please continue reading Figure 1 In some embodiments, the first frame plate 11 further includes a first air vent 112 disposed therethrough, and / or the second frame plate 12 further includes a second air vent 122 disposed therethrough.

[0111] In these embodiments, the provision of the first air holes 112 and / or the second air holes 122 can improve the gas flow condition in the accommodation space S0, thereby increasing the amount of gas flowing through the surface of the wafer 200 and improving the product yield.

[0112] In the related art, after the wafer 200 with glass powder deposited thereon is carried by the wafer carrier 100, it needs to be placed in a diffusion tube for sintering, and a large amount of oxygen and nitrogen needs to be introduced into the diffusion tube to react with the glass powder on the surface of the wafer 200. The provision of the first air holes 112 and / or the second air holes 122 can improve the gas flow in the accommodation space S0, thereby increasing the amount of gas flowing through the surface of the wafer 200, thereby improving the sintering uniformity of the surface of the wafer 200 and improving the product yield.

[0113] Figure 5 Shows Figure 1 The enlarged structure of region B in the middle.

[0114] See also Figure 3 and Figure 5 In some embodiments, the first frame plate 11 further includes a first body portion 111 and a plurality of first protrusions 113 disposed on a side of the first body portion 111 close to the second frame plate 12, the lines connecting the first protrusions 113 are triangular or polygonal, the first protrusions 113 are located on the same second arc line R2, and after the first protrusions 113 carry the wafer 200, the center of the wafer 200 is located within the triangle or polygon determined by the lines connecting the first protrusions 113, and the second arc line R2 with the largest radial dimension is aligned with the flat edge 210 of the wafer 200. Tangent, and / or, the second frame plate 12 also includes a second main body portion 121 and a plurality of second protrusions 123 arranged on the second main body portion 121 close to the side of the first frame plate 11, the connecting lines between the second protrusions 123 are triangular or polygonal, the second protrusions 123 are located on the same second arc line R2, and after the second protrusions 123 carry the wafer 200, the center of the wafer 200 is located within the triangle or polygon determined by the connecting lines between the second protrusions 123, and the second arc line R2 with the largest radial dimension is tangent to the flat edge 210 of the wafer 200.

[0115] In these embodiments, the first protrusion 113 and / or the second protrusion 123 are arranged in the same manner as the bearing portion 211. Therefore, the arrangement of the first protrusion 113 and / or the second protrusion 123 enables the first frame plate 11 and / or the second frame plate 12 to also carry the wafer 200, thereby further improving the wafer 200 carrying capacity of the wafer carrier mechanism 100 and further improving the yield.

[0116] Optionally, the wafer carrier mechanism 100 adopts a first frame plate 11 whose one side is in contact with the plane, and the first protrusion 113 can be used to carry the wafer 200 .

[0117] Optionally, the wafer carrier mechanism 100 adopts one side of the second frame plate 12 to contact the plane, and the second protrusion 123 can be used to carry the wafer 200 .

[0118] Optionally, the height dimension of the first protrusion 113 and the second protrusion 123 is 4.2 mm. The first protrusion 113 and the second protrusion 123 can compensate for the warping of the wafer 200 while preventing the wafer 200 from being scratched, thereby improving the product yield.

[0119] Please continue reading Figure 1 and Figure 3 In some embodiments, the first frame plate 11 further includes a first main body portion 111 and a first foot 114 disposed on a side of the first main body portion 111 away from the second frame plate 12, and / or the second frame plate 12 further includes a second main body portion 121 and a second foot 124 disposed on a side of the second main body portion 121 away from the first frame plate 11.

[0120] In these embodiments, the first foot 114 and / or the second foot 124 are used to support the wafer carrier mechanism 100 and facilitate the positioning of the wafer carrier mechanism 100 in the equipment mechanism of the subsequent process.

[0121] Optionally, the wafer carrier mechanism 100 adopts a first frame plate 11 with one side in contact with the plane, and the first foot 114 is used to support the entire wafer carrier mechanism 100 .

[0122] Optionally, the wafer carrier mechanism 100 adopts one side of the second frame plate 12 to contact the plane, and the second foot 124 is used to support the entire wafer carrier mechanism 100.

[0123] Please continue reading Figure 1 In some embodiments, the first frame plate 11 also includes a first main body portion 111 and a first clamping portion 115 extending along a first direction X parallel to the plane of the frame structure 10 on one side of the first main body portion 111, and / or the second frame plate 12 also includes a second main body portion 121 and a second clamping portion 125 extending along the first direction X on one side of the second main body portion 121.

[0124] In these embodiments, the first clamping portion 115 and / or the second clamping portion 125 are used to clamp with other equipment structures to form an integral structure, so as to facilitate the wafer pushing operation of the wafer 200 .

[0125] Optionally, the first clamping portion 115 and the second clamping portion 125 are both clamped with other equipment structures to further facilitate the wafer pushing operation of the wafer 200 .

[0126] Figure 6 The overall structure of a transfer mechanism 1000 provided by the second embodiment of the present application is shown. Figure 7 The overall structure of another transfer mechanism 1000 provided by the second embodiment of the present application is shown. Figure 8 The overall structure of another transfer mechanism 1000 provided by the second embodiment of the present application is shown. Fig. 9Shows Figure 6 The enlarged structure of the middle C region.

[0127] See also Figures 6 to 9 In the second aspect, an embodiment of the present application provides a transfer mechanism 1000 for transferring the wafer 200 in the wafer basket structure 300 to the wafer carrier mechanism 100, including the wafer basket structure 300 and any one of the wafer carrier mechanisms 100 provided in the first aspect of the present application.

[0128] The wafer basket structure 300 includes a wafer basket body 310 and a wafer basket groove 320 . The wafer basket is disposed on the inner side wall of the wafer basket body 310 , and the wafer 200 is embedded in the wafer basket body 310 through the wafer basket groove 320 .

[0129] The film loading mechanism 100 is fixedly connected to the film basket structure 300 , and the ratio of the average distance D1 between the supporting platforms P0 to the distance D2 between any two adjacent film basket slots 320 along the second direction Y is n:1.

[0130] In the second aspect, an embodiment of the present application provides a wafer carrier mechanism 100. Since it includes the wafer carrier mechanism 100 provided by any embodiment of the first aspect of the present application, it has the beneficial effects of the wafer carrier mechanism 100 provided by any embodiment of the first aspect of the present application, which will not be repeated here.

[0131] At the same time, the wafer loading mechanism 100 and the wafer basket structure 300 can be fixedly connected, and the average spacing D1 matches the spacing D2 between the wafer basket grooves 320. Batch loading can be achieved through a wafer pushing mechanism or manual operation by an operator. The loading operation of all wafers 200 in the wafer basket structure 300 can be completed through at most n batch loadings, thereby reducing the number of operations on the wafers 200, reducing the labor intensity of the operators, reducing the probability of glass powder deposited on the wafer 200 falling off, and improving product yield and output.

[0132] See also Figure 1 and Figures 6 to 8 In some embodiments, the first frame plate 11 of the carrier mechanism 100 further includes a first main body portion 111 and a first clamping portion 115 extending along a first direction X parallel to the plane of the frame structure 10 on one side of the first main body portion 111, and / or the second frame plate 12 further includes a second main body portion 121 and a second clamping portion 125 extending along the first direction X on one side of the second main body portion 121.

[0133] The wafer carrier mechanism 100 is connected to the wafer basket structure 300 by means of the first clamping portion 115 and / or the second clamping portion 125 .

[0134] In these embodiments, the wafer carrier mechanism 100 is clamped and connected to the wafer basket structure 300 via the first clamping portion 115 and / or the second clamping portion 125, so that the wafer carrier mechanism 100 and the wafer basket structure 300 form an integrated structure, thereby avoiding the risk of looseness between the wafer carrier mechanism 100 and the wafer basket structure 300 during the wafer pushing process, which may cause the wafer 200 to fall.

[0135] By providing the first clamping portion 115 and / or the second clamping portion 125 so that the size thereof matches the size of various film basket structures 300 , the film carrier mechanism 100 can be compatible with various film basket structures 300 , and has good compatibility.

[0136] See also Figure 6 , the film carrier mechanism 100 can be adapted to a standard black plastic film basket.

[0137] See also Figure 7 , the wafer carrier mechanism 100 can be adapted to a standard metal sheet basket.

[0138] See also Figure 8 The sheet loading mechanism 100 can be matched with the white Taiflon material sheet basket.

[0139] See also Figures 6 to 8 In some embodiments, the transfer mechanism 1000 also includes a base 400, the base 400 includes a slide groove 410 and a film pusher 420 arranged throughout the base 400, the film pusher 420 protrudes from the surface of the slide groove 410, and the film carrier mechanism 100 and the film basket structure 300 are installed on the base 400 and are slidably connected to the slide groove 410.

[0140] In these embodiments, the film pusher 420 can stably realize mutual film pushing between the film carrier mechanism 100 and the film basket structure 300 .

[0141] Optionally, the film basket structure 300 is disposed between the film pusher 420 and the film carrier mechanism 100 to implement a film pushing operation from the film basket structure 300 to the film carrier mechanism 100 .

[0142] Optionally, the film carrier mechanism 100 is disposed between the film pusher 420 and the film basket structure 300 to implement a film pushing operation from the film carrier mechanism 100 to the film basket structure 300 .

[0143] At the same time, the first cantilever 21 arranged on the same column 22 extends from the column 22 toward the accommodation space S0 in the same direction, the first cantilever 21 arranged on two of the columns 22 extends toward each other, and the first cantilever 21 on the other columns 22 is staggered with the perpendicular midline of the line connecting the two columns 22 extending toward each other. The accommodation space S0 inside the film carrier mechanism 100 also leaves some space to facilitate the film pusher 420 to enter the accommodation space S0 without interfering with the column 22 and the first cantilever 21. The arrangement of the first cantilever 21 can reserve space for the film pusher mechanism or the operator, facilitating the film pusher operation.

[0144] Fig.10 Shows Figure 6 The enlarged structure of the middle push head 422 and the wafer 200.

[0145] See also Figures 6 to 10 In some embodiments, the pusher 420 also includes a protruding body 421 and a pushing head 422 arranged on one side of the protruding body 421. The cross-section of the pushing head 422 along the first direction X parallel to the plane of the frame structure 10 is an arc shape. The width dimension of the pushing head 422 is greater than the length dimension of the flat edge 210 of the wafer 200. The radial dimension of the pushing head 422 is the same as the radial dimension of the wafer 200, and the pushing head 422 also includes a positioning groove 422a set along the first direction X through itself.

[0146] In these embodiments, the size of the pusher head 422 can ensure that the pusher 420 always has a stable contact with the wafer 200 through the pusher head 422, thereby stably realizing the pushing operation. At the same time, the setting of the positioning groove 422a can also provide temporary support for the wafer 200 during the pushing process, avoiding the risk of the wafer 200 falling due to unstable center of gravity, and successfully completing the pushing operation.

[0147] See also Fig. 9 The cross-section of the pusher head 422 is an arc shape. The width of the pusher head 422 is greater than the length of the flat edge 210 of the wafer 200. The radial dimension of the pusher head 422 is the same as the radial dimension of the wafer 200. Even if the flat edge 210 of the wafer 200 is facing the pusher head 422, the pusher head 422 can still contact the wafer 200, so that the pusher head 422 can achieve stable wafer pushing operation when the flat edge 210 of the wafer 200 is set at any position.

[0148] See also Fig.10 In the related art, during the process of pushing the wafer 200 from the wafer basket structure 300 to the wafer carrier mechanism 100, the wafer 200 first contacts a portion of the supporting portion 211. Only the support of the portion of the supporting portion 211 will make the center of gravity of the wafer 200 unstable, thereby causing a risk of the wafer 200 falling during the pushing process.

[0149] The setting of the positioning groove 422a can provide a temporary supporting point for the wafer 200 during the pushing process of the wafer 200. When the wafer 200 is only in contact with a part of the supporting part 211, the wafer 200 can also be stably supported. When the wafer 200 is in contact with all of the supporting parts 211, the wafer 200 is separated from the positioning groove 422a and the pusher 420, thereby achieving smooth loading.

[0150] Optionally, the height dimension of the positioning groove 422 a is 0.5 mm, which can achieve temporary support of multiple wafers 200 .

[0151] Fig.11 The overall structure of a semiconductor production process equipment 2000 provided in an embodiment of the third aspect of the present application is shown.

[0152] See also Fig.11 In a third aspect, an embodiment of the present application provides a semiconductor production process equipment 2000, including a furnace tube 500, a furnace paddle mechanism 600 and any one of the wafer carrier mechanisms 100 provided in the embodiment of the first aspect of the present application.

[0153] The furnace paddle mechanism 600 includes a second cantilever 610 and a transmission structure 620 arranged on the side of the second cantilever 610 away from the furnace tube 500. The transmission structure 620 pushes the second cantilever 610 into the inner cavity of the furnace tube 500 and removes the second cantilever 610 from the inner cavity of the furnace tube 500.

[0154] The wafer carrier mechanism 100 is fixedly connected to the second cantilever 610 .

[0155] On the third aspect, the semiconductor production process equipment 2000 provided in the embodiment of the present application, because it includes the wafer carrier mechanism 100 provided in any embodiment of the first aspect of the present application, has the beneficial effects of the wafer carrier mechanism 100 provided in any embodiment of the first aspect of the present application, which will not be repeated here.

[0156] At the same time, glass powder is deposited on the wafer 200 in the wafer carrier mechanism 100, and the wafer 200 is sintered through the semiconductor production process equipment 2000. Compared with the prior art, the wafer carrier mechanism 100 has a smaller overall size and an increased wafer carrying capacity, thereby improving output and production efficiency while improving product yield.

[0157] As the overall size of the wafer carrier 100 is reduced, the second cantilever 610 can be arranged closer to the center of the inner cavity of the furnace tube 500, so that the risk of interference between the wafer carrier 100 and the inner cavity side wall of the furnace tube 500 is further reduced, thereby improving product yield.

[0158] The pillars 22 on the wafer carrier mechanism 100 can also reduce the wind direction of the wafer 200 sliding down from one side of the pillars 22 when the wafer 200 is pushed and pulled out by the second cantilever 610, which also improves the product yield.

[0159] Please continue reading Figure 1 and Fig.11 In some embodiments, the first frame plate 11 of the carrier mechanism 100 further includes a first main body portion 111 and a first foot 114 disposed on a side of the first main body portion 111 away from the second frame plate 12, and / or the second frame plate 12 further includes a second main body portion 121 and a second foot 124 disposed on a side of the second main body portion 121 away from the first frame plate 11.

[0160] The wafer carrier mechanism 100 is connected to the second cantilever 610 by means of the first foot 114 and / or the second foot 124 .

[0161] In these embodiments, the wafer carrier mechanism 100 is positioned on the second cantilever 610 by the first foot 114 and / or the second foot 124, while being snap-connected to the second cantilever 610. The first foot 114 and / or the second foot 124 can ensure that the wafer carrier mechanism 100 is firmly disposed at the center of the furnace paddle mechanism 600, thereby preventing the wafer carrier mechanism 100 from contacting the edge of the paddle board, thereby also avoiding the problem of edge dimension testing required when replacing the wafer carrier mechanism 100.

[0162] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A wafer carrier mechanism for carrying a wafer, characterized in that: include: The frame structure includes a first frame plate and a second frame plate arranged opposite to each other in a second direction; A column structure is connected to the first frame plate and the second frame plate, and the column structure includes a plurality of columns and a plurality of first cantilevers arranged on each of the columns. The plurality of columns extend along the second direction and are arranged at intervals from each other. The plurality of columns and the first frame plate and the second frame plate define a storage space. Each of the first cantilevers extends from the column toward the storage space, and a bearing portion is provided at the end of each of the first cantilevers away from the column. The bearing portions of the first cantilevers on the same plane on each of the columns jointly form a support platform for carrying at least one wafer, and there is an average spacing between each of the support platforms.

2. The slide carrier mechanism according to claim 1, characterized in that: The average spacing between the supporting platforms is 8.95-9.52 mm.

3. The slide carrier mechanism according to claim 1, characterized in that: The connecting line between the orthographic projections of the multiple columns on the first frame plate along the second direction is a triangle or a polygon, the distance between at least two adjacent columns is greater than the radial dimension of the wafer, the orthographic projections of the multiple columns on the first frame plate along the second direction are located on the same first circular arc line, and the radial dimension of the first circular arc line is greater than the radial dimension of the wafer to be carried.

4. The slide carrier mechanism according to claim 3, characterized in that: The connecting line between the bearing parts located on the same supporting platform is in the form of a triangle or a polygon, the bearing parts are located on the same second arc line, and after the supporting platform carries the wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the bearing parts, and the second arc line with the maximum radial dimension is tangent to the flat edge of the wafer.

5. The slide carrier mechanism according to claim 4, characterized in that: The first cantilever arranged on the same column extends from the column toward the accommodating space in the same direction, the first cantilevers arranged on two of the columns extend toward each other, and the first cantilever on the other column is staggered with the perpendicular midline of the line connecting the two columns extending toward each other by the first cantilever.

6. The slide carrier mechanism according to claim 1, characterized in that: The bearing part is a sphere, and the radial dimension of the bearing part does not exceed 5 mm.

7. The slide carrier mechanism according to claim 1, characterized in that: The first frame plate further includes a first vent hole disposed through the first frame plate, and / or, The second frame plate also includes a second vent hole disposed through the second frame plate.

8. The slide carrier mechanism according to claim 4, characterized in that: The first frame plate further comprises a first body portion and a plurality of first protrusions arranged on a side of the first body portion close to the second frame plate, the connecting line between the first protrusions is a triangle or a polygon, the first protrusions are located on the same second arc line, and after the first protrusions carry the wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the first protrusions, the second arc line of the maximum radial dimension is tangent to the flat edge of the wafer, and / or, The second frame plate also includes a second main body and a plurality of second protrusions arranged on the second main body near the first frame plate, the connecting line between the second protrusions is a triangle or a polygon, the second protrusions are located on the same second arc line, and after the second protrusions carry the wafer, the center of the wafer is located within the triangle or polygon determined by the connecting line between the second protrusions, and the second arc line with the largest radial dimension is tangent to the flat edge of the wafer.

9. The slide carrier mechanism according to claim 1, characterized in that: The first frame plate further comprises a first body portion and a first foot disposed on a side of the first body portion away from the second frame plate, and / or, The second frame plate further includes a second body portion and a second foot disposed on a side of the second body portion away from the first frame plate.

10. The slide carrier mechanism according to claim 1, characterized in that: The first frame plate further includes a first main body portion and a first clamping portion extending along a first direction parallel to a plane of the frame structure on one side of the first main body portion, and / or, The second frame plate further includes a second main body portion and a second clamping portion extending along the first direction at one side of the second main body portion.

11. A transfer mechanism, used to transfer wafers in a wafer basket structure to the wafer carrier mechanism, characterized in that: include: The wafer basket structure comprises a wafer basket body and a wafer basket groove, wherein the wafer basket groove is arranged on the inner side wall of the wafer basket body, and the wafer is embedded in the wafer basket body through the wafer basket groove; The film loading mechanism described in any one of claims 1 to 10 is fixedly connected to the film basket structure, and the ratio between the average spacing between each of the supporting platforms and the spacing between any two adjacent film basket grooves along the second direction is n:

1.

12. The transfer mechanism according to claim 11, characterized in that: The first frame plate of the film carrier mechanism further comprises a first main body portion and a first clamping portion extending on one side of the first main body portion along a first direction parallel to the plane of the frame structure, and / or, The second frame plate further includes a second body portion and a second clamping portion extending along the first direction at one side of the second body portion; The film loading mechanism is connected to the film basket structure by means of the first clamping portion and / or the second clamping portion.

13. The transfer mechanism according to claim 11, characterized in that: It also includes a base, which includes a slide groove and a film pusher that runs through the base. The film pusher is protruding from the surface of the slide groove. The film carrier mechanism and the film basket structure are installed on the base and are slidably connected to the slide groove.

14. The transfer mechanism according to claim 13, characterized in that: The pusher also includes a protruding body and a pushing head arranged on one side of the protruding body, the cross-section of the pushing head along the first direction parallel to the plane of the frame structure is an arc shape, the width dimension of the pushing head is greater than the length dimension of the flat edge of the wafer, the radial dimension of the pushing head is the same as the radial dimension of the wafer, and the pushing head also includes a positioning groove arranged through itself along the first direction.

15. A semiconductor production process equipment, characterized in that: include: Furnace pipes; A furnace paddle mechanism, comprising a second cantilever and a transmission structure arranged on a side of the second cantilever away from the furnace tube, wherein the transmission structure pushes the second cantilever into the inner cavity of the furnace tube and withdraws the second cantilever from the inner cavity of the furnace tube; The wafer carrier mechanism according to any one of claims 1 to 10 is fixedly connected to the second cantilever.

16. The semiconductor production process equipment according to claim 15, characterized in that: The first frame plate of the film carrier mechanism further comprises a first body portion and a first foot disposed on a side of the first body portion away from the second frame plate, and / or, The second frame plate further comprises a second body portion and a second foot disposed on a side of the second body portion away from the first frame plate; The wafer carrier mechanism is connected to the second cantilever by the first foot and / or the second foot.

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