PCB layout design method and system based on heat dissipation optimization

Abstract

The invention discloses a PCB layout design method and system based on heat dissipation optimization, and the method comprises the steps: carrying out the logic design and electrical performance analysis of a to-be-optimized PCB, and obtaining a preliminarily optimized PCB; performing simulation analysis on the preliminarily optimized PCB to obtain an optimization analysis result of the PCB; performing wiring optimization and multilayer board optimization on the preliminarily optimized PCB according to an optimization analysis result of the PCB to obtain an optimized PCB; and performing verification analysis on the optimized PCB according to an electrical design rule to obtain a final optimized PCB. According to the embodiment of the invention, the electromagnetic interference can be reduced, the electromagnetic compatibility and the heat dissipation capability of the circuit are improved, and the stable transmission of signals is realized. The method can be widely applied to the technical field of electronic circuit layout design.

Description

Technical Field

[0001] The present application relates to the technical field of electronic circuit layout design, and in particular to a PCB board layout design method and system based on heat dissipation optimization. Background Art

[0002] As electronic devices develop towards high performance and miniaturization, PCB (printed circuit board) design becomes increasingly complex. In modern electronic devices, requirements such as high-speed data transmission, signal integrity, electromagnetic compatibility, and heat dissipation management continue to increase, making the layout and design of PCB not only the physical arrangement of components, but also involving complex electrical and thermal analysis. In high-speed signal transmission applications, such as DDR, PCIe, USB, and HDMI interfaces, the signal integrity and electromagnetic interference requirements are extremely high; at the same time, the heat dissipation performance directly affects the long-term stability of the circuit.

[0003] However, existing PCB designs are often prone to problems such as poor signal integrity, delay mismatch, and signal reflection when dealing with high-speed signal transmission, resulting in data loss and performance degradation. In addition, due to the increase in electromagnetic interference, crosstalk and noise interference are prone to occur in the circuit, affecting the electromagnetic compatibility of the circuit. In high-power applications, existing heat dissipation designs are often not optimized, resulting in overheating, performance degradation, and even damage to components. In addition, existing PCB designs usually lack reasonable separation of the power layer and the ground layer, resulting in power supply noise coupling to the signal line, further affecting the stability of signal transmission.

[0004] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the invention

[0005] The main purpose of the embodiments of the present application is to propose a PCB board layout design method and system based on heat dissipation optimization, which can reduce electromagnetic interference, improve the electromagnetic compatibility and heat dissipation capability of the circuit, and thus achieve stable signal transmission.

[0006] To achieve the above object, one aspect of an embodiment of the present application proposes a PCB board layout design method based on heat dissipation optimization, the method comprising:

[0007] Perform logic design and electrical performance analysis on the PCB to be optimized to obtain a preliminary optimized PCB;

[0008] Performing simulation analysis on the preliminarily optimized PCB circuit board to obtain optimization analysis results of the PCB circuit board, wherein the optimization analysis results of the PCB circuit board include signal integrity analysis results of the PCB circuit board, thermal analysis results of the PCB circuit board, and electromagnetic compatibility analysis results of the PCB circuit board;

[0009] According to the optimization analysis result of the PCB circuit board, the wiring optimization and multilayer board optimization are performed on the initially optimized PCB circuit board to obtain an optimized PCB circuit board;

[0010] The optimized PCB circuit board is verified and analyzed according to electrical design rules to obtain a final optimized PCB circuit board.

[0011] In some embodiments, the step of performing logic design and electrical performance analysis on the PCB circuit board to be optimized to obtain a preliminarily optimized PCB circuit board includes:

[0012] The PCB circuit board to be optimized is divided into units to obtain a power supply unit, a signal processing unit and an output unit;

[0013] Performing logic design and electrical performance analysis on the power supply unit to obtain a preliminarily optimized power supply unit, wherein the logic design of the power supply unit includes a voltage stabilization circuit, a buck and boost converter, and the electrical performance analysis of the power supply unit includes input and output voltages, current fluctuations, and conversion efficiency;

[0014] Performing logic design and electrical performance analysis on the signal processing unit to obtain a preliminarily optimized signal processing unit, wherein the logic design of the signal processing unit includes an amplifier, a filter, and an analog-to-digital converter, and the electrical performance analysis of the signal processing unit includes signal distortion, phase delay, and frequency response parameters;

[0015] Performing logic design and electrical performance analysis on the output unit to obtain a preliminarily optimized output unit, wherein the logic design of the output unit includes configuration of a driver, a current source, and a voltage source, and the electrical performance analysis of the output unit includes output impedance, output power, and signal bandwidth;

[0016] The preliminary optimized PCB circuit board is obtained by combining the preliminary optimized power supply unit, the preliminary optimized signal processing unit and the preliminary optimized output unit.

[0017] In some embodiments, the performing simulation analysis on the preliminarily optimized PCB circuit board to obtain the optimization analysis result of the PCB circuit board includes:

[0018] Performing signal integrity analysis and power integrity analysis on the preliminarily optimized PCB circuit board by using a time domain reflectometer and an S-parameter analysis method to obtain a signal integrity analysis result of the PCB circuit board;

[0019] Performing high power density area identification processing on the preliminarily optimized PCB circuit board by a thermal analysis method to obtain a thermal analysis result of the PCB circuit board;

[0020] Performing electromagnetic compatibility optimization on the preliminarily optimized PCB circuit board by an electromagnetic simulation method to obtain an electromagnetic compatibility analysis result of the PCB circuit board;

[0021] The optimization analysis result of the PCB circuit board is obtained by combining the signal integrity analysis result of the PCB circuit board, the thermal analysis result of the PCB circuit board and the electromagnetic compatibility analysis result of the PCB circuit board.

[0022] In some embodiments, the signal integrity analysis and power integrity analysis of the preliminarily optimized PCB circuit board are performed by time domain reflectometry and S parameter analysis method to obtain the signal integrity analysis result of the PCB circuit board, including:

[0023] Performing impedance identification on the signal reflection of the preliminarily optimized PCB circuit board by a time domain reflectometer to obtain a signal reflection analysis result;

[0024] Performing a frequency response analysis of signal transmission on the preliminarily optimized PCB circuit board by an S parameter analysis method to obtain a signal transmission frequency response analysis result;

[0025] Performing power integrity analysis on the preliminarily optimized PCB circuit board by using a power distribution network simulation tool to obtain a power integrity analysis result;

[0026] The signal reflection analysis result, the signal transmission frequency response analysis result and the power integrity analysis result are combined to obtain the signal integrity analysis result of the PCB circuit board.

[0027] In some embodiments, the high power density area identification process is performed on the preliminarily optimized PCB circuit board by a thermal analysis method to obtain a thermal analysis result of the PCB circuit board, including:

[0028] Performing thermal analysis on the preliminarily optimized PCB circuit board by using a thermal simulation tool to obtain a high power density area;

[0029] Increasing the copper foil thickness, arranging heat dissipation holes and applying high thermal conductivity materials in the high power density area to obtain a PCB circuit board after heat dissipation pretreatment;

[0030] Performing thermal simulation on the PCB circuit board after the heat dissipation pretreatment to obtain a thermal analysis result of the PCB circuit board.

[0031] In some embodiments, the electromagnetic compatibility optimization of the preliminarily optimized PCB circuit board by an electromagnetic simulation method to obtain an electromagnetic compatibility analysis result of the PCB circuit board includes:

[0032] Performing electromagnetic radiation and conduction noise analysis on the initially optimized PCB circuit board by using an electromagnetic simulation tool to construct an electromagnetic model of the PCB circuit board;

[0033] Based on the high electromagnetic radiation area of ​​the PCB circuit board electromagnetic model, an electromagnetic radiation shielding process is performed to obtain a shielded PCB circuit board electromagnetic model;

[0034] Based on the high noise signal area of ​​the PCB circuit board electromagnetic model, a ground plane optimization design and a signal stacking design are performed to obtain an optimized PCB circuit board electromagnetic model;

[0035] The electromagnetic compatibility analysis result of the PCB circuit board is obtained by combining the shielded PCB circuit board electromagnetic model with the optimized PCB circuit board electromagnetic model.

[0036] In some embodiments, performing wiring optimization and multilayer board optimization on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board includes:

[0037] According to the optimization analysis result of the PCB circuit board, a wiring optimization design is performed on the initially optimized PCB circuit board to obtain a wiring optimized PCB circuit board;

[0038] Performing multi-layer PCB optimization design on the preliminarily optimized PCB circuit board by using a geoelectric separation method to obtain a multi-layer optimized PCB circuit board;

[0039] The optimized PCB circuit board is obtained by combining the wiring-optimized PCB circuit board with the multi-layer optimized PCB circuit board.

[0040] In some embodiments, performing wiring optimization design on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain a PCB circuit board with optimized wiring includes:

[0041] According to the optimization analysis result of the PCB circuit board, differential wiring design, equal-length wiring design and inner-layer wiring design are performed on the preliminarily optimized PCB circuit board to obtain a preliminarily wiring-optimized PCB circuit board;

[0042] The power supply and ground layer are separated from the preliminary wiring-optimized PCB circuit board to obtain the wiring-optimized PCB circuit board.

[0043] In some embodiments, the method of performing multi-layer PCB optimization design on the preliminarily optimized PCB circuit board by using the geoelectric separation method to obtain a multi-layer optimized PCB circuit board includes:

[0044] The preliminarily optimized PCB circuit board is divided into a signal layer, a ground layer and a power layer;

[0045] The ground layer and the power layer are physically separated by a geoelectric separation method, the power layer is designed as a distributed power surface, and a return path is provided for the signal layer through an adjacent ground layer to obtain the multi-layer optimized PCB circuit board.

[0046] To achieve the above object, another aspect of the embodiment of the present application provides a PCB board layout design system based on heat dissipation optimization, the system comprising:

[0047] The first module is used to perform logic design and electrical performance analysis on the PCB circuit board to be optimized to obtain a preliminarily optimized PCB circuit board;

[0048] The second module is used to perform simulation analysis on the preliminarily optimized PCB circuit board to obtain an optimization analysis result of the PCB circuit board, wherein the optimization analysis result of the PCB circuit board includes a signal integrity analysis result of the PCB circuit board, a thermal analysis result of the PCB circuit board, and an electromagnetic compatibility analysis result of the PCB circuit board;

[0049] The third module is used to perform wiring optimization and multilayer board optimization on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board;

[0050] The fourth module is used to verify and analyze the optimized PCB circuit board according to electrical design rules to obtain a final optimized PCB circuit board.

[0051] The embodiments of the present application include at least the following beneficial effects: The present application provides a PCB board layout design method and system based on heat dissipation optimization. The scheme effectively reduces crosstalk, reflection and delay differences in the signal transmission process by performing logic design and electrical performance analysis on the PCB circuit board to be optimized, ensuring the synchronization and stability of high-speed signals, and then performing simulation analysis on the preliminarily optimized PCB circuit board to obtain the optimization analysis results of the PCB circuit board, further reducing electromagnetic interference and improving the electromagnetic compatibility of the circuit. Finally, according to the optimization analysis results of the PCB circuit board, the wiring optimization and multi-layer board optimization of the preliminarily optimized PCB circuit board are performed, and reasonable component layout, heat dissipation channel design and high-efficiency heat dissipation materials are adopted to further improve the heat dissipation capacity of the PCB. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a flow chart of a PCB board layout design method based on heat dissipation optimization provided in an embodiment of the present application;

[0053] Figure 2It is a structural schematic diagram of a PCB board layout design system based on heat dissipation optimization provided in an embodiment of the present application. DETAILED DESCRIPTION

[0054] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of the present application. They are only examples of systems and methods consistent with some aspects of the embodiments of the present application as detailed in the attached claims.

[0055] It is understood that the terms "first", "second", etc. used in this application can be used to describe various concepts in this article, but unless otherwise specified, these concepts are not limited by these terms. These terms are only used to distinguish one concept from another concept. For example, without departing from the scope of the embodiment of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the words "if" and "if" as used herein can be interpreted as "at the time of" or "when" or "in response to determination".

[0056] The terms "at least one", "multiple", "each", "any", etc. used in this application, at least one includes one, two or more, multiple includes two or more, each refers to each of the corresponding multiple, and any refers to any one of the multiple.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0058] Reference Figure 1 , Figure 1 A flow chart of a PCB board layout design method based on heat dissipation optimization provided by an embodiment of the present invention, referring to Figure 1 , the method comprises the following steps:

[0059] S100, performing logic design and electrical performance analysis on the PCB circuit board to be optimized, and obtaining a preliminarily optimized PCB circuit board;

[0060] Specifically, design the functional units of the circuit: according to the functional requirements of the circuit, divide the circuit into multiple functional units, the multiple functional units include power supply units, signal processing units and output units, and perform preliminary logic design and electrical performance analysis on the circuit of each unit.

[0061] It should be noted that, in some embodiments, step S100 may include: S110, performing unit division processing on the PCB circuit board to be optimized to obtain a power supply unit, a signal processing unit and an output unit;

[0062] S120, performing logic design and electrical performance analysis on the power supply unit to obtain a preliminarily optimized power supply unit, wherein the logic design of the power supply unit includes a voltage stabilization circuit, a buck and boost converter, and the electrical performance analysis of the power supply unit includes input and output voltages, current fluctuations, and conversion efficiency;

[0063] In this embodiment, a power management circuit is designed for the power supply unit, and a preliminary logic design is performed. The logic design of the power supply unit includes a voltage stabilization circuit, a buck and boost converter to ensure that the power supply provides stable voltage and current. The electrical performance analysis includes input and output voltages, current fluctuations and conversion efficiency to ensure that the power supply unit has the characteristics of high efficiency and low noise.

[0064] S130, performing logic design and electrical performance analysis on the signal processing unit to obtain a preliminarily optimized signal processing unit, wherein the logic design of the signal processing unit includes an amplifier, a filter, and an analog-to-digital converter, and the electrical performance analysis of the signal processing unit includes signal distortion, phase delay, and frequency response parameters;

[0065] In this embodiment, logic design is performed for the signal processing unit to ensure that the connection and transmission path between each signal processing module are clear. The logic design includes amplifiers, filters and analog-to-digital converters. The electrical performance analysis includes signal distortion, phase delay and frequency response parameters that occur during the signal processing process to ensure the integrity and accuracy of signal transmission.

[0066] S140, performing logic design and electrical performance analysis on the output unit to obtain a preliminarily optimized output unit, wherein the logic design of the output unit includes configuration of a driver, a current source, and a voltage source, and the electrical performance analysis of the output unit includes output impedance, output power, and signal bandwidth;

[0067] In this embodiment, for the output unit, the logic circuit of the output unit is designed to ensure that the output signal can meet the expected operating requirements. The logic design of the output unit includes the configuration of the driver, current source or voltage source. The electrical performance analysis includes output impedance, output power and signal bandwidth to ensure that the power and frequency of the output signal meet the application requirements.

[0068] S150, combining the preliminarily optimized power supply unit, the preliminarily optimized signal processing unit and the preliminarily optimized output unit to obtain a preliminarily optimized PCB circuit board.

[0069] In this embodiment, the designs of the power supply unit, signal processing unit and output unit are integrated to verify whether the logic design of each unit meets the overall circuit requirements and ensure that the signal transmission and electrical performance between the units match. By analyzing the logic design and electrical performance of the power supply unit, signal processing unit and output unit, the efficient operation of each functional module can be ensured and the overall functional requirements and performance goals of the circuit can be achieved.

[0070] S200, performing simulation analysis on the preliminarily optimized PCB circuit board to obtain an optimization analysis result of the PCB circuit board, wherein the optimization analysis result of the PCB circuit board includes a signal integrity analysis result of the PCB circuit board, a thermal analysis result of the PCB circuit board, and an electromagnetic compatibility analysis result of the PCB circuit board;

[0071] Specifically, circuit simulation and signal integrity analysis: perform electrical simulation on the designed circuit, analyze the signal integrity and power integrity during high-speed signal transmission, and use time domain reflectometry and S-parameter analysis methods to identify possible signal reflection, crosstalk and impedance mismatch problems.

[0072] Thermal analysis and heat dissipation optimization: Perform thermal analysis on the PCB layout to identify high power density areas. Optimize the heat dissipation performance of the PCB by increasing heat dissipation channels, designing component locations, and using appropriate heat dissipation materials to ensure the long-term stability of the circuit.

[0073] Electromagnetic compatibility optimization: Based on electromagnetic simulation analysis of PCB's electromagnetic radiation and conducted noise, shielding, ground plane optimization, and signal stacking design measures are adopted to reduce PCB's electromagnetic interference and electromagnetic sensitivity and improve the system's electromagnetic compatibility.

[0074] It should be noted that, in some embodiments, step S200 may include:

[0075] S210, performing signal integrity analysis and power integrity analysis on the preliminarily optimized PCB circuit board by using a time domain reflectometer and an S parameter analysis method, and obtaining a signal integrity analysis result of the PCB circuit board;

[0076] Specifically, step S210 may include: S211, performing impedance identification on the signal reflection of the preliminarily optimized PCB circuit board through a time domain reflectometer to obtain a signal reflection analysis result; S212, performing frequency response analysis of signal transmission on the preliminarily optimized PCB circuit board through an S parameter analysis method to obtain a signal transmission frequency response analysis result; S213, performing power integrity analysis on the preliminarily optimized PCB circuit board through a power distribution network simulation tool to obtain a power integrity analysis result; S214, combining the signal reflection analysis result, the signal transmission frequency response analysis result and the power integrity analysis result to obtain a signal integrity analysis result of the PCB circuit board.

[0077] In this embodiment, electrical simulation is performed on the designed circuit, and the transmission characteristics of the high-speed signal are analyzed in detail using simulation software to evaluate potential problems in the signal transmission path under high-frequency conditions to ensure signal integrity and power integrity. During the simulation process, a model between the signal source and the receiving end is established, and the simulation environment takes into account the actual operating frequency and electrical load conditions.

[0078] The signal reflection is analyzed using a time domain reflectometer, which is used to detect impedance changes in PCB circuits. By measuring the waveform and intensity of the reflected signal, the location and degree of impedance mismatch can be identified. The measurement results of the time domain reflectometer are calculated as:

[0079]

[0080] In the above formula, V ref (t) represents the reflected voltage, V0 is the input signal voltage, Z L is the load impedance, and Z0 is the characteristic impedance of the transmission line.

[0081] The frequency response of high-speed signal transmission is analyzed by S parameters, and the reflection and transmission characteristics of signals in the circuit are analyzed by S parameters (scattering parameters), focusing on S11 (reflection coefficient) and S21 (transmission coefficient) to quantify the signal reflection and signal transmission performance of each signal path. The S parameters are described by a matrix, which is expressed as:

[0082]

[0083] In the above formula, S 11 is the reflection coefficient of the input port, S 21 It represents the transmission coefficient from the input to the output port. Its value is analyzed to see whether it is within the allowable range of the design to evaluate the impedance matching of the circuit.

[0084] Analyze the power integrity and use the power distribution network simulation tool to evaluate the power supply's noise suppression capability and voltage stability. The power integrity analysis includes the power supply's impedance characteristics, load response, and coupling issues between the power supply and the signal to ensure the stability of the power supply under different load conditions.

[0085] Based on the simulation results, the problems of signal reflection, crosstalk and impedance mismatch are identified, and optimization suggestions are put forward, such as adjusting the impedance matching of the transmission line, optimizing the power distribution, adding decoupling capacitors and other measures to improve signal integrity and power integrity. Through simulation tools, time domain reflectometry and S parameter analysis methods, problems such as signal reflection, impedance mismatch and crosstalk that occur during high-speed signal transmission can be effectively identified and solved, thereby ensuring the integrity and stability of the signal and power supply in the circuit.

[0086] S220, performing high power density area identification processing on the preliminarily optimized PCB circuit board by a thermal analysis method to obtain a thermal analysis result of the PCB circuit board;

[0087] Specifically, step S220 may include: S221, performing thermal analysis on the preliminarily optimized PCB circuit board through a thermal simulation tool to obtain a high power density area; S222, increasing the copper foil thickness, arranging heat dissipation holes and applying high thermal conductivity materials in the high power density area to obtain a PCB circuit board after heat dissipation pretreatment; S223, performing thermal simulation on the PCB circuit board after heat dissipation pretreatment to obtain a thermal analysis result of the PCB circuit board. S230, performing electromagnetic compatibility optimization on the preliminarily optimized PCB circuit board through an electromagnetic simulation method to obtain an electromagnetic compatibility analysis result of the PCB circuit board;

[0088] In this embodiment, a thermal simulation tool (such as finite element analysis software) is used to perform thermal analysis on the PCB layout, a thermal model of the circuit is established when it is working, and the temperature distribution of components under different working conditions is evaluated. Through simulation analysis, high power density areas are identified, and overheated components and locations are determined.

[0089] For high power density areas, heat dissipation channels are designed to optimize the heat conduction path on the PCB. The heat dissipation channels improve the heat dissipation efficiency by increasing the copper foil thickness, arranging heat dissipation holes and using thermal vias in high power areas, and guide the heat to the heat dissipation area of ​​the PCB.

[0090] Design the component positions to ensure that high-heat components (such as power resistors and power diodes) are away from sensitive components (such as integrated circuits, sensors and capacitors) and heat-sensitive components (such as capacitors, integrated circuits, etc.), while ensuring that the heat conduction path is as short as possible. For components that generate a lot of heat, such as power transistors and processors, place them in areas with better heat dissipation conditions and as close to the heat dissipation channel as possible.

[0091] Select high thermal conductivity materials, such as copper, aluminum substrates, graphite sheets, thermally conductive silicone pads or heat pipes to improve heat dissipation performance. For local high temperature areas, use dedicated heat dissipation devices, such as heat sinks or fans.

[0092] The optimized layout is thermally simulated again to verify the heat dissipation effect. The temperature distribution of components and the thermal resistance of the heat dissipation path are evaluated through simulation to ensure that the temperature of the components is within a safe range during long-term operation of the circuit. The layout of components and the application of heat dissipation materials are further adjusted based on the simulation results. The high-temperature area is identified through thermal analysis and reasonable heat dissipation design measures are taken to effectively optimize the heat dissipation performance of the PCB and ensure the long-term stability and reliability of the circuit under high power density working conditions.

[0093] Specifically, step S230 may include: S231, using electromagnetic simulation tools to analyze electromagnetic radiation and conducted noise of the preliminarily optimized PCB circuit board, and constructing an electromagnetic model of the PCB circuit board; S232, based on the high electromagnetic radiation area of ​​the PCB circuit board electromagnetic model, performing electromagnetic radiation shielding processing to obtain the shielded PCB circuit board electromagnetic model; S233, based on the high noise signal area of ​​the PCB circuit board electromagnetic model, performing ground plane optimization design and signal stacking design to obtain the optimized PCB circuit board electromagnetic model; S234, combining the shielded PCB circuit board electromagnetic model with the optimized PCB circuit board electromagnetic model to obtain the electromagnetic compatibility analysis result of the PCB circuit board. S240, combining the signal integrity analysis result of the PCB circuit board, the thermal analysis result of the PCB circuit board, and the electromagnetic compatibility analysis result of the PCB circuit board to obtain the optimization analysis result of the PCB circuit board.

[0094] In some specific embodiments, the electromagnetic radiation and conducted noise of the PCB are analyzed based on electromagnetic simulation tools, an electromagnetic model of the PCB is established, the electromagnetic radiation intensity and noise conduction path of each component and signal line at different frequencies are evaluated, the electromagnetic interference source of high-speed signal lines and power distribution networks is focused on, and electromagnetic sensitive areas are identified.

[0095] In areas with high electromagnetic radiation intensity, shielding measures should be adopted, using metal shielding covers, conductive coatings or shielding films to cover noise sources or sensitive devices to reduce electromagnetic radiation. The shielding covers should be connected through ground planes or grounding points to ensure shielding effects while avoiding the formation of new electromagnetic coupling paths.

[0096] Optimize the ground plane design to ensure the continuity and integrity of the ground layer. Design the ground plane as a large-area separate layer to avoid floating grounding in the signal return path, reduce ground noise and loop current, provide an independent return path for high-speed signal lines, and avoid electromagnetic interference introduced by signals through long loop grounding.

[0097] Adopt signal stacking design, design the positions of signal layer, ground layer and power layer. For key high-speed signal lines, ensure that they are close to the ground layer to reduce electromagnetic radiation. Through the multi-layer board structure, the transmission path of high-speed signals is routed on the inner layer, and the outer layer provides shielding function to reduce the coupling between the signal and the external electromagnetic environment.

[0098] For the power distribution network, decoupling capacitors and filtering circuits are used to reduce the conduction of power noise, optimize the distribution of power and ground layers, avoid coupling of power noise to sensitive signal lines, and reduce the propagation of high-frequency noise.

[0099] By performing electromagnetic simulation on the optimized PCB again, the improvement effect of electromagnetic radiation and conducted noise is verified, and the shielding material, ground plane design and stacking structure are adjusted according to the simulation results to ensure that the system meets the electromagnetic compatibility (EMC) requirements; through electromagnetic simulation analysis and optimization of shielding, ground plane and signal stacking design, electromagnetic interference and noise can be effectively reduced, the electromagnetic compatibility of the PCB system can be improved, and its stability and anti-interference ability in complex electromagnetic environments can be ensured.

[0100] S300, performing wiring optimization and multilayer board optimization on the initially optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board;

[0101] Specifically, according to the requirements of signal integrity and electromagnetic compatibility, PCB wiring optimization is carried out, and differential wiring, equal-length wiring and inner-layer routing design strategies are adopted for key high-speed signal lines. Key high-speed signal lines include DDR signal lines, PCIe signal lines and USB signal lines to ensure the stability and reliability of signal transmission. In the multi-layer PCB design, the positions of the signal layer, ground layer and power layer are designed, and ground electrical separation technology is used to reduce power supply noise coupling, and the stacking structure is optimized to ensure low-noise transmission of high-speed signals.

[0102] It should be noted that, in some embodiments, step S300 may include: S310, performing wiring optimization design on the initially optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain a PCB circuit board with optimized wiring;

[0103] Specifically, step S310 may include: S311, according to the optimization analysis result of the PCB circuit board, performing differential wiring design, equal length wiring design and inner layer routing design on the preliminary optimized PCB circuit board to obtain a preliminary wiring optimized PCB circuit board; S312, performing power supply and ground layer separation processing on the preliminary wiring optimized PCB circuit board to obtain a wiring optimized PCB circuit board. S320, performing multi-layer PCB optimization design on the preliminary optimized PCB circuit board by using the ground electrical separation method to obtain a multi-layer optimized PCB circuit board;

[0104] In this embodiment, a differential wiring design is adopted for high-speed signal lines, and key high-speed signal pairs (such as USB signal pairs, HDMI signal pairs, and Ethernet signal pairs) are transmitted through two adjacent signal lines to ensure strict symmetry between the signal lines. The signal paths of the differential pairs have the same length to offset external interference and common-mode noise. The spacing between the differential signal lines remains constant, and the spacing design formula is expressed as:

[0105]

[0106] Where d is the spacing between differential signal lines, h is the height between the signal line and the ground plane, ∈ r The dielectric constant of the PCB material is used to reduce the coupling and noise interference between differential signals through precise spacing control;

[0107] Perform equal-length wiring design for key high-speed signal lines (such as USB signal lines, HDMI signal lines, and LVDS signal lines) to ensure that the signals have the same delay during transmission and avoid signal synchronization problems caused by length differences. The formula for equal-length wiring is expressed as:

[0108]

[0109] Among them, Δt is the time difference of signal propagation, L is the length of the signal line, and v is the propagation speed of the signal in the PCB. By adjusting the length of the key signal line, the propagation time is kept consistent to avoid phase difference and data loss during high-speed signal transmission;

[0110] The inner layer routing design is adopted to arrange high-speed signal lines (such as USB signal lines and HDMI signal lines) on the inner layer of the PCB, and the upper and lower ground planes are used for shielding to reduce the impact of external electromagnetic interference on the signal, ensure the stability of the electromagnetic environment of the signal transmission path, and keep the signal routing close to the ground layer to further improve the anti-interference ability; provide an independent ground loop for the signal line to ensure the shortest return path of the signal, reduce the noise caused by parasitic inductance and capacitance in the signal loop, use multiple decoupling capacitors and filter components distributed on the circuit board to reduce the impact of power supply noise on key signals; divide the power supply and ground layers in the signal line routing area to avoid power supply noise interfering with signal transmission, ensure that high-frequency signal routing is away from the power distribution area, and reduce unnecessary power supply coupling interference on the signal; through differential routing, equal-length routing and inner layer routing design strategies, the stability and reliability of high-speed signal transmission can be effectively guaranteed, the impact of noise and electromagnetic interference on the signal can be reduced, and the electrical performance and anti-interference ability of the overall PCB can be improved.

[0111] Specifically, step S320 may include: S321, dividing the initially optimized PCB circuit board to obtain a signal layer, a ground layer and a power layer; S322, physically separating the ground layer and the power layer by a ground-electric separation method, designing the power layer as a distributed power plane, and providing a return path for the signal layer through an adjacent ground layer to obtain a multi-layer optimized PCB circuit board. S330, combining the wiring optimized PCB circuit board with the multi-layer optimized PCB circuit board to obtain an optimized PCB circuit board.

[0112] In some specific embodiments, in a multi-layer PCB design, the function of each layer is accurately planned. In order to ensure the integrity of the signal and the stability of the power supply, the positions of the signal layer, the ground layer and the power layer are designed. The signal layer and the ground layer are closely adjacent, and the power layer and the ground layer are separated from each other to reduce the interference of power supply noise on the signal;

[0113] Adopt ground electrical separation technology to physically separate the power layer and the ground layer to prevent power noise from coupling to the key signal path in the ground layer through the power layer. In the design of the power layer, avoid directly passing through the high-frequency signal area, try to keep the power line away from the key signal line, and use decoupling capacitors to isolate the high-frequency noise coupling between the power layer and the signal layer; optimize the stacking structure to ensure low-noise transmission of high-speed signals. The stacking sequence is designed as follows: sandwich the key high-speed signal layer between two ground layers (i.e., "ground-signal-ground" structure), use the ground layer to shield the signal layer, and reduce external electromagnetic interference. For multi-signal layer design, set the adjacent signal layers to orthogonal wiring to reduce crosstalk; ensure the low impedance characteristics of the power layer. In multi-layer PCBs, design the power layer as a large-area distributed power surface, avoid using thin and long power lines, and use power return Circuit design can reduce impedance and power supply noise, ensure stable power supply, and improve the stability of high-frequency signal transmission; provide dedicated signal layers for key high-speed signals (such as PCIe, DDR and USB signals) to ensure that these signals are isolated from other circuits, and provide return paths through adjacent ground layers to reduce impedance mismatch and reflection problems in signal lines; use simulation tools to simulate and verify the stacked structure to ensure that under high-frequency conditions, the transmission line impedance, signal integrity and power supply noise suppression of the signal meet the design requirements, adjust the stacking order or number of layers according to the simulation results, and optimize the transmission effect of high-speed signals; through reasonable planning of the signal layer, ground layer and power layer of the multi-layer PCB, and the use of ground electrical separation technology and optimized stacking structure design, it can effectively reduce power supply noise coupling and ensure low-noise transmission of high-speed signals and the overall stability of the system.

[0114] S400, verifying and analyzing the optimized PCB circuit board according to electrical design rules to obtain a final optimized PCB circuit board;

[0115] Specifically, after completing the preliminary layout, the PCB layout is verified through design rule checking and electrical rule checking. After potential problems are found, iterative optimization is performed to ensure that the design meets production and performance requirements.

[0116] It should be noted that, in some specific embodiments, after the preliminary layout of the PCB is completed, a design rule check is performed, and the physical layout of the PCB is verified using PCB design software. The design rule check includes: minimum trace width, line spacing, via size, component spacing and pad size, etc., to ensure that the PCB meets the process specifications provided by the manufacturer and avoid the problem that the physical size does not meet the manufacturing requirements;

[0117] Conduct electrical rule checks to verify the electrical performance of the PCB. Electrical rule checks include: checking whether the power and ground connections are correct, whether the signal lines meet the predetermined impedance requirements, whether there are short circuits or open circuits in key signals, and whether the electrical connections between components are accurate;

[0118] Use simulation tools to simulate signal integrity and power integrity, verify signal reflection, crosstalk and impedance mismatch problems in high-speed signal transmission, as well as voltage drop and noise interference in the power network, and focus on signal timing analysis and power distribution network noise analysis for key high-speed signals (such as DDR, PCIe, USB, etc.);

[0119] Based on the results of the design rule check and electrical rule check, potential problems in the PCB layout are identified, especially in high-density wiring areas, areas with poor heat dissipation, or parasitic effects in signal lines. Based on the problems found, the layout is adjusted and optimized, such as rearranging component positions, adjusting routing methods, or optimizing the layout of ground and power layers.

[0120] Iteratively optimize the modified PCB, perform design rule check, electrical rule check and simulation verification again to ensure that the adjusted design eliminates all potential problems. Through multiple iterative optimizations, gradually improve the PCB layout to ensure that it meets both production process requirements and electrical performance indicators;

[0121] Finally, production files (such as Gerber files) are generated for the verified and optimized PCB layout, and it is ensured that the files meet the standards and specifications of PCB manufacturing to facilitate subsequent manufacturing and assembly. Through design rule checking, electrical rule checking, and signal integrity and power integrity simulation, potential problems in PCB layout can be discovered and resolved. After iterative optimization, it is ensured that the design not only meets production requirements, but also meets electrical performance indicators, thus ensuring the manufacturing feasibility and functional stability of the PCB.

[0122] See also Figure 2The embodiment of the present application further provides a PCB board layout design system based on heat dissipation optimization, which can implement the above-mentioned PCB board layout design method based on heat dissipation optimization, and the system includes:

[0123] The first module 201 is used to perform logic design and electrical performance analysis on the PCB circuit board to be optimized to obtain a preliminarily optimized PCB circuit board;

[0124] The second module 202 is used to perform simulation analysis on the preliminarily optimized PCB circuit board to obtain the optimization analysis result of the PCB circuit board, and the optimization analysis result of the PCB circuit board includes the signal integrity analysis result of the PCB circuit board, the thermal analysis result of the PCB circuit board and the electromagnetic compatibility analysis result of the PCB circuit board;

[0125] The third module 203 is used to perform wiring optimization and multilayer board optimization on the initially optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board;

[0126] The fourth module 204 is used to verify and analyze the optimized PCB circuit board according to the electrical design rules to obtain the final optimized PCB circuit board.

[0127] It can be understood that the contents of the above method embodiments are all applicable to the present system embodiments, the functions specifically implemented by the present system embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0128] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A PCB board layout design method based on heat dissipation optimization, characterized in that: The method comprises the following steps: Perform logic design and electrical performance analysis on the PCB to be optimized to obtain a preliminary optimized PCB; Performing simulation analysis on the preliminarily optimized PCB circuit board to obtain optimization analysis results of the PCB circuit board, wherein the optimization analysis results of the PCB circuit board include signal integrity analysis results of the PCB circuit board, thermal analysis results of the PCB circuit board, and electromagnetic compatibility analysis results of the PCB circuit board; According to the optimization analysis result of the PCB circuit board, the wiring optimization and multilayer board optimization are performed on the initially optimized PCB circuit board to obtain an optimized PCB circuit board; The optimized PCB circuit board is verified and analyzed according to electrical design rules to obtain a final optimized PCB circuit board.

2. The method according to claim 1, characterized in that The method of performing logic design and electrical performance analysis on the PCB circuit board to be optimized to obtain a preliminary optimized PCB circuit board includes: The PCB circuit board to be optimized is divided into units to obtain a power supply unit, a signal processing unit and an output unit; Performing logic design and electrical performance analysis on the power supply unit to obtain a preliminarily optimized power supply unit, wherein the logic design of the power supply unit includes a voltage stabilization circuit, a buck and boost converter, and the electrical performance analysis of the power supply unit includes input and output voltages, current fluctuations, and conversion efficiency; Performing logic design and electrical performance analysis on the signal processing unit to obtain a preliminarily optimized signal processing unit, wherein the logic design of the signal processing unit includes an amplifier, a filter, and an analog-to-digital converter, and the electrical performance analysis of the signal processing unit includes signal distortion, phase delay, and frequency response parameters; Performing logic design and electrical performance analysis on the output unit to obtain a preliminarily optimized output unit, wherein the logic design of the output unit includes configuration of a driver, a current source, and a voltage source, and the electrical performance analysis of the output unit includes output impedance, output power, and signal bandwidth; The preliminary optimized PCB circuit board is obtained by combining the preliminary optimized power supply unit, the preliminary optimized signal processing unit and the preliminary optimized output unit.

3. The method according to claim 1, characterized in that: The performing simulation analysis on the preliminarily optimized PCB circuit board to obtain the optimization analysis result of the PCB circuit board includes: Performing signal integrity analysis and power integrity analysis on the preliminarily optimized PCB circuit board by using a time domain reflectometer and an S-parameter analysis method to obtain a signal integrity analysis result of the PCB circuit board; Performing high power density area identification processing on the preliminarily optimized PCB circuit board by a thermal analysis method to obtain a thermal analysis result of the PCB circuit board; Performing electromagnetic compatibility optimization on the preliminarily optimized PCB circuit board by an electromagnetic simulation method to obtain an electromagnetic compatibility analysis result of the PCB circuit board; The optimization analysis result of the PCB circuit board is obtained by combining the signal integrity analysis result of the PCB circuit board, the thermal analysis result of the PCB circuit board and the electromagnetic compatibility analysis result of the PCB circuit board.

4. The method according to claim 3, characterized in that The signal integrity analysis and power integrity analysis of the preliminarily optimized PCB circuit board are performed by using a time domain reflectometer and an S parameter analysis method to obtain a signal integrity analysis result of the PCB circuit board, including: Performing impedance identification on the signal reflection of the preliminarily optimized PCB circuit board by a time domain reflectometer to obtain a signal reflection analysis result; Performing a frequency response analysis of signal transmission on the preliminarily optimized PCB circuit board by an S parameter analysis method to obtain a signal transmission frequency response analysis result; Performing power integrity analysis on the preliminarily optimized PCB circuit board by using a power distribution network simulation tool to obtain a power integrity analysis result; The signal reflection analysis result, the signal transmission frequency response analysis result and the power integrity analysis result are combined to obtain the signal integrity analysis result of the PCB circuit board.

5. The method according to claim 3, characterized in that: The step of performing high power density area identification processing on the preliminarily optimized PCB circuit board by a thermal analysis method to obtain a thermal analysis result of the PCB circuit board includes: Performing thermal analysis on the preliminarily optimized PCB circuit board by using a thermal simulation tool to obtain a high power density area; Increasing the copper foil thickness, arranging heat dissipation holes and applying high thermal conductivity materials in the high power density area to obtain a PCB circuit board after heat dissipation pretreatment; Performing thermal simulation on the PCB circuit board after the heat dissipation pretreatment to obtain a thermal analysis result of the PCB circuit board.

6. The method according to claim 3, characterized in that The electromagnetic compatibility optimization of the preliminarily optimized PCB circuit board by an electromagnetic simulation method to obtain an electromagnetic compatibility analysis result of the PCB circuit board includes: Performing electromagnetic radiation and conduction noise analysis on the initially optimized PCB circuit board by using an electromagnetic simulation tool to construct an electromagnetic model of the PCB circuit board; Based on the high electromagnetic radiation area of ​​the PCB circuit board electromagnetic model, an electromagnetic radiation shielding process is performed to obtain a shielded PCB circuit board electromagnetic model; Based on the high noise signal area of ​​the PCB circuit board electromagnetic model, a ground plane optimization design and a signal stacking design are performed to obtain an optimized PCB circuit board electromagnetic model; The electromagnetic compatibility analysis result of the PCB circuit board is obtained by combining the shielded PCB circuit board electromagnetic model with the optimized PCB circuit board electromagnetic model.

7. The method according to claim 1, characterized in that The method of performing wiring optimization and multilayer board optimization on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board includes: According to the optimization analysis result of the PCB circuit board, a wiring optimization design is performed on the initially optimized PCB circuit board to obtain a wiring optimized PCB circuit board; Performing multi-layer PCB optimization design on the preliminarily optimized PCB circuit board by using a geoelectric separation method to obtain a multi-layer optimized PCB circuit board; The optimized PCB circuit board is obtained by combining the wiring-optimized PCB circuit board with the multi-layer optimized PCB circuit board.

8. The method according to claim 7, characterized in that The step of performing wiring optimization design on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain a PCB circuit board with optimized wiring includes: According to the optimization analysis result of the PCB circuit board, differential wiring design, equal-length wiring design and inner-layer wiring design are performed on the preliminarily optimized PCB circuit board to obtain a preliminarily wiring-optimized PCB circuit board; The power supply and ground layer are separated on the preliminary wiring-optimized PCB circuit board to obtain the wiring-optimized PCB circuit board.

9. The method according to claim 7, characterized in that: The method of performing multi-layer PCB optimization design on the preliminarily optimized PCB circuit board by using the geoelectric separation method to obtain a multi-layer optimized PCB circuit board includes: The preliminarily optimized PCB circuit board is divided into a signal layer, a ground layer and a power layer; The ground layer and the power layer are physically separated by a geoelectric separation method, the power layer is designed as a distributed power surface, and a return path is provided for the signal layer through an adjacent ground layer to obtain the multi-layer optimized PCB circuit board.

10. A PCB board layout design system based on heat dissipation optimization, characterized in that: The system comprises: The first module is used to perform logic design and electrical performance analysis on the PCB circuit board to be optimized to obtain a preliminarily optimized PCB circuit board; The second module is used to perform simulation analysis on the preliminarily optimized PCB circuit board to obtain an optimization analysis result of the PCB circuit board, wherein the optimization analysis result of the PCB circuit board includes a signal integrity analysis result of the PCB circuit board, a thermal analysis result of the PCB circuit board, and an electromagnetic compatibility analysis result of the PCB circuit board; The third module is used to perform wiring optimization and multilayer board optimization on the preliminarily optimized PCB circuit board according to the optimization analysis result of the PCB circuit board to obtain an optimized PCB circuit board; The fourth module is used to verify and analyze the optimized PCB circuit board according to electrical design rules to obtain a final optimized PCB circuit board.

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