Laser processing device, system and method

By introducing mode switching part and focus elements into the laser welding gun, switching of welding, cleaning and cutting modes is solved, and the problem of cumbersome operation and inability to use the same set of nozzles in the prior art is solved, and processing efficiency and convenience are improved.

CN119609362APending Publication Date: 2025-03-14SHENZHEN HUANRI LASER CO LTD
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Patent Information

Application Number
CN202510023881.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-01-07
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

The existing laser welding torch requires manual disassembly of the focus mirror and replacement of the nozzle when switching functions. The operation is cumbersome and it is impossible to use the same set of nozzles for welding and cleaning at the same time, which affects processing efficiency.

Method used

A laser processing device is designed, including a focusing element, a mode switching part and a nozzle. The position of the focusing element is adjusted through the mode switching part to realize the switching of welding, cleaning and cutting modes, and there is no need to replace the same nozzle.

Benefits of technology

It realizes rapid switching of welding and cleaning modes, improves processing convenience and efficiency, saves processing time, and saves the cost of providing protective gas.

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Abstract

The invention discloses a laser processing device, system and method. The laser processing device comprises a focusing element, a mode switching part, a nozzle and a shell. The focusing element is arranged in the shell and used for forming different laser spots on the surface of a workpiece to be machined by switching between the first position and the second position so as to complete welding or cleaning of the workpiece to be machined. The mode switching part is arranged on the shell and is used for adjusting the focusing element to a first position or a second position so as to realize a welding mode or a cleaning mode; the nozzle is arranged on the light emitting side of the shell and used for welding and cleaning. According to the invention, laser spots with different focal lengths can be formed in a welding mode or a cleaning mode so as to complete a welding process or a cleaning process.
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Description

Technical Field

[0001] The present invention belongs to the technical field of laser processing, and in particular relates to a laser processing device, system and method. Background Art

[0002] With the rapid development of modern industrial technology, laser welding, as an efficient, precise and environmentally friendly connection technology, has been widely used in aerospace, automobile manufacturing, electronic communications, medical equipment and other fields. Laser welding uses a high-energy-density laser beam as a heat source to quickly melt and solidify the welded materials, thereby achieving a firm connection of the materials.

[0003] In laser welding technology, the welding gun is the output and focusing device of the laser beam, and its performance directly determines the quality and efficiency of welding. Traditional welding gun designs often only focus on the welding function and cannot integrate the cleaning function.

[0004] In recent years, many improved laser welding guns have appeared, which can realize welding and cleaning functions at the same time. However, when switching functions, the focusing lens needs to be manually disassembled and replaced. By manually changing the position of the focusing lens, the corresponding nozzles for welding and cleaning need to be manually replaced. It is impossible to use the same set of nozzles for both welding and cleaning. The operation is very cumbersome and time-consuming, affecting the duration and complexity of the processing. In addition, existing laser welding guns need to provide shielding gas when welding, which is used to protect the welding position from the atmosphere and isolate it from the air to prevent the welding position from being oxidized by air during welding. Summary of the invention

[0005] In view of this, the present invention provides a laser processing device, system and method.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] A laser processing device comprises: a focusing element, a mode switching unit, a nozzle, and a housing;

[0008] The focusing element is arranged in the housing, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the first position and the second position, so as to complete welding or cleaning of the workpiece to be processed;

[0009] The mode switching part is arranged on the housing and is used to adjust the focusing element to the first position or the second position to realize the welding mode or the cleaning mode;

[0010] The nozzle is arranged on the light emitting side of the housing, and is used for both welding and cleaning.

[0011] In some embodiments, a driving unit is further included, wherein the driving unit is connected to the focusing element and is used to drive the focusing element to switch to the first position or the second position.

[0012] In some embodiments, the focusing element is further used to switch to a third position, so as to form different laser spots on the surface of the workpiece to be processed, so as to complete the cutting of the workpiece to be processed;

[0013] The nozzle is also used for cutting.

[0014] In some embodiments, the mode switching portion is located at a welding mode position or a cleaning mode position, and switches between the welding mode position and the cleaning mode position.

[0015] In some embodiments, the mode switching portion is a trigger portion, and the trigger portion can be pressed once or pressed twice in succession to switch between welding mode and cleaning mode, respectively.

[0016] In some embodiments, the focusing element is also used to switch to a third position, so as to form different laser spots on the surface of the workpiece to be processed, so as to complete the cutting of the workpiece to be processed; the nozzle is also used for cutting;

[0017] The mode switching unit is further used to adjust the focusing element to the first position, the second position or the third position to achieve the welding mode, the cleaning mode or the cutting mode;

[0018] The mode switching part is a trigger part, and the trigger part can be pressed once or pressed twice to respectively realize one of the welding mode, the cleaning mode or the cutting mode, and the two pressing methods correspond to different modes. Alternatively, the trigger part can be pressed once, pressed twice or pressed three times to respectively realize one of the welding mode, the cleaning mode or the cutting mode, and the three pressing methods correspond to different modes.

[0019] In some embodiments, the mode switching portion is also located at the cutting mode position, and switches between the cutting mode position, the welding mode position, and the cleaning mode position, so as to adjust the focusing element to the first position, the second position, or the third position to realize the welding mode, the cleaning mode, or the cutting mode;

[0020] The nozzle is also used for cutting.

[0021] In some embodiments, the focusing element is one of a focusing mirror, a collimating mirror or a reflecting mirror.

[0022] In some embodiments, the driving unit includes a lead screw and a driving motor arranged along a first direction, the driving motor is connected to the lead screw, and the lead screw is connected to the focusing element;

[0023] or,

[0024] The driving unit comprises a stator and a rotor, wherein the stator contains piezoelectric ceramics, the stator and the rotor are cooperatively connected, and the rotor is connected to the focusing element;

[0025] or,

[0026] The driving unit includes a magnetic part.

[0027] A laser processing device comprises: a focusing element, a mode switching unit, a nozzle, and a housing;

[0028] The focusing element is arranged in the housing, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the first position or the third position, so as to complete welding or cutting of the workpiece to be processed;

[0029] The mode switching part is arranged on the housing and is used to adjust the focusing element to the first position or the third position to realize the welding mode or the cutting mode;

[0030] The nozzle is arranged on the light emitting side of the housing, and the nozzle is used for both welding and cutting.

[0031] A laser processing device comprises: a focusing element, a mode switching unit, a nozzle, and a housing;

[0032] The focusing element is arranged in the housing, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the second position or the third position, so as to complete the cleaning or cutting of the workpiece to be processed;

[0033] The mode switching portion is disposed on the housing and is used to adjust the focusing element to the second position or the second position to achieve a cleaning mode or a cutting mode;

[0034] The nozzle is arranged on the light exiting side of the housing, and the nozzle is used for both cleaning and cutting.

[0035] A laser processing method, the method comprising:

[0036] An operating mode switching unit for adjusting the focusing element to a first position to implement a welding mode;

[0037] Perform laser welding of the workpiece without or with little protective gas to form a weld;

[0038] Complete the welding process;

[0039] operating the mode switching unit again to adjust the focusing element to a second position to implement a cleaning mode;

[0040] The weld is surface cleaned without changing the nozzle;

[0041] Complete the cleaning process.

[0042] A laser processing system, the system comprising a laser generating device and a laser processing device;

[0043] The laser generating device is connected to the laser processing device and is used for generating laser light and transmitting the laser light to the laser processing device.

[0044] A laser processing system, the system comprising a laser generating device, a functional air compressor and a laser processing device;

[0045] The laser generating device is connected to the laser processing device and is used to generate laser and transmit it to the laser processing device. The functional air compressor is used to generate compressed air and transmit it to the vicinity of the nozzle to blow away smoke and dust.

[0046] Implementing the embodiments of the present invention will have at least the following beneficial effects:

[0047] The present invention can accurately adjust the position of the focusing element through the mode switching part to ensure that the laser forms different laser spots on the surface of the workpiece to be processed in the welding mode or the cleaning mode to complete the welding or cleaning of the workpiece to be processed, and the same nozzle is used for cleaning and welding after switching from the welding mode to the cleaning mode or the cleaning mode to the welding mode, and there is no need to replace the nozzle; there is no need to replace the focusing element to accurately switch to the welding mode or the cleaning mode. In this way, the convenience of processing is greatly improved and the processing time is saved. In addition, the mode switching part also has a cutting mode position, and the nozzle is the same and can be cut without replacement, which greatly improves the processing efficiency. In addition, since the workpiece to be processed is processed by the method of welding first and then cleaning, there is no need to provide shielding gas during welding. After welding is completed, the weld is cleaned to achieve the required weld quality and aesthetic requirements, so that the cost of shielding gas is completely saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 Schematic diagram of the structure of a laser processing device in one embodiment.

[0050] Figure 2 It is a schematic diagram of a partially enlarged structure of a laser processing device in another embodiment.

[0051] Figure 3A schematic diagram of the structure of a driving unit of a laser processing device in an embodiment.

[0052] Figure 4 FIG. 1 is a schematic diagram of another structure of a driving unit of a laser processing device in an embodiment.

[0053] Figure 5 Schematic diagram of the laser light path of a laser processing device in one embodiment.

[0054] Figure 6 Schematic diagram of laser beams corresponding to three modes of a laser processing device in one embodiment.

[0055] Figure 7 for Figure 6 Schematic diagram of three types of laser spots formed by the laser beam on the surface of the workpiece to be processed after being magnified 5 times.

[0056] Among them, 1-focusing element, 2-mode switching unit, 3-nozzle, 4-housing, 5-driving unit, 6-collimation component, 7-light guide rod, 8-reflection component, 9-protection component;

[0057] 51 - lead screw, 52 - drive motor, 53 - stator, 54 - rotor, 531 - piezoelectric ceramic. DETAILED DESCRIPTION

[0058] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0059] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, article or device. In the absence of more restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, article or device including the element.

[0060] Combine the following Figures 1 to 5The laser processing device involved in the present invention is further explained in detail, wherein the first direction is the X direction.

[0061] In one embodiment of a laser processing device, Figure 1 As shown, the laser processing device includes: a focusing element 1, a mode switching component 2, a nozzle 3, and a housing 4;

[0062] The focusing element 1 is arranged in the housing 4, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the first position or the second position, so as to complete the welding or cleaning of the workpiece to be processed; the mode switching part 2 is arranged on the housing 4, and can be located at the welding mode position or the cleaning mode position, and can be switched between the welding mode position and the cleaning mode position, so as to adjust the focusing element 1 to the first position or the second position to realize the welding mode or the cleaning mode; the nozzle 3 is arranged on the light exit side of the housing 4, and the nozzle 3 is used for both welding and cleaning, so there is no need to replace the nozzle 3 during welding and cleaning. A through laser channel is arranged inside the nozzle 3 to allow the laser to pass through and emit.

[0063] In this embodiment, the laser processing device can accurately adjust the position of the focusing element 1 through the mode switching unit 2, and form different laser spots on the surface of the workpiece to be welded or cleaned, thereby completing the welding process or the cleaning process. Moreover, cleaning and welding are performed after switching from the welding mode to the cleaning mode or from the cleaning mode to the welding mode. The same nozzle is used without replacing the nozzle 3 (that is, the welding mode and the cleaning mode use the same nozzle 3), and there is no need to disassemble the focusing element 1 and replace it with a new focusing element with a different focal length, so the welding mode or the cleaning mode can be accurately switched.

[0064] It should be noted that the focusing element 1 is a focusing lens in this embodiment, and may also be a collimating lens or a reflecting mirror in other embodiments, which are not shown in the figure.

[0065] In an embodiment of the laser processing device, the laser processing device further includes a driving unit 5, which is connected to the focusing element 1 and is used to drive the focusing element 1 to switch to the corresponding first position or second position.

[0066] In another embodiment, the mode switching unit 2 may also be located in the cutting mode position, and may switch between the cutting mode position, the welding mode position, and the cleaning mode position, so as to adjust the focusing element 1 to the first position, the second position, or the third position to realize the welding mode, the cleaning mode, or the cutting mode, and the nozzle 3 is used for welding, cleaning, and cutting.

[0067] It should be noted that the cutting mode position, welding mode position and cleaning mode position are different positions of the mode switching unit 2 .

[0068] The focusing element 1 is also used to switch to the third position, so as to form different laser spots on the surface of the workpiece to be processed to complete the cutting of the workpiece to be processed; the nozzle 3 is also used for cutting.

[0069] The driving unit 5 is further used to drive the focusing element 1 to switch to the corresponding third position according to the cutting mode.

[0070] The driving unit 5 can drive the focusing element 1 to switch to a corresponding position according to the mode position of the mode switching portion 2, thereby realizing the mode switching.

[0071] In this embodiment, the linkage arrangement of the mode switching part 2 and the driving unit 5 enables the driving unit 5 to accurately adjust the position of the focusing element 1 in different modes.

[0072] Specifically, the mode switching portion 2 is in the welding mode position, and is used to drive the focusing element 1 to move to a preset first position (ie, welding position) through the driving unit 5 when in the welding mode.

[0073] In the welding mode, the focusing element 1 is adjusted to a preset welding position to generate a laser spot suitable for welding on the surface of the workpiece to be processed, thereby completing the welding of the workpiece to be processed.

[0074] The mode switching portion 2 is in the cleaning mode position, and is used to drive the focusing element 1 to move to a preset second position (ie, the cleaning position) through the driving unit 5 when in the cleaning mode.

[0075] In the cleaning mode, the focusing element 1 is adjusted to a preset cleaning position so as to generate a laser spot suitable for cleaning on the surface of the workpiece to be processed, thereby completing the cleaning of the workpiece to be processed.

[0076] In this way, the mode switching portion 2 is located at the welding mode position or the cleaning mode position, thereby achieving switching between the welding mode position and the cleaning mode position.

[0077] In another embodiment, the mode switching portion 2 is in the cutting mode position, and is used to drive the focusing element 1 to move to a preset third position (ie, the cutting position) through the driving unit 5 when in the welding mode.

[0078] In the cutting mode, the focusing element 1 is adjusted to a preset cutting position to generate a laser spot suitable for cutting on the surface of the workpiece to be processed, thereby completing the cutting of the workpiece to be processed.

[0079] In this way, the mode switching portion 2 is located in the welding mode position, the cleaning mode position or the cutting mode position, thereby realizing switching among the welding mode position, the cleaning mode position and the cutting mode position.

[0080] It should be noted that the mode position can be switched from any mode position to another mode position.

[0081] More specifically, the mode switching unit 2 is disposed at the handle of the housing 4 and is used to generate a switching signal according to a user's switching operation and send the signal to the driving unit 5;

[0082] The driving unit 5 is used to drive the focusing element 1 to move to the first position or the second position according to the switching signal.

[0083] In this embodiment, the user can easily switch between the cleaning mode and the welding mode by simply operating the mode switching unit 2 ; when the user performs the switching operation, the mode switching unit 2 generates a corresponding switching signal and sends it to the drive unit 5 .

[0084] After receiving the switching signal, the driving unit 5 drives the focusing element 1 to move along a first direction (eg, X direction) to a corresponding cleaning position or welding position according to preset programs and parameters.

[0085] For example, the mode switching part 2 is usually arranged at a position convenient for user operation, such as on the handle of the welding gun or at a position that is easily accessible.

[0086] After the mode switching unit 2 switches to the corresponding mode position, it generates a switching signal corresponding to the mode position, so that the driving unit 5 determines that the focusing element 1 needs to be moved to the cleaning position or the welding position according to the switching signal.

[0087] In this embodiment, the focusing element 1 changes different positions along the first direction (such as the X direction) under the drive of the driving unit 5, thereby generating different laser spots, thereby realizing corresponding welding and cleaning functions.

[0088] In this embodiment, the mode switching part 2 is a trigger part, and the trigger part can be pressed once or pressed twice to switch to the welding mode or the cleaning mode respectively.

[0089] The trigger can be accurately switched between welding mode and cleaning mode by pressing the trigger for different times.

[0090] Specifically, when the user needs to perform welding operations, he only needs to press the trigger once to trigger the drive unit 5, and the drive unit 5 will then drive the focusing element 1 to move to the preset welding position (i.e., the first position) according to the preset program and parameters; at this time, after the laser passes through the focusing element 1, a laser spot suitable for welding will be formed on the surface of the workpiece to be processed, thereby completing the welding process.

[0091] When the user completes the welding operation and needs to clean the weld, he only needs to press the trigger twice to trigger the drive unit 5, and the drive unit 5 will then drive the focusing element 1 to move to the preset cleaning position (i.e., the second position) according to the preset program and parameters; at this time, after the laser passes through the focusing element 1, a laser spot suitable for cleaning will be formed on the surface of the workpiece to be processed, thereby completing the cleaning process.

[0092] In another embodiment, the mode switching part is a trigger part, and the trigger part realizes one of the welding mode, the cleaning mode or the cutting mode by pressing it once or twice in succession, and the two pressing methods correspond to different modes.

[0093] Specifically, the user can correspond one press to welding mode, cleaning mode or cutting mode according to daily operating habits or process requirements, and correspond two consecutive presses to one of the remaining two modes. In other words, the selection of the corresponding mode is realized, giving the user better autonomy.

[0094] Exemplarily, one press corresponds to the cleaning mode, and two consecutive presses correspond to the cutting mode.

[0095] In another embodiment, the mode switching part 2 is a trigger part, and the trigger part realizes one of the welding mode, cleaning mode or cutting mode by pressing once, pressing twice in a row and pressing three times in a row respectively, and the three pressing methods correspond to different modes, and the nozzle 3 is also used for cutting.

[0096] Specifically, when the user needs to perform a cutting operation, he only needs to press the trigger three times in a row to trigger the drive unit 5. The drive unit 5 then drives the focusing element 1 to move to the preset cutting position (i.e., the third position) according to the preset program and parameters; at this time, after the laser passes through the focusing element 1, a laser spot suitable for cutting will be formed on the surface of the workpiece to be processed, thereby completing the cutting process.

[0097] It should be noted that the number of consecutive presses can be adjusted to the corresponding mode according to the user's usage habits and other conditions. For example, two consecutive presses correspond to the welding mode, and three consecutive presses correspond to the cleaning mode.

[0098] In another embodiment, Figure 2 As shown, the mode switching part 2 is a switching switch, and the switching switch is switched to the left or right sides to realize the welding mode or the cleaning mode respectively.

[0099] Likewise, the middle position of the switch may correspond to the cutting mode.

[0100] In this embodiment, the user can easily switch between the cleaning mode, the welding mode and the cutting mode by simply operating the switch 21 .

[0101] In another embodiment, the mode switching portion 2 is a knob having at least two gears, and the welding mode or the cleaning mode is realized by rotating the knob clockwise or counterclockwise to a corresponding gear.

[0102] Similarly, the third gear can also be set to correspond to the cutting mode.

[0103] In this embodiment, the user can easily switch between the cleaning mode, the welding mode and the cutting mode by simply rotating the knob clockwise or counterclockwise to the corresponding gear position.

[0104] Exemplarily, the focusing element 1 moves to the welding position, and then the laser passes through the focusing element 1 at this position and finally forms a welding laser spot for welding on the surface of the workpiece to be processed.

[0105] When the focusing element 1 moves to the cleaning position, the laser passes through the focusing element 1 at this position and finally forms a cleaning laser spot for cleaning on the surface of the workpiece to be processed.

[0106] Exemplarily, the focusing element 1 moves to the welding position (first position) to form a +5 focal laser spot, thereby realizing the welding process.

[0107] The focusing element 1 moves to the cleaning position (second position) to form a -5 focal laser spot, thereby realizing the cleaning process.

[0108] It should be noted that Figure 6 The laser spot in welding mode and cleaning mode, as well as the laser spot at 0 focus, formed on the surface of the workpiece to be processed are shown in the enlarged diagram. These laser spots are of different sizes and shapes because the position of the focusing element 1 changes, resulting in the laser focus being at different heights, which will form different laser spots when reflected on the surface to be processed. The spots shown in the figure illustrate three different laser spots formed on the surface of the workpiece to be processed.

[0109] exist Figure 6 In the figure, there is no light spot in the cutting mode, but the principle is the same, that is, the cutting of the workpiece to be processed is achieved by setting the mode switching unit 2 to the cutting mode position and adjusting the position of the focusing element 1 to the third position.

[0110] Of course, the light spot indicated by 0 focus can also be used as a cutting laser spot for cutting processing.

[0111] The cleaning position and the welding position may be a specific position or a range; within the range, the focal length may be finely adjusted according to the specific welding or cleaning conditions to obtain the best focusing effect.

[0112] In this embodiment, the mode switching portion 2 is disposed at the handle position of the housing 5 , and the driving unit 5 is disposed in the housing 4 and located at one side of the focusing element 1 .

[0113] For example, Figure 3 As shown, the driving unit 5 includes a lead screw 51 and a driving motor 52 arranged along a first direction. The driving motor 52 is connected to the lead screw 51 , and the lead screw 51 is connected to the focusing element 1 .

[0114] The driving motor is connected to the mode switching unit 2, and after receiving the switching signal, drives the lead screw to rotate forward or reverse, thereby driving the focusing element 1 on the lead screw to move, that is, driving the focusing element 1 to switch between the cleaning position, the cutting position and the welding position.

[0115] In another embodiment, the driving unit 5 includes a piezoelectric ceramic part, which converts electrical energy into mechanical energy through the piezoelectric ceramic. When a certain voltage is applied, the piezoelectric ceramic will undergo a slight deformation, which can be converted into the required movement distance of the focusing element 1 through an amplification mechanism.

[0116] Specifically, Figure 4 As shown, the driving unit 5 includes a stator 53 and a rotor 54 . The stator 53 includes a piezoelectric ceramic 531 . The stator 53 and the rotor 54 are cooperatively connected. The rotor 54 is connected to the focusing element 1 .

[0117] By adjusting different modes through the mode switching unit 2, the electric field of the piezoelectric ceramic 531 applied to the stator 53 is changed. The particles on the surface of the stator 53 perform elliptical motion under the action of the high-frequency vibration generated by the piezoelectric ceramic, and the friction force is transmitted to the rotor 54, causing the rotor 54 to start moving, thereby realizing the switching of the welding mode or the cleaning mode.

[0118] In another embodiment, the driving unit 5 includes a magnetic part, and the magnetic part can use a permanent magnet to realize the driving function, and the movement of the focusing element 1 is controlled by changing the magnetic field direction of the permanent magnet.

[0119] In an embodiment of the laser processing device, the laser processing device also includes a collimating component 6, which is arranged before the laser light input side of the focusing element 1, and is used to form the laser into parallel light, project it onto a vibrating mirror (i.e., a reflector) and then onto the focusing element 1.

[0120] In this embodiment, the collimating component 6 shapes the divergent and expanded laser into collimated light for emission, and the collimated light has a stable diameter and energy distribution, so that the focusing element 1 can focus and adjust the collimated light. Through the cooperation of the two, precise control and energy transfer of the laser beam can be achieved during welding and cleaning.

[0121] In an embodiment of the laser processing device, the laser processing device further includes a light guide rod 7 , which is disposed before the laser light input side of the collimating component 6 and is used to transmit the laser to the collimating component 6 .

[0122] In an embodiment of the laser processing device, the laser processing device further includes a reflection component 8 , which is disposed on the laser light emitting side of the collimation component 6 and is used to change the direction of the laser and project it onto the focusing element 1 .

[0123] In an embodiment of a laser processing device, the laser processing device also includes a protective component 9, which is arranged on the laser light emitting side of the focusing element 1, and is used to absorb and disperse part of the laser energy and heat, reduce the burden on the lens inside the element 1, help to extend the service life of the focusing element 1, and reduce maintenance and replacement costs.

[0124] In an embodiment of a laser processing device, it also includes a feedback component and a control component; the feedback component is used to detect the current position of the focusing element 1; the control component is used to confirm whether the current position is successfully switched to the first position or the second position based on the current position of the focusing element 1 fed back by the feedback component, that is, to confirm whether the current position is successfully switched to the cleaning mode or the welding mode.

[0125] In this embodiment, the feedback component may adopt a position sensor, a photoelectric sensor, etc. to capture the position change of the focusing element 1 in real time.

[0126] The feedback component and the control component can ensure that after the mode switching component 2 switches the mode, the focusing element 1 is definitely moved to the corresponding position, thereby avoiding switching failure and causing operational losses.

[0127] In some embodiments, in a laser processing device embodiment, as Figure 1 As shown, the laser processing device includes: a focusing element 1, a mode switching component 2, a nozzle 3, and a housing 4;

[0128] The focusing element 1 is arranged in the housing 4, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the first position or the third position, so as to complete the welding or cutting of the workpiece to be processed; the mode switching part 2 is arranged on the housing 4, and can be located at the welding mode position or the cutting mode position, and can be switched between the welding mode position and the cutting mode position, so as to adjust the focusing element 1 to the first position or the third position to realize the welding mode or the cutting mode; the nozzle 3 is arranged on the light exit side of the housing 4, and the nozzle 3 is used for both welding and cutting, so there is no need to replace the nozzle 3 during welding and cutting. A through laser channel is arranged inside the nozzle 3 to allow the laser to pass through and emit.

[0129] In this embodiment, the laser processing device can accurately adjust the position of the focusing element 1 through the mode switching unit 2, and form different laser spots on the surface of the workpiece to be welded or cut, thereby completing the welding process or the cutting process. Moreover, cutting and welding are performed after switching from the welding mode to the cutting mode or from the cutting mode to the welding mode. The same nozzle is used without replacing the nozzle 3 (that is, the welding mode and the cutting mode use the same nozzle 3), and there is no need to disassemble the focusing element 1 and replace it with a new focusing element with a different focal length, so the welding mode or the cutting mode can be accurately switched.

[0130] In some embodiments, in a laser processing device embodiment, as Figure 1 As shown, the laser processing device includes: a focusing element 1, a mode switching component 2, a nozzle 3, and a housing 4;

[0131] The focusing element 1 is arranged in the housing 4, and is used to form different laser spots on the surface of the workpiece to be processed by switching to the second position or the third position, so as to complete the cleaning or cutting of the workpiece to be processed; the mode switching part 2 is arranged on the housing 4, and can be located in the cleaning mode position or the cutting mode position, and can be switched between the cleaning mode position and the cutting mode position, so as to adjust the focusing element 1 to the second position or the third position to realize the cleaning mode or the cutting mode; the nozzle 3 is arranged on the light exit side of the housing 4, and the nozzle 3 is used for both cleaning and cutting, so there is no need to replace the nozzle 3 during cleaning and cutting. A through laser channel is arranged inside the nozzle 3 to allow the laser to pass through and emit.

[0132] In this embodiment, the laser processing device can accurately adjust the position of the focusing element 1 through the mode switching unit 2, and form different laser spots on the surface of the workpiece to be cleaned or cut, thereby completing the cleaning process or the cutting process. Moreover, cutting and cleaning are performed after switching from the cleaning mode to the cutting mode or from the cutting mode to the cleaning mode. The same nozzle is used without replacing the nozzle 3 (that is, the cleaning mode and the cutting mode use the same nozzle 3), and there is no need to disassemble the focusing element 1 and replace it with a new focusing element with a different focal length, so the cleaning mode or the cutting mode can be accurately switched.

[0133] It should be noted that the mode switching unit 2 of the present invention can be set to have only two positions (any two of the welding, cleaning and cutting positions) or three positions (the welding, cleaning and cutting positions).

[0134] The laser processing method involved in the present invention is further explained in detail below.

[0135] In one embodiment of a laser processing method, the laser processing method includes:

[0136] The mode switching part 2 is set at the welding mode position to adjust the focusing element 1 to the first position to realize the welding mode;

[0137] Perform laser welding on the workpiece without protective gas to form a weld;

[0138] Complete the welding process;

[0139] The mode switching portion 2 is set in a cleaning mode position to adjust the focusing element 1 to a second position to implement a cleaning mode;

[0140] The weld is surface cleaned without changing the nozzle;

[0141] Complete the cleaning process.

[0142] Specifically, in the cleaning mode, under the action of the laser spot, the surface oxidation and blackening of the weld formed during the previous welding is effectively removed, the workpiece surface is cleaned, and the weld quality and appearance are also improved to meet the requirements.

[0143] After the welding process is completed, the present invention quickly switches to the cleaning mode through the mode switching part 2, so as to clean the weld of the previous welding process. The switching from the welding mode to the cleaning mode is fast and simple.

[0144] It is precisely because the present application can quickly and easily switch from welding mode to cleaning mode, so that the process from welding to cleaning can be completed quickly, and there is no need to introduce additional protective gas or less protective gas during the welding process to isolate the air and prevent weld oxidation.

[0145] In an embodiment of a laser processing system, the system includes a laser generating device and a laser processing device; the laser generating device is connected to the laser processing device and is used to generate laser light and transmit the laser light to the laser processing device.

[0146] The laser processing device adopts the configuration of the above-mentioned embodiment.

[0147] In a laser processing system, the system includes a laser generating device, a functional air compressor and a laser processing device;

[0148] The laser generating device is connected to the laser processing device and is used to generate laser and transmit it to the laser processing device. The functional air compressor is used to generate compressed air and transmit it to the vicinity of the nozzle to blow away smoke and dust.

[0149] Since the present invention adopts the method of welding first and then cleaning, after welding is completed, the oxidized part on the weld is effectively removed by the subsequent cleaning step, so there is no need to provide shielding gas to prevent oxidation during the welding process. During the process, the functional air compressor is used to blow out air, which is completely different from the prior art that requires blowing shielding gas through a nitrogen bottle or a nitrogen generator. The air blown out by the functional air compressor is used to blow away the smoke and dust generated during welding, cutting and cleaning, replacing the shielding gas blown out in the prior art, and the cost is greatly reduced.

[0150] Functional air compressors can be set up as small compressors and integrated into the system.

[0151] The laser processing device adopts the configuration of the above-mentioned embodiment.

[0152] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0153] The above embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for those of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A laser processing device, characterized in that: include: Focusing element, mode switching unit, nozzle, housing; The focusing element is arranged in the housing, and is used to form different laser spots on the surface of the workpiece to be processed by switching between the first position and the second position, so as to complete welding or cleaning of the workpiece to be processed; The mode switching part is arranged on the housing and is used to adjust the focusing element to the first position or the second position to realize the welding mode or the cleaning mode; The nozzle is arranged on the light emitting side of the housing, and is used for both welding and cleaning.

2. The laser processing device according to claim 1, characterized in that: The invention also comprises a driving unit, wherein the driving unit is connected to the focusing element and is used to drive the focusing element to switch to the first position or the second position.

3. The laser processing device according to claim 1, characterized in that: The focusing element is also used to switch to a third position, so as to form different laser spots on the surface of the workpiece to be processed, so as to complete the cutting of the workpiece to be processed; The nozzle is also used for cutting.

4. The laser processing device according to claim 1, characterized in that: The mode switching portion is located at a welding mode position or a cleaning mode position, and switches between the welding mode position and the cleaning mode position.

5. The laser processing device according to claim 1, characterized in that: The mode switching part is a trigger part, and the trigger part can be pressed once or pressed twice to switch to a welding mode or a cleaning mode respectively.

6. The laser processing device according to claim 1, characterized in that: The focusing element is also used to switch to a third position, so as to form different laser spots on the surface of the workpiece to be processed, so as to complete the cutting of the workpiece to be processed; the nozzle is also used for cutting; The mode switching unit is further used to adjust the focusing element to the first position, the second position or the third position to achieve the welding mode, the cleaning mode or the cutting mode; The mode switching part is a trigger part, and the trigger part can be pressed once or pressed twice to respectively realize one of the welding mode, the cleaning mode or the cutting mode, and the two pressing methods correspond to different modes. Alternatively, the trigger part can be pressed once, pressed twice or pressed three times to respectively realize one of the welding mode, the cleaning mode or the cutting mode, and the three pressing methods correspond to different modes.

7. The laser processing device according to claim 3, characterized in that: The mode switching portion is also located at the cutting mode position and switches between the cutting mode position, the welding mode position and the cleaning mode position, so as to adjust the focusing element to the first position, the second position or the third position to realize the welding mode, the cleaning mode or the cutting mode; The nozzle is also used for cutting.

8. The laser processing device according to claim 1, characterized in that: The focusing element is one of a focusing mirror, a collimating mirror or a reflecting mirror.

9. The laser processing device according to claim 2, characterized in that: The driving unit comprises a lead screw and a driving motor arranged along a first direction, the driving motor is connected to the lead screw, and the lead screw is connected to the focusing element; or, The driving unit comprises a stator and a rotor, wherein the stator contains piezoelectric ceramics, the stator and the rotor are cooperatively connected, and the rotor is connected to the focusing element; or, The driving unit includes a magnetic part.

10. A laser processing method, characterized in that: The method includes: An operating mode switching unit for adjusting the focusing element to a first position to implement a welding mode; Perform laser welding of the workpiece without or with little protective gas to form a weld; Complete the welding process; operating the mode switching unit again to adjust the focusing element to a second position to implement a cleaning mode; The weld is surface cleaned without changing the nozzle; Complete the cleaning process.

11. A laser processing system, characterized in that: The system comprises a laser generating device, a laser processing device as claimed in any one of claims 1 to 9; The laser generating device is connected to the laser processing device and is used for generating laser light and transmitting the laser light to the laser processing device.

12. A laser processing system, characterized in that: The system comprises a laser generating device, a functional air compressor and a laser processing device as claimed in any one of claims 1 to 9; The laser generating device is connected to the laser processing device and is used to generate laser and transmit it to the laser processing device. The functional air compressor is used to generate compressed air and transmit it to the vicinity of the nozzle to blow away smoke and dust.