Welding tool and welding process for ceramic packaging product

Abstract

The invention provides a welding tool and a welding process for a ceramic packaging product, and relates to the technical field of ceramic packaging, the ceramic packaging product comprises a ceramic substrate and a sealing ring, and the sealing ring is welded to the front face of the ceramic substrate through a first welding piece; the welding tool comprises a base, the base is provided with a positioning face, and at least one positioning groove used for positioning the ceramic packaging product is formed in the positioning face of the base. The positioning groove comprises a first groove body, and the sealing ring, the first soldering lug and the ceramic substrate can be sequentially embedded into the first groove body from bottom to top; a protruding part is arranged on the groove bottom face of the first groove body, and the peripheral side of the protruding part and the inner wall of the peripheral side of the first groove body are arranged in a spaced mode so that the sealing ring and the first soldering lug can be arranged on the peripheral side of the protruding part in a sleeving mode after being placed in the first groove body. The ceramic packaging product is formed in the positioning groove at a time in an inverted mode, the generated positioning error is small, and the precision and the welding quality of the ceramic packaging product are improved.

Description

Technical Field

[0001] The present application belongs to the technical field of ceramic packaging products, and more specifically, relates to a welding tool and welding process for ceramic packaging products. Background Art

[0002] With the rapid development of ceramic substrate (LTCC / HTCC) technology, ceramic packaging products such as antennas, frequency sources, transceiver components based on ceramic substrates are showing a development trend of systematization, miniaturization, high integration and high reliability. In terms of high-frequency applications with higher added value, ceramic substrates are inherently superior to traditional PCB boards, and their advantages in integration are more obvious. Ceramic substrates can embed film resistors, inductors, capacitors, microwave transmission lines and passive components or networks composed of them. They are also the assembly carriers of external parts such as IC chips, chip components, micro-sealed devices, and micro-components. They can also be used as part of the component packaging shell, which is suitable for the development trend of miniaturization and high integration in the industry.

[0003] Ceramic packaging products are generally composed of components such as ceramic substrates and sealing rings. The components are connected by welding, and the size of each component gradually increases from bottom to top. At present, multi-layer stacked welding tools are often used to position the components of ceramic packaging products in order from bottom to top. However, there will be positioning errors between different layers of welding tools. Multi-layer stacked welding work will lead to the accumulation of positioning errors, thereby reducing the positioning accuracy of ceramic packaging products, and is prone to positioning offset or positioning failure problems, affecting the qualified rate of ceramic packaging products. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a welding tool and welding process for a ceramic packaging product, so as to solve the problem in the prior art that when using multi-layer welding tooling to position the components in the ceramic packaging product, the positioning error will be accumulated, thereby resulting in low positioning accuracy of the ceramic packaging product.

[0005] To achieve the above-mentioned purpose, in a first aspect, the present application provides a welding tool for a ceramic packaging product, wherein the ceramic packaging product includes a ceramic substrate, a first welding sheet and a sealing ring which are stacked in sequence; the welding tool includes a base, the base has a positioning surface, and the positioning surface of the base is provided with at least one positioning groove for positioning the ceramic packaging product; the positioning groove includes a first groove body, the cross-section of the first groove body is adapted to the cross-section of the ceramic substrate, and the sealing ring, the first welding sheet and the ceramic substrate can be embedded in sequence from bottom to top; a protruding portion is provided on the groove bottom surface of the first groove body, and an accommodating gap for accommodating the sealing ring and the first welding sheet is formed between the peripheral side surface of the protruding portion and the groove side wall surface of the first groove body, and the protruding portion can be adaptively fitted in the sealing ring and the first welding sheet.

[0006] In some embodiments, the ceramic packaging product also includes a pin, which is welded to the back side of the ceramic substrate through a second welding sheet. The positioning groove also includes a second groove body, which is arranged on the positioning surface of the substrate, and the first groove body is arranged on the groove bottom surface of the second groove body. The cross-section of the second groove body is adapted to the cross-section of the pin.

[0007] In some embodiments, a positioning mark is provided on the base for positioning the placement direction of the pin in the second slot.

[0008] In some embodiments, the positioning mark is a chamfered portion disposed at one end of the base.

[0009] In some embodiments, the substrate is provided with at least one exhaust hole on the peripheral side of the positioning groove, and the exhaust hole is communicated with the positioning groove.

[0010] In some embodiments, the exhaust hole is disposed between two adjacent circumferential inner walls of the positioning groove.

[0011] In some embodiments, a pressing block is further included, and the pressing block can be pressed on the upper side of the ceramic package product after the ceramic package product is embedded in the positioning groove.

[0012] In some embodiments, the depth of the positioning groove is greater than the thickness of the ceramic package product, so that the side of the pressing block facing the ceramic package product can be embedded in the positioning groove.

[0013] In some embodiments, a through hole is provided on the pressing block, the opening direction of the through hole is parallel to the opening direction of the positioning groove, and the through hole is used to allow a tool to be inserted and connected to the pressing block.

[0014] In a second aspect, the present application provides a welding process for a ceramic package product, using the welding tool described in the first aspect and any optional embodiment thereof, the welding process comprising:

[0015] Put the sealing ring into the first groove body and sleeve it on the raised part;

[0016] Put the first welding sheet into the first slot, sleeve it on the raised portion, and abut against the upper surface of the sealing ring;

[0017] Place the front side of the ceramic substrate into the first tank with the front side facing downwards and abutting against the upper surface of the first welding sheet;

[0018] The base is placed in a welding furnace, and the sealing ring is welded to the front side of the ceramic substrate through the first welding sheet.

[0019] The welding tooling and welding process of the ceramic packaging product provided by the present application have the beneficial effect that: compared with the prior art, when welding the ceramic packaging product, the sealing ring, the first welding piece and the ceramic substrate can be sequentially embedded in the positioning groove from bottom to top, the sealing ring and the first welding piece can be positioned by the protrusion in the positioning groove, and the position of the ceramic substrate can be positioned by the first groove body, thereby determining the relative positions of the sealing ring, the first welding piece and the ceramic substrate, so that the sealing ring and the ceramic substrate form a ceramic packaging product inverted in the positioning groove. By inverting the ceramic packaging product in the positioning groove, the ceramic packaging product is positioned and formed at one time, and the positioning error generated is small, thereby improving the positioning accuracy of each component in the ceramic packaging product and improving the welding quality of the ceramic packaging product. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0021] Figure 1 This is a schematic structural diagram of a ceramic packaging product in an exemplary embodiment of the present application;

[0022] Figure 2 This is a schematic structural diagram of a welding tool in an exemplary embodiment of the present application;

[0023] Figure 3 A partial cross-sectional view of a ceramic package product positioned in a positioning groove in an exemplary embodiment of the present application;

[0024] Figure 4It is a structural schematic diagram of a ceramic packaging product in another exemplary embodiment of the present application;

[0025] Figure 5 This is a schematic structural diagram of a welding tool in another exemplary embodiment of the present application;

[0026] Figure 6 for Figure 5 A magnified view of part A;

[0027] Figure 7 A partial cross-sectional view of a ceramic package product positioned in a positioning groove in another exemplary embodiment of the present application;

[0028] Figure 8 This is a partial view of a pin positioned in a second slot in another exemplary embodiment of the present application.

[0029] Among them, the reference numerals in the figure are:

[0030] 100-ceramic package product; 110-ceramic substrate; 120-sealing ring; 121-first welding piece; 130-pin; 131-second welding piece; 1301-arc inner angle; 1302-inclined inner angle;

[0031] 200-base; 201-positioning surface; 202-first slot body; 203-second slot body; 204-protrusion; 205-exhaust hole; 206-chamfered portion; 207-rounded corner portion;

[0032] 300 - pressing block; 310 - first block; 320 - second block; 301 - through hole. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0037] In a first aspect, the present application embodiment provides a welding tool for a ceramic package product 100, such as Figure 1 As shown, the ceramic package product 100 includes a ceramic substrate 110 and a sealing ring 120, and the sealing ring 120 is welded to the front of the ceramic substrate 110 through a first welding piece 121. The shape of the ceramic substrate 110 can be rectangular, and the sealing ring 120 is an annular structure that matches the shape of the ceramic substrate 110, and the outer contour size of the sealing ring 120 is slightly smaller than the size of the ceramic substrate 110. The first welding piece 121 is made of silver-copper solder or gold-tin solder, and its shape is the same as the end face shape of the sealing ring 120. During welding, the first welding piece 121 is placed between the sealing ring 120 and the ceramic substrate 110, and is heated in a welding furnace to melt the first welding piece 121, so as to weld the sealing ring 120 to the front of the ceramic substrate 110. When in use, the front of the ceramic substrate 110 is set upward, and the sealing ring 120 is located above the ceramic substrate 110.

[0038] like Figure 2 and Figure 3 As shown, the welding tool provided in the embodiment of the present application includes a base 200, and the base 200 has a positioning surface 201. The positioning surface 201 of the base 200 is provided with a positioning groove for positioning the ceramic package product 100, and the positioning groove includes a first groove body 202, and the cross-section of the first groove body 202 is adapted to the cross-section of the ceramic substrate 110, so that the sealing ring 120, the first welding piece 121 and the ceramic substrate 110 can be embedded in sequence; a protrusion 204 is convexly provided on the groove bottom surface of the first groove body 202, and an accommodating gap for accommodating the sealing ring 120 and the first welding piece 121 is formed between the peripheral side surface of the protrusion 204 and the groove side wall surface of the first groove body 202, and the protrusion 204 can be adapted to be fitted in the sealing ring 120 and the first welding piece 121.

[0039] Specifically, the base 200 may be a plate-like structure, the shape of the base 200 may be a rectangle or other shapes, and the base 200 may be made of a metal material or a non-metal material, for example, the base 200 may be made of a graphite material to have good heat resistance and corrosion resistance. When in use, the base 200 is placed horizontally, and the positioning surface 201 may be the upper surface of the base 200.

[0040] The positioning groove is a receiving structure with a certain space, which is used to receive the ceramic package product 100 so as to position each component in the ceramic package product 100. The positioning groove is arranged on the positioning surface 201 of the base 200, that is, the opening of the positioning groove is arranged upward. The number of the positioning grooves can be one or more, for example, a plurality of positioning grooves arranged at intervals are arranged on the positioning surface 201 of the base 200, so that a plurality of ceramic package products 100 can be positioned at the same time, and a plurality of ceramic package products 100 can be welded at the same time.

[0041] When the ceramic package product 100 is composed of a ceramic substrate 110 and a sealing ring 120, the positioning groove includes a first groove body 202, and the first groove body 202 can be set on the positioning surface 201 of the base 200. The shape of the first groove body 202 should be the same as the shape of the ceramic substrate 110. For example, the shape of the positioning groove is a rectangle, so that the position of the ceramic substrate 110 can be positioned by using the first groove body 202. The depth of the first groove body 202 can be greater than or equal to the total thickness of the ceramic substrate 110, the first welding sheet 121 and the sealing ring 120 after being stacked, so that the ceramic substrate 110, the first welding sheet 121 and the sealing ring 120 can be completely placed in the first groove body 202.

[0042] Since the outer contour dimensions of the sealing ring 120 and the first welding piece 121 are slightly smaller than the dimensions of the ceramic substrate 110, the sealing ring 120 and the first welding piece 121 can be placed in the first slot body 202. The raised portion 204 is a raised structure protruding upward on the bottom surface of the slot of the first slot body 202, and the shape of the raised portion 204 is the same as the inner shape of the sealing ring 120. For example, the shape of the raised portion 204 is a rectangle. After the sealing ring 120 and the first welding piece 121 are placed in the first slot body 202 in turn, the sealing ring 120 and the first welding piece 121 can be sleeved on the raised portion 204 to position the sealing ring 120 and the first welding piece 121 in the first slot body 202. The height of the raised portion 204 should be greater than the thickness of the sealing ring 120, so that the sealing ring 120 and the first welding piece 121 can be sequentially mounted on the raised portion 204 after being placed in the first groove 202. The height of the raised portion 204 should also be less than or equal to the total height of the sealing ring 120 and the first welding piece 121 after being stacked, so that after the sealing ring 120 and the first welding piece 121 are mounted on the raised portion 204, the upper surface of the raised portion 204 is not higher than the upper surface of the first welding piece 121, so as to avoid affecting the contact between the ceramic substrate 110 and the first welding piece 121. For example Figure 3 As shown, the height of the protrusion 204 is less than the total height of the sealing ring 120 and the first welding piece 121 after being stacked, so that after the first welding piece 121 is sleeved on the protrusion 204, the upper surface of the first welding piece 121 is slightly higher than the upper surface of the protrusion 204. On the one hand, it can ensure that the ceramic substrate 110 is in stable contact with the first welding piece 121, and on the other hand, it can ensure that the ceramic substrate 110 can be tightly connected with the sealing ring 120 after the first welding piece 121 is heated and melted.

[0043] The welding tool provided in this embodiment has a first groove body 202 arranged on the base 200 and a protrusion 204 arranged on the groove bottom surface of the first groove body 202. When welding the ceramic package product 100, the sealing ring 120 and the first welding piece 121 are first placed in the first groove body 202 in sequence and sleeved on the protrusion 204, and the positions of the sealing ring 120 and the first welding piece 121 are positioned. Then, the front side of the ceramic substrate 110 is placed into the first groove body 202 facing downward, so that the front side of the ceramic substrate 110 is against the first welding piece 121, and the position of the ceramic substrate 110 is positioned by the first groove body 202, so as to accurately locate the relative position of the sealing ring 120 and the ceramic substrate 110. By inverting the components in the ceramic package product 100, the ceramic package product 100 can be positioned and formed in the positioning groove at one time, without the need to use multi-layer stacked welding tooling for multiple positioning, and positioning errors will not accumulate, thereby improving the positioning accuracy of the ceramic package product 100 and ensuring the quality of the ceramic package product 100.

[0044] like Figure 4 As shown, another ceramic package product 100 further includes a pin 130, which is connected to the back of the ceramic substrate 110 through a second welding piece 131. The pin 130 is used to provide electrical connection, and is a rectangular sheet structure. The inner side of the pin 130 is hollowed out, and the outer contour size of the pin 130 is larger than the size of the ceramic substrate 110. The ceramic substrate 110 is located in the middle part of the pin 130. The outer contour shape of the second welding piece 131 is the same as the outer contour shape of the ceramic substrate 110, so as to weld the middle part of the pin 130 to the back of the ceramic substrate 110. When in use, the back of the ceramic substrate 110 faces downward, and the pin 130 is located below the ceramic substrate 110.

[0045] like Figure 5 , Figure 6 and Figure 7As shown, in some embodiments, when the ceramic package product 100 is composed of a ceramic substrate 110, a sealing member, and a pin 130, the positioning groove further includes a second groove body 203, the second groove body 203 is arranged on the positioning surface 201 of the substrate, and the first groove body 202 is arranged on the groove bottom surface of the second groove body 203. The cross section of the second groove body 203 is adapted to the cross section of the pin 130, so that the pin 130 can be in the second groove body 203.

[0046] Specifically, the second slot body 203 is disposed on the positioning surface 201 of the base 200, and an opening of the second slot body 203 is formed on the positioning surface 201. The shape of the second slot body 203 is the same as the outer contour shape of the pin 130, for example, the shape of the second slot body 203 is rectangular, and the depth of the second slot body 203 is not less than the thickness of the pin 130, so that the pin 130 can be completely embedded in the second slot body 203, and the second slot body 203 is used to locate the position of the pin 130.

[0047] The first groove body 202 is arranged on the groove bottom surface of the second groove body 203, and the opening of the first groove body 202 is formed on the groove bottom surface of the second groove body 203. The depth of the first groove body 202 can be greater than the total thickness of the sealing ring 120, the first welding piece 121 and the ceramic substrate 110 after stacking, so that the second welding piece 131 can be embedded in the first groove body 202 and abut against the upper surface of the ceramic substrate 110. Since the outer contour of the second welding piece 131 is the same as the outer contour of the ceramic substrate 110, the second welding piece 131 can be positioned by the first groove body 202 to determine the relative position of the second welding piece 131 and the ceramic substrate 110. Furthermore, the depth of the first groove body 202 may be slightly smaller than the total thickness of the sealing ring 120, the first welding piece 121, the ceramic substrate 110 and the second welding piece 131 after being stacked, so that after the second welding piece 131 is embedded in the positioning groove, the upper surface of the second welding piece 131 is higher than the bottom surface of the groove of the first groove body 202, so that the pin 130 can be completely attached to the second welding piece 131, ensuring the stable connection between the pin 130 and the ceramic substrate 110.

[0048] When the ceramic packaging product 100 is composed of a substrate, a sealing ring 120 and a pin 130, the positioning groove includes a first groove body 202 and a second groove body 203, and the second groove body 203 is arranged on the positioning surface 201 of the substrate, the first groove body 202 is arranged on the groove bottom surface of the second groove body 203, and a protrusion 204 is arranged on the groove bottom surface of the first groove body 202, and the protrusion 204 is used to position the sealing ring 120 and the first welding piece 121, the first groove body 202 is used to position the ceramic substrate 110 and the second welding piece 131, and the second groove body 203 is used to position the pin 130, so that the ceramic packaging product 100 is inverted in the positioning groove, the ceramic packaging product 100 is positioned and formed at one time, and the positioning accuracy of the ceramic packaging product 100 is improved.

[0049] In some embodiments, a positioning mark is provided on the base 200 for positioning the placement direction of the pin 130 in the second slot 203 .

[0050] Specifically, Figure 4 As shown, the connection between the pin 130 and the ceramic substrate 110 is directional. In order to facilitate identification of the connection position of the pin 130, the pin 130 will have an identification structure for identifying the direction of the pin 130. For example, the inner side of the pin 130 is hollowed out and forms four corners, three of which are set as arc inner corners 1301, and the other corner is set as an inclined inner corner 1302. When placing the pin 130, it is necessary to make the inclined inner corner 1302 on each pin 130 in the second slot 203 face the same direction. By setting a positioning mark on one side of the base 200, when the pin 130 is placed in the second slot 203, the placement direction of the pin 130 can be determined by making the inclined inner corner 1302 on the pin 130 face or face away from the positioning mark.

[0051] In some embodiments, the positioning mark is a chamfered portion 206 disposed at one end of the base 200. Figure 5 and Figure 8 As shown, when the shape of the base 200 is rectangular, the base 200 has four corners, and one end corner of the base 200 can be set as a chamfered portion 206, and the remaining corners can be set as rounded corners 207. When placing the pin 130, the chamfered portion 206 on the pin 130 is directed toward the chamfered portion 206 on the base 200, so as to determine the placement position of the pin 130 in the second slot 203. In addition, the positioning mark can also be a groove set on the upper surface of the base 200 or a protruding structure convexly set on the upper surface of the base 200.

[0052] In some embodiments, at least one exhaust hole 205 is disposed on the substrate around the positioning groove, and the exhaust hole 205 is connected to the positioning groove.

[0053] like Figure 2As shown, when the positioning groove only includes the first groove body 202, the exhaust hole 205 can be arranged on the positioning surface 201 of the substrate, and an orifice is formed on the positioning surface 201 of the substrate. The exhaust hole 205 is used to allow the gas generated when the first welding sheet 121 melts into solder during the welding process to enter the exhaust hole 205 and be discharged from the first groove body 202 through the orifice of the exhaust hole 205. In addition, when the ceramic substrate 110 is placed in the first groove body 202, the gas pressed under the ceramic substrate 110 can be discharged from the exhaust hole 205, so that it is not easy to mix gas between the ceramic substrate 110 and the sealing ring 120, so that the welding effect of the ceramic substrate 110 and the sealing ring 120 is better. Among them, the shape of the exhaust hole 205 can be circular, and the number of the exhaust holes 205 can be multiple and arranged around the first groove body 202, so that the gas can be discharged from multiple positions around the first groove body 202.

[0054] In some embodiments, the exhaust hole 205 can be arranged between two adjacent circumferential inner walls of the first groove body 202. While being able to exhaust gas, it can also serve as a back-off groove when processing the first groove body 202, so as to improve the processing accuracy between the two adjacent circumferential inner walls of the first groove body 202, thereby improving the positioning accuracy of the first groove body 202 on the ceramic substrate 110.

[0055] like Figure 5 and Figure 6 As shown, when the positioning groove includes the first groove body 202 and the second groove body 203, one or more exhaust holes 205 may be provided on the peripheral sides of the first groove body 202 and the second groove body 203, wherein the exhaust holes 205 located on the peripheral sides of the first groove body 202 are used to exhaust the gas generated under the ceramic substrate 110, and the exhaust holes 205 located on the peripheral sides of the second groove body 203 are used to exhaust the gas generated under the pins 130. Of course, the air flow holes located on the peripheral sides of the second groove body 203 may also be provided between two adjacent peripheral side inner walls of the second groove body 203, and can also be used as the tool backing groove when processing the second groove body 203, thereby improving the processing accuracy of the second groove body 203, and further providing the positioning accuracy of the second groove body 203 to the position of the pins 130.

[0056] In some embodiments, the welding tool further includes a pressing block 300 , which can be pressed onto the upper side of the ceramic package product 100 after the ceramic package product 100 is placed into the positioning groove.

[0057] The pressing block 300 can be made of metal material or non-metal material, for example, it can be made of the same graphite material as the base 200, so as to have good heat resistance and corrosion resistance. The number of pressing blocks 300 can be the same as the number of positioning grooves on the base 200 and correspond one to one. When in use, each ceramic package product 100 in each positioning groove uses a single pressing block 300 to provide pressure. In addition, the number of pressing blocks 300 can be set to only one, and the shape is the same as the upper surface of the base 200. When in use, the pressing block 300 is placed as a whole on the positioning surface 201 of the base 200, and is pressed on the ceramic package products 100 in multiple positioning grooves at the same time.

[0058] like Figure 2 and Figure 3 As shown, for the ceramic packaging product 100 composed of the ceramic substrate 110 and the sealing ring 120, the positioning groove includes a first groove body 202, and the shape of the pressing block 300 can be the same as the shape of the first groove body 202, so that it can be pressed on the upward side surface of the ceramic substrate 110, and the gravity of the pressing block 300 is used to apply downward pressure to the ceramic substrate 110, so that the ceramic substrate 110, the first welding sheet 121 and the sealing ring 120 are tightly fitted to ensure the welding effect.

[0059] like Figure 5 and Figure 7 As shown, when the ceramic packaging product 100 includes a ceramic substrate 110, a sealing ring 120 and a pin 130, the positioning groove includes a first groove body 202 and a second groove body 203, and the pressing block 300 may include a first block body 310 and a second block body 320, the first block body 310 is connected to one end of the second block body 320, the shape of the first block body 310 is the same as the shape of the first groove body 202, and the shape of the second block body 320 is the same as the shape of the second groove body 203. After placing the sealing ring 120, the first welding piece 121, the ceramic substrate 110, the second welding piece 131 and the pin 130 into the positioning groove in sequence, the pressing block 300 can be placed into the first groove body 202 with the first block 310 facing downward, so that the first block 310 applies downward pressure to the portion of the pin 130 at the opening of the first groove body 202, so as to ensure that the pin 130, the second welding piece 131, the ceramic substrate 110, the first welding piece 121 and the sealing ring 120 are tightly fitted to each other to ensure the welding quality.

[0060] In some embodiments, the depth of the positioning groove is greater than the thickness of the ceramic package product 100 , so that the portion of the pressing block 300 facing the ceramic package product 100 can be embedded in the positioning groove.

[0061] Specifically, Figure 3As shown, for the ceramic package product 100 composed of the ceramic substrate 110 and the sealing ring 120, the positioning groove includes a first groove body 202, and the depth of the first groove body 202 should be greater than the sum of the total thickness of the ceramic substrate 110, the first welding piece 121 and the sealing ring 120, so that after the ceramic substrate 110 is placed in the first groove body 202, there is a space for the partial embedding of the pressing block 300 from the upper surface of the ceramic substrate 110 to the opening of the first groove body 202, and the position of the pressing block 300 is positioned by using the first groove body 202 to ensure that the pressure provided by the pressing block 300 to the ceramic substrate 110 is in the middle position, so that the pressure on each position of the ceramic substrate 110, the first welding piece 121 and the sealing ring 120 is evenly applied, and the fitting effect is better.

[0062] like Figure 7 As shown, when the ceramic packaging product 100 includes a ceramic substrate 110, a sealing ring 120 and a pin 130, the positioning groove includes a first groove body 202 and a second groove body 203, wherein the depth of the second groove body 203 should be greater than the thickness of the pin 130, so that after the pin 130 is placed in the second groove body 203, there is a space between the upper surface of the pin 130 and the opening of the second groove body 203 for partially embedding the pressing block 300, so that the second groove body 203 is used to locate the placement position of the second block 320, ensuring that the first block 310 is accurately pressed at the contact position between the pin 130 and the ceramic substrate 110, thereby improving the fitting effect.

[0063] In addition, the depth of the positioning groove can also be slightly smaller than the thickness of the ceramic package product 100, so that after the ceramic package product 100 is placed in the positioning groove, the upper surface of the ceramic package product 100 is slightly higher than the positioning surface 201 of the base 200, so that the pressing block 300 can be stably pressed against the upward surface of the ceramic package product 100 to provide stable pressure.

[0064] In some embodiments, a through hole 301 may be provided on the pressing block 300. After the welding of the ceramic package product 100 is completed, the temperature of the pressing block 300 is relatively high when the base 200 is taken out of the welding furnace. The through hole 301 can be inserted with tools such as a rod to facilitate the application of force to the pressing block 300, so as to facilitate the removal of the pressing block 300 from the base 200. The shape of the through hole 301 may be circular, and the axial direction of the through hole 301 may be parallel to the opening direction of the positioning groove. The through hole 301 may be provided at the center of the pressing block 300 to prevent the center of gravity of the pressing block 300 from shifting and affecting the pressing effect on the ceramic package product 100.

[0065] In the second aspect, the embodiment of the present application also provides a welding process for a ceramic packaging product 100, using the welding tooling in the embodiment of the first aspect, wherein the ceramic packaging product 100 includes a ceramic substrate 110 and a sealing ring 120, and the sealing ring 120 is welded to the front side of the ceramic substrate 110 through a first welding sheet 121.

[0066] Combination Figures 1 to 8 As shown, the welding process includes the following steps:

[0067] Step 1: Place the sealing ring 120 into the first groove 202 and sleeve it on the raised portion 204;

[0068] Step 2: Place the first welding sheet 121 into the first groove 202, sleeve it on the raised portion 204, and abut against the upper surface of the sealing ring 120;

[0069] Step 3: Place the front side of the ceramic substrate 110 into the first tank 202 with the front side facing downwards and abut against the upper surface of the first welding piece 121;

[0070] Step 4: Place the base 200 into a welding furnace, and weld the sealing ring 120 to the front side of the ceramic substrate 110 via the first welding sheet 121 .

[0071] Through the above steps, the ceramic package product 100 can be positioned and formed in the positioning groove in an inverted manner at one time, and the positioning error is small, thereby ensuring that the welding quality meets the technical requirements.

[0072] In some embodiments, the ceramic package product 100 further includes a pin 130, and the pin 130 is welded to the back of the ceramic substrate 110 through the second welding piece 131. At this time, after the front side of the ceramic substrate 110 is placed into the first slot 202 with the front side facing downward, the welding process further includes: placing the second welding piece 131 into the first slot 202 to abut against the back of the ceramic substrate 110, and placing the pin 130 into the second slot 203 to abut against the upper surface of the second welding piece 131. The second slot 203 is used to locate the placement position of the pin 130, so that the pin 130 can be accurately welded to the back of the ceramic substrate 110 through the second welding piece 131.

[0073] In addition, after the ceramic packaging product 100 is inverted and positioned in the positioning groove, the pressing block 300 is pressed onto the ceramic packaging product 100 to provide pressure to the ceramic packaging product 100, thereby ensuring the tight connection of the components in the ceramic packaging product 100, improving the welding quality of the ceramic packaging product 100, and improving the production qualification rate of the ceramic packaging product 100.

[0074] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A welding tool for a ceramic package product, wherein the ceramic package product comprises a ceramic substrate, a first welding sheet and a sealing ring stacked in sequence; characterized in that: The welding tool includes a base, the base has a positioning surface, and the positioning surface of the base is provided with at least one positioning groove for positioning the ceramic packaging product; the positioning groove includes a first groove body, the cross-section of the first groove body is adapted to the cross-section of the ceramic substrate, and the sealing ring, the first welding piece and the ceramic substrate can be embedded in sequence from bottom to top; a protruding portion is protruding from the bottom surface of the groove of the first groove body, and an accommodating gap for accommodating the sealing ring and the first welding piece is formed between the peripheral side surface of the protruding portion and the groove side wall surface of the first groove body, and the protruding portion can be adapted to be fitted in the sealing ring and the first welding piece.

2. The welding tool according to claim 1, wherein the ceramic package product further comprises a pin, and the pin is welded to the back side of the ceramic substrate through a second welding sheet, wherein: The positioning groove further includes a second groove body, the second groove body is arranged on the positioning surface of the substrate, the first groove body is arranged on the groove bottom surface of the second groove body, and the cross section of the second groove body is adapted to the cross section of the pin.

3. The welding tool according to claim 2, characterized in that: The base is provided with a positioning mark for positioning the placement direction of the pin in the second slot body.

4. The welding tool according to claim 3, characterized in that: The positioning mark is a chamfered portion arranged at one end of the base.

5. The welding tool according to any one of claims 1 to 4, characterized in that: The substrate is provided with at least one exhaust hole on the peripheral side of the positioning groove, and the exhaust hole is communicated with the positioning groove.

6. The welding tool according to claim 5, characterized in that: The exhaust hole is arranged between two adjacent peripheral inner walls of the positioning groove.

7. The welding tool according to any one of claims 1 to 4, characterized in that: It also includes a pressing block, which can be pressed on the upper side of the ceramic package product after the ceramic package product is embedded in the positioning groove.

8. The welding tool according to claim 7, characterized in that: The depth of the positioning groove is greater than the thickness of the ceramic package product, so that the side of the pressing block facing the ceramic package product can be embedded in the positioning groove.

9. The welding tool according to claim 7, characterized in that: The pressing block is provided with a through hole, the opening direction of the through hole is parallel to the opening direction of the positioning groove, and the through hole is used for inserting a tool to connect with the pressing block.

10. A welding process for a ceramic packaging product, characterized in that: Using the welding tool described in any one of claims 1 to 9, the welding process includes: Put the sealing ring into the first groove body and sleeve it on the raised part; Put the first welding sheet into the first slot, sleeve it on the raised portion, and abut against the upper surface of the sealing ring; Place the front side of the ceramic substrate into the first tank with the front side facing downwards and abutting against the upper surface of the first welding sheet; The base is placed in a welding furnace, and the sealing ring is welded to the front side of the ceramic substrate through the first welding sheet.

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