Novel ultrathin high-heat-dissipation projection lamp

Abstract

The novel ultrathin high-heat-dissipation projection lamp comprises a shell and a circuit board arranged in the shell, a plurality of lamp beads are arranged on the circuit board, and the novel ultrathin high-heat-dissipation projection lamp is characterized in that the shell is provided with a hollowed-out part, the circuit board is arranged on the back face of the shell, a heat dissipation structure is arranged on the back face of the circuit board, and all the lamp beads are located in the hollowed-out part. The shell of the novel ultrathin high-heat-dissipation projection lamp is provided with the hollowed-out part, the circuit board is located on the back face of the shell, all the lamp beads are located on the hollowed-out part, and the heat dissipation structure is directly arranged on the back face of the circuit board, so that the heat conduction link is reduced, the heat resistance is lower, heat dissipation is facilitated, the heat dissipation effect of the projection lamp is better, and meanwhile the projection lamp is thinner.

Description

Technical Field

[0001] The invention relates to the technical field of lamps, and in particular to a novel ultra-thin high-heat dissipation floodlight. Background Art

[0002] A floodlight is a lamp with a higher illumination on a designated illuminated surface than the surrounding environment. For example, Chinese invention patent application number CN202420435376.4 discloses an LED floodlight, comprising a main shell, a mounting seat is provided on the front side of the main shell and is covered by a front cover, the front cover and the mounting seat constitute a mounting cavity, a light-emitting module is arranged in the mounting cavity, a plurality of heat sinks are regularly arranged on the rear side of the main shell, the heat sinks are integrally formed with the main shell, a drive compartment is provided on the main shell below the heat sink, a drive power supply and a control circuit board are installed in the drive compartment, the drive compartment is covered by the rear cover, a plurality of heat dissipation holes are provided on the surface of the main shell, the heat dissipation holes are located on the periphery of the mounting seat, the heat dissipation holes are in a narrow and long structure, and the heat dissipation holes pass through the front cover.

[0003] The heat dissipation structure of this type of floodlight is mostly set on the back of the shell. The heat is transferred from the lamp beads and the circuit board to the shell, and then transferred to the heat dissipation structure for heat dissipation. There are many heat conduction links, the heat dissipation effect is poor, the thermal resistance is high, and the floodlight is thicker. Summary of the invention

[0004] In view of the shortcomings of the background technology, the technical problem to be solved by the present invention is to provide a new type of ultra-thin high heat dissipation floodlight with better heat dissipation effect.

[0005] To this end, the present invention is implemented by adopting the following technical solutions:

[0006] A novel ultra-thin high heat dissipation floodlight comprises a shell and a circuit board arranged in the shell, on which a plurality of lamp beads are arranged. The invention is characterized in that the shell has a hollow portion, the circuit board is arranged on the back of the shell, and a heat dissipation structure is arranged on the back of the circuit board, and all the lamp beads are located in the hollow portion.

[0007] Furthermore, the outer ring of the circuit board is bonded to the back of the shell by glue, the front of the shell is provided with a groove for placing the power supply and wires, the shell is provided with a terminal block inserted into the groove, the terminal block is provided with a threading hole, and a light-transmitting plate covering the hollow part and the groove is bonded to the front of the shell by glue, the part of the light-transmitting plate corresponding to the groove is coated with a colored paint that can cover the groove and its internal structure, the shell is detachably connected with a ring panel exposing the hollow part, a plurality of card slots are provided around the shell, and the ring panel is provided with buckles that are snapped into the card slots.

[0008] Furthermore, a light-transmitting plate is bonded to the back of the shell by glue, and the outer ring of the circuit board is bonded to the back of the light-transmitting plate by glue. A groove for placing a power source and wires is provided on the back of the shell, and the groove is equipped with a cover.

[0009] Furthermore, a circle of shallow glue grooves is provided in the groove, and the lower end of the cover has a circle of long inserts that can be inserted into the shallow glue grooves. The long inserts are provided with wiring seats, and the wiring seats are provided with threading holes. The shell is provided with an opening for inserting the wiring seat.

[0010] Furthermore, a circle of shallow glue grooves is provided in the groove, the lower end of the cover has a circle of pressing plates pressed flat on the shallow glue grooves, the insert is provided with a wiring seat, the wiring seat is provided with a threading hole, and the shell is provided with an opening for inserting the wiring seat.

[0011] Furthermore, a circle of deep glue grooves is provided in the groove, a circle of short inserts that can be inserted into the deep glue grooves is provided at the lower end of the cover, a wiring seat is provided on the shell, and a threading hole is provided on the wiring seat.

[0012] Furthermore, the circuit board is an aluminum substrate or a flexible circuit board, the aluminum substrate is composed of a conductive layer, an insulating layer and an aluminum plate from top to bottom, and countersunk rivets for connecting a ground wire are riveted on the aluminum substrate, and the flexible circuit board is composed of a conductive layer and an insulating layer from top to bottom.

[0013] Furthermore, the circuit board is an aluminum substrate or a flexible circuit board, the aluminum substrate is composed of a conductive layer, an insulating layer and an aluminum plate from top to bottom, the heat dissipation structure and the aluminum plate are laser welded, and the aluminum substrate has a punching hole from bottom to top, the flexible circuit board is composed of a conductive layer and an insulating layer from top to bottom, the aluminum plate has an upward stamping and stretching portion, the stamping and stretching portion has an outwardly curled bending portion, and the lower end of the bending portion presses a wiring piece for connecting a grounding wire.

[0014] Furthermore, the shell is provided with a circle of enclosures surrounding the heat dissipation structure, the enclosure is provided with air holes communicating with the heat dissipation structure, there is a gap between the enclosure and the heat sink, and drainage holes are provided on both sides of the enclosure away from the air holes.

[0015] Furthermore, the heat dissipation structure includes a heat sink bonded to the circuit board, the heat sink is provided with a plurality of upwardly protruding ridges, a first ventilation duct is formed between adjacent ridges, the ridges are provided with heat dissipation holes along their length direction, the heat dissipation holes form a second ventilation duct, the heat sink is an integrally formed metal sheet, the ridges are straight or wavy, and the shell is a non-metallic frame.

[0016] After adopting the above technical solution, the shell has a hollow part, the circuit board is located on the back of the shell, all the lamp beads are located in the hollow part, and the heat dissipation structure is directly arranged on the back of the circuit board, which reduces the heat conduction link, lowers the thermal resistance, and facilitates heat dissipation, so that the heat dissipation effect of the floodlight is better, and the thickness of the floodlight is thinner. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention has the following accompanying drawings:

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the first embodiment of the present invention;

[0019] Figure 2 It is a three-dimensional structural schematic diagram of another viewing direction of the first embodiment of the present invention;

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the first embodiment of the present invention without the light-transmitting plate;

[0021] Figure 4 This is a schematic diagram of a three-dimensional structure of the second embodiment of the present invention with the cover opened;

[0022] Figure 5 This is a schematic diagram of a three-dimensional structure of a cover opened according to a third embodiment of the present invention;

[0023] Figure 6 This is a schematic diagram of a three-dimensional structure of a fourth embodiment of the present invention with the cover opened;

[0024] Figure 7 It is a partial cross-sectional view of a first embodiment of the grounding structure of an aluminum substrate in the present invention;

[0025] Figure 8 It is a partial cross-sectional view of the second embodiment of the aluminum substrate grounding structure of the present invention.

[0026] Figure numerals: 1. shell; 2. circuit board; 3. lamp bead; 4. hollow part; 5. heat sink; 6. convex strip; 7. heat dissipation through hole; 8. groove; 9. terminal block; 10. threading hole; 11. light-transmitting plate; 12. cover; 13. shallow glue groove; 14. long plug; 15. opening; 16. pressure plate; 17. deep glue groove; 18. short plug; 19. enclosure; 20. air vent; 21. conductive layer; 22. insulating layer; 23. aluminum plate; 24. countersunk rivet; 25. stamping hole; 26. stamping stretching part; 27. bending part; 28. terminal; 29. ​​slot; 30. drainage hole. DETAILED DESCRIPTION

[0027] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined invention purpose, the specific implementation method, structure, characteristics and effects of the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.

[0028] Referring to the above-mentioned drawings, the new type of ultra-thin high heat dissipation floodlight provided by the present invention includes a shell 1 and a circuit board 2 arranged in the shell 1, and a plurality of lamp beads 3 are arranged on the circuit board 2. The characteristics are: the shell 1 has a hollow portion 4, the circuit board 2 is arranged on the back of the shell 1, and the back of the circuit board 2 is provided with a heat dissipation structure, all the lamp beads 3 are located in the hollow portion 4, the heat dissipation structure includes a heat sink 5 bonded to the circuit board 2, the heat sink 5 is provided with a plurality of upwardly protruding ribs 6, and a first ventilation duct is formed between adjacent ribs 6, the ribs 6 are penetrated along the length direction thereof with heat dissipation through holes 7, and the heat dissipation through holes 7 form a second ventilation duct, the heat sink 5 is an integrally formed metal sheet, the ribs 6 are straight or wavy, and the shell 1 is a non-metallic frame.

[0029] In this embodiment, the shell 1 has a hollow portion 4, the circuit board 2 is located on the back of the shell 1, and all the lamp beads 3 are located in the hollow portion 4. The heat dissipation structure is directly arranged on the back of the circuit board 2, which reduces the heat conduction link, has lower thermal resistance, and is convenient for heat dissipation, so that the heat dissipation effect of the floodlight is better, and the thickness of the floodlight is thinner; the setting of the first ventilation duct and the second ventilation duct greatly increases its contact area with the air and wind flow, so that the heat dissipation structure can quickly dissipate the heat generated by the lamp beads 3, so as to achieve rapid cooling of the lamp beads 3, better heat dissipation effect, and also reduce light decay, and extend the service life of the lamp; the heat sink 5 is an integrally formed metal sheet, and the heat conduction and heat dissipation are more uniform; the wavy ridges 6 can increase its contact area with the air and wind flow, and further increase the heat dissipation effect.

[0030] Reference Figure 1-3 As shown, it is the first embodiment of the present invention, the outer ring of the circuit board 2 is bonded to the back of the shell 1 by glue, the front of the shell 1 is provided with a groove 8 for placing the power supply and wires, the shell 1 is provided with a terminal block 9 inserted into the groove 8, the terminal block 9 is provided with a threading hole 10, and the front of the shell 1 is bonded with a light-transmitting plate 11 covering the hollow part 4 and the groove 8 by glue, the part of the light-transmitting plate 11 corresponding to the groove 8 is coated with a colored paint that can cover the groove 8 and its internal structure, so that the floodlight is more beautiful, the shell 1 is detachably connected with a circle panel exposing the hollow part 4, a plurality of card slots 29 are provided around the shell 1, and the circle panel is provided with a buckle that is inserted into the card slot 29, and the circle panel can be selected by users with different needs, and has stronger applicability.

[0031] Reference Figure 4As shown, it is a second embodiment of the present invention, the back of the shell 1 is bonded with a light-transmitting plate 11 by glue, the outer circle of the circuit board 2 is bonded to the back of the light-transmitting plate 11 by glue, the back of the shell 1 is provided with a groove 8 for placing the power supply and wires, the groove 8 is equipped with a cover 12, a circle of shallow glue grooves 13 is provided in the groove 8, the lower end of the cover 12 has a circle of long inserts 14 that can be inserted into the shallow glue grooves 13, the long inserts 14 are provided with a wiring seat 9, the wiring seat 9 is provided with a threading hole 10, and the shell 1 is provided with an opening 15 for accommodating the wiring seat 9 to be inserted.

[0032] In this embodiment, glue is injected into the shallow glue groove 13 , and then the cover 12 is covered to insert the long insert piece 14 into the shallow insertion groove to contact and bond with the glue, thereby ensuring the sealing of the groove 8 .

[0033] Reference Figure 5 As shown, it is a third embodiment of the present invention, the back of the shell 1 is bonded with a light-transmitting plate 11 by glue, the outer circle of the circuit board 2 is bonded to the back of the light-transmitting plate 11 by glue, the back of the shell 1 is provided with a groove 8 for placing a power supply and wires, the groove 8 is equipped with a cover 12, a circle of shallow glue grooves 13 is provided in the groove 8, the lower end of the cover 12 has a circle of pressing plates 16 pressed flat on the shallow glue grooves 13, the plug is provided with a wiring seat 9, the wiring seat 9 is provided with a threading hole 10, and the shell 1 is provided with an opening 15 for accommodating the wiring seat 9 to be inserted.

[0034] In this embodiment, glue is injected into the shallow glue groove 13, and then the cover 12 is covered to make the pressure plate 16 flat on the shallow glue groove 13 to contact and bond with the glue to ensure the sealing of the groove 8. The setting of the pressure plate 16 has a larger contact area with the glue and better sealing.

[0035] Reference Figure 6 As shown, it is the fourth embodiment of the present invention, the back of the shell 1 is bonded with a light-transmitting plate 11 by glue, the outer circle of the circuit board 2 is bonded to the back of the light-transmitting plate 11 by glue, the back of the shell 1 is provided with a groove 8 for placing a power source and wires, the groove 8 is equipped with a cover 12, the lower end of the cover 12 has a circle of short inserts 18 that can be inserted into the deep glue groove 17, the shell 1 is provided with a wiring seat 9, and the wiring seat 9 is provided with a threading hole 10.

[0036] In this embodiment, glue is injected into the deep glue groove 17 , and then the cover 12 is closed to insert the short insert 18 into the deep glue groove 17 to contact and bond with the glue, thereby ensuring the sealing of the groove 8 .

[0037] The above four embodiments provide a variety of different housing 1 assembly structures to meet different needs and have greater applicability.

[0038] Among them, in the first, second and third embodiments, the shell 1 is provided with a circle of panels 19 surrounding the heat dissipation structure, and the panels 19 are provided with air holes 20 communicating with the heat dissipation structure. There is a gap between the panels 19 and the heat sink 5, and the panels 19 are provided with drainage holes 30 on both sides away from the air holes, so that rainwater can be discharged on rainy days to prevent water accumulation in the panels 19. The heat dissipation structure on the back of the shell 1 is surrounded by a circle of panels 19, which effectively prevents the heat dissipation structure from harming people or objects, and protects the heat dissipation structure at the same time, making it safer and more beautiful. The heat dissipation structure can be made thinner after being protected by the panels 19, reducing costs. The setting of the air holes 20 is conducive to convection between the heat dissipation structure and the outside to ensure the heat dissipation effect. The setting of the gap avoids blocking the first ventilation duct and the second ventilation duct to ensure normal heat dissipation of the first ventilation duct and the second ventilation duct.

[0039] Reference Figure 7 As shown, it is a cross-sectional view of the first embodiment of the aluminum substrate grounding structure in the present invention, the circuit board 2 is an aluminum substrate or a flexible circuit board, the aluminum substrate is composed of a conductive layer 21, an insulating layer 22 and an aluminum plate 23 from top to bottom, the heat dissipation structure and the aluminum plate are welded by laser, and a countersunk rivet 24 for connecting the grounding wire is riveted on the aluminum substrate, and the flexible circuit board is composed of a conductive layer 21 and an insulating layer 22 from top to bottom.

[0040] In this embodiment, the aluminum substrate is riveted by countersunk rivets 24. The head of the countersunk rivet 24 serves as a grounding point, and the other end is flush with the aluminum plate 23, so that the back of the aluminum substrate is convenient for bonding the heat sink 5. The heat sink 5 can also be laser welded to the aluminum plate, and the two are in direct contact, which further reduces the heat conduction link and makes the floodlight have a better heat dissipation effect. The flexible circuit board has only two layers of structure, which is thinner and has fewer heat transfer paths, making it easier to dissipate heat.

[0041] Reference Figure 8 As shown, it is a cross-sectional view of the second embodiment of the aluminum substrate grounding structure in the present invention, the circuit board 2 is an aluminum substrate or a flexible circuit board, the aluminum substrate is composed of a conductive layer 21, an insulating layer 22 and an aluminum plate 23 from top to bottom, and the aluminum substrate has a punching hole 25 from bottom to top, the flexible circuit board is composed of a conductive layer 21 and an insulating layer 22 from top to bottom, the aluminum plate 23 has an upward stamping stretching portion 26, the stamping stretching portion 26 has an outwardly curled bending portion 27, and the lower end of the bending portion 27 presses a terminal piece 28 for connecting a grounding wire.

[0042] In this embodiment, the aluminum substrate is stamped from bottom to top, so that the aluminum plate 23 is deformed to form an upward stamped and stretched portion 26, and the stamped and stretched portion 26 is then rolled outward to form a bent portion 27. The lower end of the bent portion 27 presses a terminal plate 28 for connecting a ground wire, so that the back side of the aluminum substrate is convenient for bonding the heat sink 5. The flexible circuit board has only two layers of structure, is thinner, has fewer heat transfer paths, and is convenient for heat dissipation.

[0043] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A new type of ultra-thin high heat dissipation floodlight, comprising a housing and a circuit board arranged in the housing, wherein a plurality of lamp beads are arranged on the circuit board, and the characteristics are: The shell has a hollow portion, the circuit board is arranged on the back of the shell, and a heat dissipation structure is arranged on the back of the circuit board, and all the lamp beads are located in the hollow portion.

2. The novel ultra-thin high heat dissipation floodlight according to claim 1 is characterized in that: The outer ring of the circuit board is bonded to the back of the shell by glue, and the front of the shell is provided with a groove for placing the power supply and wires, and the shell is provided with a terminal block inserted into the groove, and the terminal block is provided with a threading hole, and a light-transmitting plate covering the hollow part and the groove is bonded to the front of the shell by glue, and the part of the light-transmitting plate corresponding to the groove is coated with a colored paint that can cover the groove and its internal structure, and the shell is detachably connected with a ring panel exposing the hollow part, and a plurality of card slots are provided around the shell, and the ring panel is provided with a buckle that is inserted into the card slot.

3. The novel ultra-thin high heat dissipation floodlight according to claim 1 is characterized in that: The back of the shell is bonded with a light-transmitting plate by glue, the outer ring of the circuit board is bonded to the back of the light-transmitting plate by glue, and the back of the shell is provided with a groove for placing a power source and wires, and the groove is equipped with a cover.

4. The novel ultra-thin high heat dissipation floodlight according to claim 3 is characterized in that: A circle of shallow glue grooves is arranged in the groove, a circle of long inserts which can be inserted into the shallow glue grooves is arranged at the lower end of the cover, a wiring seat is arranged on the long inserts, a threading hole is arranged on the wiring seat, and an opening for inserting the wiring seat is arranged on the shell.

5. The novel ultra-thin high heat dissipation floodlight according to claim 3 is characterized in that: A circle of shallow glue groove is arranged in the groove, a circle of pressing plate is arranged at the lower end of the sealing cover to press flatly on the shallow glue groove, a wiring seat is arranged on the inserting piece, a threading hole is arranged on the wiring seat, and an opening is arranged on the shell to accommodate the insertion of the wiring seat.

6. The novel ultra-thin high heat dissipation floodlight according to claim 3 is characterized in that: A circle of deep glue grooves is arranged in the groove, a circle of short inserts which can be inserted into the deep glue grooves is arranged at the lower end of the cover, a wiring seat is arranged on the shell, and a threading hole is arranged on the wiring seat.

7. The novel ultra-thin high heat dissipation floodlight according to any one of claims 1 to 6 is characterized in that: The circuit board is an aluminum substrate or a flexible circuit board. The aluminum substrate is composed of a conductive layer, an insulating layer and an aluminum plate from top to bottom, and countersunk rivets for connecting a grounding wire are riveted on the aluminum substrate. The flexible circuit board is composed of a conductive layer and an insulating layer from top to bottom.

8. The novel ultra-thin high heat dissipation floodlight according to any one of claims 1 to 6 is characterized in that: The circuit board is an aluminum substrate or a flexible circuit board. The aluminum substrate consists of a conductive layer, an insulating layer and an aluminum plate from top to bottom. The heat dissipation structure and the aluminum plate are laser welded, and the aluminum substrate has a punching hole from bottom to top. The flexible circuit board consists of a conductive layer and an insulating layer from top to bottom. The aluminum plate has an upward stamping and stretching portion, and the stamping and stretching portion has an outwardly curled bending portion, and the lower end of the bending portion presses a wiring piece for connecting a grounding wire.

9. The novel ultra-thin high heat dissipation floodlight according to any one of claims 2 to 5 is characterized in that: The shell is provided with a circle of enclosures surrounding the heat dissipation structure, the enclosure is provided with air holes communicating with the heat dissipation structure, there is a gap between the enclosure and the heat dissipation structure, and drainage holes are provided on both sides of the enclosure away from the air holes.

10. The novel ultra-thin high heat dissipation floodlight according to claim 1 is characterized in that: The heat dissipation structure includes a heat sink bonded to the circuit board, the heat sink is provided with a plurality of upwardly protruding ridges, a first ventilation duct is formed between adjacent ridges, the ridges are provided with heat dissipation holes along their length direction, the heat dissipation holes form a second ventilation duct, the heat sink is an integrally formed metal sheet, the ridges are straight or wavy, and the shell is a non-metallic frame.

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