Application method of component embedded packaging unit in PCB

Abstract

The invention discloses an application method of a component embedded packaging unit in a PCB, and belongs to the technical field of printed circuit boards, the method comprises the steps that a second PCB substrate is processed according to design requirements, a scooping groove is generated, and the surface of the second PCB substrate after the scooping groove is formed is provided with a second copper layer; vertically embedding a component embedding and packaging unit into the fishing groove; and sequentially laying a prepreg and a copper foil on the surface of the second copper layer, carrying out lamination, processing a laser hole for external conduction at the pin position of the component, and carrying out electroplating copper plating on the laser hole so as to realize circuit conduction in the PCB. The application mode has flexibility; and compared with the traditional horizontal structure, the vertical embedding structure can reduce the plane occupied space and increase the through-flow density.

Description

Technical Field

[0001] The invention relates to an application method of a component embedding packaging unit in a PCB, belonging to the technical field of printed circuit boards. Background Art

[0002] With the rapid development of the science and technology industry in recent decades, the continuous development and progress of electronic equipment technology, the functions of electronic equipment are becoming more and more complex and diversified, making the packaging of components and the application requirements of PCB (printed circuit board) more and more stringent. Due to the multi-faceted development of the use of electronic equipment, traditional packaging methods and PCB processing methods can no longer meet the ever-changing social needs. More research is needed to improve current carrying capacity, reduce losses, and increase power and utility. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an application method of a component embedding packaging unit in a PCB. The method comprises embedding the components into a unit, processing the pins facing outward at the side walls, and then vertically embedding the component embedding packaging unit into a second PCB substrate. Metallized holes that are conductive up and down are made at the pins to achieve circuit conduction.

[0004] To achieve the above object, the present invention is implemented by adopting the following technical solutions: In a first aspect, the present invention provides an application method of a component embedding packaging unit in a PCB, comprising: Processing the second PCB substrate according to design requirements to form a groove, wherein the surface of the second PCB substrate after the groove is formed has a second copper layer; Embed the component packaging unit vertically in the fishing groove; The semi-cured sheet and copper foil are laid on the surface of the second copper layer in sequence and pressed together, and laser holes for external conduction are processed at the pin positions of the components. The laser holes are electroplated with copper to achieve circuit conduction in the PCB.

[0005] Furthermore, the manufacturing process of the component embedding packaging unit includes: Punching holes and electroplating copper on the first PCB substrate according to design requirements, so that the surface of the first PCB substrate has a first copper layer; performing graphic design on the first copper layer to generate a placement area; A first groove is processed in a predetermined placement area of ​​the first PCB substrate, wherein the bottom of the first groove extends to the first copper layer at the bottom of the first PCB substrate; attaching components to the first copper layer at the bottom of the first groove; Laying a prepreg and copper foil in sequence on the side of the first PCB substrate to which components are attached, and performing a lamination process; Processing a second groove on the prepreg and the copper foil for external conduction of components; Electroplating copper on the second groove on the top of the component to generate a metallized filling layer; Performing electroplating thickening treatment on the top and bottom surfaces of the pressed first PCB substrate to generate a thickened copper layer on the surface; Graphic design is performed on the thickened copper layer to generate component top pins and component bottom pins to obtain a finished component embedded packaging unit.

[0006] Furthermore, when the top and bottom surfaces of the pressed first PCB substrate are subjected to electroplating thickening treatment, the thickening is at least greater than 2 oz.

[0007] Furthermore, the components are attached to the first copper layer by forming a welding layer through silver sintering or eutectic welding.

[0008] Furthermore, the bottom pins of the component are extended to the side walls through the welding layer and the etching pattern and exposed, and the top pins of the component are extended to the side walls through the second groove filled with metallization and the etching pattern and exposed.

[0009] Furthermore, the size of the groove of the second PCB substrate is larger than the size of the component embedded packaging unit, and the single-side spacing is between 100 and 300 um; the thickness of the second PCB substrate matches the thickness of the component, with a deviation within + / -100 um.

[0010] Furthermore, the first PCB substrate / the second PCB substrate is a single-layer core board or a multi-layer core board pressed together as a whole.

[0011] Furthermore, the thickness of the first copper layer at the bottom of the first PCB substrate is not less than 1 oz, and the board thickness is greater than the thickness of the components.

[0012] Furthermore, the size of the first groove is larger than the size of the component, and the single-side spacing is between 100 and 200 um.

[0013] Furthermore, one or more components are embedded in the component embedding packaging unit.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides an application method of a component embedding packaging unit in a PCB. Based on the PCB processing foundation, the component embedding packaging with high integration is realized, and pins that can be exposed on the side wall are processed, and the component embedding packaging unit is vertically embedded in a second PCB substrate, and conductive metallized holes are made above and below the pins to form a circuit distribution perpendicular to the components. Compared with the traditional planar power supply structure, under the same current capacity, the plane occupied area is reduced, and the current density per unit area can be increased by several times. The copper surface structure in the vertical direction improves the system heat dissipation distribution, reduces the loss, and improves the energy efficiency. It has strong applicability and far-reaching significance. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of vertically embedding a component embedding packaging unit in a second PCB substrate provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of a traditional planar power supply structure provided by an embodiment of the present invention; Figure 3 It is a schematic diagram of a vertical embedded structure in a PCB provided by an embodiment of the present invention; Figure 4 It is a schematic diagram of drilling, electroplating and pattern processing of a first PCB substrate according to design requirements provided by an embodiment of the present invention; Figure 5 is a schematic diagram of machining a first groove provided by an embodiment of the present invention; Figure 6 It is a schematic diagram of attaching components to the first copper layer by silver sintering or eutectic welding, etc., provided by an embodiment of the present invention; Figure 7 It is a schematic diagram of laminating a prepreg and a copper foil on a first PCB substrate provided by an embodiment of the present invention; Figure 8 is a schematic diagram of machining a second groove provided by an embodiment of the present invention; Fig. 9 The second groove electroplating and surface copper electroplating thickening provided by the embodiment of the present invention Schematic diagram; Fig.10 It is a schematic diagram of a component embedding packaging unit provided by an embodiment of the present invention.

[0016] In the figure: 1. first PCB substrate; 2. first groove; 3. components; 4. welding layer; 5. copper foil; 6. prepreg; 7. second groove; 8. metallized filling layer; 9. component embedded packaging unit; 10.1. top pins of components; 10.2. bottom pins of components; 11. metallized holes above and below the pins; 12. second PCB substrate. DETAILED DESCRIPTION

[0017] The present invention will be further described below in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and the like are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0019] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood by specific circumstances.

[0020] like Figure 1-10 As shown, this embodiment introduces an application method of a component embedding packaging unit in a PCB, including: 1. Drill, electroplate and pattern the first PCB substrate 1 according to design requirements, such as Figure 4 As shown; 2. Process a first groove 2 in the area where the components need to be placed to expose the first copper layer at the bottom of the first PCB substrate 1, such as Figure 5 As shown; 3. Components 3 are attached to the first copper layer by forming a welding layer 4 through silver sintering or eutectic welding, such as Figure 6 As shown; 4. Overlay the prepreg 6 and copper foil 5 on the first PCB substrate 1 with components attached thereto, and press them together. Figure 7 As shown; 5. A second groove 7 is formed above the area on the top of the component that needs to be connected to the outside, and a hole is drilled on the pressed first PCB substrate 1 according to the design requirements. Figure 8As shown; 6. Electroplating copper is performed in the second groove 7 at the top of the component to form a metallized filling layer 8, and electroplating metallization is performed on the drilled hole; 7. The first copper layer on the top and bottom of the first PCB substrate 1 after pressing is electroplated and thickened to at least 2 oz. Fig. 9 As shown; 8. Make a surface pattern according to the circuit design to form the top pin 10.1 of the component and the bottom pin 10.2 of the component; 9. The surface of the first PCB substrate 1 can be further metallized as required; 10. Process into component embedded packaging unit 9 according to design, such as Fig.10 As shown; 11. Make a second PCB substrate 12, punch holes in the second PCB substrate according to the design requirements, generate a groove, vertically embed the component embedding package unit 9 in the groove, add prepreg and copper foil on the upper and lower parts for pressing, make metallized holes 11 on the upper and lower parts of the pin area, complete the vertical embedding of the component embedding package unit 9 in the PCB, and realize the circuit conduction in the PCB, such as Figure 1 shown.

[0021] The first PCB substrate 1 can be a core board or a composite of multiple core boards pressed together. The thickness of the first copper layer at the bottom must be ≥1oz, and the board thickness must be greater than the thickness of the component 3. Drilling, electroplating and pattern processing can be performed selectively according to the circuit design of the component 3.

[0022] The first groove 2 processed in the component 3 placement area needs to have a size larger than that of the component 3, and a single-side spacing between 100 and 300 um.

[0023] The component 3 attachment method not only includes the silver sintering and eutectic welding methods described as examples, but also includes other bonding methods.

[0024] The metallization treatment of the second groove 7 and the drilled hole on the top of the component 3 includes not only the electroplating processing method described in the example, but also other metallization treatments.

[0025] The copper surface thickness of the top and bottom of the PCB board is thickened by electroplating, and the copper thickness specification is determined according to the circuit design and current of the component 3.

[0026] The top pin 10.1 of the component extends through the metallized filled second groove 7 and the etching pattern to the side wall and is exposed; the bottom pin 10.2 of the component extends through the welding layer 4 and the etching pattern to the side wall and is exposed.

[0027] The further metallization treatment on the surface of the pressed first PCB substrate 1 can be selectively performed according to the circuit design of the component 3 .

[0028] The component embedding packaging unit 9 can embed one or more or more components 3 according to the design.

[0029] The second PCB substrate 12 can be a core board or a whole after multiple core boards are pressed together; the size of the groove is larger than the size of the component embedding packaging unit 9, and the single-side spacing is between 100 and 200um; the thickness of the second PCB substrate 12 matches the thickness of the component 3, with a deviation within + / -100um; the structural design of vertically embedding the component embedding packaging unit 9 and making metallized holes on the upper and lower pins to achieve circuit conduction in the PCB is considered to use this solution.

[0030] like Figure 2 As shown, the traditional component package is attached to the surface of the substrate to form a traditional planar power supply structure. This solution makes a component embedded package unit 9, which is vertically embedded in the PCB, and metallized holes 11 are made above and below the pins to form a vertical embedded structure in the PCB, such as Figure 3 As shown, the area occupied by the unit device is reduced. Under the same current capacity, the current density per unit area is increased to 3 times, and the heat dissipation distribution is improved, and the loss is reduced, which has far-reaching significance.

[0031] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for applying a component embedding packaging unit in a PCB, characterized in that: include: Processing the second PCB substrate according to design requirements to form a groove, wherein the surface of the second PCB substrate after the groove is formed has a second copper layer; Embed the component packaging unit vertically in the fishing groove; The semi-cured sheet and copper foil are laid on the surface of the second copper layer in sequence and pressed together, and laser holes for external conduction are processed at the pin positions of the components. The laser holes are electroplated with copper to achieve circuit conduction in the PCB.

2. The method for applying the component embedding packaging unit in PCB according to claim 1, characterized in that: The manufacturing process of the component embedding packaging unit includes: Punching holes and electroplating copper on the first PCB substrate according to design requirements, so that the surface of the first PCB substrate has a first copper layer; performing graphic design on the first copper layer to generate a placement area; A first groove is processed in a predetermined placement area of ​​the first PCB substrate, wherein the bottom of the first groove extends to the first copper layer at the bottom of the first PCB substrate; attaching components to the first copper layer at the bottom of the first groove; Laying a prepreg and copper foil in sequence on the side of the first PCB substrate to which components are attached, and performing a lamination process; Processing a second groove on the prepreg and the copper foil for external conduction of components; Electroplating copper on the second groove on the top of the component to generate a metallized filling layer; Performing electroplating thickening treatment on the top and bottom surfaces of the pressed first PCB substrate to generate a thickened copper layer on the surface; Graphic design is performed on the thickened copper layer to generate component top pins and component bottom pins to obtain a finished component embedded packaging unit.

3. The method for applying the component embedding packaging unit in PCB according to claim 2, characterized in that: When the top and bottom surfaces of the pressed first PCB substrate are subjected to electroplating thickening treatment, the thickening is at least greater than 2 oz.

4. The method for applying the component embedding packaging unit in PCB according to claim 2, characterized in that: The components are attached to the first copper layer by forming a welding layer through silver sintering or eutectic welding.

5. The method for applying the component embedding packaging unit in PCB according to claim 4, characterized in that: The bottom pins of the component are extended to the side wall through the welding layer and the etching pattern and exposed, and the top pins of the component are extended to the side wall and exposed through the second groove filled with metallization and the etching pattern.

6. The method for applying the component embedding packaging unit in PCB according to claim 1, characterized in that: The size of the groove of the second PCB substrate is larger than the size of the component embedded packaging unit, and the single-side spacing is between 100 and 300 um; the thickness of the second PCB substrate matches the thickness of the component, with a deviation within + / -100 um.

7. The method for applying the component embedding packaging unit in PCB according to claim 2, characterized in that: The first PCB substrate / the second PCB substrate is a single-layer core board or a multi-layer core board pressed together as a whole.

8. The method for applying the component embedding packaging unit in PCB according to claim 2, characterized in that: The thickness of the first copper layer at the bottom of the first PCB substrate is not less than 1 oz, and the board thickness is greater than the thickness of the components.

9. The method for applying the component embedding packaging unit in PCB according to claim 1, characterized in that: The size of the first groove is larger than that of the component, and the single-side spacing is between 100 and 200 um.

10. The method for applying the component embedding packaging unit in PCB according to claim 1, characterized in that: One or more components are embedded in the component embedding packaging unit.

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