Heat dissipation type decoder and 360-degree panoramic navigator

Abstract

The utility model provides a heat dissipation type decoder and a 360-degree panoramic navigator. The heat dissipation type decoder comprises a shell, a decoder mainboard and a heat dissipation device. The shell is provided with at least one heat dissipation hole. The decoder mainboard is accommodated in the housing. The radiator comprises a semiconductor chilling plate, a heat-conducting fin and at least one radiating fan, the semiconductor chilling plate and the heat-conducting fin are both arranged in the shell, the semiconductor chilling plate is electrically connected with the decoder mainboard, the semiconductor chilling plate is clamped between the decoder mainboard and the heat-conducting fin, the heat-conducting fin abuts against the inner wall of the shell, and the radiating fan is arranged in the shell. And the heat dissipation fan is arranged on one side, far away from the decoder mainboard, of the heat conduction sheet, is located at the heat dissipation hole and is connected with the shell, and the heat dissipation fan is electrically connected with the decoder mainboard. The heat dissipation type decoder is small in size, high in heat dissipation efficiency and good in heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicle-mounted protective equipment, in particular to a heat dissipation decoder and a 360-degree panoramic navigator. Background Art

[0002] The existence of the decoder is because audio and video data storage must first be compressed, otherwise the amount of data is too large, and compression requires certain encoding to use the smallest capacity to store the highest quality audio and video data. Therefore, when the data needs to be played, it must first be decoded by the decoder. For example, the vehicle-mounted decoder requires a long time to play audio and video data due to the large number of vehicles, so the decoder also needs to run for a long time. This causes the decoder to generate more heat during use, so that the decoder needs to be cooled. For example, the Chinese utility model patent application with application number 201922313056.3 absorbs the heat generated by the decoder mainboard through the first heat sink and the second heat sink, and the cooling fan takes away the heat to achieve the heat dissipation of the decoder. However, it is necessary to set an additional shell outside the decoder to install the heat sink and the cooling fan to achieve the heat dissipation of the decoder, which greatly increases the volume of the decoder. And because there are many electronic components in the decoder, the decoder shell is only cooled by the heat sink and the cooling fan, and the heat dissipation effect and heat dissipation efficiency are poor. Utility Model Content

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a heat dissipation decoder and a 360-degree panoramic navigator with small size, high heat dissipation efficiency and good heat dissipation effect.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A heat dissipation decoder comprises a housing, a decoder mainboard and a heat sink, wherein the housing is provided with at least one heat dissipation hole;

[0006] The decoder mainboard is accommodated in the housing;

[0007] The radiator includes a semiconductor refrigeration sheet, a heat conductive sheet and at least one cooling fan, the semiconductor refrigeration sheet and the heat conductive sheet are both arranged in the shell, the semiconductor refrigeration sheet is electrically connected to the decoder mainboard, and the semiconductor refrigeration sheet is clamped between the decoder mainboard and the heat conductive sheet, the heat conductive sheet abuts against the inner wall of the shell, the cooling fan is arranged on the side of the heat conductive sheet away from the decoder mainboard, the cooling fan is located at the heat dissipation hole and connected to the shell, and the cooling fan is electrically connected to the decoder mainboard.

[0008] In one embodiment, the number of the heat dissipation holes is two;

[0009] The number of the cooling fans is two, and the two cooling fans are evenly distributed on a side of the heat conducting sheet away from the decoder mainboard, and the two cooling fans are arranged at the two cooling holes in a one-to-one correspondence.

[0010] In one embodiment, the number of the heat dissipation holes is multiple;

[0011] The number of the cooling fans is multiple, and the multiple cooling fans are evenly distributed on a side of the heat conducting sheet away from the decoder mainboard, and the multiple cooling fans are arranged at the multiple cooling holes in a one-to-one correspondence.

[0012] In one of the embodiments, a plurality of heat sink fins are connected to one side of the heat conductive sheet close to the heat dissipation fan, and the plurality of heat sink fins are spaced apart on the heat conductive sheet, and each of the heat sink fins is spaced apart from the heat dissipation fan, and every two adjacent heat sink fins are spaced apart on the heat conductive sheet to form an air circulation channel, and one end of the air circulation channel is disposed toward the heat dissipation fan.

[0013] In one embodiment, the heat conductive sheet and the plurality of heat dissipating fins are an integrally formed structure.

[0014] In one of the embodiments, the heat dissipation fan is snap-connected to the housing.

[0015] In one of the embodiments, the heat dissipation fan is clamped to the housing by screws.

[0016] In one embodiment, the outer shell includes a shell body and a cover body, the cover body is covered on the shell body, and the cover body is connected to the shell body to form a accommodating cavity, the heat dissipation holes are opened on the shell body, and the heat dissipation holes and the cover body are avoided, the decoder mainboard, the semiconductor cooling plate and the heat conductive plate are all arranged in the accommodating cavity, the heat conductive plate is abutted against the inner wall of the shell body, and the cooling fan is connected to the shell body.

[0017] In one embodiment, the cover is connected to the shell body by screws.

[0018] A 360-degree panoramic navigator comprises the heat dissipation decoder described in any one of the above embodiments.

[0019] Compared with the prior art, the utility model has at least the following advantages:

[0020] The heat dissipation decoder of the present invention electrically connects the semiconductor refrigeration sheet to the decoder mainboard, and the semiconductor refrigeration sheet is sandwiched between the decoder mainboard and the heat conductive sheet, so that the semiconductor refrigeration sheet can directly and quickly conduct heat to the decoder mainboard, and then cooperate with the heat conductive sheet to abut against the inner wall of the shell, and the heat dissipation fan is arranged on the side of the heat conductive sheet away from the decoder mainboard, so that the heat conductive sheet and the heat dissipation fan can further quickly dissipate the heat generated by the decoder mainboard, and the heat dissipation efficiency is high, which effectively improves the heat dissipation effect of the heat dissipation decoder, avoids the arrangement of additional structures such as shells, reduces the change in the volume of the heat dissipation decoder, and ensures that the volume of the heat dissipation decoder is small. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 This is a schematic structural diagram of a heat dissipation decoder according to an embodiment of the present utility model;

[0023] Figure 2 for Figure 1 A cross-sectional view of the heat dissipation decoder shown;

[0024] Figure 3 for Figure 1 Another cross-sectional view of the heat dissipation decoder shown. DETAILED DESCRIPTION

[0025] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly and comprehensively understood.

[0026] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0028] The present application provides a heat dissipation decoder. The heat dissipation decoder includes a housing, a decoder mainboard and a radiator. The housing is provided with at least one heat dissipation hole. The decoder mainboard is accommodated in the housing. The radiator includes a semiconductor cooling sheet, a heat conducting sheet and at least one heat dissipation fan, the semiconductor cooling sheet and the heat conducting sheet are both arranged in the housing, the semiconductor cooling sheet is electrically connected to the decoder mainboard, and the semiconductor cooling sheet is sandwiched between the decoder mainboard and the heat conducting sheet, the heat conducting sheet abuts against the inner wall of the housing, the heat dissipation fan is arranged on the side of the heat conducting sheet away from the decoder mainboard, the heat dissipation fan is located at the heat dissipation hole and connected to the housing, and the heat dissipation fan is electrically connected to the decoder mainboard.

[0029] The above-mentioned heat dissipation decoder electrically connects the semiconductor refrigeration plate to the decoder mainboard, and the semiconductor refrigeration plate is sandwiched between the decoder mainboard and the heat conductive plate, so that the semiconductor refrigeration plate directly conducts heat to the decoder mainboard quickly and timely, and then cooperates with the heat conductive plate to abut against the inner wall of the outer shell. The heat dissipation fan is arranged on the side of the heat conductive plate away from the decoder mainboard, which further enables the heat conductive plate and the heat dissipation fan to quickly dissipate the heat generated by the decoder mainboard. The heat dissipation efficiency is high, which effectively improves the heat dissipation effect of the heat dissipation decoder, avoids the setting of additional structures such as shells, reduces the change in the volume of the heat dissipation decoder, and ensures that the volume of the heat dissipation decoder is small.

[0030] In order to better understand the heat dissipation decoder of the present application, the heat dissipation decoder of the present application is further explained below:

[0031] Please also read Figures 1 to 3A heat dissipation decoder 10 of one embodiment includes a housing 100, a decoder mainboard 200 and a heat sink 300. The housing 100 is provided with at least one heat dissipation hole 101. The decoder mainboard 200 is accommodated in the housing 100. The heat sink 300 includes a semiconductor cooling sheet 310, a heat conductive sheet 320 and at least one heat dissipation fan 330. The semiconductor cooling sheet 310 and the heat conductive sheet 320 are both arranged in the housing 100. The semiconductor cooling sheet 310 is electrically connected to the decoder mainboard 200, and the semiconductor cooling sheet 310 is sandwiched between the decoder mainboard 200 and the heat conductive sheet 320. The heat conductive sheet 320 abuts against the inner wall of the housing 100. The heat dissipation fan 330 is arranged on the side of the heat conductive sheet 320 away from the decoder mainboard 200, and the heat dissipation fan 330 is located at the heat dissipation hole 101 and connected to the housing 100, and the heat dissipation fan 330 is electrically connected to the decoder mainboard 200.

[0032] The above-mentioned heat dissipation decoder 10 makes the semiconductor refrigeration plate 310 electrically connected to the decoder mainboard 200, and the semiconductor refrigeration plate 310 is sandwiched between the decoder mainboard 200 and the heat conductive plate 320, so that the semiconductor refrigeration plate 310 can directly and quickly conduct heat to the decoder mainboard 200, and then cooperate with the heat conductive plate 320 to abut against the inner wall of the outer shell 100. The heat dissipation fan 330 is arranged on the side of the heat conductive plate 320 away from the decoder mainboard 200, so that the heat conductive plate 320 and the heat dissipation fan 330 can further quickly dissipate the heat generated by the decoder mainboard 200, and the heat dissipation efficiency is high, which effectively improves the heat dissipation effect of the heat dissipation decoder 10, and avoids the setting of additional structures such as shells, reduces the change in the volume of the heat dissipation decoder 10, and ensures that the volume of the heat dissipation decoder 10 is small.

[0033] Please also read Figures 1 to 3 In one embodiment, the number of the heat dissipation holes 101 is two. Furthermore, the number of the heat dissipation fans 330 is two, and the two heat dissipation fans 330 are evenly distributed on the side of the heat conductive sheet 320 away from the decoder mainboard 200, and the two heat dissipation fans 330 are arranged at the two heat dissipation holes 101 in a one-to-one correspondence, further improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation decoder 10.

[0034] In one embodiment, there are multiple heat dissipation holes. Further, there are multiple heat dissipation fans, which are evenly distributed on the side of the heat conductive sheet away from the decoder mainboard, and the multiple heat dissipation fans are arranged at the multiple heat dissipation holes in a one-to-one correspondence, further improving the heat dissipation efficiency and heat dissipation effect of the heat dissipation decoder.

[0035] Please also read Figures 1 to 3In one embodiment, a plurality of heat sink fins 340 are connected to one side of the heat conducting sheet 320 close to the heat dissipation fan 330. The plurality of heat sink fins 340 are arranged on the heat conducting sheet 320 at intervals, and each heat sink fin 340 is arranged to avoid the heat dissipation fan 330. Every two adjacent heat sink fins 340 are arranged on the heat conducting sheet 320 at intervals to form an air circulation channel 302, and one end of the air circulation channel 302 is arranged toward the heat dissipation fan 330. Furthermore, the heat conducting sheet 320 is in contact with the inner wall of the housing 100 through the plurality of heat sink fins 340, which further improves the heat dissipation efficiency and heat dissipation effect of the heat dissipation decoder 10.

[0036] Please also read Figures 1 to 3 In one of the embodiments, the heat conductive sheet 320 and the plurality of heat sink fins 340 are integrally formed, which improves the connection stability between the heat conductive sheet 320 and the plurality of heat sink fins 340, thereby improving the structural stability and compactness of the heat dissipation type decoder 10, and reduces the processing steps of the heat dissipation type decoder 10, thereby improving the preparation efficiency of the heat dissipation type decoder 10.

[0037] Please also read Figures 1 to 3 In one embodiment, the heat dissipation fan 330 is clamped on the housing 100. Further, the heat dissipation fan is clamped on the housing by screws, ensuring the stable installation of the heat dissipation fan 330.

[0038] Please also read Figures 1 to 3 In one embodiment, the housing 100 includes a housing body 110 and a cover body 120, the cover body 120 is covered on the housing body 110, and the cover body 120 and the housing body 110 are connected to form a receiving cavity 101, the heat dissipation hole 101 is opened on the housing body 110, and the heat dissipation hole 101 and the cover body 120 are arranged to avoid each other, the decoder mainboard 200, the semiconductor cooling sheet 310 and the heat conducting sheet 320 are all arranged in the receiving cavity 101, the heat conducting sheet 320 abuts against the inner wall of the housing body 110, and the heat dissipation fan 330 is connected to the housing body 110. Further, the cover body 120 is connected to the housing body 110 by screws, which is conducive to the maintenance of the decoder mainboard 200, the heat dissipation fan 330 and the semiconductor cooling sheet 310 inside the heat dissipation type decoder 10, thereby improving the convenience of use of the heat dissipation type decoder 10.

[0039] The present application provides a 360-degree panoramic navigator, comprising a heat dissipation decoder according to any of the above-mentioned embodiments.

[0040] Compared with the prior art, the utility model has at least the following advantages:

[0041] The heat dissipation decoder 10 of the present invention electrically connects the semiconductor refrigeration sheet 310 to the decoder mainboard 200, and the semiconductor refrigeration sheet 310 is sandwiched between the decoder mainboard 200 and the heat conductive sheet 320, so that the semiconductor refrigeration sheet 310 directly conducts heat to the decoder mainboard 200 quickly and timely, and then cooperates with the heat conductive sheet 320 to abut against the inner wall of the outer shell 100, and the heat dissipation fan 330 is arranged on the side of the heat conductive sheet 320 away from the decoder mainboard 200, so that the heat conductive sheet 320 and the heat dissipation fan 330 can further quickly dissipate the heat generated by the decoder mainboard 200, and the heat dissipation efficiency is high, which effectively improves the heat dissipation effect of the heat dissipation decoder 10, and avoids the arrangement of additional structures such as shells, reduces the change in the volume of the heat dissipation decoder 10, and ensures that the volume of the heat dissipation decoder 10 is small.

[0042] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A heat dissipation decoder, comprising a housing, a decoder mainboard and a heat sink, characterized in that: The housing is provided with at least one heat dissipation hole; The decoder mainboard is accommodated in the housing; The radiator includes a semiconductor refrigeration sheet, a heat conductive sheet and at least one cooling fan, the semiconductor refrigeration sheet and the heat conductive sheet are both arranged in the shell, the semiconductor refrigeration sheet is electrically connected to the decoder mainboard, and the semiconductor refrigeration sheet is clamped between the decoder mainboard and the heat conductive sheet, the heat conductive sheet abuts against the inner wall of the shell, the cooling fan is arranged on the side of the heat conductive sheet away from the decoder mainboard, the cooling fan is located at the heat dissipation hole and connected to the shell, and the cooling fan is electrically connected to the decoder mainboard.

2. The heat dissipation decoder according to claim 1, characterized in that: The number of the heat dissipation holes is two; The number of the cooling fans is two, and the two cooling fans are evenly distributed on a side of the heat conducting sheet away from the decoder mainboard, and the two cooling fans are arranged at the two cooling holes in a one-to-one correspondence.

3. The heat dissipation decoder according to claim 1, characterized in that: The number of the heat dissipation holes is multiple; The number of the cooling fans is multiple, and the multiple cooling fans are evenly distributed on a side of the heat conducting sheet away from the decoder mainboard, and the multiple cooling fans are arranged at the multiple cooling holes in a one-to-one correspondence.

4. The heat dissipation decoder according to claim 1, characterized in that: A plurality of heat sink fins are connected to one side of the heat conductive sheet close to the heat dissipation fan. The plurality of heat sink fins are spaced apart on the heat conductive sheet, and each of the heat sink fins is spaced apart from the heat dissipation fan. Every two adjacent heat sink fins are spaced apart on the heat conductive sheet to form an air circulation channel, and one end of the air circulation channel is disposed toward the heat dissipation fan.

5. The heat dissipation decoder according to claim 4, characterized in that: The heat conducting sheet and the plurality of heat dissipating fins are an integrally formed structure.

6. The heat dissipation decoder according to claim 1, characterized in that: The heat dissipation fan is clamped on the housing.

7. The heat dissipation decoder according to claim 1, characterized in that: The heat dissipation fan is clamped on the housing through screws.

8. The heat dissipation decoder according to claim 1, characterized in that: The outer shell includes a shell body and a cover body, the cover body is covered on the shell body, and the cover body is connected to the shell body to form a accommodating cavity, the heat dissipation holes are opened on the shell body, and the heat dissipation holes and the cover body are arranged in a avoidance manner, the decoder mainboard, the semiconductor cooling plate and the heat conductive plate are all arranged in the accommodating cavity, the heat conductive plate is abutted against the inner wall of the shell body, and the cooling fan is connected to the shell body.

9. The heat dissipation decoder according to claim 8, characterized in that: The cover body is connected to the shell body through screws.

10. A 360-degree panoramic navigator, characterized in that: A heat dissipation decoder comprising the heat dissipation decoder according to any one of claims 1 to 9.

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