Soldering flux infiltrating device of piezoresistor welding device

Abstract

The utility model discloses a scaling powder infiltrating device of a piezoresistor welding device, which comprises an infiltrating groove, a blanking groove, a first conveying pipe, a recycling groove and a material pumping device, the first conveying pipe is gradually and obliquely arranged downwards from the blanking groove to the infiltrating groove, a feeding port of the first conveying pipe is communicated with the blanking groove, and a discharging port of the first conveying pipe is communicated with the recycling groove. A discharge hole of the first conveying pipe is formed in the upper edge of the side wall of the infiltration tank or extends into the infiltration tank; the size of the recovery tank is larger than that of the infiltration tank, an opening of the recovery tank faces upwards, and the infiltration tank is located above the opening of the recovery tank; the feeding end of the material pumping device is communicated with the discharging port of the recycling groove, and the discharging end of the material pumping device is communicated with the feeding port of the discharging groove. According to the soldering flux infiltrating device, the soldering flux can be continuously circulated, solute adhesion in a solvent is avoided, the fluctuation of the liquid level of the solvent is small, and infiltrating of a product cannot be affected.

Description

Technical Field

[0001] The utility model relates to resistor manufacturing equipment, in particular to a soldering flux infiltration device for a varistor welding device. Background Art

[0002] When producing varistors, leads need to be welded on both sides of the varistor chip. Before welding, flux is needed to wet the welding parts of the leads. After the leads come into contact with the chip, the oxides on the surface of the welding parts of the leads and the chip need to be removed to make the welding parts of the leads and the chip reach the necessary cleanliness. At the same time, flux can also provide certain surfactant components, which helps to improve the welding fullness of the component chip and the welding performance.

[0003] In the existing equipment, the flux is usually placed in a single wetting tank, and the lead wire extends the part to be welded into the wetting tank for flux infiltration. In order to avoid the solute adhesion or sinking to the bottom of the flux during long-term static state, which affects the use effect, a stirring device is generally set in the wetting tank so that the stirring device can continuously stir the flux in the wetting tank to avoid solute adhesion. However, this method will cause the liquid level in the wetting tank to continuously fluctuate greatly, resulting in different infiltration lengths of different leads during infiltration. When the lead wire infiltration part is too short, the welding part cannot be completely infiltrated with the flux, which will affect the subsequent welding effect; when the lead wire infiltration part is too long, the flux infiltrates to places outside the lead wire welding part, which will cause the flux to remain on the wire, leaving dark dirty marks on the lead wire surface, and the lead wire will be contaminated by the flux for a long time and will also cause rust, resulting in the inability to install and use components, affecting product quality. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a flux infiltration device for a varistor welding device, which can circulate the flux continuously to avoid the adhesion of solutes in the solvent, and the solvent liquid level fluctuates slightly, which will not affect the infiltration of the product.

[0005] In order to solve the above technical problems, the technical solutions adopted are as follows:

[0006] A solder flux infiltration device for a varistor welding device comprises an infiltration tank, a feed tank, a first conveying pipe, a recovery tank and a pumping device, wherein the first conveying pipe is gradually inclined downward from the feed tank to the infiltration tank, the feed port of the first conveying pipe is connected to the feed tank, and the discharge port of the first conveying pipe is located at the upper edge of the side wall of the infiltration tank or extends into the infiltration tank; the size of the recovery tank is larger than the infiltration tank, the opening of the recovery tank faces upward, and the infiltration tank is located above the opening of the recovery tank; the feed end of the pumping device is connected to the discharge port of the recovery tank, and the discharge end of the pumping device is connected to the feed port of the feed tank.

[0007] In the above-mentioned flux infiltration device, when the product needs to be infiltrated with flux, it is immersed in the infiltration tank. In the initial state, the infiltration tank, the feed tank and the recovery tank are all filled with sufficient flux, and the flux in the feed tank is transported to the infiltration tank through the first conveying pipe; when the flux in the infiltration tank overflows, the flux can flow down along the outer side walls of the infiltration tank and fall into the recovery tank through the opening of the recovery tank; at the same time, the extraction device continuously extracts the flux in the recovery tank to the feed tank, so that the flux forms a cycle. This flux infiltration device can make the flux circulate continuously between the three tanks when the resistor is infiltrated with flux, effectively avoiding the adhesion of solutes in the solvent and ensuring the effect of the flux; at the same time, when the flux flows into the infiltration tank, since the discharge port of the first conveying pipe is at the upper edge of the side wall of the infiltration tank or extends into the infiltration tank, the flux can minimize the fluctuation of the liquid level when it flows in; and when the flux flows out of the infiltration tank, the flux in the infiltration tank needs to be filled before overflowing, which will also not cause fluctuations in the liquid level. Compared with stirring with a stirring device, this flux infiltration device can ensure that the flux can circulate smoothly, and the liquid level of the flux in the infiltration tank is more stable whether it flows in or out, so that the product has a good flux infiltration effect, and the flux infiltration position on the lead will not be too long or too short.

[0008] In the preferred embodiment, the infiltration tank is arranged in front of the lower material tank, the first conveying pipe extends into the lower material tank, and the feed port of the first conveying pipe is located in the front of the lower material tank; the feed port of the lower material tank is arranged on the rear side wall or the rear of the bottom wall of the lower material tank. By arranging the feed port of the lower material tank and the feed port of the first conveying pipe at the front and rear of the infiltration tank respectively, the positions where the flux flows in and out of the lower material tank can be separated as much as possible, which can make the flux in the lower material tank flow more fully and enhance the circulation effect, and can also avoid the conveying speed of the pumping device affecting the conveying speed of the first conveying pipe due to the close distance between the feed port of the lower material tank and the first conveying pipe, causing the conveying speed of the first conveying pipe to be too fast, thereby increasing the degree of fluctuation of the liquid level in the infiltration tank.

[0009] In a further preferred embodiment, the feed port of the first delivery pipe is located in the middle of the front of the feed tank. With this arrangement, since the pressure in the middle is smaller than that at the bottom, the speed of the first delivery pipe delivering the flux to the wetting tank can be effectively slowed down, so that the liquid level of the flux in the wetting tank can be kept stable.

[0010] In a further preferred embodiment, the height of the feed opening of the first conveying pipe is higher than the height of the feed opening of the lower trough. In this way, the influence of the flux flow on the first conveying pipe when the flux flows into the lower trough through the extraction device can be further reduced, ensuring that the speed of the first conveying pipe remains uniform and stable during delivery.

[0011] In a preferred embodiment, the solder flux infiltration device further comprises a liquid level alarm device, the detection end of which extends into the feed trough, and the detection end of which is located above the feed inlet of the first conveying pipe. As the solder flux is gradually used, when the liquid level of the solder flux in the feed trough drops to a level that cannot submerge the detection end of the liquid level alarm device, the liquid level alarm device sounds an alarm to remind the staff that the solder flux needs to be replenished in time.

[0012] In a further preferred embodiment, the liquid level alarm device includes a liquid level sensor and an alarm. The sensing end of the liquid level sensor is located above the feed port of the first conveying pipe, and the signal output end of the liquid level sensor is electrically connected to the corresponding signal input end of the alarm. The liquid level sensor detects the liquid level of the solder flux in the feed trough, and when the liquid level of the solder flux in the feed trough is reduced to a level that cannot submerge the liquid level sensor, the liquid level sensor sends a signal to the alarm, and the alarm issues an alarm reminder.

[0013] In a further preferred embodiment, the feed trough is located above the recovery trough, and the flux infiltration device also includes a second conveying pipe, the feed port of the second conveying pipe is connected to the feed trough, the discharge port of the second conveying pipe is connected to the recovery trough, and the feed port of the second conveying pipe is located above the detection end of the liquid level alarm device. Since the conveying speed of the pumping device is usually greater than the conveying speed of the first conveying pipe, by setting the second conveying pipe, when the flux liquid level in the lower material tank exceeds the height of the second conveying pipe, the flux is returned to the recovery tank through the second conveying pipe, so that the conveying speed of the pumping device does not need to be controlled (that is, when the liquid level in the lower material tank is low, it is necessary to control the conveying speed of the pumping device to be greater than the conveying speed of the first conveying pipe to avoid the conveying speed of the first conveying pipe being too slow; when the liquid level in the lower material tank is high, it is necessary to control the conveying speed of the pumping device to be less than the conveying speed of the first conveying pipe to avoid the conveying speed of the first conveying pipe being too fast, resulting in increased liquid level fluctuations in the infiltration tank), the flux in the lower material tank can be kept at a certain liquid level, the first conveying pipe can maintain a certain conveying speed under a constant pressure, and the flux can be prevented from overflowing from the lower material tank; at the same time, the circulation effect of the flux can be enhanced. Usually, the position of the feed port of the second conveying pipe is the position where the flux liquid level in the lower material tank can provide the best conveying pressure for the first conveying pipe.

[0014] In a preferred embodiment, the discharge port of the recovery tank is arranged on the lower part of the side wall or the bottom wall of the recovery tank. The extraction device extracts the soldering flux from the lower part of the recovery tank, which is more conducive to the circulation of the soldering flux.

[0015] The above-mentioned liquid level sensor and alarm can adopt existing structures. The above-mentioned pumping device adopts a pumping pump and a pumping pipeline, the feed end of the pumping pump is connected to the discharge port of the recovery tank through the pumping pipeline, and the discharge end of the pumping pump is connected to the feed port of the discharge tank through the pumping pipeline.

[0016] The beneficial effects of the utility model are: the soldering flux infiltration device can make the soldering flux circulate continuously, avoid the solute adhesion in the solvent, and the solvent liquid level fluctuation is small, which will not affect the infiltration of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the flux infiltration device in the embodiment of the utility model. DETAILED DESCRIPTION

[0018] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments:

[0019] like Figure 1 A flux infiltration device of a varistor welding device shown in the figure comprises a wetting tank 1, a feed tank 2, a recovery tank 3, a first conveying pipe 4 and a pumping device 5, wherein the first conveying pipe 4 is gradually inclined downward from the feed tank 2 to the wetting tank 1, the feed port of the first conveying pipe 4 is connected with the feed tank 2, and the discharge port of the first conveying pipe 4 extends into the wetting tank 1; the size of the recovery tank 3 is larger than that of the wetting tank 1, the opening of the recovery tank 3 faces upward, and the wetting tank 1 is located above the opening of the recovery tank 3; the feed end of the pumping device 5 is connected with the discharge port of the recovery tank 3, and the discharge end of the pumping device 5 is connected with the feed port of the feed tank 2.

[0020] In the above-mentioned flux infiltration device, when the product needs to be infiltrated with flux, it is immersed in the infiltration tank 1. In the initial state, the infiltration tank 1, the feed tank 2 and the recovery tank 3 are all filled with sufficient flux, and the flux in the feed tank 2 is transported to the infiltration tank 1 through the first conveying pipe 4; when the flux in the infiltration tank 1 overflows, the flux can flow down along the outer side walls of the infiltration tank 1 and fall into the recovery tank 3 through the opening of the recovery tank 3; at the same time, the extraction device 5 continuously extracts the flux in the recovery tank 3 to the feed tank 2, so that the flux forms a circulation. This flux infiltration device can make the flux circulate continuously between the three tanks when the resistor is infiltrated with flux, effectively avoiding the adhesion of solutes in the solvent and ensuring the effect of the flux; at the same time, when the flux flows into the infiltration tank 1, since the discharge port of the first conveying pipe 4 extends into the infiltration tank 1, the flux can also reduce the fluctuation of the liquid level as much as possible when it flows in; and when the flux flows out of the infiltration tank 1, the flux in the infiltration tank 1 needs to be filled before overflowing, which will also not cause fluctuations in the liquid level. Compared with stirring by using a stirring device, the use of this flux infiltration device can ensure that the flux can circulate smoothly, and the liquid level of the flux in the infiltration tank 1 is more stable whether it flows in or out, so that the product has a good flux infiltration effect, and the flux infiltration position on the lead will not be too long or too short.

[0021] The infiltration tank 1 is arranged in front of the lower material tank 2, the first conveying pipe 4 extends into the lower material tank 2, and the feed port of the first conveying pipe 4 is located in the front part of the lower material tank 2; the feed port of the lower material tank 2 is arranged on the rear side wall of the lower material tank 2. By arranging the feed port of the lower material tank 2 and the feed port of the first conveying pipe 4 at the front and rear parts of the infiltration tank 1 respectively, the positions where the flux flows in and out of the lower material tank 2 can be separated as much as possible, which can not only make the flux in the lower material tank 2 flow more fully and enhance the circulation effect, but also avoid that the conveying speed of the pumping device 5 affects the conveying speed of the first conveying pipe 4 due to the close distance between the feed port of the lower material tank 2 and the first conveying pipe 4, causing the conveying speed of the first conveying pipe 4 to be too fast, thereby increasing the degree of fluctuation of the liquid level in the infiltration tank 1.

[0022] The feed port of the first delivery pipe 4 is located in the middle of the front of the feed tank 2. With this arrangement, since the pressure in the middle is smaller than that at the bottom, the speed at which the first delivery pipe 4 delivers the flux to the wetting tank 1 can be effectively slowed down, so that the liquid level of the flux in the wetting tank 1 can be kept stable.

[0023] The height of the feed opening of the first conveying pipe 4 is higher than that of the feed opening of the feeding trough 2. In this way, the influence of the flux flow on the first conveying pipe 4 when the flux flows into the feeding trough 2 through the extraction device 5 can be further reduced, ensuring that the speed of the first conveying pipe 4 is kept uniform and stable during conveying.

[0024] The solder flux infiltration device further includes a liquid level alarm device 6, the detection end of which extends into the feed trough 2 and is located above the feed inlet of the first conveying pipe 4. As the solder flux is gradually used, when the liquid level of the solder flux in the feed trough 2 is reduced to a level that cannot submerge the detection end of the liquid level alarm device 6, the liquid level alarm device 6 sounds an alarm to remind the staff that the solder flux needs to be replenished in time.

[0025] The liquid level alarm device 6 includes a liquid level sensor 601 and an alarm 602. The sensing end of the liquid level sensor 601 is located above the feed port of the first conveying pipe 4, and the signal output end of the liquid level sensor 601 is electrically connected to the corresponding signal input end of the alarm 602. The liquid level sensor 601 detects the liquid level of the solder flux in the feed trough 2, and when the liquid level of the solder flux in the feed trough 2 is reduced to a level that cannot submerge the liquid level sensor 601, the liquid level sensor 601 sends a signal to the alarm 602, and the alarm 602 issues an alarm reminder.

[0026] The feed trough 2 is located above the recovery trough 3, and the flux infiltration device also includes a second conveying pipe 7, the feed port of the second conveying pipe 7 is connected to the feed trough 2, the discharge port of the second conveying pipe 7 is connected to the recovery trough 3, and the feed port of the second conveying pipe 7 is located above the detection end of the liquid level alarm device 6. Since the conveying speed of the pumping device 5 is usually greater than the conveying speed of the first conveying pipe 4, by setting the second conveying pipe 7, when the flux liquid level in the lower trough 2 exceeds the height of the second conveying pipe 7, the flux is allowed to flow back to the recovery tank 3 through the second conveying pipe 7, thereby, without having to control the conveying speed of the pumping device 5 (that is, when the second conveying pipe 7 is not set, when the liquid level in the lower trough 2 is low, it is necessary to control the conveying speed of the pumping device 5 to be greater than the conveying speed of the first conveying pipe 4 to avoid the conveying speed of the first conveying pipe 4 being too slow; when the liquid level in the lower trough 2 is high, it is necessary to control the conveying speed of the pumping device 5 to be less than the conveying speed of the first conveying pipe 4 to avoid the conveying speed of the first conveying pipe 4 being too fast, resulting in increased liquid level fluctuations in the infiltration tank 1), the flux in the lower trough 2 can be maintained at a certain liquid level, the first conveying pipe 4 can maintain a certain conveying speed under a constant pressure, and the flux can be prevented from overflowing from the lower trough 2; at the same time, the circulation effect of the flux can be enhanced. Usually, the position of the feed port of the second delivery pipe 7 is the position where the flux liquid level in the feed trough 2 can provide the best delivery pressure for the first delivery pipe 4 .

[0027] The discharge port of the recovery tank 3 is arranged on the lower part of the side wall of the recovery tank 3. The extraction device 5 extracts the soldering flux from the lower part of the recovery tank 3, which is more conducive to the circulation of the soldering flux.

[0028] The above-mentioned liquid level sensor 601 and alarm 602 both adopt existing structures. The above-mentioned pumping device 5 adopts a pumping pump 501 and a pumping pipe 502. The feed end of the pumping pump 501 is connected to the discharge port of the recovery tank 3 through the pumping pipe 502, and the discharge end of the pumping pump 501 is connected to the feed port of the discharge tank 2 through the pumping pipe 502.

Claims

1. A flux infiltration device for a varistor welding device, comprising an infiltration tank, characterized in that: It also includes a feed trough, a first conveying pipe, a recovery trough and a pumping device. The first conveying pipe is arranged to be gradually inclined downward from the feed trough to the infiltration trough. The feed port of the first conveying pipe is connected with the feed trough, and the discharge port of the first conveying pipe is located at the upper edge of the side wall of the infiltration trough or extends into the infiltration trough. The size of the recovery trough is larger than the infiltration trough, the opening of the recovery trough faces upward, and the infiltration trough is located above the opening of the recovery trough. The feed end of the pumping device is connected with the discharge port of the recovery trough, and the discharge end of the pumping device is connected with the feed port of the feed trough.

2. A flux infiltration device for a varistor welding device as claimed in claim 1, characterized in that: The infiltration tank is arranged in front of the feeding tank, the first conveying pipe extends into the feeding tank, and the feed port of the first conveying pipe is located in the front of the feeding tank; the feed port of the feeding tank is arranged on the rear side wall or the rear part of the bottom wall of the feeding tank.

3. A soldering flux infiltration device for a varistor welding device as claimed in claim 2, characterized in that: The feed inlet of the first conveying pipe is located in the middle of the front part of the feeding chute.

4. A soldering flux infiltration device for a varistor welding device as claimed in claim 2, characterized in that: The height of the feed opening of the first conveying pipe is higher than the height of the feed opening of the lower chute.

5. A soldering flux infiltration device for a varistor welding device as claimed in claim 1, characterized in that: The soldering flux infiltration device also includes a liquid level alarm device, a detection end of the liquid level alarm device extends into the feed trough, and the detection end of the liquid level alarm device is located above the feed port of the first conveying pipe.

6. A soldering flux infiltration device for a varistor welding device as claimed in claim 5, characterized in that: The liquid level alarm device includes a liquid level sensor and an alarm. The sensing end of the liquid level sensor is located above the feed port of the first conveying pipe. The signal output end of the liquid level sensor is electrically connected to the corresponding signal input end of the alarm.

7. A soldering flux infiltration device for a varistor welding device as claimed in claim 5, characterized in that: The feed trough is located above the recovery trough, and the flux infiltration device also includes a second conveying pipe, the feed port of the second conveying pipe is connected to the feed trough, the discharge port of the second conveying pipe is connected to the recovery trough, and the feed port of the second conveying pipe is located above the detection end of the liquid level alarm device.

8. A soldering flux infiltration device for a varistor welding device as claimed in claim 1, characterized in that: The discharge port of the recovery tank is arranged on the lower part of the side wall or the bottom wall of the recovery tank.

Images