Grinding machine with dust removal function
By introducing active rollers, driven rollers and spray systems into the grinder, using water to reduce dust sputtering, and replacing the grinding wheel without shutdown through backup rollers, the problem of dust pollution in traditional grinding equipment is solved, and the grinding accuracy is improved. Productivity.
Patent Information
- Application Number
- CN202420895602.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-28
AI Technical Summary
Traditional grinding equipment generates dust during the grinding of semiconductor wafers, affecting the accuracy and contaminating the working environment.
A grinder with dust removal function was designed. Through the active roller, driven roller, main grinding wheel and spray system, water is used as grinding medium to reduce dust sputtering, and the grinding wheel is replaced without shutdown through backup rollers and access doors. .
It effectively reduces the impact of dust on grinding accuracy, maintains the cleanliness of the working environment, and improves production efficiency and grinding effect.
Smart Images
Figure CN222177130U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor equipment parts production, in particular to a grinder with a dust removal function. Background Art
[0002] Semiconductor devices are a key type of electronic components that play an important role in modern technology. Based on the characteristics of semiconductor materials, they achieve functions such as signal amplification, switching and regulation by controlling current and voltage. The purpose of semiconductor wafer polishing is to achieve surface flatness and remove damaged layers to ensure the performance and quality of semiconductor devices. In the semiconductor manufacturing process, polishing also helps to remove surface pollutants and impurities to reduce the impact on device performance.
[0003] However, the above-mentioned traditional grinding equipment will generate dust during the process of grinding semiconductor wafers. The dust will affect the grinding accuracy and pollute the working environment. In view of this, we propose a grinding machine with dust removal function. Utility Model Content
[0004] The purpose of the utility model is to provide a grinder with a dust removal function to solve the problems raised in the above background technology.
[0005] To achieve the above object, the utility model provides the following technical solution: a grinder with dust removal function, comprising a frame, a conveying assembly is arranged at the bottom of the frame, a grinding assembly is arranged at the inner top of the frame, and the grinding assembly comprises:
[0006] Active roller, the top end surface of the frame is fixedly connected to a motor, the output end of the motor is fixedly connected to a rotating shaft, and the end of the rotating shaft away from the motor is fixedly connected to the active roller;
[0007] A main grinding wheel, wherein the inner top of the frame is fixedly connected to an electric push rod, an end of the electric push rod away from the frame is rotatably connected to a driven roller, and the bottom end surface of the driven roller is clamped with the main grinding wheel;
[0008] The collection box, the frame is movably connected with the collection box;
[0009] An oblique baffle, the side wall of the frame is fixedly connected with an oblique baffle;
[0010] A spray pipe is fixedly connected to the frame, and a spray hole is opened at the bottom of the spray pipe.
[0011] Preferably, the inner top end surface of the frame is fixedly connected to a telescopic rod, the bottom end surface of the telescopic rod is fixedly connected to a spare roller, the bottom end surface of the spare roller is clamped with a spare grinding wheel, the side wall of the telescopic rod is fixedly connected to a connecting piece 1, the connecting piece 1 is hinged to the telescopic piece, the telescopic piece is rotatably connected to the rotating rod, and the rotating rod is fixedly connected to the inner wall of the frame.
[0012] Preferably, an inspection door is hinged on the front of the frame, through which the main grinding wheel can be replaced.
[0013] Preferably, the collecting box is located at the bottom of the conveying assembly, and the collecting box is used to collect the mixture of water and dust.
[0014] Preferably, a vertical groove is provided on the side wall of the active roller, and a vertical groove is provided on the side wall of the driven roller. The active roller and the driven roller are movably connected. The friction between the active roller and the driven roller is increased by providing the vertical groove, and the active roller drives the driven roller to rotate.
[0015] Preferably, a second connecting member is fixedly connected to the side wall of the electric push rod, and an end of the telescopic member away from the first connecting member is hinged to the second connecting member.
[0016] Compared with the prior art, the utility model provides a grinder with a dust removal function, which has the following beneficial effects:
[0017] 1. The grinder with dust removal function is provided with an active roller, a passive roller and a main grinding wheel. The driven roller rotates to drive the main grinding wheel to rotate, thereby grinding the semiconductor wafer. The friction between the active roller and the driven roller is increased by providing a vertical groove, so that the active roller can better drive the driven roller to rotate. Water flows along the oblique baffle, and the oblique baffle guides the water. At the same time, the concave setting also prevents dust or mixture generated by grinding from splashing out of the frame body. Water drops fall on the semiconductor wafer. By adding water as a grinding medium, the influence of dust on the grinding accuracy is reduced, the grinding effect is improved, and dust is prevented from floating in the air, keeping the working environment clean.
[0018] 2. The grinder with dust removal function is provided with a spare roller and a spare grinding wheel. When the main grinding wheel needs to be replaced, the main grinding wheel moves upward, and the spare roller is movably connected with the active roller through the transmission of the telescopic part. The spare grinding wheel abuts against the semiconductor wafer, and the rotation of the active roller drives the spare roller to move, thereby making the spare grinding wheel grind the semiconductor wafer. The main grinding wheel can be replaced through the inspection door, and the maintenance of the grinding wheel can be completed without stopping the machine, thereby improving production efficiency and improving grinding effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the main structure of the utility model;
[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of the frame of the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of the spray pipeline of the utility model;
[0022] Figure 4 This is a schematic diagram of the structure of the grinding component of the utility model.
[0023] In the figure: 1. frame; 2. transmission component; 3. inspection door; 4. oblique baffle; 5. motor; 6. rotating shaft; 7. active roller; 8. electric push rod; 9. driven roller; 10. main grinding wheel; 11. spray pipe; 12. spray hole; 13. collection box; 14. telescopic rod; 15. spare roller; 16. spare grinding wheel; 17. connecting piece 1; 18. telescopic piece; 19. connecting piece 2; 20. rotating rod. DETAILED DESCRIPTION
[0024] like Figure 1-Figure 4 As shown, the utility model provides a technical solution: a grinder with a dust removal function, comprising a frame 1, a maintenance door 3 is hinged on the front of the frame 1, a main grinding wheel 10 can be replaced through the maintenance door 3, a conveying assembly 2 is arranged at the bottom of the frame 1, a grinding assembly is arranged at the inner top of the frame 1, and the grinding assembly includes an oblique baffle 4, a motor 5, a rotating shaft 6, an active roller 7, an electric push rod 8, a driven roller 9, a main grinding wheel 10, a spray pipe 11, a spray hole 12, a collecting box 13, a telescopic rod 14, a spare roller 15, a spare grinding wheel 16, a connecting piece 17, a telescopic piece 18, a connecting piece 2 19, and a rotating rod 20.
[0025] In one embodiment of the utility model, the top end face of the frame 1 is fixedly connected to a motor 5, the output end of the motor 5 is fixedly connected to a rotating shaft 6, the end of the rotating shaft 6 away from the motor 5 is fixedly connected to an active roller 7, the side wall of the active roller 7 is provided with a vertical groove, the side wall of the driven roller 9 is provided with a vertical groove, the active roller 7 is movably connected to the driven roller 9, the friction between the active roller 7 and the driven roller 9 is increased by providing the vertical groove, the active roller 7 drives the driven roller 9 to rotate, the inner top of the frame 1 is fixedly connected to an electric push rod 8, the end of the electric push rod 8 away from the frame 1 is rotatably connected to the driven roller 9, the bottom end face of the driven roller 9 is clamped with a main grinding wheel 10, the frame 1 is movably connected to a collecting box 13, the collecting box 13 is located at the bottom of the conveying component 2, and the collecting box 13 is used to collect a mixture of water and dust, the side wall of the frame 1 is fixedly connected with an oblique baffle 4, the frame 1 is fixedly connected with a spray pipe 11, and a spray hole 12 is opened at the bottom of the spray pipe 11, the inner top end surface of the frame 1 is fixedly connected with a telescopic rod 14, the bottom end surface of the telescopic rod 14 is fixedly connected with a spare roller 15, and the bottom end surface of the spare roller 15 is clamped with a spare grinding wheel 16, the side wall of the telescopic rod 14 is fixedly connected with a connecting piece 17, the connecting piece 17 is hinged with the telescopic piece 18, the telescopic piece 18 is rotatably connected with the rotating rod 20, the rotating rod 20 is fixedly connected to the inner wall of the frame 1, the side wall of the electric push rod 8 is fixedly connected with a connecting piece 2 19, and the end of the telescopic piece 18 away from the connecting piece 17 is hinged with the connecting piece 2 19.
[0026] The semiconductor wafer is placed on the transmission component 2, and the transmission component 2 transfers the semiconductor wafer to the frame 1. The motor 5 is started to drive the rotating shaft 6 to rotate, and the rotation of the rotating shaft 6 drives the active roller 7 to rotate. The electric push rod 8 pushes the driven roller 9 to move downward, so that the main grinding wheel 10 is in contact with the semiconductor wafer. The driven roller 9 is movably connected with the active roller 7. The rotation of the active roller 7 drives the driven roller 9 to rotate, and the rotation of the driven roller 9 drives the main grinding wheel 10 to rotate, thereby grinding the semiconductor wafer. Water passes through the spray pipe 11 and the spray hole 12, along the oblique baffle 4, and the oblique baffle 4 guides the water. At the same time, the concave setting also prevents the dust or mixture generated by the grinding from splashing out of the frame 1. The water drops on the semiconductor wafer. By adding water as a grinding medium, the influence of dust on the grinding accuracy is reduced, the grinding effect is improved, and at the same time, dust is prevented from floating in the air, keeping the working environment clean.
[0027] In addition, the inner top end surface of the frame body 1 is fixedly connected with a telescopic rod 14, the bottom end surface of the telescopic rod 14 is fixedly connected with a spare roller 15, the bottom end surface of the spare roller 15 is clamped with a spare grinding wheel 16, the side wall of the telescopic rod 14 is fixedly connected with a connecting piece 17, the connecting piece 17 is hinged to the telescopic piece 18, the telescopic piece 18 is rotatably connected to the rotating rod 20, the rotating rod 20 is fixedly connected to the inner wall of the frame body 1, the side wall of the electric push rod 8 is fixedly connected with a connecting piece 2 19, and the end of the telescopic piece 18 away from the connecting piece 17 is hinged to the connecting piece 2 19.
[0028] When the main grinding wheel 10 needs to be replaced, the electric push rod 8 contracts to drive the main grinding wheel 10 to move upward. At the same time, the electric push rod 8 rises, causing the telescopic member 18 to rotate around the rotating rod 20, and the telescopic rod 14 moves downward, so that the spare roller 15 is movably connected with the active roller 7, and the spare grinding wheel 16 abuts against the semiconductor wafer. The active roller 7 rotates to drive the spare roller 15 to move, and then the spare grinding wheel 16 grinds the semiconductor wafer. The main grinding wheel 10 is replaced through the inspection door 3, and the maintenance of the grinding wheel can be completed without stopping the machine, thereby improving production efficiency and improving grinding effect.
[0029] In the present invention, when in use, the semiconductor wafer is placed on the conveying assembly 2, the conveying assembly 2 transfers the semiconductor wafer to the frame 1, the motor 5 is started to drive the rotating shaft 6 to rotate, the rotating shaft 6 drives the active roller 7 to rotate, the electric push rod 8 drives the driven roller 9 to move downward, so that the main grinding wheel 10 abuts against the semiconductor wafer, the driven roller 9 is movably connected with the active roller 7, the active roller 7 rotates to drive the driven roller 9 to rotate, the driven roller 9 rotates to drive the main grinding wheel 10 to rotate, and then the semiconductor wafer is polished, and water passes through the spray pipe 11 and the spray hole 12, along the inclined baffle 4, water is added as a grinding medium. Further, when the main grinding wheel 10 needs to be replaced, the electric push rod 8 contracts to drive the main grinding wheel 10 to move upward, and at the same time the electric push rod 8 rises, so that the telescopic member 18 rotates around the rotating rod 20, and the telescopic rod 14 moves downward, so that the spare roller 15 is movably connected with the active roller 7, and the spare grinding wheel 16 abuts against the semiconductor wafer. The rotation of the active roller 7 drives the spare roller 15 to move, and then the spare grinding wheel 16 grinds the semiconductor wafer.
[0030] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.
Claims
1. A grinding machine with dust removal function, comprising a frame (1), a conveying assembly (2) being arranged at the bottom of the frame (1), characterized in that: The inner top of the frame (1) is provided with a grinding assembly, and the grinding assembly comprises: A driving roller (7), wherein the top end surface of the frame (1) is fixedly connected to a motor (5), the output end of the motor (5) is fixedly connected to a rotating shaft (6), and the end of the rotating shaft (6) away from the motor (5) is fixedly connected to the driving roller (7); A main grinding wheel (10), the inner top of the frame (1) is fixedly connected to an electric push rod (8), one end of the electric push rod (8) away from the frame (1) is rotatably connected to a driven roller (9), and the bottom end surface of the driven roller (9) is clamped with the main grinding wheel (10); A collection box (13), the frame (1) is movably connected to the collection box (13); An oblique baffle (4), the side wall of the frame (1) being fixedly connected with the oblique baffle (4); A spray pipe (11), wherein the frame (1) is fixedly connected with the spray pipe (11), and a spray hole (12) is provided at the bottom of the spray pipe (11).
2. A grinding machine with dust removal function according to claim 1, characterized in that: The inner top end surface of the frame body (1) is fixedly connected to a telescopic rod (14), the bottom end surface of the telescopic rod (14) is fixedly connected to a spare roller (15), the bottom end surface of the spare roller (15) is clamped with a spare grinding wheel (16), the side wall of the telescopic rod (14) is fixedly connected to a connecting piece 1 (17), the connecting piece 1 (17) is hinged to the telescopic piece (18), the telescopic piece (18) is rotatably connected to a rotating rod (20), and the rotating rod (20) is fixedly connected to the inner wall of the frame body (1).
3. The grinding machine with dust removal function according to claim 1, characterized in that: An inspection door (3) is hingedly connected to the front of the frame (1).
4. The grinding machine with dust removal function according to claim 1, characterized in that: The collecting box (13) is located at the bottom of the conveying assembly (2).
5. The grinding machine with dust removal function according to claim 1, characterized in that: The side wall of the active roller (7) is provided with a vertical groove, the side wall of the driven roller (9) is provided with a vertical groove, and the active roller (7) and the driven roller (9) are movably connected.
6. A grinding machine with dust removal function according to claim 2, characterized in that: The side wall of the electric push rod (8) is fixedly connected with a second connecting member (19), and one end of the telescopic member (18) away from the first connecting member (17) is hinged to the second connecting member (19).