Prewarming disc material warping improvement mechanism for semiconductor test

Abstract

The utility model discloses a pre-warming disc material warping improvement mechanism for semiconductor testing, which comprises a pre-warming disc, and clamps for clamping a test workpiece are arranged above and below the pre-warming disc; at least one of the left side and the right side of the preheating disc is provided with a knocking cylinder, the knocking cylinder is transversely arranged, a main shaft of the knocking cylinder transversely extends out, the position of the main shaft corresponds to the position of the test workpiece, and the side wall of the test workpiece can be transversely knocked, so that the test workpiece can correspondingly move between the clamps on the upper side and the lower side, and the position of the test workpiece can be correspondingly adjusted. According to the device, the knocking air cylinders are arranged on one side or two sides of the pre-warming disc, and the tested workpiece can be knocked and adjusted to the position matched with the pre-warming disc through knocking of the knocking air cylinders, so that the temperature conduction is uniform during pre-heating or pre-cooling, the temperature of the tested workpiece is uniform, and the problem of material warping of a product in the pre-warming disc is completely avoided; and as no personnel intervention is needed, the output loss caused by frequent shutdown is reduced, and meanwhile, the problem of accidental scald / frostbite of operators is completely eradicated.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor production testing, and in particular relates to a pre-heating plate warping improvement mechanism for semiconductor testing. Background Art

[0002] In the prior art, when semiconductor test pieces are produced at high or low temperatures, the test workpieces need to be placed on a preheating plate for preheating or precooling. When placing the test workpiece on the preheating plate, the placement of the test workpiece may not match the position of the preheating plate, resulting in improper placement of the preheating plate. If this problem is not handled in a timely manner, the product will experience uneven temperature conduction during subsequent preheating or precooling, causing product warping and abnormal temperature testing. The warping problem will cause problems in the subsequent product absorption process, and the product cannot be absorbed normally.

[0003] Moreover, manual adjustments can no longer be made at this time, because the product temperature may reach a high temperature of 150 degrees or a low temperature of -55 degrees. The staff's handling efficiency will be very low, and there is a risk of burns or frostbite on their hands.

[0004] Therefore, in order to solve the above problems, it is necessary to develop a pre-heating plate warpage improvement mechanism with a reasonable structure for semiconductor testing. Utility Model Content

[0005] Technical solution: In order to solve the above technical problems, the technical solution adopted by the utility model is as follows:

[0006] A pre-heating plate warpage improvement mechanism for semiconductor testing comprises a pre-heating plate, wherein clamps for clamping a test workpiece are arranged at upper and lower positions of the pre-heating plate; and a knocking cylinder is arranged on at least one of the left and right sides of the pre-heating plate, wherein the knocking cylinder is arranged laterally, and the spindle of the knocking cylinder extends laterally, and the position of the spindle corresponds to the position of the test workpiece, and the side wall of the test workpiece can be knocked laterally, so that the test workpiece can be moved accordingly between the clamps on the upper and lower sides to adjust the position.

[0007] Furthermore, it also includes a controller and a sensor. The sensor is arranged on the upper and lower sides of the pre-heating plate and is used to sense the test workpiece. The sensor is connected to the controller, and the controller is connected to the knocking cylinder through a solenoid valve.

[0008] Furthermore, when only one of the left and right sides of the pre-heating plate is provided with a knocking cylinder, a position-fixed limiting plate is provided on the other side of the pre-heating plate.

[0009] Furthermore, two knocking cylinders, one upper and one lower, may be provided on one side of the pre-warming plate, and the two knocking cylinders move synchronously to knock on the corresponding side walls of the test workpiece.

[0010] Furthermore, knocking cylinders are installed on both sides of the pre-heating plate, and each side is provided with two upper and lower knocking cylinders, and the upper and lower knocking cylinders move synchronously to knock on both sides of the test workpiece.

[0011] Furthermore, two sensors are respectively arranged on the upper side and the lower side of the pre-warming plate, and a total of four sensors are arranged.

[0012] Furthermore, a knocking block is provided at the front end of the knocking cylinder main shaft, and the knocking block is configured as a triangular structure; the provision of a triangular knocking block can increase the knocking area, making the position adjustment of the test workpiece smoother.

[0013] Beneficial effects: Compared with the prior art, the utility model has the following advantages:

[0014] 1) This device sets a knocking cylinder on one or both sides of the preheating plate. The knocking of the knocking cylinder can adjust the test workpiece to a position that matches the preheating plate. In this way, the temperature conduction is uniform during preheating or precooling, and the temperature of the test workpiece is uniform, which completely avoids the problem of product warping on the preheating plate. In addition, since no human intervention is required, the output loss caused by frequent shutdowns is reduced, and the problem of accidental scalding / freezing of operators is eliminated;

[0015] 2) In this device, sensors are set above and below the pre-heating plate. The sensors are connected to the controller. The controller is connected to the knocking cylinder through an electromagnetic valve to realize automatic knocking work. The entire device does not need to obtain the equipment communication port protocol and is a completely independent operation system. The trigger signal of the sensor is provided by the key action of the equipment, so the device can not be triggered when the equipment is stopped. It is only triggered when there is a test workpiece at the pre-heating plate position. After being triggered once, the knocking force and frequency of the cylinder can be set by the controller to adapt to the production of products of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural diagram of Embodiment 1 of the present utility model;

[0017] Figure 2 This is a test workpiece placement diagram for Example 1 of the utility model;

[0018] Figure 3 This is a structural diagram of Embodiment 2 of the present utility model;

[0019] Figure 4 This is a diagram for placing test workpieces in Example 2 of the utility model. DETAILED DESCRIPTION

[0020] The present invention will be further explained below in conjunction with specific embodiments. The embodiments are implemented based on the technical solution of the present invention. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0021] Example 1

[0022] like Figure 1 and Figure 2 As shown, it is a structural diagram of a pre-heating plate warpage improvement mechanism for semiconductor testing of the present embodiment, comprising a pre-heating plate 1, wherein fixtures 3 for clamping a test workpiece 2 are arranged at the upper and lower positions of the pre-heating plate 1; and a knocking cylinder 4 is arranged on the right side of the pre-heating plate 1, and the knocking cylinder 4 is arranged horizontally. The spindle of the knocking cylinder 4 extends horizontally, and the position of the spindle corresponds to the position of the test workpiece 2, and the side wall of the test workpiece 2 can be knocked horizontally, so that the test workpiece 2 can be moved accordingly between the fixtures 3 on the upper and lower sides to adjust the position.

[0023] It also includes a controller 5 and a sensor 6. The sensor 6 is arranged on the upper and lower sides of the pre-heating plate 1 and is used to sense the test workpiece 2. The sensor 6 is connected to the controller 5, and the controller 5 is connected to the knocking cylinder 4 through the solenoid valve 9.

[0024] A fixed limit plate 7 is provided on the other side of the pre-heating plate 1; two sensors 6 are correspondingly provided on the upper and lower sides of the pre-heating plate 1, and a total of four sensors 6 are provided; a knocking block 8 is provided at the front end of the main shaft of the knocking cylinder 4, and the knocking block 8 is set as a triangular structure.

[0025] In this embodiment, a knocking cylinder is provided at the right side of the preheating disk, and a limit plate is correspondingly provided at the left side. After the test workpiece is placed on the clamps on the upper and lower sides of the preheating disk, the upper and lower sensors sense the test workpiece and transmit the sensing signal to the controller. The controller then controls the knocking cylinder to open through the solenoid valve, and knocks the side wall of the test workpiece by the knocking block on the main shaft of the knocking cylinder, forcing the test workpiece to move and make the test workpiece close to the limit plate on the left. At this time, the test workpiece is just in contact with the preheating disk. After such a design, when the preheating disk is preheated or precooled, the temperature is evenly conducted, and the overall temperature of the test workpiece is also very uniform, which effectively improves the warping situation.

[0026] Example 2

[0027] like Figure 3 and Figure 4As shown, a pre-heating plate warpage improvement mechanism for semiconductor testing according to the present embodiment comprises a pre-heating plate 1, and fixtures 3 for clamping a test workpiece 2 are arranged at the upper and lower positions of the pre-heating plate 1; and knocking cylinders 4 are arranged on both the left and right sides of the pre-heating plate 1, and the knocking cylinders 4 are arranged laterally. The spindle of the knocking cylinder 4 extends laterally, and the position of the spindle corresponds to the position of the test workpiece 2, and the side wall of the test workpiece 2 can be knocked laterally, so that the test workpiece 2 can be moved accordingly between the fixtures 3 on the upper and lower sides to adjust the position.

[0028] It also includes a controller 5 and a sensor 6. The sensor 6 is arranged on the upper and lower sides of the pre-heating plate 1 and is used to sense the test workpiece 2. The sensor 6 is connected to the controller 5, and the controller 5 is connected to the knocking cylinder 4 through the solenoid valve 9.

[0029] There are knocking cylinders 4 installed on both sides of the pre-heating plate 1, and each side is provided with two upper and lower knocking cylinders 4, which move synchronously to realize knocking on both sides of the test workpiece 2; there are two sensors 6 correspondingly arranged on the upper and lower sides of the pre-heating plate 1, and there are four sensors 6 in total; a knocking block 8 is arranged at the front end of the main shaft of the knocking cylinder 4, and the knocking block 8 is arranged as a triangular structure.

[0030] In this embodiment, knocking cylinders are provided on both sides of the preheating plate, and each side is provided with two knocking cylinders, one upper and one lower, and the two knocking cylinders on one side move synchronously. Then, after the test workpiece is installed in the fixture, the sensor senses it, and the controller controls the four knocking cylinders on both sides to knock. After several rounds of knocking, the test workpiece is knocked to the position corresponding to the preheating plate, and then preheated or precooled, which effectively solves the problem of warping.

[0031] The knocking amplitude and frequency of the knocking cylinder can be adjusted according to actual usage to adapt to test workpieces of different sizes. In addition, the fixture setting can adopt a roller-type fixture component, or a fixture with not very large clamping force, so that the test workpiece can move accordingly.

[0032] The above are only preferred implementations of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A pre-heating plate warpage improvement mechanism for semiconductor testing, Features: The invention comprises a preheating plate (1), wherein a clamp (3) for clamping a test workpiece (2) is arranged at the upper and lower positions of the preheating plate (1); and a knocking cylinder (4) is arranged on at least one of the left and right sides of the preheating plate (1), wherein the knocking cylinder (4) is arranged transversely, and the main shaft of the knocking cylinder (4) extends transversely, and the position of the main shaft corresponds to the position of the test workpiece (2), so that the side wall of the test workpiece (2) can be knocked transversely, so that the test workpiece (2) can be moved accordingly between the clamps (3) on the upper and lower sides to adjust the position.

2. A pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 1, Features: The invention also comprises a controller (5) and a sensor (6), wherein the sensor (6) is arranged on the upper and lower sides of the pre-heating plate (1) and is used to sense the test workpiece (2), and the sensor (6) is connected to the controller (5), and the controller (5) is connected to the knocking cylinder (4) via a solenoid valve (9).

3. The pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 1, Features: When only one of the left and right sides of the pre-heating plate (1) is provided with a knocking cylinder (4), a position-fixed limiting plate (7) is provided on the other side of the pre-heating plate (1).

4. A pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 3, Features: The knocking cylinder (4) on one side of the pre-warming plate (1) may be provided with two knocking cylinders, one above and one below, and the two knocking cylinders (4) move synchronously to knock on the corresponding side walls of the test workpiece (2).

5. The pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 1, Features: The two sides of the pre-heating plate (1) are respectively provided with knocking cylinders (4), and each side is respectively provided with two upper and lower knocking cylinders (4), and the two upper and lower knocking cylinders (4) move synchronously to knock on the two sides of the test workpiece (2).

6. The pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 2, Features: Two sensors (6) are respectively arranged on the upper side and the lower side of the pre-heating plate (1), and a total of four sensors (6) are arranged.

7. The pre-heating plate warpage improvement mechanism for semiconductor testing according to claim 1, Features: A knocking block (8) is arranged at the front end of the main shaft of the knocking cylinder (4), and the knocking block (8) is arranged in a triangular structure.

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