Heat dissipation structure of electronic equipment

Abstract

The utility model discloses a heat dissipation structure of electronic equipment. The heat dissipation structure comprises an electronic equipment cover plate, and a U-shaped heat dissipation plate, a heat dissipation sheet and a circuit board which are arranged in the electronic equipment cover plate and are stacked in sequence, the U-shaped heat dissipation plate is inversely arranged on the electronic equipment cover plate, and a heat conduction gap is formed between the U-shaped heat dissipation plate and the electronic equipment cover plate; the cooling fin covers one side, deviating from the electronic equipment cover plate, of the U-shaped cooling plate; the circuit board is arranged on the side, away from the U-shaped heat dissipation plate, of the heat dissipation sheet and conducts heat with the U-shaped heat dissipation plate through the heat dissipation sheet. The electronic equipment cover plate and the U-shaped heat dissipation plate are both cold-rolled plates. According to the heat dissipation structure provided by the utility model, the U-shaped heat dissipation plate is matched with the heat dissipation sheets, so that heat generated by the circuit board can be effectively transmitted to the external environment, a complicated heat dissipation device structure is omitted, the heat dissipation structure is efficient, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a heat dissipation structure of electronic equipment. Background Art

[0002] Printed circuit board (PCB) is an important component of electronic equipment. It carries electronic components and provides electrical connection and signal transmission functions. However, as the precision of circuit boards becomes higher and higher, heat will be generated when electronic equipment is running. The accumulation of heat will affect the electrical characteristics of components on the circuit board. Long-term operation under high temperature conditions will greatly reduce the service life of the circuit board and may even directly burn the circuit board.

[0003] Therefore, there are many heat dissipation methods proposed on the current traditional circuit boards. One is to improve the material and use aluminum or copper fin structure heat sinks, and the other is to dissipate heat through external air cooling equipment. The existing heat dissipation methods of electronic equipment have technical problems of complex structure and high cost. Utility Model Content

[0004] The main purpose of the utility model is to provide a heat dissipation structure of an electronic device, aiming to solve the problem of complex heat dissipation structures in the prior art and to reduce heat dissipation costs.

[0005] To achieve the above-mentioned purpose, the utility model proposes an electronic device heat dissipation structure, comprising: an electronic device cover plate and a U-shaped heat sink, a heat sink, and a circuit board installed in the electronic device cover plate and stacked in sequence; the U-shaped heat sink is inverted on the electronic device cover plate, and a heat conduction gap is formed between the U-shaped heat sink and the electronic device cover plate; the heat sink covers the side of the U-shaped heat sink away from the electronic device cover plate; the circuit board is arranged on the side of the heat sink away from the U-shaped heat sink and transfers heat to the U-shaped heat sink through the heat sink; wherein the electronic device cover plate and the U-shaped heat sink are both cold-rolled plates.

[0006] Optionally, the heat sink is arranged in parallel with the circuit board, and the surface area of ​​the heat sink is smaller than the surface area of ​​the circuit board.

[0007] Optionally, the electronic device heat dissipation structure further includes a plurality of support columns, and the circuit board is mounted on the ends of the support columns.

[0008] Optionally, a threaded hole is formed at the end of the support column, and the circuit board is fixed to the end of the support column by screws.

[0009] Optionally, the U-shaped heat sink is provided with a welding portion for welding to the electronic equipment cover.

[0010] Optionally, the welding portions are symmetrically arranged at two ends of the U-shaped heat dissipation plate, and the welding portions are configured as a rectangular structure extending along the length direction of the U-shaped heat dissipation plate.

[0011] Optionally, the U-shaped heat sink, the heat sink and the circuit board are connected by screws.

[0012] Optionally, the heat sink is a thermally conductive silicone sheet.

[0013] The beneficial effect of the utility model is that the utility model provides an electronic equipment heat dissipation structure, which can effectively transfer the heat generated by the circuit board to the external environment through the U-shaped heat dissipation plate, eliminating the need for a complex radiator, is highly efficient and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0015] Figure 1 This is a schematic diagram of the overall structure of the heat dissipation structure of an electronic device according to an embodiment of the utility model;

[0016] Figure 2 This is a schematic diagram of the exploded structure of the heat dissipation structure of an electronic device according to an embodiment of the utility model;

[0017] Figure 3 The figure is a schematic cross-sectional view of a heat dissipation structure of an electronic device according to an embodiment of the present utility model.

[0018] Description of Figure Numbers:

[0019] Electronic device cover 1; U-shaped heat sink 2; welding portion 2a; heat sink 3; circuit board 4;

[0020] Heat conducting gap 5; support column 6;

[0021] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0024] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0025] The utility model proposes a heat dissipation structure of an electronic device, comprising: an electronic device cover plate 1, and a U-shaped heat sink, a heat sink 3, and a circuit board 4 which are installed in the electronic device cover plate 1 and stacked in sequence; the U-shaped heat sink is inverted on the electronic device cover plate 1, and a heat conduction gap 5 is formed between the U-shaped heat sink and the electronic device cover plate 1; the heat sink 3 covers a side of the U-shaped heat sink away from the electronic device cover plate 1; the circuit board 4 is arranged on a side of the heat sink 3 away from the U-shaped heat sink and transfers heat with the U-shaped heat sink through the heat sink 3; wherein the electronic device cover plate 1 and the U-shaped heat sink are both cold-rolled plates.

[0026] Specifically, the electronic device cover 1 is a rectangular frame with an opening on one side, and the electronic device is installed in the opening. The electronic device cover 1 may also be provided with a plurality of sockets for electrical connection with external devices. The U-shaped heat sink 2 is a plate with a U-shaped cross section. The electronic device cover 1 and the U-shaped heat sink 2 are both cold-rolled plates, which are products made by rolling hot-rolled coils at room temperature below the recrystallization temperature. The materials of the cold-rolled plates include but are not limited to galvanized and galvanized.

[0027] Furthermore, a U-shaped heat sink 2 is used as a heat dissipation structure, and the heat on the circuit board 4 is directly transferred to the surrounding environment through a simple insulating medium, and the heat transfer path is short. The U-shaped heat sink structure is not limited to a U-shaped structure. The U-shaped structure is used to open the gap between the front panel and the circuit board 4 to ensure the designed installation distance to form a certain thermal conductive gap 5. The thermal conductive gap 5 refers to a certain distance or space left between two adjacent components in the overall structure to reduce the heat transfer resistance in the heat conduction path, promote the conduction of heat and improve the heat dissipation effect.

[0028] Furthermore, the heat sink 3 serves as a heat dissipation medium between the U-shaped heat sink 2 and the circuit board 4. It can be a metal heat sink 3 such as a copper-aluminum composite heat sink 3, or a graphite heat sink 3 with good thermal conductivity and corrosion resistance. In addition, in the heat dissipation application scenarios of some special electronic components, a ceramic heat sink 3 with high insulation and high temperature resistance can also be used. In this embodiment, a sheet-like heat-conducting silicone sheet with a fixed shape under normal conditions is used as the heat sink 3.

[0029] In this embodiment, the heat sink 3 is arranged in parallel with the circuit board 4 , and the surface area of ​​the heat sink 3 is smaller than the surface area of ​​the circuit board 4 .

[0030] Specifically, the heat sink 3 and the circuit board 4 are arranged in parallel to ensure the adhesion effect between the heat sink 3 and the circuit board 4 to a certain extent, realize a compact structure and a close fit of the heat dissipation contact surface, and then the circuit board 4 is quickly and effectively conducted to the shell and the external environment through the heat sink 3 and other components, and the heat dissipation effect is excellent.

[0031] Furthermore, the surface area of ​​the heat sink 3 is smaller than the surface area of ​​the circuit board 4, which means that part of the structure of the circuit board 4 is suspended on one side of the U-shaped heat sink 2 and the heat sink 3. When space is limited, this design can make the overall layout more compact. At the same time, since the circuit board 4 structure is partially suspended on one side of the heat sink 3, the effective heat dissipation surface area can be increased, thereby improving the heat dissipation efficiency.

[0032] In this embodiment, the electronic device heat dissipation structure further includes a plurality of support columns 6, and the circuit board 4 is mounted on the ends of the support columns 6. The support columns 6 are located on the suspension structure of the circuit board 4, and are used to enhance the support strength of the circuit board 4, thereby increasing the stability and firmness of the overall structure, ensuring a firm connection between the components, and avoiding loosening or damage of the circuit board 4 due to vibration or other external forces.

[0033] In this embodiment, a threaded hole is formed at the end of the support column 6, and the circuit board 4 is fixed to the end of the support column 6 by screws.

[0034] In this embodiment, the U-shaped heat sink 2 is provided with a welding portion 2a for welding to the electronic device cover 1, and the welding portion 2a is formed by extending along both sides of the U-shaped heat sink 2. The area of ​​the welding portion 2a and the number of welding points can be set according to specific needs. The area of ​​the welding portion 2a and the number of welding points limit the speed and amount of heat transfer to a certain extent, and control the time and temperature to reach thermal equilibrium. Specifically, the principle that changing the number of welding points can affect the heat transfer efficiency is to increase the overall contact heat dissipation area of ​​the welded U-shaped plate and the front panel of the battery module to improve the heat dissipation effect.

[0035] In this embodiment, the welding portion 2a is symmetrically arranged at both ends of the U-shaped heat sink 2, and the welding portion 2a is set as a rectangular structure extending along the length direction of the U-shaped heat sink 2. The welding portion 2a is formed by the two side walls of the U-shaped heat sink 2 extending outward in the horizontal direction, and the connection between the welding portion 2a and the main body of the U-shaped heat sink 2 can be designed with a certain curvature to improve the connection strength. The welding portion 2a of the U-shaped heat sink is welded on the electronic device cover 1 to realize the integrated structure of the electronic device cover 1 and the U-shaped heat sink.

[0036] In this embodiment, the U-shaped heat sink 2, the heat sink 3 and the circuit board 4 are connected by screws.

[0037] In this embodiment, the heat sink 3 is a thermally conductive silicone sheet. The thermally conductive silicone sheet is a polymer composite thermally conductive material that uses silicone resin as a bonding substrate and is filled with thermally conductive powder to achieve the purpose of thermal conductivity. It is a sheet-like thermally conductive adhesive with a fixed shape under normal conditions. Both sides of the thermally conductive silicone sheet have natural stickiness, and are easy to operate and maintain. With the addition of the thermally conductive silicone sheet, the U-shaped heat sink and the circuit board 4 have reliable, close and sufficient contact, truly achieving the largest area of ​​face-to-face contact, and the temperature reaction can achieve a temperature difference as small as possible.

[0038] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An electronic equipment heat dissipation structure, characterized in that: include: An electronic equipment cover plate, and a U-shaped heat sink, a heat sink, and a circuit board installed in the electronic equipment cover plate and stacked in sequence; The U-shaped heat sink is inverted on the electronic device cover, and a heat-conducting gap is formed between the U-shaped heat sink and the electronic device cover; The heat sink covers a side of the U-shaped heat sink facing away from the electronic device cover; The circuit board is arranged on a side of the heat sink away from the U-shaped heat sink and conducts heat with the U-shaped heat sink through the heat sink; Wherein, the electronic equipment cover plate and the U-shaped heat dissipation plate are both cold-rolled plates.

2. The electronic device heat dissipation structure according to claim 1, characterized in that: The heat sink is arranged in parallel with the circuit board, and the surface area of ​​the heat sink is smaller than the surface area of ​​the circuit board.

3. The electronic equipment heat dissipation structure according to claim 2, characterized in that: The electronic equipment heat dissipation structure further comprises a plurality of support columns, and the circuit board is mounted on the ends of the support columns.

4. The electronic equipment heat dissipation structure according to claim 3, characterized in that: A threaded hole is provided at the end of the support column, and the circuit board is fixed to the end of the support column by screws.

5. The electronic equipment heat dissipation structure according to claim 1, characterized in that: The U-shaped heat sink is provided with a welding portion for welding with the electronic equipment cover.

6. The electronic equipment heat dissipation structure according to claim 5, characterized in that: The welding parts are symmetrically arranged at two ends of the U-shaped heat dissipation plate, and the welding parts are configured as a rectangular structure extending along the length direction of the U-shaped heat dissipation plate.

7. The electronic equipment heat dissipation structure according to claim 1, characterized in that: The U-shaped heat sink, the heat sink and the circuit board are connected by screws.

8. The electronic equipment heat dissipation structure according to claim 1, characterized in that: The heat sink is a thermally conductive silicone sheet.

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