Heat dissipation structure of booster pump
By designing a spring array and heat dissipation fin structure that absorbs impact on the booster pump, the problem of the outer and inner rings of the existing booster pump cooling system is solved, and the heat dissipation efficiency and service life are improved to prevent damage. .
Patent Information
- Application Number
- CN202420953194.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2025-01-03
- Estimated Expiration
- 2034-05-06
AI Technical Summary
The outer ring and inner ring of the existing booster pump cooling system are affected by water flow for a long time, and the impact force is transmitted to the booster pump through the inner ring, which can easily lead to damage to the booster pump.
A heat dissipation structure of a booster pump is designed, including the inner ring and outer ring fixed to the outside of the booster pump, the inner ring surface is evenly distributed, the outer ring of the ring plate is fixed on the arc surface, and the spring is installed between the ring plates to form The cooling chamber is maintained through the drainage pipe and the water inlet pipe. The spring array absorbs impact force, the communication hole enhances the strength of the ring, and the heat dissipation fins accelerate heat exchange.
Effectively absorb impact force, prevent damage to the booster pump, improve heat dissipation efficiency and service life, avoid deformation of the outer ring or inner ring, and enhance the durability of the heat dissipation components.
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Figure CN222296484U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of booster pumps, in particular to a heat dissipation structure of a booster pump. Background Art
[0002] A booster pump, as the name suggests, is a pump used to increase pressure. Its main purpose is to increase the pressure of water in the cervical cancer pipeline, and then keep the water in the pipeline at a certain flow rate.
[0003] After searching, the application with patent number CN202222541018.5 discloses a booster pump cooling system, including a booster pump and a heat dissipation device, the heat dissipation device includes a heat dissipation ring and an outer ring, the outer ring cover is arranged on the heat dissipation ring to form a cavity, the cavity is used for the cooling medium to pass through, the outer ring is sealed and connected to the edge of the heat dissipation ring, the heat dissipation ring is sleeved on the booster pump, the inner side of the heat dissipation ring is in contact with the outer side of the booster pump, the outer ring is provided with a water inlet hole and a water outlet hole, the water inlet hole and the water outlet hole are both connected to the cavity, and a reinforcement structure is provided on the outer ring;
[0004] Although the boost pump cooling system increases the strength of the heat dissipation device and reduces the risk of water leakage by setting a reinforced structure, the outer ring and the inner ring of the boost pump cooling system are subjected to the impact of water flow for a long time, and the impact force will be transmitted to the boost pump through the inner ring, which may easily cause the boost pump to be damaged by the impact.
[0005] Therefore, we propose a heat dissipation structure for a booster pump. Utility Model Content
[0006] In view of the deficiencies in the prior art, the utility model provides a heat dissipation structure for a booster pump, which solves the problem that the outer ring and the inner ring of the prior device are subjected to long-term impact of water flow, and the impact force is transmitted to the booster pump through the inner ring, which easily causes the booster pump to be damaged by the impact.
[0007] To achieve the above purpose, the utility model is implemented through the following technical solutions: a heat dissipation structure of a booster pump, which is arranged on a booster pump body, and a heat dissipation component is arranged outside the booster pump body;
[0008] The heat dissipation component includes an inner ring fixedly mounted on the outside of the boost pump body, the outer surface of the inner ring is fixedly mounted with evenly distributed annular plates, the arc surface of the annular plate is fixedly mounted with an outer ring, a cooling cavity is formed between the outer ring and the inner ring, two ends of a spring are fixedly mounted between adjacent annular plates, and a drain pipe and a water inlet pipe connected to the cooling cavity are respectively fixedly mounted on the annular plates at both ends of the inner ring.
[0009] Preferably, the drain pipe and the water inlet pipe are respectively connected to the water inlet and the water outlet of the booster pump body, so as to facilitate the input of water into the interior of the cooling chamber and keep the water circulating therein.
[0010] Preferably, the spring array is distributed between adjacent annular plates, and eight springs are arranged between adjacent annular plates, wherein when the boost pump body itself vibrates or the outer ring is impacted by external force, the springs can absorb the impact force through vibration, thereby protecting the boost pump body.
[0011] Preferably, there are five annular plates in total, and the side of the annular plate located in the middle is provided with an array of connecting holes, wherein the annular plates can support the inner ring and the outer ring, thereby enhancing the strength of the outer ring and the inner ring, avoiding the outer ring or the inner ring from being deformed due to external impact, and the water can be smoothly filled in the interior of the cooling chamber through the connecting holes.
[0012] Preferably, the arc surface of the inner ring is fixedly mounted with heat dissipation fins evenly distributed between adjacent annular plates, so as to facilitate the conduction of heat inside the inner ring to the inside of the heat dissipation fins, and then heat exchange is carried out between the heat dissipation fins and the water inside the cooling chamber, thereby accelerating the heat dissipation rate of the booster pump body.
[0013] The utility model provides a heat dissipation structure of a booster pump, which has the following beneficial effects:
[0014] 1. The heat dissipation structure of the booster pump absorbs the heat generated by the booster pump body when it is working through the inner ring, and conducts it to the inside of the heat dissipation fins, and transports the external water to the inside of the cooling chamber through the water inlet pipe, and then cools the inner ring and the heat dissipation fins, thereby reducing the temperature of the booster pump body and improving the heat dissipation efficiency of the booster pump body. When the booster pump body itself vibrates or the heat dissipation component is impacted by the outside world, the spring itself vibrates to absorb the impact force, thereby achieving the purpose of protecting the booster pump body, and solving the problem that the outer ring and the inner ring of the existing device are impacted by the water flow for a long time, and the impact force is transmitted to the booster pump through the inner ring, which easily causes the booster pump to be damaged by the impact;
[0015] 2. The heat dissipation structure of the booster pump can increase the strength of the inner ring and the outer ring through the connecting hole and the connection structure between the inner ring and the outer ring, avoid deformation of the outer ring or the inner ring due to external impact, and increase the service life of the heat dissipation component. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 It is a structural schematic diagram of the heat dissipation structure of the utility model;
[0018] Figure 3 This is a schematic diagram of the inner ring structure of the utility model;
[0019] Figure 4 It is a schematic diagram of the disassembled structure of the heat dissipation structure of the utility model.
[0020] In the figure: 1. Booster pump body; 2. Heat dissipation assembly; 21. Inner ring; 22. Ring plate; 23. Cooling chamber; 24. Connecting hole; 25. Heat dissipation fin; 26. Spring; 27. Outer ring; 28. Drain pipe; 29. Water inlet pipe. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] Embodiment 1:
[0023] like Figure 1-4 As shown: it includes a booster pump body 1, and a heat dissipation component 2 is arranged on the outside of the booster pump body 1. The heat dissipation component 2 includes an inner ring 21 fixedly sleeved on the outside of the booster pump body 1, and the outer surface of the inner ring 21 is fixedly sleeved with evenly distributed annular plates 22, and the arc surface of the annular plate 22 is fixedly sleeved with an outer ring 27, and a cooling cavity 23 is formed between the outer ring 27 and the inner ring 21. The two ends of a spring 26 are fixedly installed between adjacent annular plates 22, and a drain pipe 28 and a water inlet pipe 29 connected to the cooling cavity 23 are fixedly installed on the annular plates 22 at both ends of the inner ring 21, respectively. The drain pipe 28 and the water inlet pipe 29 are respectively connected to the water inlet and the water outlet of the booster pump body 1, and the spring 26 array is distributed between adjacent annular plates 22, and eight springs 26 are arranged between adjacent annular plates 22, and the heat generated when the booster pump body 1 is working is absorbed through the inner ring 21. , the external water is transported to the inside of the cooling chamber 23 through the water inlet pipe 29, and then the inner ring 21 and the heat dissipation fins 25 are cooled, thereby reducing the temperature of the booster pump body 1, and finally the water in the cooling chamber 23 is discharged through the drain pipe 28. When the booster pump body 1 itself vibrates or the heat dissipation component 2 is impacted by the outside, the spring 26 itself vibrates to absorb the impact force, thereby achieving the purpose of protecting the booster pump body 1. The connecting structure between the connecting hole 24, the inner ring 21 and the outer ring 27 can increase the strength of the inner ring 21 and the outer ring 27, and avoid the deformation of the outer ring 27 or the inner ring 21 due to external impact, thereby increasing the service life of the heat dissipation component 2, and solving the problem that the outer ring and the inner ring of the existing device are impacted by the water flow for a long time, and the impact force will be transmitted to the booster pump through the inner ring, which is easy to cause the booster pump to be damaged by the impact;
[0024] Embodiment 2:
[0025] like Figure 2-4 As shown: there are five annular plates 22 in total, and the side of the annular plate 22 located in the middle is provided with an array of connecting holes 24, and the arc surface of the inner ring 21 is fixedly installed with heat dissipation fins 25 evenly distributed between adjacent annular plates 22. The water body can be smoothly filled in the cooling cavity 23 through the connecting holes 24, and the heat inside the inner ring 21 can be conducted to the inside of the heat dissipation fins 25, and then heat exchange is performed with the water body in the cooling cavity 23 through the heat dissipation fins 25, which can accelerate the heat dissipation rate of the booster pump body 1.
[0026] Working principle and use process of the utility model: the heat dissipation structure of the booster pump, when in use, absorbs the heat generated by the booster pump body 1 during operation through the inner ring 21, and conducts it to the inside of the heat dissipation fins 25, and transports the external water to the inside of the cooling chamber 23 through the water inlet pipe 29, and then cools the inner ring 21 and the heat dissipation fins 25, and then the water inside the cooling chamber 23 is discharged through the drain pipe 28. When the booster pump body 1 itself vibrates or the heat dissipation component 2 is subjected to external impact, the impact force can be absorbed by the vibration of the spring 26 itself, and then the booster pump body 1 is protected. The connecting structure between the connecting hole 24 and the inner ring 21 and the outer ring 27 can increase the strength of the inner ring 21 and the outer ring 27, and avoid the deformation of the outer ring 27 or the inner ring 21 due to external impact.
[0027] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.
[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A heat dissipation structure of a booster pump, characterized in that: The booster pump body (1) is provided with a heat dissipation component (2) outside the booster pump body (1); The heat dissipation component (2) comprises an inner ring (21) fixedly mounted on the outside of the booster pump body (1); the outer surface of the inner ring (21) is fixedly mounted with evenly distributed annular plates (22); the arc surface of the annular plate (22) is fixedly mounted with an outer ring (27); a cooling cavity (23) is formed between the outer ring (27) and the inner ring (21); two ends of a spring (26) are fixedly mounted between adjacent annular plates (22); and a drain pipe (28) and a water inlet pipe (29) connected to the cooling cavity (23) are fixedly mounted on the annular plates (22) at the two ends of the inner ring (21).
2. The heat dissipation structure of a booster pump according to claim 1, characterized in that: The drainage pipe (28) and the water inlet pipe (29) are respectively connected to the water inlet and the water outlet of the booster pump body (1).
3. The heat dissipation structure of a booster pump according to claim 1, characterized in that: The spring (26) array is distributed between adjacent annular plates (22), and eight springs (26) are arranged between adjacent annular plates (22).
4. The heat dissipation structure of a booster pump according to claim 1, characterized in that: A total of five annular plates (22) are provided, and the side surface of the annular plate (22) located in the middle is provided with communicating holes (24) distributed in an array.
5. The heat dissipation structure of a booster pump according to claim 1, characterized in that: The arc surface of the inner ring (21) is fixedly provided with heat dissipation fins (25) evenly distributed between adjacent annular plates (22).
