Diode lead processing jig

Abstract

The utility model discloses a diode lead processing jig. Relates to the field of diode processing. Comprising a bottom plate and a cover plate, the top surface of the bottom plate is provided with frame grooves and pin grooves which are arranged at intervals, the frame grooves are used for placing frames, the pin grooves are used for placing pins, the cover plate is provided with chip grooves and lead grooves, the chip grooves are located in the bottom surface of the cover plate, and the lead grooves are located in the top surface of the cover plate; the lead groove comprises a chip lead groove, a transition groove and a pin lead groove which are communicated in sequence, the chip lead groove is communicated with the chip groove, a sliding block is arranged below the transition groove, and the sliding block is connected to the cover plate in a sliding mode and located on the top face of the frame and the top face of the pin; and the pin guide grooves are positioned on the top surfaces of the pins. Through the arrangement of the jig, the lead can be conveniently processed in a pouring mode, and convenience and reliability are achieved.

Description

Technical Field

[0001] The utility model relates to the field of diode processing, in particular to a diode lead processing jig. Background Art

[0002] Traditional diode chip bonding requires high-frequency vibration of wire bonders, cutters, wire nozzles and other equipment. During operation, the wire bonder uses high-frequency vibration to bond the aluminum wire to the chip surface and pins respectively, and the equipment is expensive. With the application of casting technology in diode processing, how to set up reliable jigs for lead processing is a current problem. Utility Model Content

[0003] In view of the above problems, the utility model provides a diode lead integrated forming machine which has a simple structure, is convenient for processing and has improved reliability.

[0004] The technical solution of the utility model is: a diode lead processing jig comprises a bottom plate and a cover plate,

[0005] The top surface of the bottom plate is provided with frame grooves and pin grooves arranged at intervals, wherein the frame grooves are used to place the frame, and the pin grooves are used to place the pins.

[0006] The cover plate is provided with a chip slot and a lead slot, the chip slot is located on the bottom surface of the cover plate, and the lead slot is located on the top surface of the cover plate;

[0007] The lead groove includes a chip lead groove, a transition groove and a pin lead groove which are connected in sequence.

[0008] The chip lead groove is connected to the chip groove,

[0009] A slider is provided below the transition groove, the slider is slidably connected to the cover plate and is located on the top surface of the frame and the pin;

[0010] The pin guide groove is located on the top surface of the pin.

[0011] The cover plate is provided with a slide groove, and the slider is slidably connected in the slide groove.

[0012] A handle is arranged on the outer side of the sliding block.

[0013] The bottom surface of the cover plate is provided with a positioning column, the top surface of the bottom plate is provided with a positioning groove, and the positioning column is adaptively arranged in the positioning groove.

[0014] During operation, the present invention first places the frame with the chip in the frame groove of the bottom plate, places the pins in the pin grooves, and then covers the cover plate. At this time, the chip is located in the chip groove of the cover plate. Since the cover plate is provided with a lead groove, the lead groove includes a chip lead groove, a transition groove and a pin lead groove which are connected in sequence.

[0015] The chip lead groove is connected to the chip groove, and the pin lead groove is located on the top surface of the pin. In this way, during casting, the lead wire is processed to realize the connection between the chip and the pin.

[0016] At the same time, a slider is arranged under the transition groove. After pouring, the slider can be moved to remove the cover plate, so as to facilitate the removal of the formed diode and complete the processing.

[0017] The utility model is convenient for processing the lead wire in a pouring form by arranging a jig, which is convenient and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the specific implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the specific implementation or the prior art description. In the drawings, each part is not necessarily drawn according to the actual scale.

[0019] Figure 1 It is a structural schematic diagram of the utility model.

[0020] Figure 2 yes Figure 1 The left view of

[0021] Figure 3 This is a schematic diagram of the structure of the tin tube and the cavity.

[0022] Figure 4 This is a schematic diagram of the structure of the diode before processing.

[0023] Figure 5 This is a schematic diagram of the structure of the diode after processing.

[0024] Figure 6 It is a schematic diagram of the structure of the base plate.

[0025] Figure 7 It is a schematic diagram of the structure of the cover.

[0026] Figure 8 This is a schematic diagram of the cover plate.

[0027] Fig. 9 It is a schematic diagram of the connection structure between the base plate and the cover plate;

[0028] In the figure, 1 is the workbench, 2 is the groove,

[0029] 3 is a fixture, 31 is a bottom plate, 311 is a frame slot, 312 is a pin slot, 32 is a cover plate, 321 is a chip slot, 322 is a lead slot, 3221 is a chip lead slot, 3222 is a transition slot, 3223 is a pin lead slot,

[0030] 4 is the X-axis track, 5 is the column, 6 is the crossbar, 7 is the tin outlet seat, 8 is the tin outlet tube, 9 is the tin melting pot, 10 is the tin liquid delivery pipe, 11 is the frame, 12 is the pin, 13 is the chip, 14 is the slider, 15 is the cavity, 16 is the air outlet, 17 is the input hole, 18 is the camera, 19 is the handle, 20 is the Z-axis track, and 21 is the lead wire;

[0031] Figure 1 , 2 The xyz coordinate system is marked in . DETAILED DESCRIPTION

[0032] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0033] In the description of the present invention, it should be understood that the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] The utility model Figure 1-9 As shown, the diode lead processing jig 3 includes a bottom plate 31 and a cover plate 32.

[0036] The top surface of the bottom plate 31 is provided with frame grooves 311 and pin grooves 312 arranged at intervals. The frame grooves are used to place the frame 11, and the pin grooves are used to place the pins 12.

[0037] The cover plate 32 is provided with a chip slot 321 and a lead slot 322 , wherein the chip slot 321 is located on the bottom surface of the cover plate 32 , and the lead slot 322 is located on the top surface of the cover plate 32 ;

[0038] The lead groove 322 includes a chip lead groove 3221, a transition groove 3222 and a pin lead groove 3223 which are connected in sequence.

[0039] The chip guide groove 3221 is connected to the chip groove 321.

[0040] A slider 14 is provided below the transition groove 3222. The slider 14 is slidably connected to the cover plate and is located on the top surface of the frame 11 and the tube pin 12 (used to cover the gap between the frame and the tube pin); the bottom surface of the slider and the bottom surface of the cover plate are located in the same plane; in application, the top surface of the frame and the top surface of the tube pin are located in the same plane;

[0041] The pin guide groove 3223 is located on the top surface of the pin 12 .

[0042] During operation, the present invention first places the frame with the chip in the frame groove of the bottom plate, places the pins in the pin grooves, and then covers the cover plate. At this time, the chip is located in the chip groove of the cover plate. Since the cover plate is provided with a lead groove, the lead groove includes a chip lead groove, a transition groove and a pin lead groove which are connected in sequence.

[0043] The chip lead groove is connected to the chip groove, and the pin lead groove is located on the top surface of the pin. In this way, during casting, the lead wire 21 is processed to achieve the connection between the chip and the pin.

[0044] At the same time, a slider is arranged below the transition groove. After pouring, the slider can be moved to remove the cover plate, so as to facilitate the removal of the formed diode and complete the processing.

[0045] The application also includes a workbench 1 and a pouring device, wherein a groove 2 is provided in the middle of the workbench, and a fixture 3 is provided in the groove;

[0046] The workbench 1 is provided with X-direction tracks 4 at both ends of the groove, and a column 5 is slidably provided in the X-direction track 4. A cross bar 6 is provided between a pair of columns 5. A tin outlet seat 7 movable in the Y direction is provided on the cross bar, and a tin outlet tube 8 is provided on the tin outlet seat 7. The bottom outlet of the tin outlet tube is located above the fixture;

[0047] The pouring device includes a molten tin tank 9 and a molten tin delivery pipe 10. The molten tin tank 9 is arranged on one side of the workbench. The molten tin tank 9 is connected to the molten tin delivery pipe 10 through a delivery pump. The molten tin delivery pipe 10 is connected to the top inlet of the tin tube 8.

[0048] In this way, during work, the frame and pins with the chip are placed in the jig, and the jig is placed in the groove of the workbench. Since a pouring device is provided on the workbench, the tin liquid in the molten tin tank is transported to the tin outlet pipe through the tin liquid delivery pipe by a delivery pump, and pouring is performed through the tin outlet pipe, so that the chip and the pins are connected, which is convenient for processing and reliable for operation.

[0049] In this way, the phenomenon of craters and poor solder joints can be eliminated; the production efficiency can be greatly improved; and special-shaped leads can be designed according to needs to meet the needs of higher current products.

[0050] In application, the bottom plate can be slidably connected in the groove to facilitate movement; at the same time, at least two fixtures can be provided.

[0051] A cavity 15 is provided around the tin outlet tube 8 in the tin outlet seat 7 , and an annular air outlet 16 is provided at the bottom of the cavity. Nitrogen is transported to the cavity through an input hole 17 .

[0052] In this way, the bottom outlet of the tin tube is protected by nitrogen during the pouring process to prevent oxidation. The input hole is connected to an external gas transmission device to perform gas transmission.

[0053] The device also includes a camera 18, which is arranged at the bottom of the tin outlet seat and connected to a controller.

[0054] The camera can be used to observe the working conditions and control the pouring process. The controller is used to control the action of the delivery pump.

[0055] The cover plate 32 is provided with a slide groove, and the slider is slidably connected in the slide groove.

[0056] The slide groove is provided to facilitate reliable sliding of the slider. Figure 8 The middle arrow indicates the direction of slider movement.

[0057] A handle 19 is provided on the outer side of the slide block 14 .

[0058] The handle is provided to facilitate grabbing, thereby driving the slider to move.

[0059] A Z-direction track 20 is disposed on the inner side of the column 5, and the crossbar is lifted and connected between a pair of columns.

[0060] In this way, the crossbar can be easily raised and lowered to adapt to different working conditions.

[0061] The bottom surface of the cover plate is provided with a positioning column, the top surface of the bottom plate is provided with a positioning groove, and the positioning column is adaptively arranged in the positioning groove.

[0062] This makes it easier for the two to be reliably positioned and connected.

[0063] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0064] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0065] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0066] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A diode lead processing jig, characterized in that: Including base plate and cover plate, The top surface of the bottom plate is provided with frame grooves and pin grooves arranged at intervals, wherein the frame grooves are used to place the frame, and the pin grooves are used to place the pins. The cover plate is provided with a chip slot and a lead slot, the chip slot is located on the bottom surface of the cover plate, and the lead slot is located on the top surface of the cover plate; The lead groove includes a chip lead groove, a transition groove and a pin lead groove which are connected in sequence. The chip lead groove is connected to the chip groove, A slider is provided below the transition groove, the slider is slidably connected to the cover plate and is located on the top surface of the frame and the pin; The pin guide groove is located on the top surface of the pin.

2. The diode lead processing jig according to claim 1, characterized in that: The cover plate is provided with a slide groove, and the slider is slidably connected in the slide groove.

3. The diode lead processing jig according to claim 1 or 2, characterized in that: A handle is arranged on the outer side of the sliding block.

4. The diode lead processing jig according to claim 1, characterized in that: The bottom surface of the cover plate is provided with a positioning column, the top surface of the bottom plate is provided with a positioning groove, and the positioning column is adaptively arranged in the positioning groove.

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