SOP16 lead frame and packaging module

Abstract

According to the SOP16 lead frame and the packaging module, a first base island and a second base island which are arranged at intervals are arranged in a base island area of a frame unit, a first pin, a fifth pin, a seventh pin and an eighth pin are sequentially arranged on one side of the base island area at intervals, and a ninth pin, a thirteenth pin and a fifteenth pin are sequentially arranged on the other side of the base island area at intervals; the first pin, the thirteenth pin and the fifteenth pin are connected with the first base island; and the seventh pin is connected with the second base island. The second pin is combined to the first pin to widen the first pin, the fourteenth pin is combined to the thirteenth pin to widen the thirteenth pin, and the sixteenth pin is combined to the fifteenth pin to widen the fifteenth pin. And the third pin, the fourth pin, the tenth pin, the eleventh pin and the twelfth pin are omitted or removed. The packaging module comprises the frame units of the SOP16 lead frame. According to the scheme, a plurality of different chips can be pasted, part of the pins are combined, part of the pins are removed, heat dissipation is improved, and the screeding yield after packaging is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit packaging, in particular to a SOP16 lead frame and a packaging module. Background Art

[0002] Multi-chip module packaging is an important trend in electronic manufacturing inventions. It integrates more different chips into the same package to realize the functions of the module. Compared with discrete devices, modular packaging can reduce related parasitic impedance and greatly reduce the line parasitic inductance between devices, which is conducive to high-frequency operation. SOP16 is a widely used traditional package form that can be mounted. In order to meet the needs of integrating two chips in the SOP16 package form, such as a driver IC and a MOS chip, it is necessary to improve the existing lead frame of this type to adapt to the integration requirements and ensure the heat dissipation effect. Utility Model Content

[0003] In order to solve the above-mentioned deficiencies in the related prior art, the utility model provides a SOP16 lead frame and a packaging module. The base island area of ​​the frame unit is provided with two spaced base islands for mounting different chips, and some pins are merged and some pins are removed to improve the heat dissipation effect and reduce the cumbersomeness of punching ribs after packaging.

[0004] In order to achieve the purpose of this utility model, the following scheme is proposed:

[0005] A SOP16 lead frame is provided with column units arranged in an array along the length direction of a frame body, each column unit has a plurality of frame units, a first base island and a second base island arranged at intervals are provided in a base island region of the frame unit, a first pin, a fifth pin, a seventh pin and an eighth pin are arranged at intervals in sequence on one side of the base island region, and a ninth pin, a thirteenth pin and a fifteenth pin are arranged at intervals in sequence on the other side; the first pin, the thirteenth pin and the fifteenth pin are connected to the first base island; and the seventh pin is connected to the second base island.

[0006] Further, the second pin is merged into the first pin to widen the first pin, the fourteenth pin is merged into the thirteenth pin to widen the thirteenth pin, and the sixteenth pin is merged into the fifteenth pin to widen the fifteenth pin. The third pin, the fourth pin, the tenth pin, the eleventh pin, and the twelfth pin are omitted or removed.

[0007] Furthermore, the first base island is used to set a power chip, and the second base island is used to set a control chip.

[0008] Furthermore, a glue locking hole is provided on the frame unit.

[0009] A packaging module comprises a plastic package and a frame unit of a SOP16 lead frame wrapped in the plastic package, wherein a first pin, a fifth pin, a seventh pin and an eighth pin extend from one side of the plastic package, and a ninth pin, a thirteenth pin and a fifteenth pin extend from the other side of the plastic package.

[0010] Beneficial effects of the utility model:

[0011] The lead frame and packaging module of the present application retain the layout of the SOP16 packaging format, can be set up with multiple chips, and are compatible with existing tooling and fixtures, avoiding excessive equipment investment due to the new frame design. At the same time, the package size and pin position remain unchanged, only some pins are merged or removed, reducing the change in the position of the packaged finished product on the board, and the widened pins can save some welding wires and provide a wider heat dissipation path, which is beneficial to meet the heat dissipation requirements when setting the power chip on the first base island, and the removed pins can save the tediousness of punching ribs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A partial schematic diagram of the overall structure of the frame body of an embodiment of the present application is shown.

[0013] Figure 2 A schematic diagram of the frame unit structure of an embodiment of the present application is shown.

[0014] Figure 3 A schematic diagram of the packaging module structure of an embodiment of the present application is shown. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.

[0016] The embodiment of the present application provides a SOP16 lead frame, which has column units arranged in an array along the length direction of the frame body 1, and each column unit has a plurality of frame units 2, such as Figure 1 As shown, 8 frame units are arranged in each column unit to increase the batch production quantity.

[0017] like Figure 2As shown, the first base island 3 and the second base island 4 are arranged at intervals in the base island area of ​​the frame unit 2. The first base island 3 is used to set the power chip, and the second base island 4 is used to set the control chip. The first pin A1, the fifth pin A5, the sixth pin A6, the seventh pin A7, and the eighth pin A8 are arranged at intervals on one side of the base island area, and the ninth pin A9, the thirteenth pin A13, and the fifteenth pin A15 are arranged at intervals on the other side. Among them, the first pin A1 corresponds to the fifteenth pin A15, and the eighth pin A8 corresponds to the ninth pin A9.

[0018] The first pin A1, the thirteenth pin A13 and the fifteenth pin A15 are connected to the first base island 3, and the seventh pin A7 is connected to the second base island 4. The fifth pin A5, the sixth pin A6, the eighth pin A8 and the ninth pin A9 are independent of each other.

[0019] like Figure 2 and Figure 3 , the fifth pin A5, the sixth pin A6, the seventh pin A7, and the eighth pin A8 can adopt the conventional pin width. The second pin corresponding to the SOP16 package is merged into the first pin A1 to widen the first pin A1, the fourteenth pin is merged into the thirteenth pin A13 to widen the thirteenth pin A13, and the sixteenth pin is merged into the fifteenth pin A15 to widen the fifteenth pin A15. Preferably, the width can be extended to more than twice the conventional pin width, expanding the heat dissipation path and improving the heat dissipation effect of the first base island 3, so as to facilitate the setting of the power chip on the first base island 3 and meet its heat dissipation requirements.

[0020] In order to improve the electrical performance of the package, unnecessary pins are removed. In this example, Figure 2 and Figure 3 The sixteenth pin corresponding to the SOP16 package is merged into the fifteenth pin A15 to widen the fifteenth pin A15. The third pin, the fourth pin, the tenth pin, the eleventh pin, and the twelfth pin are omitted or removed, thereby reducing the tediousness of cutting the ribs after subsequent packaging.

[0021] In order to improve the packaging stability, a glue locking hole 5 is provided on the frame unit 2. Figure 2 As described above, the glue locking hole 5 can be set on the pin or the base island, which enhances the bonding force between the plastic encapsulation material and the base island or the pin, reduces the risk of delamination, and provides a channel for the plastic encapsulation material to flow up and down, reducing the risk of plastic encapsulation backpacking caused by inconsistent up and down flow rates.

[0022] The present application embodiment also provides a packaging module, such as Figure 3As shown, it includes a plastic package 6 and the SOP16 lead frame described in the previous embodiment, the frame unit 2 of the SOP16 lead frame is wrapped in the plastic package 6, the first pin A1, the fifth pin A5, the sixth pin A6, the seventh pin A7, and the eighth pin A8 extend from one side of the plastic package 6, and the ninth pin A9, the thirteenth pin A13, and the fifteenth pin A15 extend from the other side of the plastic package 6.

[0023] The lead frame and packaging module of this example retain the layout of the SOP16 packaging format and are compatible with existing tooling and fixtures, avoiding excessive equipment investment due to a completely new frame design. At the same time, the package size and pin position remain unchanged, and only some pins are merged or removed to reduce changes in the position of the finished package on the board.

[0024] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.

Claims

1. A SOP16 lead frame, wherein column units are arranged in an array along the length direction of a frame body (1), each column unit having a plurality of frame units (2), characterized in that: A first base island (3) and a second base island (4) are arranged at intervals in the base island region of the frame unit (2). A first pin (A1), a fifth pin (A5), a sixth pin (A6), a seventh pin (A7), and an eighth pin (A8) are sequentially arranged on one side of the base island area, and a ninth pin (A9), a thirteenth pin (A13), and a fifteenth pin (A15) are sequentially arranged on the other side; The first pin (A1), the thirteenth pin (A13), and the fifteenth pin (A15) are connected to the first base island (3); The seventh pin (A7) is connected to the second base island (4).

2. The SOP16 lead frame according to claim 1, characterized in that: The second pin is merged into the first pin (A1) to widen the first pin (A1), the fourteenth pin is merged into the thirteenth pin (A13) to widen the thirteenth pin (A13), and the sixteenth pin is merged into the fifteenth pin (A15) to widen the fifteenth pin (A15).

3. The SOP16 lead frame according to claim 1, characterized in that: The third pin, the fourth pin, the tenth pin, the eleventh pin, and the twelfth pin are omitted or removed.

4. The SOP16 lead frame according to claim 1, characterized in that: The first base island (3) is used to arrange a power chip, and the second base island (4) is used to arrange a control chip.

5. The SOP16 lead frame according to claim 1, characterized in that: The frame unit (2) is provided with a glue locking hole (5).

6. A packaging module, characterized in that: A frame unit (2) comprising a plastic package (6) and a SOP16 lead frame as claimed in any one of claims 1 to 5 wrapped in the plastic package (6), wherein a first pin (A1), a fifth pin (A5), a sixth pin (A6), a seventh pin (A7), and an eighth pin (A8) extend from one side of the plastic package (6), and a ninth pin (A9), a thirteenth pin (A13), and a fifteenth pin (A15) extend from the other side of the plastic package (6).

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