Efficient cutting device for semiconductor materials

Abstract

The utility model relates to the technical field of semiconductor material processing, and discloses an efficient cutting device for semiconductor materials, which comprises a front support frame, the front support frame is fixedly connected with a first motor, the output end of the first motor is fixedly connected with a first driving chain wheel, the first driving chain wheel is connected with a first driven chain wheel through a chain, and the first driven chain wheel is connected with a second driven chain wheel through a chain. The first driven chain wheel is fixedly connected with an incomplete gear, the incomplete gear is meshed with a conveying driving gear, the incomplete gear is meshed with a first clamping gear, the incomplete gear is meshed with a second clamping gear, and the incomplete gear is meshed with a lifting driving gear. According to the utility model, the three procedures of conveying, fixing and cutting the semiconductor material are carried out in sequence, additional labor and devices are not needed, the labor and equipment cost of production is reduced, high-efficiency cutting is realized, and the wire guide wheel is adopted to drive the steel wire to move at a high speed for cutting, so that the damage to the cutting surface of the semiconductor material during cutting is smaller.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor material processing, in particular to a high-efficiency cutting device for semiconductor materials. Background Art

[0002] Semiconductor materials are the core components of electronic devices. In addition, semiconductor materials also play a key role in various fields such as information technology, medical care, energy, and transportation. Therefore, the production efficiency of semiconductor materials has an important impact on all walks of life, and the cutting of semiconductor materials is an important part of the semiconductor production and manufacturing process.

[0003] However, traditional semiconductor material cutting devices often require manual or other devices to transport and fix the semiconductor materials before cutting. The operation is cumbersome, costly, and inefficient, and it is difficult to meet the production efficiency required by the market. Therefore, the market needs an efficient cutting device for semiconductor materials. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a high-efficiency cutting device for semiconductor materials.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an efficient cutting device for semiconductor materials, comprising a front support frame, the front support frame is fixedly connected to a motor 1, the output end of the motor 1 is fixedly connected to a driving sprocket 1, the driving sprocket 1 is connected to a driven sprocket 1 through a chain, the driven sprocket 1 is fixedly connected to an incomplete gear, the incomplete gear is meshed with a conveying drive gear, the incomplete gear is meshed with a clamping gear 1, the incomplete gear is meshed with a clamping gear 2, the incomplete gear is meshed with a lifting drive gear, and the conveying drive gear is fixedly connected to a roller through a shaft. Drum one, the drum one is connected to drum two through a belt, the drum two is rotatably connected to the rear support frame through an axis, the lifting drive gear is fixedly connected to a rotating disk, the rotating disk is fixedly connected to a driving slider, the driving slider is slidably connected to a T-shaped rod, the T-shaped rod is fixedly connected to a cutting plate, the cutting plate is fixedly connected to a motor two, the output end of the motor two is fixedly connected to a driving sprocket three, the driving sprocket three is connected to a driven sprocket three through a chain, the driven sprocket three is fixedly connected to a wire driving gear, the wire driving gear is meshed with a transmission gear one, and the wire driving gear is fixedly connected to a wire wheel.

[0006] As a further description of the above technical solution:

[0007] The clamping gear 1 is fixedly connected to the driving sprocket 2, the driving sprocket 2 is connected to the driven sprocket 2 through a chain, the driven sprocket 2 is fixedly connected to the clamping gear 3, and the clamping gear 3 is meshed with the clamping gear 2.

[0008] As a further description of the above technical solution:

[0009] The driven sprocket 1, the incomplete gear, the conveying drive gear, the clamping gear 1, the clamping gear 2, the lifting drive gear, the driving sprocket 2, the driven sprocket 2, the clamping gear 3 and the rotating disk are all rotatably connected to the front support frame, and the driven sprocket 3, the wire driving gear, the transmission gear 1 and the wire wheel are all rotatably connected to the cutting plate.

[0010] As a further description of the above technical solution:

[0011] The clamping gear 2 is fixedly connected with a rotating shaft 1, and the rotating shaft 1 is rotatably connected with the front support frame. The rotating shaft 1 is provided with two opposite sections of threads, and the rotating shaft 1 is threadedly connected with a clamping plate, and the clamping plate is slidably connected with the limit shaft through a slide groove, and the limit shaft is fixedly connected with the front support frame.

[0012] As a further description of the above technical solution:

[0013] The wire driving gears are provided with two and meshed with two sides of the transmission gear respectively. The wire wheels are provided with two and fixedly connected with the wire driving gear respectively. The wire wheels are provided with steel wires.

[0014] As a further description of the above technical solution:

[0015] The front support frame is provided with a slide groove, and the cutting plate is slidably connected to the front support frame through the slide groove; one end of the T-shaped rod is provided with a slide groove, and the T-shaped rod is slidably connected to the driving slider through the slide groove.

[0016] As a further description of the above technical solution:

[0017] The tooth groove of the incomplete gear is only a quarter of a circle, and the conveying drive gear, the clamping gear 1, the clamping gear 2 and the lifting drive gear are respectively located in four right-angle directions of the incomplete gear.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the front support frame is fixedly connected to motor 1, the output end of motor 1 is fixedly connected to driving sprocket 1, driving sprocket 1 is connected to driven sprocket 1 through a chain, driven sprocket 1 is fixedly connected to an incomplete gear, the incomplete gear meshes with the conveying drive gear, the incomplete gear meshes with clamping gear 1, the incomplete gear meshes with clamping gear 2, the incomplete gear meshes with the lifting drive gear, the clamping gear 2 is fixedly connected to a rotating shaft 1, the rotating shaft 1 is rotatably connected to the front support frame, the rotating shaft 1 is provided with two opposite sections of threads, the rotating shaft 1 is threadedly connected to the clamping plate, the clamping plate is slidably connected to the limit shaft through a slide groove, and the limit shaft is fixedly connected to the front support frame, thereby realizing the three processes of conveying, fixing and cutting of semiconductor materials in sequence, no longer requiring additional labor and devices, reducing the labor and equipment costs of production, and achieving efficient cutting.

[0020] 2. In the utility model, the cutting plate is fixedly connected to the motor 2, the output end of the motor 2 is fixedly connected to the driving sprocket 3, the driving sprocket 3 is connected to the driven sprocket 3 through a chain, the driven sprocket 3 is fixedly connected to the wire driving gear, the wire driving gear meshes with the transmission gear 1, the wire driving gear is fixedly connected to the wire wheel, two wire driving gears are provided and mesh with the two sides of the transmission gear 1 respectively, two wire wheels are provided and fixedly connected with the wire driving gear respectively, a steel wire is provided on the wire wheel, and the wire wheel is used to drive the steel wire to move at a high speed for cutting, so that the cutting surface of the semiconductor material is less damaged during cutting, thereby improving the cutting quality of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the three-dimensional structure of a high-efficiency cutting device for semiconductor materials proposed in the utility model Figure 1 ;

[0022] Figure 2 A schematic diagram of the three-dimensional structure of a high-efficiency cutting device for semiconductor materials proposed in the utility model Figure 2 ;

[0023] Figure 3 A schematic diagram of the local structure of a highly efficient cutting device for semiconductor materials proposed in the utility model Figure 1 ;

[0024] Figure 4 A schematic diagram of the local structure of a highly efficient cutting device for semiconductor materials proposed in the utility model Figure 2 .

[0025] Legend:

[0026] 1. Front support frame; 2. Motor 1; 3. Driving sprocket 1; 4. Driven sprocket 1; 5. Incomplete gear; 6. Conveying drive gear; 7. Clamping gear 1; 8. Clamping gear 2; 9. Lifting drive gear; 10. Driving sprocket 2; 11. Driven sprocket 2; 12. Clamping gear 3; 13. Roller 1; 14. Roller 2; 15. Rear support frame; 16. Rotating disk; 17. Driving slider; 18. T-bar; 19. Cutting plate; 20. Motor 2; 21. Driving sprocket 3; 22. Driven sprocket 3; 23. Wire drive gear; 24. Transmission gear 1; 25. Wire wheel; 26. Steel wire; 27. Rotating shaft 1; 28. Clamping plate; 29. ​​Limiting shaft. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-Figure 4 , an embodiment provided by the utility model: an efficient cutting device for semiconductor materials, comprising a front support frame 1, the front support frame 1 is fixedly connected to a motor 2, the output end of the motor 2 is fixedly connected to a driving sprocket 3, the driving sprocket 3 is connected to a driven sprocket 4 through a chain, the driven sprocket 4 is fixedly connected to an incomplete gear 5, the incomplete gear 5 is meshed with a conveying drive gear 6, the incomplete gear 5 is meshed with a clamping gear 7, the incomplete gear 5 is meshed with a clamping gear 8, the incomplete gear 5 is meshed with a lifting drive gear 9, the conveying drive gear 6 is fixedly connected to a roller 13 through an axis, the roller 13 is connected to a roller 2 14 through a belt, the roller 2 14 is rotatably connected to a rear support frame 15 through an axis, and the lifting drive gear 9 is fixedly connected with a rotating disk 16, the rotating disk 16 is fixedly connected with a driving slider 17, the driving slider 17 is slidably connected with a T-bar 18, the T-bar 18 is fixedly connected with a cutting plate 19, the cutting plate 19 is fixedly connected with a motor 20, the output end of the motor 20 is fixedly connected with a driving sprocket 3 21, the driving sprocket 3 21 is connected with a driven sprocket 3 22 through a chain, the driven sprocket 3 22 is fixedly connected with a wire driving gear 23, the wire driving gear 23 is meshed with a transmission gear 1 24, and the wire driving gear 23 is fixedly connected with a wire wheel 25, thereby realizing the three processes of conveying, fixing and cutting of semiconductor materials in sequence, no longer requiring additional labor and equipment, reducing the labor and equipment costs of production, and realizing efficient cutting.

[0029] The clamping gear 17 is fixedly connected with the driving sprocket 2 10, the driving sprocket 2 10 is connected with the driven sprocket 2 11 through a chain, the driven sprocket 2 11 is fixedly connected with the clamping gear 3 12, the clamping gear 3 12 is meshed with the clamping gear 2 8, the driven sprocket 1 4, the incomplete gear 5, the conveying drive gear 6, the clamping gear 1 7, the clamping gear 2 8, the lifting drive gear 9, the driving sprocket 2 10, the driven sprocket 2 11, the clamping gear 3 12 and the rotating disk 16 are all rotatably connected with the front support frame 1, the driven sprocket 3 22, the wire drive gear 23, the transmission gear 1 24 and the wire wheel 25 are all rotatably connected with the cutting plate 19, the clamping gear 2 8 is fixedly connected with the rotating shaft 1 27, the rotating shaft 1 27 is rotatably connected with the front support frame 1, the rotating shaft 1 27 is provided with two opposite threads, the rotating shaft 1 27 is threadedly connected with the clamping plate 28, and the clamping plate 28 is connected with the front support frame 1 through the rotating shaft 1 27. The slide groove is slidably connected with the limit shaft 29, and the limit shaft 29 is fixedly connected with the front support frame 1. Two wire driving gears 23 are provided and mesh with the two sides of the transmission gear 1 24 respectively. Two wire wheels 25 are provided and fixedly connected with the wire driving gear 23 respectively. A steel wire 26 is arranged on the wire wheel 25. The front support frame 1 is provided with a slide groove. The cutting plate 19 is slidably connected with the front support frame 1 through the slide groove. A slide groove is provided at one end of the T-shaped rod 18. The T-shaped rod 18 is slidably connected with the driving slider 17 through the slide groove. The tooth groove of the incomplete gear 5 is only a quarter of a circle. The conveying drive gear 6, the clamping gear 1 7, the clamping gear 2 8 and the lifting drive gear 9 are respectively located at four right angles to the incomplete gear 5. The wire wheel 25 is used to drive the steel wire 26 to move at high speed for cutting, so that the cutting surface of the semiconductor material is less damaged during cutting, thereby improving the cutting quality of the semiconductor.

[0030] Working principle: First, start the motor 20, the motor 20 drives the driving sprocket 3 21 to rotate, the driving sprocket 3 21 drives the driven sprocket 3 22 to rotate, the driven sprocket 3 22 drives the wire driving gear 23 to rotate, the wire driving gear 23 drives the transmission gear 1 24 to rotate, the transmission gear 1 24 drives another wire driving gear 23 to rotate, the wire driving gear 23 drives the wire wheel 25 to rotate, the wire wheel 25 drives the steel wire 26 to move at high speed, then, start the motor 12, the motor 12 drives the driving sprocket 13 to rotate, the driving sprocket 13 drives the driven sprocket 14 to rotate, the driven sprocket 14 drives the incomplete gear 5 to rotate, the incomplete gear 5 drives The conveying drive gear 6 rotates, the conveying drive gear 6 drives the roller 13 to rotate through the shaft, and the roller 13 drives the belt to move, so as to transport the semiconductor material to a suitable position, and then the tooth groove of the incomplete gear 5 disengages from the conveying drive gear 6, the incomplete gear 5 contacts the clamping gear 17, the incomplete gear 5 drives the clamping gear 17 to rotate, the clamping gear 17 drives the active sprocket 2 10 to rotate, the active sprocket 2 10 drives the driven sprocket 2 11 to rotate, the driven sprocket 2 11 drives the clamping gear 3 12 to rotate, the clamping gear 3 12 drives the clamping gear 2 8 to rotate, the clamping gear 2 8 drives the rotating shaft 1 27 to rotate, and the rotating shaft 1 27 drives the clamping plate 28 moves toward the middle along the limit shaft 29, thereby clamping the semiconductor material, and then the tooth groove of the incomplete gear 5 is disengaged from the clamping gear 7, the incomplete gear 5 is in contact with the lifting drive gear 9, the incomplete gear 5 drives the lifting drive gear 9 to rotate, the lifting drive gear 9 drives the rotating disk 16 to rotate, the rotating disk 16 drives the driving slider 17 to rotate, the driving slider 17 pushes the T-shaped rod 18 to move up and down, the T-shaped rod 18 drives the cutting plate 19 to move up and down along the slide groove on the front support frame 1, the steel wire 26 moves with the cutting plate 19 to cut the semiconductor material, and then the tooth groove of the incomplete gear 5 is disengaged from the lifting drive gear 9, the incomplete gear 5 contacts with the clamping gear 2 8, the incomplete gear 5 drives the clamping gear 2 8 to rotate, and the rotation direction of the clamping gear 2 8 at this time is opposite to that before, the clamping gear 2 8 drives the rotating shaft 1 27 to rotate in the opposite direction, and the rotating shaft 1 27 drives the clamping plate 28 to move to both sides along the limiting shaft 29, thereby loosening the semiconductor material, and finally, the tooth groove of the incomplete gear 5 is disengaged from the clamping gear 2 8, the incomplete gear 5 is released from the conveying drive gear 6, and the conveying drive gear 6 rotates through the shaft to drive the roller 13 to rotate, and the roller 13 drives the belt to move, and the belt transports the semiconductor material to the specified position to continue to start the next round of cutting, thereby realizing efficient cutting of the semiconductor material.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An efficient cutting device for semiconductor materials, comprising a front support frame (1), characterized in that: The front support frame (1) is fixedly connected to a motor 1 (2); the output end of the motor 1 (2) is fixedly connected to a driving sprocket 1 (3); the driving sprocket 1 (3) is connected to a driven sprocket 1 (4) via a chain; the driven sprocket 1 (4) is fixedly connected to an incomplete gear (5); the incomplete gear (5) is meshed with a conveying drive gear (6); the incomplete gear (5) is meshed with a clamping gear 1 (7); the incomplete gear (5) is meshed with a clamping gear 2 (8); the incomplete gear (5) is meshed with a lifting drive gear (9); the conveying drive gear (6) is fixedly connected to a roller 1 (13) via a shaft; the roller 1 (13) is connected to a roller 2 (14) via a belt; the roller 2 (14) is rotatably connected to a conveying drive gear (6) via a shaft. The rear support frame (15) is fixedly connected to the lifting drive gear (9) with a rotating disk (16), the rotating disk (16) is fixedly connected to a driving slider (17), the driving slider (17) is slidably connected to a T-shaped rod (18), the T-shaped rod (18) is fixedly connected to a cutting plate (19), the cutting plate (19) is fixedly connected to a motor 2 (20), the output end of the motor 2 (20) is fixedly connected to a driving sprocket 3 (21), the driving sprocket 3 (21) is connected to a driven sprocket 3 (22) through a chain, the driven sprocket 3 (22) is fixedly connected to a wire driving gear (23), the wire driving gear (23) is meshed with a transmission gear 1 (24), and the wire driving gear (23) is fixedly connected to a wire wheel (25).

2. The high-efficiency cutting device for semiconductor materials according to claim 1, characterized in that: The clamping gear one (7) is fixedly connected to the driving sprocket two (10), the driving sprocket two (10) is connected to the driven sprocket two (11) through a chain, the driven sprocket two (11) is fixedly connected to the clamping gear three (12), and the clamping gear three (12) is meshed with the clamping gear two (8).

3. The high-efficiency cutting device for semiconductor materials according to claim 2, characterized in that: The driven sprocket wheel 1 (4), the incomplete gear (5), the conveying drive gear (6), the clamping gear 1 (7), the clamping gear 2 (8), the lifting drive gear (9), the driving sprocket wheel 2 (10), the driven sprocket wheel 2 (11), the clamping gear 3 (12) and the rotating disk (16) are all rotatably connected to the front support frame (1), and the driven sprocket wheel 3 (22), the wire driving gear (23), the transmission gear 1 (24) and the wire wheel (25) are all rotatably connected to the cutting plate (19).

4. The high-efficiency cutting device for semiconductor materials according to claim 2, characterized in that: The clamping gear 2 (8) is fixedly connected to a rotating shaft 1 (27), and the rotating shaft 1 (27) is rotatably connected to the front support frame (1). The rotating shaft 1 (27) is provided with two opposite sections of threads. The rotating shaft 1 (27) is threadedly connected to a clamping plate (28), and the clamping plate (28) is slidably connected to a limiting shaft (29) through a sliding groove, and the limiting shaft (29) is fixedly connected to the front support frame (1).

5. The high-efficiency cutting device for semiconductor materials according to claim 1, characterized in that: The wire driving gears (23) are provided with two and are respectively meshed with the two sides of the transmission gear (24); the wire wheels (25) are provided with two and are respectively fixedly connected with the wire driving gears (23); and the wire wheels (25) are provided with steel wires (26).

6. The high-efficiency cutting device for semiconductor materials according to claim 1, characterized in that: The front support frame (1) is provided with a slide groove, the cutting plate (19) is slidably connected to the front support frame (1) via the slide groove, one end of the T-shaped rod (18) is provided with a slide groove, and the T-shaped rod (18) is slidably connected to the driving slider (17) via the slide groove.

7. The high-efficiency cutting device for semiconductor materials according to claim 1, characterized in that: The tooth groove of the incomplete gear (5) is only a quarter of a circle, and the conveying drive gear (6), the clamping gear 1 (7), the clamping gear 2 (8) and the lifting drive gear (9) are respectively located in four right-angle directions of the incomplete gear (5).

Images