Expansion seat with heat dissipation piece
By installing a heat dissipation component between the expansion device and the mobile device, the problem of excessive temperature caused by heat accumulation is solved, thereby achieving device stability and extending lifespan.
Patent Information
- Application Number
- CN202421068886.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-16
AI Technical Summary
Existing expansion and mobile devices are prone to overheating due to heat buildup during prolonged use, which affects user experience and device lifespan.
Design an expansion dock with a heat sink. By placing a heat sink between the expansion device and the mobile device, the temperature is reduced by using a cooling fan or semiconductor heat sink, and the power is drawn from the expansion device by a control circuit board to achieve autonomous heat dissipation.
It effectively reduces the temperature between the expansion device and the mobile device, improving the stability and lifespan of the device.
Smart Images

Figure CN222320586U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of expansion equipment, in particular to an expansion seat with a heat dissipation element. Background Art
[0002] Existing mobile devices such as handheld game consoles and tablets often require expansion devices (such as power adapters, network cables, mice, external keyboards, printers, and external displays) for function expansion due to their own functional or configuration defects. The expansion devices are connected to the mobile devices via data cables, but their structures have low stability, are prone to shaking, and cannot fix or place the mobile devices.
[0003] There is an existing expansion seat that can fix the mobile device and the expansion device on the expansion seat, which greatly improves convenience and stability. However, when this type of design is used for a long time, the heat of the expansion device and the mobile device will accumulate between the two, causing the temperature of the contact part between the two to be too high, affecting the user experience and the service life of the two devices. Utility Model Content
[0004] The purpose of the utility model is to provide an expansion seat with a heat sink in view of the defects and shortcomings of the prior art, which has the advantage of effectively reducing the heat accumulation between the mobile device and the expansion device and lowering the temperature between the two by setting a heat sink between the two.
[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: an expansion seat with a heat sink, characterized in that the expansion seat includes: a plug-in portion, the plug-in portion is for detachable assembly of the expansion device; a placement portion, the placement portion is for tilting or vertically placing the mobile device, and the mobile device is coupled to the expansion device; a heat sink, the heat sink is arranged between the expansion device and the mobile device, and the heat sink is coupled to the expansion seat or the mobile device.
[0006] Preferably, a mounting structure is provided on the heat sink or the expansion device, and the mounting structure is used for the heat sink to be mounted on the expansion device, and the heat dissipation surface of the heat sink faces the mobile device.
[0007] Preferably, the heat sink is a heat dissipation fan, and the heat dissipation fan is provided with an air outlet and an air inlet, the air outlet is close to the mobile device, and the air inlet is close to the expansion device.
[0008] Preferably, the mounting structure is a mounting groove provided on the heat sink, and an embedding portion provided on the expansion device, wherein the embedding portion is embedded in the mounting groove so as to position the heat sink on the expansion device.
[0009] Preferably, the mounting groove is arranged on a side of the heat sink away from the heat dissipation surface; a placement surface is arranged on the expansion seat, the placement surface is for the bottom of the heat sink to abut, and the embedding portion is embedded in the mounting groove.
[0010] Preferably, the placement portion is a placement groove provided on the expansion seat, the first surface of the placement groove is for the back of the mobile device to abut against, and the second surface of the placement groove is for the bottom of the mobile device to abut against.
[0011] Preferably, when the mounting groove is embedded in the embedding portion and the bottom of the heat sink abuts against the placement surface, the first surface of the placement groove is coplanar with the heat dissipation surface of the heat sink.
[0012] Preferably, the edge of the mounting groove is provided with a bevel.
[0013] Preferably, a socket is provided on the placement surface, and the socket is used for coupling the heat dissipation element with the expansion seat.
[0014] Preferably, the expansion device is a docking station, a mobile power supply or a mobile hard disk.
[0015] After adopting the above technical scheme, the beneficial effects of the utility model are as follows: by arranging a plug-in part on the expansion seat, the plug-in part is for the expansion device to be plugged in, and a placement part is arranged on the expansion seat, the placement part is for the mobile device to be placed, and the expansion device is coupled with the mobile device to realize the function expansion of the mobile device; at the same time, a heat sink is arranged between the expansion device and the mobile device, the heat sink can effectively reduce the temperature between the mobile device and the expansion device, and the heat sink can draw power from the mobile device or the expansion seat. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0017] Figure 1 It is a structural schematic diagram of the utility model;
[0018] Figure 2 It corresponds to Figure 1 of the explosion.
[0019] Explanation of the reference numerals: 1. expansion seat; 11. plug-in portion; 12. connector; 13. placement portion; 14. limit plate; 15. socket; 2. expansion device; 21. plug-in wire; 22. embedded portion; 3. heat sink; 31. cooling fan; 32. mounting slot; 321. inclined surface; 33. button. DETAILED DESCRIPTION
[0020] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0021] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.
[0022] This embodiment relates to an expansion base 1 with a cooling fan 31, such as Figure 1 As shown, the bottom of the expansion seat 1 can be placed on a supporting surface, which can be a desktop, the ground or other surfaces. At least one plug-in portion 11 for assembling the expansion device 2 is provided on the upper portion of the expansion seat 1. After the expansion device 2 is assembled on the plug-in portion 11, it can be fixed on the expansion seat 1. A placement portion 13 is also provided on the expansion seat 1. The placement portion 13 can be used for tilting or vertically placing the mobile device. The mobile device can be a handheld game console, a tablet or a mobile phone, etc. The mobile device is coupled to at least one expansion device 2 to achieve functional expansion of the mobile device.
[0023] In this embodiment, the plug-in portion 11 is a plug-in slot, and the plug-in slot allows the expansion device 2 to be detachably plugged into the plug-in slot, so that the expansion device 2 can be detached to achieve replacement of expansion devices 2 with different functions or models. The plug-in portion 11 is provided with a connector 12 for coupling the expansion device 2. The connector 12 can be a connector 12 of different models, such as a Micro USB connector 12 or a Lighting connector 12, etc., to adapt to expansion devices 2 of different models, and can also be an HDMI connector 12 or a headphone connector 12, etc., to adapt to expansion devices 2 with different functions. In this embodiment, the connectors 12 are all TYPE-C connectors.
[0024] In other embodiments, the plug-in portion 11 may be a magnetic portion, and the expansion device 2 may be detachably assembled on the expansion seat 1 by magnetically engaging with a magnetic block disposed on the expansion seat 1 and a magnetic block disposed on the expansion device 2 .
[0025] like Figure 2 As shown, a heat sink 3 is provided between the expansion device 2 and the mobile device. The heat sink 3 is coupled to the expansion seat 1 or the mobile device, and can also be coupled to the expansion device 2, so that the heat sink 3 can draw power from the expansion device 2 or the mobile device. The heat sink 3 can dissipate heat for the expansion device 2 installed on the plug-in portion 11, thereby reducing the temperature between the heat sink 3 and the expansion device 2.
[0026] In this embodiment, the heat sink 3 is specifically on the expansion seat 1. A control circuit board is provided in the expansion seat 1. The control circuit board is coupled with the connector 12, so that it can draw power from the expansion device 2 plugged into the expansion seat 1. Therefore, when the expansion device 2 is a power module, the heat sink 3 does not need to be powered by a mobile device or an external power supply. It only needs to transmit the current from the control circuit board to the heat sink 3 through the power module, and the power module can be coupled with the mobile module to realize charging of the mobile device. At the same time, the mobile device can also adjust the wind speed or switch state of the heat sink 3 through the indirect electrically connected control circuit board. The expansion device 2 can also be an expansion dock. The expansion dock is provided with multiple interfaces that can expand the connection of the mobile device. Specifically, a plug wire 21 is provided on the expansion device 2 so that the expansion device 2 can be coupled with the mobile device.
[0027] In other embodiments, the expansion seat 1 is equipped with a rechargeable battery, and the rechargeable battery is coupled to the control circuit board. A socket 15 is provided on the expansion seat 1, and the socket 15 can be used by an external power source to charge the rechargeable battery in the expansion device 2. Similarly, the expansion seat 1 can also power the expansion device 2 and the heat sink 3 through the connector 12 and the socket 15, or charge mobile devices, and can also charge other electronic devices that need to be charged, such as an electric toothbrush and a wireless mouse.
[0028] Specifically, a mounting structure is provided on the heat sink 3 or the expansion device 2. The mounting structure allows the heat sink 3 to be installed on the expansion device 2, and the heat dissipation surface of the heat sink 3 faces the mobile device, so that the heat sink 3 can better dissipate heat for the mobile device. Specifically, the heat sink 3 is a cooling fan 31. A button 33 is provided on the cooling fan 31. The button 33 can control the opening or closing of the cooling fan 31, and can also control the gear size of the cooling fan 31. The cooling fan 31 is provided with an air outlet and an air inlet, wherein the air outlet is provided close to the mobile device so that airflow blows toward the mobile device, and the air inlet is close to the expansion device 2. The airflow of the air inlet can also dissipate heat for the expansion device 2, but its heat dissipation effect is lower than that of the air outlet. In other embodiments, the heat dissipation structure is a semiconductor radiator.
[0029] It should be noted that the mounting structure is a mounting groove 32 provided on the heat sink 3 and an embedding portion 22 provided on the expansion device 2. The embedding portion 22 is embedded in the mounting groove 32 so that the heat sink 3 is positioned on the expansion device 2 to achieve the installation and fixation of the expansion device 2. Specifically, after the embedding portion 22 is embedded in the mounting groove 32, the embedding portion 22 is loosely matched with the mounting groove 32, thereby reducing the shaking of the heat sink 3.
[0030] In other embodiments, the mounting structure is a magnetic attraction structure, in which magnets and magnetic parts are arranged between the heat sink 3 and the expansion device 2, or magnets and magnetic parts are arranged between the heat sink 3 and the mobile device; the mounting structure can also be Velcro.
[0031] In this embodiment, the mounting groove 32 is arranged on a side of the heat sink 3 away from the heat dissipation surface, and a placement surface is arranged on the expansion seat 1, the placement surface is for the bottom of the heat sink 3 to abut, the embedding portion 22 is embedded in the mounting groove 32, and the placement portion 13 cooperates with the embedding surface to fix the heat sink 3 more firmly. Specifically, the embedding portion 22 is one of the surfaces of the expansion device 2 close to the heat sink 3, and the expansion device 2 is arranged in a rectangular parallelepiped shape. The bottom of the mounting groove 32 fits the above-mentioned surface of the expansion device 2, and the groove wall of the mounting groove 32 fits the surface of the expansion device 2 adjacent to the above-mentioned surface. Specifically, the mounting groove 32 is opened in a rectangular parallelepiped shape to adapt to the width and height of the expansion device 2. The mounting groove 32 connects the two opposite side surfaces on the heat sink 3, so as to adapt to expansion devices 2 of different lengths.
[0032] Preferably, the placement portion 13 is a placement slot provided on the expansion seat 1, and the placement slot connects two opposite side surfaces of the expansion seat 1, so that even a mobile device whose width exceeds the placement slot width can be placed on the expansion seat 1, thereby improving the adaptability of the expansion seat 1 to mobile devices of different widths. In other embodiments, the placement slot connects two adjacent side surfaces.
[0033] It should be noted that the placement groove includes a first surface and a second surface, the first surface is for the back of the mobile device to rest against, and the second surface is for the bottom of the mobile device to abut against, so that the mobile device can be placed on the expansion seat 1 at an angle or vertically. Specifically, in this embodiment, the first surface is inclined relative to the supporting surface, so that the back of the mobile device can be inclined to fit the first surface. At this time, the bottom of the mobile device tilts forward and presses against the second surface, so that the mobile device can be placed on the expansion seat 1 at an angle.
[0034] Preferably, a limit plate 14 is protruded on the second surface of the placement groove, and the limit plate 14 is arranged toward the first surface. The limit plate 14 cooperates with the placement groove so that a part of the bottom of the mobile device abuts against the placement groove, and the other part abuts against the limit plate 14, so as to improve the stability of the mobile device after placement.
[0035] It should be added that when the mounting groove 32 is embedded in the embedding portion 22 and the bottom of the heat sink 3 is in contact with the placement surface, the first surface of the placement groove is coplanar with the heat dissipation surface of the heat sink 3. At this time, the heat sink 3 and the first surface of the placement groove can be fitted with the back of the mobile device to prevent the back of the mobile device higher than the first surface of the placement groove from being suspended without backing, thereby improving the stability of the mobile device after placement. In this embodiment, the edge of the mounting groove 32 is provided with a bevel 321, and the bevel 321 facilitates the embedding portion 22 to be embedded in the mounting groove 32. The socket 15 is provided on the placement surface so that the power plug on the heat sink 3 can be inserted.
[0036] The above is only used to illustrate the technical solution of the utility model rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the utility model by ordinary technicians in this field should be included in the scope of the claims of the utility model as long as they do not depart from the spirit and scope of the technical solution of the utility model.
Claims
1. An expansion seat with a heat sink, characterized in that: The expansion seat includes: A plug-in portion, the plug-in portion is used for detachable assembly of the expansion device and for coupling the expansion device with the expansion seat; A placement portion, the placement portion is for the mobile device to be placed obliquely or vertically, and the mobile device is coupled to the expansion device; A heat sink is disposed between the expansion device and the mobile device, the heat sink is coupled to the expansion seat or the mobile device, and the expansion seat draws power from the expansion device or its own built-in power supply.
2. The expansion seat with heat dissipation element according to claim 1, characterized in that: The heat sink and / or the expansion device is provided with a mounting structure, and the mounting structure is used for the heat sink to be mounted on the expansion device, and the heat dissipation surface of the heat sink faces the mobile device.
3. The expansion seat with heat dissipation element according to claim 2, characterized in that: The heat sink is a heat dissipation fan, and the heat dissipation fan is provided with an air outlet and an air inlet, the air outlet is close to the mobile device, and the air inlet is close to the expansion device.
4. The expansion seat with heat dissipation element according to claim 2, characterized in that: The mounting structure is a mounting groove formed on the heat sink and an embedding portion provided on the expansion device. The embedding portion is embedded in the mounting groove so that the heat sink is positioned on the expansion device.
5. The expansion seat with heat dissipation element according to claim 4, characterized in that: The mounting groove is arranged on a side of the heat sink away from the heat dissipation surface; The expansion seat is provided with a placement surface, the placement surface is for the bottom of the heat sink to abut against, and the embedding portion is embedded in the installation groove.
6. The expansion seat with heat dissipation element according to claim 5, characterized in that: The placement portion is a placement groove provided on the expansion seat, wherein the back of the mobile device is abutted against a first surface of the placement groove, and the bottom of the mobile device is abutted against a second surface of the placement groove.
7. The expansion seat with heat dissipation element according to claim 6, characterized in that: When the installation groove is embedded in the embedding portion and the bottom of the heat sink abuts against the placement surface, the first surface of the placement groove is coplanar with the heat dissipation surface of the heat sink.
8. The expansion seat with heat dissipation element according to claim 4, characterized in that: The edge of the installation groove is provided with a bevel.
9. The expansion seat with heat dissipation element according to claim 5, characterized in that: The placement surface is provided with a socket, and the socket is used for coupling the heat sink with the expansion seat.
10. The expansion seat with heat dissipation element according to claim 1, characterized in that: The expansion device is a docking station, a mobile power supply or a mobile hard disk.