Special high-frequency power supply for ozone

Abstract

The utility model relates to the technical field of power supplies, and discloses a special high-frequency power supply for ozone, which comprises a high-frequency power supply module used on an ozone generator, a ventilation opening is arranged at the front end of the high-frequency power supply module, and heat dissipation holes are arranged on two sides of the high-frequency power supply module. A heat dissipation plate used for installing a circuit board is arranged in a shell of the high-frequency power module, the heat dissipation plate is in an L shape, a heat dissipation fan is installed at the head end of the heat dissipation plate, and an accelerated cooling structure is arranged at the front end of the heat dissipation plate. According to the high-frequency power supply special for ozone, the circuit board in the high-frequency power supply module is installed on the heat dissipation plate, heat conduction is conducted on the circuit board through the heat dissipation plate, heat dissipation is conducted through the accelerated cooling structure, the heat dissipation fan drives air to cool the accelerated cooling structure, cooling of the heat dissipation plate is accelerated, and therefore the temperature of the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of power supplies, in particular to a high-frequency power supply dedicated to ozone. Background Art

[0002] An ozone generator is a device used to generate ozone gas. It usually needs to work with a specific power supply. It generally needs a high-frequency power supply to drive it. However, the high-frequency power supply will release a lot of heat during operation, and the heat accumulation will burn the electrical components. Therefore, the current high-frequency power supply will be equipped with a cooling fan for heat dissipation. However, the heat of the high-frequency power supply will generally be transferred to the circuit board. Therefore, the temperature of the circuit board will affect the operation of the electrical components on it. For this reason, the cooling fan cannot effectively cool it down. For this reason, we propose a high-frequency power supply dedicated to ozone. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, the utility model provides a high-frequency power supply dedicated for ozone.

[0004] The utility model provides the following technical solution: a high-frequency power supply dedicated for ozone, comprising a high-frequency power supply module for an ozone generator, wherein a vent is provided at the front end of the high-frequency power supply module, and heat dissipation holes are provided at both sides of the high-frequency power supply module, a heat dissipation plate for installing a circuit board is provided inside a shell of the high-frequency power supply module, the heat dissipation plate is L-shaped, and a heat dissipation fan is installed at the head end of the heat dissipation plate, and an accelerated cooling structure is provided at the front end of the heat dissipation plate.

[0005] Preferably, the heat sink adopts a hollow design, and the interior of the heat sink is filled with heat-conducting oil.

[0006] Preferably, the heat sink is attached to the circuit board in the high-frequency power module via a thermally conductive silicone layer, so that the circuit board transfers heat to the heat sink through the thermally conductive silicone layer.

[0007] Preferably, the accelerated cooling structure comprises a rectangular opening opened at the front end of the heat sink, and a plurality of heat pipes communicating with the interior of the heat sink are arranged in the rectangular opening, and heat sink fins are arranged on the heat pipes.

[0008] Compared with the prior art, the utility model has the following beneficial effects:

[0009] The circuit board in the high-frequency power supply module of the ozone-specific high-frequency power supply is installed on a heat sink, and the heat is conducted by the heat sink and dissipated through an accelerated cooling structure. The heat dissipation fan drives air to cool the accelerated cooling structure, accelerates the cooling of the heat sink, and thus reduces the temperature of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the structure of the utility model;

[0011] Figure 2 It is a structural schematic diagram of the heat dissipation plate of the utility model.

[0012] In the figure: 1. high-frequency power module; 2. ventilation opening; 3. heat dissipation hole; 4. heat dissipation plate; 5. accelerated cooling structure; 51. rectangular opening; 52. heat pipe; 53. heat dissipation fin; 6. thermal conductive silicone layer; 7. heat dissipation fan. DETAILED DESCRIPTION

[0013] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components to avoid unnecessary confusion of the concepts of the present invention.

[0014] See also Figure 1-2 A high-frequency power supply dedicated to ozone includes a high-frequency power module 1 for an ozone generator, and a vent 2 is provided at the front end of the high-frequency power module 1, and heat dissipation holes 3 are provided on both sides of the high-frequency power module 1. A heat sink 4 for mounting a circuit board is provided inside the shell of the high-frequency power module 1, and the heat sink 4 is L-shaped, and a heat dissipation fan 7 is installed at the head end of the heat sink 4, and an accelerated cooling structure 5 is provided at the front end of the heat sink 4. The circuit board in the high-frequency power module 1 is installed on the heat sink 4, and heat conduction is performed on the heat sink 4 and heat is dissipated through the accelerated cooling structure 5, and the heat dissipation fan 7 drives air to cool the accelerated cooling structure 5, accelerates the cooling of the heat sink 4, and thus reduces the temperature of the circuit board.

[0015] The heat sink 4 is bonded to the circuit board in the high-frequency power module 1 through the thermally conductive silicone layer 6, so that the circuit board transfers heat to the heat sink 4 through the thermally conductive silicone layer 6. The thermally conductive silicone layer 6 is elastic and can be bonded to the bottom of the circuit board in the high-frequency power module 1, so that the circuit board can better transfer the temperature to the thermally conductive heat sink 4.

[0016] The heat sink 4 is hollow in design, and the interior of the heat sink 4 is filled with heat transfer oil. The accelerated cooling structure 5 includes a rectangular opening 51 opened at the front end of the heat sink 4, and a plurality of heat pipes 52 communicating with the interior of the heat sink 4 are arranged in the rectangular opening 51, and the heat pipes 52 are provided with heat dissipation fins 53 and heat transfer oil heat conduction blocks. The heat transfer oil is connected to the heat pipes 52, so that the heat pipes 52 can cool the heat transfer oil through the heat transfer fins 53, and cooperate with the heat dissipation fan 7 to drive air to cool the heat transfer fins 53, thereby accelerating the cooling of the heat transfer oil.

[0017] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A high frequency power supply for ozone, characterized in that: The invention comprises a high-frequency power module (1) for an ozone generator, wherein a vent (2) is provided at the front end of the high-frequency power module (1), and heat dissipation holes (3) are provided on both sides of the high-frequency power module (1), a heat dissipation plate (4) for mounting a circuit board is provided inside the housing of the high-frequency power module (1), the heat dissipation plate (4) is L-shaped, a heat dissipation fan (7) is installed at the front end of the heat dissipation plate (4), and an accelerated cooling structure (5) is provided at the front end of the heat dissipation plate (4).

2. The ozone-specific high-frequency power supply according to claim 1, characterized in that: The heat sink (4) adopts a hollow design, and the interior of the heat sink (4) is filled with heat-conducting oil.

3. The ozone-specific high-frequency power supply according to claim 1, characterized in that: The heat sink (4) is bonded to the circuit board in the high-frequency power module (1) via the heat-conducting silicone layer (6), so that the circuit board transfers heat to the heat sink (4) via the heat-conducting silicone layer (6).

4. The ozone-specific high-frequency power supply according to claim 1, characterized in that: The accelerated cooling structure (5) comprises a rectangular opening (51) opened at the front end of the heat sink (4), and a plurality of heat conduction pipes (52) communicating with the interior of the heat sink (4) are arranged in the rectangular opening (51), and heat dissipation fins (53) are arranged on the heat conduction pipes (52).

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