Organic silicon modified epoxy heat-conducting glue preheating device

Abstract

The utility model discloses an organic silicon modified epoxy heat-conducting glue preheating device, and relates to the technical field of industrial robots. The organic silicon modified epoxy heat-conducting glue preheating device comprises a heating cylinder, a moving assembly and an air-entrapping assembly, a hot glue barrel is arranged in the heating cylinder, the moving assembly is located above the hot glue barrel, the air-entrapping assembly is located on the outer side of the heating cylinder, and the air-entrapping assembly comprises an assembling rod, a connecting spray head, an air pump, a balancing weight and a connecting hose. The top of the heating cylinder is fixedly connected with a connecting sleeve, the bottom of the heating cylinder is fixedly connected with an air pump, the air outlet end of the air pump is fixedly connected with a connecting hose, and the connecting hose is sleeved with the connecting sleeve. According to the device, potential bubbles in the organic silicon modified epoxy heat-conducting glue can be eliminated through air entrapping, the bonding quality is improved, the organic silicon modified epoxy heat-conducting glue is continuously turned over to be in contact with the inner wall of the hot glue barrel through the air entrapping mode, and the heating effect of the organic silicon modified epoxy heat-conducting glue is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial robots, in particular to a preheating device for an organosilicon-modified epoxy thermal conductive adhesive. Background Art

[0002] Silicone-modified epoxy thermally conductive adhesive is a special glue with excellent thermal conductivity and high temperature resistance. The glue needs to be heated and preheated before use. Some preheating devices in the prior art directly load the glue into the device during preheating. This method is prone to uneven heating of the glue, and the glue contains certain bubbles, which may affect the bonding performance and appearance of the glue. Therefore, in response to the above problems, a silicone-modified epoxy thermally conductive adhesive preheating device is proposed. Utility Model Content

[0003] The purpose of the utility model is to provide a preheating device for a silicone-modified epoxy thermally conductive adhesive, which can solve the problem that some preheating devices in the prior art directly load the glue into the device during preheating, which is prone to uneven heating of the glue and contains certain bubbles in the glue, which may affect the bonding performance and appearance of the glue.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a preheating device for a silicone-modified epoxy thermally conductive adhesive, comprising a heating tube, a moving assembly and a gas filling assembly, a hot glue barrel is arranged inside the heating tube, the moving assembly is located above the hot glue barrel, the gas filling assembly is located outside the heating tube, the gas filling assembly comprises an assembly rod, a connecting nozzle, an air pump, a counterweight block and a connecting hose, the top of the heating tube is fixedly connected to a connecting sleeve, the bottom of the heating tube is fixedly connected to an air pump, the air outlet end of the air pump is fixedly connected to a connecting hose, and the connecting hose is sleeved in the connecting sleeve.

[0005] Preferably, the hot glue barrel is sleeved inside the heating barrel, and the outer wall of the hot glue barrel does not contact the inner wall of the heating barrel. This arrangement facilitates heating of the hot glue barrel.

[0006] Preferably, a mounting stand is fixedly connected to the top of the hot glue barrel, and its arrangement facilitates the fixing of the movable component. A circular opening is provided on the mounting stand, and its arrangement facilitates the auxiliary movement of the gas filling component.

[0007] Preferably, the moving component includes an electric push rod and a sliding rod. The electric push rod is fixedly connected to the top of the mounting frame, and the sliding rod is slidably installed on the mounting frame. Through the coordinated use of the electric push rod and the sliding rod, the gas filling component can be driven to move, so that the heating component is located in the hot glue barrel, thereby improving the convenience of heating the silicone-modified epoxy thermal conductive glue and improving the practicability of the device.

[0008] Preferably, the assembly rod is arranged in the mounting stand, and a plurality of groups of connecting nozzles are fixedly connected to the outer wall of the assembly rod, the top of the assembly rod is fixedly connected to one end of a connecting hose, and a counterweight is fixedly connected to the outer wall of the connecting hose. By using the assembly rod, the connecting nozzle, the air pump, the counterweight and the connecting hose in coordination, the silicone-modified epoxy thermal adhesive can be aerated. By aerating, potential bubbles in the silicone-modified epoxy thermal adhesive can be removed and the bonding quality can be improved. In addition, by aerating, the silicone-modified epoxy thermal adhesive can be continuously rolled and contacted with the inner wall of the hot glue barrel, thereby improving the heating effect of the silicone-modified epoxy thermal adhesive.

[0009] Preferably, the free end of the electric push rod is fixedly connected to the top of the assembly rod, and one end of the sliding rod is fixedly connected to the top of the assembly rod, which is arranged to assist the up and down movement of the assembly rod.

[0010] Preferably, the center point of the assembly rod and the thermal glue barrel are located in a straight line, which is convenient for aerating the silicone-modified epoxy thermally conductive glue.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] (1) The preheating device for the organic silicon modified epoxy thermal conductive adhesive can perform aeration on the organic silicon modified epoxy thermal conductive adhesive by using an assembly rod, a connecting nozzle, an air pump, a counterweight block and a connecting hose. By aerating, potential bubbles in the organic silicon modified epoxy thermal conductive adhesive can be removed, thereby improving the bonding quality. In addition, by aerating, the organic silicon modified epoxy thermal conductive adhesive can be continuously rolled and contacted with the inner wall of the thermal adhesive barrel, thereby improving the heating effect of the organic silicon modified epoxy thermal conductive adhesive.

[0013] (2) The preheating device for the silicone-modified epoxy thermally conductive adhesive can drive the gas-filling component to move through the coordinated use of the electric push rod and the sliding rod, so that the heating component is located in the hot glue barrel, thereby improving the convenience of heating the silicone-modified epoxy thermally conductive adhesive and improving the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0015] Figure 1 It is a three-dimensional diagram of the utility model;

[0016] Figure 2 It is a three-dimensional diagram of the connecting sleeve of the utility model;

[0017] Figure 3 It is a top perspective view of the present invention.

[0018] Figure numerals: 1. Heating tube; 2. Hot glue bucket; 3. Mounting stand; 4. Circular opening; 5. Electric push rod; 6. Assembly rod; 7. Connecting nozzle; 8. Sliding rod; 9. Connecting sleeve; 10. Air pump; 11. Counterweight; 12. Connecting hose. DETAILED DESCRIPTION

[0019] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0020] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0021] See also Figure 1-3The utility model provides a technical solution: a preheating device for an organic silicon modified epoxy thermal conductive adhesive, comprising a heating cylinder 1, a moving component and a gas filling component. A hot glue barrel 2 is arranged inside the heating cylinder 1, and the hot glue barrel 2 is sleeved inside the heating cylinder 1. The outer wall of the hot glue barrel 2 does not contact the inner wall of the heating cylinder 1, and its arrangement is convenient for heating the hot glue barrel 2. A mounting stand 3 is fixedly connected to the top of the hot glue barrel 2, and its arrangement is convenient for fixing the moving component. A circular opening 4 is opened on the mounting stand 3, and its arrangement is convenient for assisting the moving work of the gas filling component. The moving component is located above the hot glue barrel 2, and the moving component comprises an electric push rod 5 and a sliding rod 8. The top of the mounting stand 3 is fixedly connected to an electric push rod 5 and a sliding rod 8. The electric push rod 5 is actuated, and a slide rod 8 is slidably installed on the mounting frame 3. The coordinated use of the electric push rod 5 and the slide rod 8 can drive the gas filling component to move, so that the heating component is located in the hot glue barrel 2, which improves the convenience of heating the silicone-modified epoxy thermal conductive adhesive and the practicality of the device. The gas filling component is located on the outside of the heating cylinder 1. The gas filling component includes an assembly rod 6, a connecting nozzle 7, an air pump 10, a counterweight 11 and a connecting hose 12. The top of the heating cylinder 1 is fixedly connected to a connecting sleeve 9, the bottom of the heating cylinder 1 is fixedly connected to an air pump 10, and the air outlet end of the air pump 10 is fixedly connected to a connecting hose 12. The connecting hose 12 is sleeved in the connecting sleeve 9, the assembly rod 6 is arranged in the mounting frame 3, and the assembly The outer wall of the rod 6 is fixedly connected with a plurality of connecting nozzles 7. The top of the assembly rod 6 is fixedly connected with one end of the connecting hose 12. The outer wall of the connecting hose 12 is fixedly connected with a counterweight 11. The silicone-modified epoxy thermal conductive adhesive is loaded into the hot glue barrel 2. Then the heating cylinder 1 is controlled to start. After the heating cylinder 1 is started, the silicone-modified epoxy thermal conductive adhesive in the hot glue barrel 2 is heated. At the same time, the electric push rod 5 is controlled to start. The free end of the electric push rod 5 drives the assembly rod 6 to move downward. The assembly rod 6 moves downward and drives the connecting nozzle 7 to move downward, so that the connecting nozzle 7 is located in the hot glue barrel 2. When the assembly rod 6 moves downward, it drives the connecting hose 12 to slide in the connecting sleeve 9. At the same time, the air pump 10 is controlled to start. The air outlet end of the air pump 10 transmits the air to the assembly rod 6 through the connecting hose 12, and the air in the assembly rod 6 is discharged through the connecting nozzle 7 to aerate the silicone-modified epoxy thermally conductive adhesive in the thermal glue barrel 2, thereby improving the preheating efficiency of the silicone-modified epoxy thermally conductive adhesive. By using the assembly rod 6, the connecting nozzle 7, the air pump 10, the counterweight block 11 and the connecting hose 12 in coordination, the silicone-modified epoxy thermally conductive adhesive can be aerated. By aerating, potential bubbles in the silicone-modified epoxy thermally conductive adhesive can be removed, thereby improving the bonding quality. Moreover, by aerating, the silicone-modified epoxy thermally conductive adhesive is continuously rolled and in contact with the inner wall of the thermal glue barrel 2, thereby improving the heating effect of the silicone-modified epoxy thermally conductive adhesive.

[0022] Furthermore, the free end of the electric push rod 5 is fixedly connected to the top of the assembly rod 6, and one end of the sliding rod 8 is fixedly connected to the top of the assembly rod 6. It is arranged to assist the up and down movement of the assembly rod 6. The center point of the assembly rod 6 and the hot glue barrel 2 are located in a straight line. Its arrangement facilitates the aeration of the silicone-modified epoxy thermal conductive adhesive.

[0023] Working principle: When in use, put the silicone modified epoxy thermal conductive adhesive into the hot glue barrel 2, and then control the heating tube 1 to start. After the heating tube 1 is started, the silicone modified epoxy thermal conductive adhesive in the hot glue barrel 2 is heated, and the electric push rod 5 is controlled to start at the same time. The free end of the electric push rod 5 drives the assembly rod 6 to move downward, and the assembly rod 6 moves downward to drive the connecting nozzle 7 to move downward, so that the connecting nozzle 7 is located in the hot glue barrel 2. When the assembly rod 6 moves downward, it drives the connecting hose 12 to slide in the connecting sleeve 9. At the same time, the air pump 10 is controlled to start, and the air outlet end of the air pump 10 transmits the air to the assembly rod 6 through the connecting hose 12. The air in the assembly rod 6 is discharged through the connecting nozzle 7 to add air to the silicone modified epoxy thermal conductive adhesive in the hot glue barrel 2, thereby improving the preheating efficiency of the silicone modified epoxy thermal conductive adhesive.

[0024] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A preheating device for silicone-modified epoxy thermally conductive adhesive, characterized in that: include: A heating cylinder (1), wherein a hot glue barrel (2) is arranged inside the heating cylinder (1); A movable assembly, the movable assembly being located above the hot glue barrel (2); The gas filling component is located outside the heating cylinder (1), and comprises an assembly rod (6), a connecting nozzle (7), an air pump (10), a counterweight (11) and a connecting hose (12). The top of the heating cylinder (1) is fixedly connected to a connecting sleeve (9), the bottom of the heating cylinder (1) is fixedly connected to the air pump (10), the air outlet end of the air pump (10) is fixedly connected to a connecting hose (12), and the connecting hose (12) is sleeved in the connecting sleeve (9).

2. The preheating device for silicone-modified epoxy thermally conductive adhesive according to claim 1, characterized in that: The hot glue barrel (2) is sleeved inside the heating barrel (1), and the outer wall of the hot glue barrel (2) does not contact the inner wall of the heating barrel (1).

3. The preheating device of a silicone-modified epoxy thermally conductive adhesive according to claim 2, characterized in that: The top of the hot glue barrel (2) is fixedly connected to a mounting stand (3), and a circular opening (4) is provided on the mounting stand (3).

4. The preheating device for silicone-modified epoxy thermally conductive adhesive according to claim 3, characterized in that: The moving assembly comprises an electric push rod (5) and a sliding rod (8); the top of the mounting frame (3) is fixedly connected with the electric push rod (5); and the sliding rod (8) is slidably mounted on the mounting frame (3).

5. The preheating device for silicone-modified epoxy thermally conductive adhesive according to claim 4, characterized in that: The assembly rod (6) is arranged in the mounting stand (3), the outer wall of the assembly rod (6) is fixedly connected to multiple groups of connection nozzles (7), the top of the assembly rod (6) is fixedly connected to one end of a connection hose (12), and a counterweight block (11) is fixedly connected to the outer wall of the connection hose (12).

6. The preheating device for silicone-modified epoxy thermally conductive adhesive according to claim 5, characterized in that: The free end of the electric push rod (5) is fixedly connected to the top of the assembly rod (6), and one end of the sliding rod (8) is fixedly connected to the top of the assembly rod (6).

7. The preheating device for silicone-modified epoxy thermally conductive adhesive according to claim 6, characterized in that: The center point of the assembly rod (6) and the hot glue barrel (2) are located on a straight line.

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