Semiconductor cleaning equipment and liquid supplementing device thereof

Abstract

The utility model discloses semiconductor cleaning equipment and a liquid supplementing device thereof, and belongs to the technical field of semiconductors. The liquid supplementing device comprises a liquid storage device, a liquid supplementing pipeline, a circulating pipeline, a pump body and a control part, the outlet end of the liquid storage device is communicated with the inlet end of the pump body, the outlet end of the pump body is communicated with the first end of the liquid supplementing pipeline and the first end of the circulating pipeline, and the second end of the circulating pipeline is communicated with the inlet end of the liquid storage device; the second end of the liquid supplementing pipeline is a liquid supplementing opening, the control component is connected with the liquid supplementing pipeline and used for controlling the on-off state of the liquid supplementing pipeline, and under the condition that the opening duration of the pump body reaches the preset duration, the control component controls the liquid supplementing pipeline to be in the on state. The semiconductor cleaning equipment comprises the liquid supplementing device. Thus, before the cleaning fluid flows to the fluid supplementing pipeline, the pump body starts to work and reaches a stable pressurization state, the actual pressurization amount is basically equal to the calibrated pressurization amount, and fluid supplementing deviation can be reduced.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a semiconductor cleaning device and a liquid replenishing device thereof. Background Art

[0002] Semiconductor cleaning equipment usually includes multiple process modules. Wafers are processed in each process module in turn. Each process module includes a process tank filled with cleaning liquid, a water tank and a wafer carrier. The wafer carrier carries the wafer into the process tank for processing. After the process of the wafer in the process tank is completed, the wafer carrier carries the wafer into the water tank to rinse the chemicals and other contaminants on the surface of the wafer. After the rinsing is completed, the wafer carrier transfers the wafer to the wafer transfer mechanism, which transports the wafer to the next process module.

[0003] However, in the process of transferring the wafer from the process tank to the water tank, the surface of the wafer will carry some cleaning liquid, resulting in a reduction in the volume of the cleaning liquid in the process tank; similarly, in the process of the wafer entering the process tank of the next process module from the water tank, it will also carry a certain amount of clean water into the process tank, resulting in a decrease in the concentration of the cleaning liquid in the process tank, thereby affecting the process effects of other wafers in the process tank and even causing the wafer to be scrapped.

[0004] In the prior art, in order to solve the above-mentioned problem, a liquid replenishing device is added to the semiconductor cleaning equipment. The liquid replenishing device includes a liquid storage device and a liquid replenishing pipeline. The liquid storage device stores cleaning liquid. One end of the liquid replenishing pipeline is connected to the outlet of the liquid storage device, and the other end of the liquid replenishing device is connected to the process tank. A pump body is provided on the liquid replenishing pipeline. When the volume or concentration of the cleaning liquid in the process tank drops to a set value, the pump body is turned on, and the pressurization effect of the pump body is utilized to allow the cleaning liquid in the liquid storage device to enter the process tank through the liquid replenishing pipeline, so as to increase the volume and concentration of the cleaning liquid in the process tank.

[0005] However, the pump body in this solution is unstable at the initial start-up, and there is a deviation between the actual boost volume and the calibrated boost volume, resulting in a deviation between the actual fluid replenishment volume and the theoretical fluid replenishment volume; moreover, the cleaning fluid stored in the liquid storage tank is in a static state for a long time, accompanied by volatilization, decomposition and other problems, and the cleaning fluid in the liquid storage tank is prone to uneven concentration problems. Utility Model Content

[0006] The purpose of the embodiments of the present application is to provide a semiconductor cleaning device and a liquid replenishing device thereof, which can solve the problem of deviation in the actual liquid replenishing amount of the liquid replenishing device in the related art.

[0007] In a first aspect, an embodiment of the present application provides a liquid replenishing device for semiconductor cleaning equipment, comprising a liquid storage device, a liquid replenishing pipeline, a circulation pipeline, a pump body and a control component, wherein the outlet end of the liquid storage device is connected to the inlet end of the pump body, the outlet end of the pump body is respectively connected to the first end of the liquid replenishing pipeline and the first end of the circulation pipeline, the second end of the circulation pipeline is connected to the inlet end of the liquid storage device, and the second end of the liquid replenishing pipeline is a liquid replenishing port.

[0008] The control component is connected to the infusion pipeline, and is used to control the on / off state of the infusion pipeline. When the opening time of the pump body reaches a preset time, the control component controls the infusion pipeline to be in an on state.

[0009] In a second aspect, an embodiment of the present application further provides a semiconductor cleaning device, comprising the above-mentioned liquid replenishing device.

[0010] In the embodiment of the present application, a circulation pipeline is added to the fluid replenishment device. Before the pump body drives the cleaning liquid in the liquid storage device to flow to the fluid replenishment pipeline, the control component first controls the fluid replenishment pipeline to be in a cut-off state, and the pump body drives the cleaning liquid to flow to the circulation pipeline, so that the cleaning liquid circulates in the liquid storage device and the circulation pipeline, thereby improving the uniformity of the cleaning liquid in the liquid storage device and avoiding problems such as volatilization and decomposition caused by long-term standing that affect the uniformity of the cleaning liquid. In addition, before the pump body drives the cleaning liquid to flow to the fluid replenishment pipeline, it has already started working and reached a stable boost state. At this time, the actual boost amount is basically equal to the calibrated boost amount, which is conducive to reducing the deviation between the actual fluid replenishment amount and the theoretical fluid replenishment amount, and thus is conducive to accurately controlling the fluid replenishment amount. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a schematic diagram of the structure of the liquid replenishing device and the process tank disclosed in the embodiment of the present application;

[0012] Figure 2 It is a schematic diagram of the flow direction of the cleaning liquid when the circulation pipeline disclosed in the embodiment of the present application is in a conducting state;

[0013] Figure 3 It is a schematic diagram of the flow direction of the cleaning liquid when the liquid replenishing pipeline disclosed in the embodiment of the present application is in a conducting state;

[0014] Figure 4 It is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiment of the present application.

[0015] Description of reference numerals:

[0016] 100-liquid storage device,

[0017] 200-Pump body,

[0018] 300-liquid replenishment pipeline, 310-first control valve, 320-liquid replenishment port,

[0019] 400-circulation pipeline, 410-second control valve,

[0020] 500-gas source,

[0021] 610-first connecting pipeline, 620-second connecting pipeline,

[0022] 700-adapter, 710-first connector, 720-second connector, 730-third connector,

[0023] 810-process tank, 820-water tank, 830-wafer carrier, 840-wafer transfer mechanism, 850-guide rail,

[0024] 900-wafer. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0026] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0027] The semiconductor cleaning equipment and liquid replenishing device provided by the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0028] Please refer to Figure 1-Figure 4The liquid replenishing device disclosed in the embodiment of the present application is applied to semiconductor cleaning equipment, and the liquid replenishing device includes a liquid storage device 100, a liquid replenishing pipeline 300, a circulation pipeline 400, a pump body 200 and a control component, wherein the liquid storage device 100 can be a container such as a liquid storage box and a liquid storage tank that can hold cleaning liquid, the liquid replenishing pipeline 300 leads to the process tank 810 of the semiconductor cleaning equipment, and the liquid storage device 100 can add cleaning liquid to the process tank 810 of the semiconductor cleaning equipment through the liquid replenishing pipeline 300; the circulation pipeline 400 is used to circulate the cleaning liquid in the liquid storage device 100, and the pump body 200 is used to provide power for the cleaning liquid to flow to the circulation pipeline 400 and the liquid replenishing pipeline 300.

[0029] like Figure 1 As shown, the outlet end of the liquid storage device 100 is connected to the inlet end of the pump body 200. Optionally, the outlet end of the liquid storage device 100 can be connected to the inlet end of the pump body 200 through a first pipe section, that is, one end of the first pipe section is connected to the outlet end of the liquid storage device 100, and the other end of the first pipe section is connected to the inlet end of the pump body 200; the outlet end of the pump body 200 is respectively connected to the first end of the fluid infusion pipeline 300 and the first end of the circulation pipeline 400. Optionally, the first end of the fluid infusion pipeline 300, the outlet end of the pump body 200 and the first end of the circulation pipeline 400 can be connected by structures such as a three-way joint; the second end of the circulation pipeline 400 is connected to the inlet end of the liquid storage device 100, and the second end of the fluid infusion pipeline 300 is a fluid infusion port 320, which is used to connect to the process tank 810.

[0030] Moreover, the control component is connected to the liquid infusion pipeline 300, and the control component is used to control the on-off state of the liquid infusion pipeline 300. When the opening time of the pump body 200 does not reach the preset time, the control component controls the liquid infusion pipeline 300 to be in a cut-off state, and the cleaning liquid in the liquid storage device 100 circulates through the circulation pipeline 400; when the opening time of the pump body 200 reaches the preset time, the control component controls the liquid infusion pipeline 300 to be in a conducting state, and the cleaning liquid in the liquid storage device 100 enters the process tank 810 through the liquid infusion pipeline 300. It should be noted that the preset time can be set as needed. When the opening time of the pump body 200 reaches the preset time, it means that the boost state of the pump body 200 has stabilized, and the actual boost amount is substantially equal to the calibrated boost amount.

[0031] Optionally, the control component may include a first valve body, which is arranged on the fluid infusion pipeline 300, and the first valve body is used to control the on-off of the fluid infusion pipeline 300; the control component may also include a movable cover, which is arranged on the fluid infusion port 320, and the movement of the movable cover is used to open or close the fluid infusion port 320, thereby controlling the on-off of the fluid infusion pipeline 300.

[0032] In the embodiment of the present application, the refilling device is additionally provided with a circulation pipeline 400. Before the pump body 200 drives the cleaning liquid in the liquid storage device 100 to flow to the refilling pipeline 300, the control component first controls the refilling pipeline 300 to be in a cut-off state, and the pump body 200 drives the cleaning liquid to flow to the circulation pipeline 400, so that the cleaning liquid circulates in the liquid storage device 100 and the circulation pipeline 400, thereby improving the uniformity of the cleaning liquid in the liquid storage device 100 and avoiding the problems of volatilization and decomposition caused by long-term standing that affect the uniformity of the cleaning liquid. In addition, before driving the cleaning liquid to flow to the refilling pipeline 300, the pump body 200 has already started working and reached a stable boost state. At this time, the actual boost amount is substantially equal to the calibrated boost amount, which is conducive to reducing the deviation between the actual refilling amount and the theoretical refilling amount, and thus is conducive to accurately controlling the refilling amount.

[0033] In an optional embodiment, the control component is only connected to the liquid replenishment pipeline 300, that is, the control component is only used to control the on-off state of the liquid replenishment pipeline 300. In this way, when the liquid replenishment pipeline 300 is not needed to replenish the cleaning liquid in the process tank 810, the cleaning liquid only circulates between the liquid storage device 100 and the circulation pipeline 400; when the liquid replenishment pipeline 300 is needed to replenish the cleaning liquid in the process tank 810, a part of the cleaning liquid driven by the pump body 200 circulates between the liquid storage device 100 and the circulation pipeline 400, and the other part flows to the process tank 810 through the liquid replenishment pipeline 300.

[0034] In another embodiment, the control component is connected to the infusion pipeline 300 and the circulation pipeline 400 respectively, and the control component is used to control the on-off state of the infusion pipeline 300 and the circulation pipeline 400 to be opposite, that is, when the opening time of the pump body 200 does not reach the preset time, the control component controls the infusion pipeline 300 to be in the cut-off state and controls the circulation pipeline 400 to be in the conducting state; when the opening time of the pump body 200 reaches the preset time, the control component controls the infusion pipeline 300 to be in the conducting state and controls the circulation pipeline 400 to be in the cut-off state. Optionally, the control component may further include a second valve body, which is arranged on the circulation pipeline 400, and the on-off of the circulation pipeline 300 is controlled by the second valve body; or, the control component may further include other components capable of controlling the on-off of the circulation pipeline 300.

[0035] With such arrangement, when the infusion pipeline 300 is in the conducting state, the control component controls the circulation pipeline 400 to be in the cut-off state, ensuring that all the cleaning fluid driven by the pump body 200 flows to the infusion pipeline 300, which is beneficial to improving the infusion efficiency and also beneficial to accurately controlling the infusion volume.

[0036] In an optional embodiment, the infusion pipeline 300 is provided with a first control valve 310, which is used to control the on-off of the infusion pipeline 300. The first control valve 310 may be a switch valve, a regulating valve, or the like that can control the on-off of the infusion pipeline 300. The embodiment of the present application does not impose any specific restrictions on the type of the first control valve 310. The circulation pipeline 400 is provided with a second control valve 410, which is used to control the on-off of the circulation pipeline 400. The second control valve 410 may also be a switch valve, a regulating valve, or the like that can control the on-off of the circulation pipeline 400. The embodiment of the present application does not impose any specific restrictions on the type of the second control valve 410.

[0037] Moreover, the control component is connected to the first control valve 310 and the second control valve 410 respectively to control the state of the first control valve 310 to be opposite to the state of the second control valve 410. That is, when the first control valve 310 is opened, the liquid replenishing pipeline 300 is in a conducting state. At this time, the control component controls the second control valve 410 to be closed to cut off the circulation pipeline 400. The flow direction of the cleaning liquid can be referred to Figure 3 When the first control valve 310 is closed, the infusion line 300 is in a cut-off state. At this time, the control component controls the second control valve 410 to open to connect the circulation line 400. The flow direction of the cleaning fluid can be referred to Figure 2 That is, the control component is indirectly connected to the infusion pipeline 300 through the first control valve 310, and the control component is indirectly connected to the circulation pipeline 400 through the second control valve 410. Optionally, the control component can be a controller such as a single chip microcomputer, a programmable logic controller, etc., and the controller is electrically connected to the first control valve 310 and the second control valve 410 respectively.

[0038] With this embodiment, when the first control valve 310 conducts the liquid replenishment pipeline 300, the control component controls the second control valve 410 to cut off the circulation pipeline 400, ensuring that the cleaning fluid driven by the pump body 200 all flows to the liquid replenishment pipeline 300, which is beneficial to improving the liquid replenishment efficiency and accurately controlling the liquid replenishment amount. Moreover, the control component can timely and accurately control the state of the first control valve 310 to be opposite to the state of the second control valve 410, so that the on-off state of the liquid replenishment pipeline 300 and the circulation pipeline 400 are opposite.

[0039] Of course, in other embodiments, the control component may include the first control valve 310 and the second control valve 410 described above, and the user may manually control the first control valve 310 and the second control valve 410 to keep the two valves in opposite states.

[0040] In an optional embodiment, the first control valve 310 is a normally closed valve, the second control valve 410 is a normally open valve, and the control component includes a driving source. When the opening time of the pump body 200 reaches a preset time, the driving source is turned on, and the driving source acts on the normally open valve and the normally closed valve at the same time, so that the normally closed valve is in an open state and the normally open valve is in a closed state; when the opening time of the pump body 200 does not reach the preset time, the driving source is turned off, the normally closed valve is in a closed state, and the normally open valve is in an open state.

[0041] By adopting this embodiment, a driving source is used to simultaneously control the normally open valve and the normally closed valve, so that the normally open valve and the normally closed valve are interlocked, thereby preventing human error in operation or problems such as the control system from causing the first control valve 310 and the second control valve 410 to be opened or closed at the same time, thereby avoiding the problem of incorrect flow of the cleaning fluid.

[0042] Of course, in other embodiments, the first control valve 310 and the second control valve 410 can be non-functional interlocked control valves, and the first control valve 310 and the second control valve 410 are controlled by a controller such as a single-chip microcomputer or a programmable logic controller to keep the two in opposite states.

[0043] In an optional embodiment, the driving source can be a power supply, and the normally closed valve and the normally open valve are both solenoid valves. The power supply is electrically connected to the solenoid valve. When the power supply is off, the normally closed valve is closed and the normally open valve is opened; when the power supply is on, the normally closed valve is opened and the normally open valve is closed.

[0044] In another embodiment, if Figure 1 As shown, the driving source is an air source 500, and the air source 500 can be a gas compression tank, an air compressor or other structures, and the air source 500 can provide compressed gas; the normally closed valve has a first pneumatic valve, and the normally open valve has a second pneumatic valve, and the control component also includes a first connecting line 610 and a second connecting line 620, and the outlet end of the air source 500 is respectively connected to the first end of the first connecting line 610 and the first end of the second connecting line 620, the second end of the first connecting line 610 extends to the first pneumatic valve, and the second end of the second connecting line 620 extends to the second pneumatic valve.

[0045] In this way, the same gas source 500 controls the normally open valve and the normally closed valve at the same time, which is conducive to the gas acting on the normally open valve and the normally closed valve at the same time, so that the normally open valve and the normally closed valve maintain mechanical interlocking. When the gas source 500 is turned on, a part of the compressed gas flows to the first pneumatic valve through the first connecting pipeline 610 to open the normally closed valve, and at the same time, another part of the compressed gas flows to the second pneumatic valve through the second connecting pipeline 620 to close the normally open valve.

[0046] The air drive method can more stably control the states of the first control valve 310 and the second control valve 410, thereby avoiding the inability to accurately control the first control valve 310 and the second control valve 410 due to abnormal conditions such as power failure in the electric drive method.

[0047] In an optional embodiment, the control component further includes an adapter 700, which includes a first connector 710, a second connector 720 and a third connector 730. The second connector 720 and the third connector 730 are respectively connected to the first connector 710, the first connector 710 is connected to the outlet end of the gas source 500, the second connector 720 is connected to the first end of the first connecting pipeline 610, and the third connector 730 is connected to the first end of the second connecting pipeline 620. In this embodiment, the adapter 700 can be used to change the direction of the gas flowing out of the outlet end of the gas source 500 and to divert the gas, so that gas can be provided to the first connecting pipeline 610 and the second connecting pipeline 620 at the same time through one outlet end of the gas source 500.

[0048] Of course, in other embodiments, the fluid infusion device may not be provided with the adapter 700, that is, the outlet end of the gas source 500 may be directly connected to the first end of the first connecting pipeline 610 and the first end of the second connecting pipeline 620. Optionally, the gas source 500 is provided with two gas outlets, and the two gas outlets are respectively connected to the first connecting pipeline 610 and the second connecting pipeline 620.

[0049] In an optional embodiment, the adapter 700 may be a three-way connector; or, the adapter 700 may be a three-way valve, so that the gas source 500 may be continuously in an open state, and by controlling the opening and closing of the three-way valve, it is further controlled whether the gas source 500 provides gas to the first connecting pipeline 610 and the second connecting pipeline 620.

[0050] In an optional embodiment, the difference between the length value of the first connecting line 610 and the length value of the second connecting line 620 is within a preset range. Optionally, the preset range is a range between zero and a preset value, and the user can set the preset value as needed. The preset value can be 0.5 mm, that is, the difference between the length value of the first connecting line 610 and the length value of the second connecting line 620 does not exceed 0.5 mm. Further optionally, the length value of the first connecting line 610 is equal to the length value of the second connecting line 620. It should be noted that the difference does not exceed 0.5 mm for the first connecting line 610 and the second connecting line 620 with an inner diameter of 4 mm. Of course, when the inner diameters of the first connecting line 610 and the second connecting line 620 are other values, the preset value can also be other values.

[0051] With this embodiment, the difference in length between the first connecting pipeline 610 and the second connecting pipeline 620 is relatively small, ensuring that the gas circulation time in the first connecting pipeline 610 and the second connecting pipeline 620 is substantially equal. Then, when the gas source 500 is turned on, the gas acts on the first pneumatic valve and the second pneumatic valve substantially simultaneously, ensuring that the normally open valve and the normally open valve change state at the same time, thereby ensuring that the normally open valve and the normally closed valve continue to maintain an interlocked state.

[0052] Optionally, the pump body 200 can be a metering pump. The metering pump belongs to a hydraulic pump, and has the advantages of being simple, reliable, low cost, and constant flow. Moreover, the discharge volume of the metering pump for one stroke is determined, and the user can calculate the number of strokes required for the metering pump to work according to the required amount of fluid replenishment, and ensure the number of strokes corresponding to the work of the metering pump by controlling the opening time of the first control valve 310, so as to achieve the amount of fluid replenishment more accurately. Further optionally, the opening time of the first control valve 310 is controlled by controlling the opening time of the air source 500.

[0053] Specifically, when the metering pump is just turned on, the gas source 500 is in a closed state, and the discharge volume of the metering pump is unstable. At this time, the cleaning liquid only circulates between the liquid storage device 100 and the circulation pipeline 400. After the discharge volume of the metering pump is stable, the gas source 500 is controlled to be opened to change the state of the first control valve 310 and the second control valve 410, so that the cleaning liquid enters the process tank 810 through the liquid replenishing pipeline 300. Optionally, the metering pump and the gas source 500 can be controlled by a control system. Usually, the discharge volume of the first four strokes of the metering pump is unstable. After the metering pump works for four strokes and before the next stroke begins, the control system controls the gas source 500 to be opened, and the liquid replenishing pipeline 300 is replenished. After the liquid replenishing volume is reached, the control system controls the gas source 500 to be closed. The user can set the opening time and opening times of the metering pump in the control system according to the properties of the cleaning liquid in the liquid storage device 100 to achieve regular circulation of the cleaning liquid in the liquid storage device 100.

[0054] Of course, in other embodiments, the pump body 200 may be other types of hydraulic pumps.

[0055] Based on the liquid replenishing device disclosed in the present application, the embodiment of the present application further provides a semiconductor cleaning device, including the liquid replenishing device in the above embodiment and a process tank 810, and the liquid replenishing port 320 of the liquid replenishing pipeline 300 is connected to the process tank 810. In this way, when the liquid replenishing pipeline 300 is in a conducting state, the liquid replenishing port 320 directly replenishes the cleaning liquid into the process tank 810.

[0056] By adopting this embodiment, a circulation pipeline 400 is added to the liquid replenishing device of the semiconductor cleaning equipment, which can enable the cleaning liquid in the liquid storage device 100 to circulate between the liquid storage device 100 and the circulation pipeline 400, thereby improving the uniformity of the cleaning liquid in the liquid storage device 100; moreover, before the liquid replenishing port 320 replenishes liquid into the process tank 810, the pump body 200 has started to work and reaches a stable pressurization state. At this time, the actual pressurization amount is basically equal to the calibrated pressurization amount, which is beneficial to reduce the deviation between the actual liquid replenishment amount and the theoretical liquid replenishment amount, and further beneficial to accurately control the liquid replenishment amount.

[0057] In an optional embodiment, if Figure 4 As shown, the semiconductor cleaning equipment includes at least two cleaning modules and a wafer transfer mechanism 840. The wafer transfer mechanism 840 is used to transfer wafers 900 between two adjacent cleaning modules. The cleaning module includes a process tank 810, a liquid replenishing device, a water tank 820, and a wafer carrier 830. The wafer carrier 830 is used to carry the wafer 900 and can transfer the wafer 900 between the water tank 820 and the process tank 810. Specifically, each cleaning module is responsible for a different cleaning process of the wafer 900. Optionally, the process tank 810 of each cleaning module contains a different type of cleaning liquid.

[0058] The wafer transfer mechanism 840 transports the wafer 900 to the wafer carrier 830 in a cleaning module. The wafer carrier 830 carries the wafer 900 and drives the wafer 900 to enter the process tank 810 and the water tank 820 in sequence. When the wafer 900 completes the cleaning process in this cleaning module, the wafer carrier 830 exchanges the wafer 900 to the wafer transfer mechanism 840, and the wafer transfer mechanism 840 continues to transport the wafer 900 to the next cleaning module.

[0059] Optionally, the semiconductor cleaning equipment further includes a guide rail 850 , and the arrangement direction of the cleaning modules is the same as the extension direction of the guide rail 850 . The wafer transfer mechanism 840 moves along the guide rail 850 to transfer the wafer 900 between the cleaning modules.

[0060] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A liquid replenishing device used in semiconductor cleaning equipment, characterized in that: The invention comprises a liquid storage device (100), a liquid infusion pipeline (300), a circulation pipeline (400), a pump body (200) and a control component, wherein the outlet end of the liquid storage device (100) is connected to the inlet end of the pump body (200), the outlet end of the pump body (200) is respectively connected to the first end of the liquid infusion pipeline (300) and the first end of the circulation pipeline (400), the second end of the circulation pipeline (400) is connected to the inlet end of the liquid storage device (100), the second end of the liquid infusion pipeline (300) is a liquid infusion port (320), The control component is connected to the infusion pipeline (300), and is used to control the on / off state of the infusion pipeline (300). When the opening time of the pump body (200) reaches a preset time, the control component controls the infusion pipeline (300) to be in an on state.

2. The fluid replenishing device according to claim 1, characterized in that: The control component is connected to the infusion pipeline (300) and the circulation pipeline (400) respectively, and is used to control the on / off states of the infusion pipeline (300) and the circulation pipeline (400) to be opposite. When the opening time of the pump body (200) does not reach the preset time, the control component controls the liquid infusion pipeline (300) to be in a cut-off state and controls the circulation pipeline (400) to be in a conducting state; When the opening time of the pump body (200) reaches the preset time, the control component controls the liquid infusion pipeline (300) to be in a conducting state and controls the circulation pipeline (400) to be in a cut-off state.

3. The fluid replenishing device according to claim 2, characterized in that: The infusion pipeline (300) is provided with a first control valve (310), and the first control valve (310) is used to control the on-off of the infusion pipeline (300). The circulation pipeline (400) is provided with a second control valve (410), and the second control valve (410) is used to control the on-off of the circulation pipeline (400). The control component is connected to the first control valve (310) and the second control valve (410) respectively to control the state of the first control valve (310) to be opposite to the state of the second control valve (410).

4. The fluid replenishing device according to claim 3, characterized in that: The first control valve (310) is a normally closed valve, the second control valve (410) is a normally open valve, and the control component includes a driving source, When the opening time of the pump body (200) reaches the preset time, the driving source is turned on, and the driving source acts on the normally open valve and the normally closed valve, so that the normally closed valve is in an open state and the normally open valve is in a closed state; When the opening time of the pump body (200) does not reach the preset time, the driving source is turned off, the normally closed valve is in a closed state, and the normally open valve is in an open state.

5. The fluid replenishing device according to claim 4, characterized in that: The driving source is an air source (500), the normally closed valve has a first pneumatic valve, and the normally open valve has a second pneumatic valve. The control component also includes a first connecting pipeline (610) and a second connecting pipeline (620), the outlet end of the gas source (500) is respectively connected to the first end of the first connecting pipeline (610) and the first end of the second connecting pipeline (620), the second end of the first connecting pipeline (610) extends to the first pneumatic valve, and the second end of the second connecting pipeline (620) extends to the second pneumatic valve.

6. The fluid replenishing device according to claim 5, characterized in that: The control component also includes an adapter (700), the adapter (700) includes a first connector (710), a second connector (720) and a third connector (730), the second connector (720) and the third connector (730) are respectively connected to the first connector (710), the first connector (710) is connected to the outlet end of the gas source (500), the second connector (720) is connected to the first end of the first connecting pipe (610), and the third connector (730) is connected to the first end of the second connecting pipe (620).

7. The fluid replenishing device according to claim 6, characterized in that: The difference between the length of the first connecting pipe (610) and the length of the second connecting pipe (620) is within a preset range.

8. The fluid replenishing device according to claim 6, characterized in that: The adapter (700) is a three-way valve or a three-way joint.

9. The fluid replenishing device according to claim 1, characterized in that: The pump body (200) is a quantitative pump.

10. A semiconductor cleaning device, characterized in that: It comprises a process tank (810) and the fluid replenishing device according to any one of claims 1 to 9, and the fluid replenishing port (320) is connected to the process tank (810).

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