Semiconductor process chamber

Abstract

The utility model discloses a semiconductor process chamber, and relates to the field of semiconductors. A semiconductor process cavity comprises a cavity body and a base arranged in the cavity body, the base is connected with a lifting shaft, and the lifting shaft penetrates out of the cavity body from the bottom wall of the cavity body; the process chamber further comprises a blocking assembly. The blocking assembly comprises a bearing piece, a first blocking piece and a second blocking piece. The bearing piece is arranged on the bottom wall of the cavity, and the first blocking piece and the second blocking piece are detachably arranged on the bearing piece. A channel is defined by the first blocking piece and the second blocking piece, and the lifting shaft is movably arranged in the channel in a penetrating mode. The problem that particle pollution is easily caused by byproducts in the sealing pipe can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a semiconductor process chamber. Background Art

[0002] With the continuous development of semiconductor technology, the requirements for thin film performance in the field of thin film deposition are getting higher and higher, especially in terms of indicators such as film deposition thickness control and uniformity. The shortcomings and disadvantages of traditional thin film deposition technologies such as physical vapor deposition (PVD) and chemical vapor deposition (CVD) in this regard are becoming more and more obvious, especially in related application fields with high requirements for step coverage rate. The application of atomic layer deposition (ALD) technology can better meet the existing requirements for thin film deposition control and uniformity indicators, and the characteristics of good step coverage, low process temperature, and a wide range of substrate types of atomic layer deposition technology have also made it more and more concerned and used.

[0003] Atomic layer deposition technology is mainly a thin film deposition method that alternately introduces different gas-phase reaction precursors into the reaction chamber, and then introduces inert gas to purge between different reaction precursors, so that the single atomic film is finally attached to the substrate surface layer by layer. During the atomic layer deposition process, when the activation points on the substrate surface are used up, the attachment or reaction will stop, and the remaining reaction precursors will be purged out of the reaction environment by the inert gas, which also makes the atomic layer deposition technology have high stability, purity and good uniformity. In addition, the film thickness of this technology can be more accurately controlled by controlling the number of reaction cycles.

[0004] However, atomic layer deposition technology will produce process particles in scenarios with smaller processes. That is, during the process, the reaction precursor cannot be completely purged due to reasons such as short gas purge time or insufficient flow, resulting in the reaction precursor remaining in the reaction chamber or pipeline, and reacting abnormally with another reaction precursor. The by-products produced form particles, affecting product quality.

[0005] In some reaction chambers of the related art, after the process is carried out, since the sealing tube outside the base support shaft is connected to the chamber and there is a temperature difference inside and outside the sealing tube, by-products are easily condensed in the sealing tube and adhere to the wall of the sealing tube or the wall of the support shaft, and powder, particles and other substances are easily generated, thereby affecting the process environment in the reaction chamber and ultimately reducing the product yield. Utility Model Content

[0006] The purpose of the embodiments of the present application is to provide a semiconductor process chamber that can solve the problem of by-products in a sealed tube easily causing particle contamination.

[0007] In order to solve the above technical problems, this application is implemented as follows:

[0008] The embodiment of the present application provides a semiconductor process chamber, comprising a cavity and a base disposed in the cavity, wherein the base is connected to a lifting shaft, and the lifting shaft passes through the cavity from the bottom wall of the cavity;

[0009] The semiconductor process chamber further comprises a barrier assembly, wherein the barrier assembly comprises a carrier, a first barrier and a second barrier;

[0010] The carrier is disposed on the bottom wall of the cavity, and the first stopper and the second stopper are respectively detachably disposed on the carrier;

[0011] A channel is formed between the first stopper and the second stopper, and the lifting shaft is movably arranged through the channel.

[0012] In the embodiment of the present application, the space between the lifting shaft and the cavity can be blocked by a blocking component to alleviate the problem of powder and particle contamination caused by condensation of process by-products in the cavity and adhesion to the wall of the lifting shaft, thereby improving product quality and reducing the frequency of cleaning and maintenance of the semiconductor process chamber, reducing labor and material costs; in addition, the lifting shaft can also move freely along the channel to ensure its lifting function. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A flowchart of an atomic layer deposition technology in the related art;

[0014] Figure 2 It is a structural schematic diagram of a reaction chamber in the related art;

[0015] Figure 3 It is a structural schematic diagram of another reaction chamber in the related art;

[0016] Figure 4 It is a schematic diagram of the structures of the cavity, base, lifting shaft, bellows and baffle assembly disclosed in the embodiment of the present application;

[0017] Figure 5 A schematic diagram of the structure of a carrier disclosed in an embodiment of the present application;

[0018] Figure 6 A cross-sectional view of a carrier disclosed in an embodiment of the present application;

[0019] Figure 7 It is a schematic diagram of the structure of the cavity, bellows, bearing member, etc. disclosed in the embodiment of the present application;

[0020] Figure 8 It is a schematic diagram of assembling the first stopper and the second stopper disclosed in the embodiment of the present application;

[0021] Fig. 9 A disassembly diagram of the first stopper and the second stopper disclosed in the embodiment of the present application;

[0022] Fig.10 It is a schematic diagram of the structures of the base, lifting shaft, bearing member, first stopper and second stopper disclosed in the embodiment of the present application;

[0023] Fig.11 A schematic diagram of the installation process of the baffle assembly, the base and the lifting shaft disclosed in the embodiment of the present application;

[0024] Fig.12 This is a schematic diagram of the baffle assembly disclosed in an embodiment of the present application being fixed to a cavity.

[0025] Description of reference numerals:

[0026] 01-chamber; 02-base; 03-support shaft; 04-sealing tube; 05-sealing tube base; 06-exhaust port; 07-baffle;

[0027] 100- cavity;

[0028] 210-base; 220-lifting axis;

[0029] 300-Blocking assembly;

[0030] 310-bearing member; 311-through hole; 312-groove; 3121-first mounting hole; 3122-inclined sink; 313-positioning protrusion; 314-first fixing hole;

[0031] 320-first stopper; 321-first assembly protrusion; 322-convex edge structure; 3221-second mounting hole; 323-first fastening hole; 324-first arc groove;

[0032] 330 - second stopper; 331 - second assembly protrusion; 332 - second fastening hole; 333 - second arc groove;

[0033] 410-first fastener;

[0034] 500- bellows;

[0035] 600-Support tool;

[0036] 700- screwing tool;

[0037] M-channel; N-preset gap. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0040] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0041] refer to Figure 2 A process chamber in the related art mainly includes chamber 01, base 02, sealing tube 04, sealing tube base 05 and exhaust port 06. Chamber 01 mainly provides a vacuum reaction environment and is a closed chamber; base 02 mainly provides reaction heat and carries wafers and is a heater; a support shaft 03 is provided inside the sealing tube 04, and the support shaft 03 mainly carries the base 02 and provides lifting function; the inside of the sealing tube base 05 is cooled by water, which mainly plays a cooling role to protect the surrounding sealing ring and avoid failure of the sealing ring due to high temperature; exhaust port 06 is mainly provided with negative pressure by a dry pump to extract the residual gas in chamber 01.

[0042] The whole reaction process is as follows Figure 1 As shown, when the first and second reaction precursors are pressurized and introduced into the chamber respectively, they will react on the surface of the wafer to form the desired products, and by-products will be formed at the same time. After the reaction is completed, the by-products remaining in the chamber will be extracted through the exhaust port to form a good chamber environment to prepare for the next cycle.

[0043] However, since the sealing tube is a slender structure, when the gas flows to this area, it cannot flow out smoothly and gather in this area. In particular, when the by-products come into contact with the base of the sealing tube, the temperature of the base of the sealing tube itself is relatively low, forming a temperature difference with the by-products, causing the by-products to condense and adhere to the base of the sealing tube, the outer wall of the support shaft and other parts. The appearance is a layer of powder and particles, which affects the chamber environment and the reaction process, and ultimately leads to a reduction in product yield.

[0044] To solve the above problems, another process chamber is provided in the related art, such as Figure 3 As shown, a circle of baffles 07 is provided at the position where the support shaft 03 passes through the bottom wall of the chamber 01, which can ensure that the support shaft 03 can be raised and lowered, and can also block the byproducts in the chamber 01 to reduce the byproducts from entering the sealing tube 04. However, this design will make it difficult to disassemble and assemble during the maintenance and cleaning of the base, and cannot achieve quick disassembly and assembly, which affects the overall efficiency of the equipment.

[0045] Based on the above situation, the embodiment of the present application discloses a semiconductor process chamber, which can not only alleviate the problem of particle contamination caused by byproduct adhesion, but also achieve quick disassembly and assembly. Figures 4 to 12 The disclosed semiconductor process chamber includes a chamber body 100 , a base 210 , a lifting shaft 220 and a baffle assembly 300 .

[0046] The chamber 100 provides space and environment for the process, and the base 210 is arranged in the chamber 100 to carry the wafer for the process. In addition, the base 210 is connected to a lifting shaft 220, which can drive the base 210 to rise and fall to change the position of the wafer to meet the process requirements.

[0047] Considering that the power source for lifting the pedestal 210 is located outside the cavity 100, in the embodiment of the present application, the lifting shaft 220 passes through the cavity 100 from the bottom wall of the cavity 100, so that the bottom end of the lifting shaft 220 is connected to the power source, thereby transmitting the power of the power source to the pedestal 210, so as to achieve the lifting of the pedestal 210 and the wafers carried thereon. Exemplarily, the bottom wall of the cavity 100 may be provided with a through hole for the lifting shaft 220 to pass through.

[0048] In addition, the semiconductor process chamber may further include a bellows 500, such as Figure 4 As shown, the bellows 500 is sleeved on the outside of the lifting shaft 220, and one end of the bellows 500 is connected to the bottom wall of the chamber 100. In this way, the bellows 500 can be used to seal the connection between the lifting shaft 220 and the bottom wall of the chamber 100 to prevent reaction precursors or process by-products from leaking from the gap between the lifting shaft 220 and the bottom wall of the chamber 100. Of course, the bellows 500 can also be freely extended and retracted to adapt to the lifting movement of the lifting shaft 220.

[0049] Taking into account that there is a gap between the lifting shaft 220 and the bottom wall of the chamber 100, in order to reduce the leakage of by-products from the gap, a blocking component 300 is additionally provided in the embodiment of the present application. The blocking component 300 is arranged between the lifting shaft 220 and the bottom wall of the chamber 100 to seal the gap, thereby reducing excessive reaction precursors or process by-products from entering the bellows 500 through the gap and adhering to the wall of the bellows 500 or the wall of the lifting shaft 220, thereby alleviating the problem of particle contamination.

[0050] Among them, Figure 4 As shown, the barrier assembly 300 includes a bearing member 310, a first stopper 320 and a second stopper 330. The bearing member 310 is a basic mounting component, which can provide a mounting base for the first stopper 320 and the second stopper 330 to carry and limit the first stopper 320 and the second stopper 330.

[0051] Specifically, the carrier 310 is arranged on the bottom wall of the cavity 100, and the first stopper 320 and the second stopper 330 are respectively detachably arranged on the carrier 310. In this way, the first stopper 320 and the second stopper 330 can be installed through the carrier 310 to ensure the stability of the first stopper 320 and the second stopper 330, and the disassembly and assembly of the first stopper 320 and the second stopper 330 can also be facilitated, so as to improve the maintenance and disassembly and assembly efficiency of the semiconductor process chamber.

[0052] Exemplarily, the first stopper 320 and the second stopper 330 are two structural members with mirror-image shapes.

[0053] To ensure that the lifting shaft 220 can move freely without obstruction, a channel M is formed between the first stopper 320 and the second stopper 330, and the lifting shaft 220 is movably arranged in the channel M. Based on this arrangement, the lifting shaft 220 can be freely lifted and lowered along the channel M, and the surrounding space of the lifting shaft 220 can be blocked.

[0054] Based on the above arrangement, the semiconductor process chamber in the embodiment of the present application adopts a new type of barrier assembly 300, which can seal the gap between the lifting shaft 220 and the bottom wall of the chamber 100 to reduce the leakage of by-products in the chamber 100, and alleviate the problem of powder and particle contamination caused by the condensation of process by-products in the chamber 100 and adhesion to the wall surface of the lifting shaft 220, thereby improving product quality, reducing the cleaning and maintenance frequency of the semiconductor process chamber, and reducing labor and material costs; in addition, the free lifting and moving of the lifting shaft 220 can be guaranteed to ensure the lifting function of the base 210, thereby meeting process requirements.

[0055] refer to Figure 5 , Figure 8 and Fig. 9In order to realize the installation of the first stopper 320 and the second stopper 330, the carrier 310 can be provided with a through hole 311, and the center line of the through hole 311 is colinear with the center line of the channel M; accordingly, the first stopper 320 can be provided with a first assembly protrusion 321, and the second stopper 330 can be provided with a second assembly protrusion 331, and the first assembly protrusion 321 and the second assembly protrusion 331 are docked and inserted into the through hole 311, so that the outer walls of the first assembly protrusion 321 and the second assembly protrusion 331 can be pressed against the inner wall of the through hole 311, so that the installation of the first stopper 320 and the second stopper 330 can be realized, and the first stopper 320 and the second stopper 330 are limited to ensure the firmness and stability of the docking of the first stopper 320 and the second stopper 330, and prevent the first stopper 320 and the second stopper 330 from separating from each other.

[0056] Exemplarily, the bearing member 310 may be a stepped annular structure, so as to carry and limit the first stopper 320 and the second stopper 330. In addition, the through hole 311 may be a circular hole, and accordingly, the outer wall of the first assembly protrusion 321 and the outer wall of the second assembly protrusion 331 are both arc surfaces; of course, the through hole 311 may also be other shapes, and the shapes of the outer walls of the first assembly protrusion 321 and the outer walls of the second assembly protrusion 331 are both adapted to the shape of the through hole 311.

[0057] To ensure that the lifting shaft 220 can pass through, the channel M passes through the first assembly protrusion 321 and the second assembly protrusion 331 that are connected to each other. In this way, the lifting shaft 220 can pass through the first assembly protrusion 321 and the second assembly protrusion 331 through the channel M.

[0058] refer to Fig. 9 In some embodiments, the first stopper 320 may be provided with a first arc groove 324, which passes through the first stopper 320 along the center line direction of the channel M, and the first assembly protrusion 321 is provided with a portion of the first arc groove 324; similarly, the second stopper 330 may be provided with a second arc groove 333, which passes through the second stopper 330 along the center line direction of the channel M, and the second assembly protrusion 331 is provided with a portion of the second arc groove 333.

[0059] Based on the above configuration, when the first stopper 320 is connected to the second stopper 330 , the first arc groove 324 and the second arc groove 333 are buckled together to form a complete channel M for the lifting shaft 220 to pass through.

[0060] In order to enable the first stopper 320 and the second stopper 330 to be firmly mounted to the carrier 310, the carrier 310 may be provided with a first mounting hole 3121, such as Figure 6 and Figure 7As shown. There may be a plurality of first mounting holes 3121, and accordingly, the first stopper 320 and the second stopper 330 may each be provided with a second mounting hole 3221. When the first stopper 320 and the second stopper 330 are both assembled to the carrier 310, the second mounting holes 3221 of the first stopper 320 and the second stopper 330 are respectively aligned with the corresponding first mounting holes 3121 on the carrier 310, and are penetrated with the first fastener 410, so that the first stopper 320 and the second stopper 330 are respectively fastened and installed to the carrier 310 by the first fastener 410, thereby ensuring the firmness and stability of the installation.

[0061] Exemplarily, the first mounting hole 3121 may be a threaded hole, and the first fastener 410 may be a structural member such as a screw or a bolt; of course, it may also be in other forms, which are not specifically limited here.

[0062] Considering that the baffle assembly 300 is located in the bottom area of ​​the cavity 100, when installing the first fastener 410, a tool needs to be inserted from the top of the cavity 100 to install the first fastener 410. Therefore, the first mounting hole 3121 and the second mounting hole 3221 need to be adaptively designed to facilitate the installation of the first fastener 410. When the first fastener 410 is a screw or a bolt, the tool can be a screwing tool 700, such as a screwdriver, etc., to facilitate screwing the first fastener 410.

[0063] refer to Figure 5 and Figure 6 In some embodiments, a groove 312 may be provided on the surface of the carrier 310, and the groove 312 is located at the periphery of the through hole 311, and a first mounting hole 3121 may be provided on the wall of the groove 312 adjacent to the through hole 311, and a center line of the first mounting hole 3121 is inclined relative to a center line of the through hole 311; accordingly, a convex edge structure 322 may be provided at each outer edge of the first stopper 320 and the second stopper 330, respectively, and each convex edge structure 322 may be provided with a second mounting hole 3221, and a center line of the second mounting hole 3221 is colinear with a center line of the corresponding first mounting hole 3121.

[0064] Based on the above settings, when the first stopper 320 and the second stopper 330 are both assembled to the carrier 310, their respective second mounting holes 3221 are aligned with the corresponding first mounting holes 3121, and a first angle is formed between the center lines of the aligned first mounting holes 3121 and the second mounting holes 3221 and the center line of the through hole 311. In this case, the first fastener 410 inserted into the first mounting hole 3121 and the corresponding second mounting hole 3221 is also inclined relative to the center line of the through hole 311. Thus, the first fastener 410 can be oriented away from the bottom surface of the base 210 to prevent the bottom surface of the base 210 from blocking the first fastener 410 and affecting the operation of the tool on the first fastener 410.

[0065] Of course, considering that when the first angle is too large, the first fastener 410 will be arranged toward the side wall of the cavity 100, so that the side wall of the cavity 100 will block the first fastener 410 and affect the operation of the tool on the first fastener 410. Based on this, the center line of the first mounting hole 3121 is located between the outer edge of the base 210 and the side wall of the cavity 100, so that the first fastener 410 installed in the first mounting hole 3121 can be oriented between the outer edge of the base 210 and the side wall of the cavity 100, so that the tool can enter the cavity 100 from between the outer edge of the base 210 and the side wall of the cavity 100 and operate the first fastener 410.

[0066] In a more specific embodiment, the bearing member 310 may be provided with two first mounting holes 3121, and the two are diagonally distributed; accordingly, the convex structure 322 of the first stopper 320 is provided in an area away from the second stopper 330, and the convex structure 322 of the second stopper 330 is provided in an area away from the first stopper 320. This arrangement can also ensure the fixed installation of the first stopper 320 and the second stopper 330, and facilitate disassembly.

[0067] Continue to refer Figure 5 In some embodiments, the wall surface of the groove 312 adjacent to the through hole 311 may be provided with an inclined groove 3122, and the first mounting hole 3121 is provided at the bottom surface of the inclined groove 3122, so that the processing of the first mounting hole 3121 and the installation of the first fastener 410 can be facilitated. It should be noted here that since the first mounting hole 3121 is an inclined hole, the first mounting hole 3121 can be conveniently processed vertically by providing the inclined groove 3122 and using the bottom surface of the inclined groove 3122 as the processing surface.

[0068] To ensure that the lifting shaft 220 can be lifted and lowered freely without interference, in the embodiment of the present application, a preset gap N is provided between the outer wall of the lifting shaft 220 and the inner wall of the channel M, such as Fig.10As shown, this arrangement can ensure that the lifting shaft 220 can move up and down smoothly without being scratched; of course, the size of the preset gap N is relatively small, that is, a narrow annular gap is formed between the outer wall of the lifting shaft 220 and the inner wall of the channel M, thereby increasing the gas flow range and increasing the flow resistance, thereby reducing the leakage of reaction precursors or process by-products from the preset gap N, reducing the adhesion of by-products to the outer wall of the lifting shaft 220, and alleviating the problem of particle contamination.

[0069] To further reduce gas leakage, in an embodiment of the present application, the air pressure in the preset gap N can be greater than the air pressure in the cavity 100. This design can effectively alleviate the flow of reaction precursors or process by-products in the chamber from the chamber to the preset gap N, further reduce the leakage of reaction precursors or process by-products, and further reduce the adhesion of by-products to the outer wall of the lifting shaft 220, thereby alleviating the problem of particle contamination.

[0070] Exemplarily, pressurized gas, such as an inert gas including Ar, N2, Ne, etc., can be introduced into the preset gap N to maintain the gas pressure in the preset gap N greater than the gas pressure in the chamber by setting the gas pressure in the preset gap N, thereby further preventing reaction precursors or process by-products from flowing into the preset gap N.

[0071] refer to Figure 8 and Fig. 9 In order to further improve the installation stability of the first stopper 320 and the second stopper 330, in the embodiment of the present application, the wall surface of the first stopper 320 may be provided with a first fastening hole 323, and the wall surface of the second stopper 330 may be provided with a second fastening hole 332. When the first stopper 320 and the second stopper 330 are docked, the center line of the first fastening hole 323 and the center line of the second fastening hole 332 are collinear, and a second fastener (not shown in the figure) is inserted through the first fastening hole 323 and the second fastening hole 332. Based on this arrangement, when the first stopper 320 and the second stopper 330 are buckled on both sides of the lifting shaft 220 from both sides, the first stopper 320 and the second stopper 330 can be fastened together by the second fastener to prevent the two from being separated from each other, so as to ensure the firmness and stability of the installation between the first stopper 320 and the second stopper 330; when disassembly is required, the second fastener is removed so that the first stopper 320 and the second stopper 330 can be relatively separated, thereby facilitating equipment maintenance.

[0072] In addition, the first stopper 320 and the second stopper 330 fastened together by the second fastener can be installed on the carrier 310 together and fastened by the first fastener 410 , so as to further improve the stability of the first stopper 320 and the second stopper 330 .

[0073] Exemplarily, first fastening holes 323 may be respectively provided at both ends of the wall surface of the first stopper 320, and correspondingly, second fastening holes 332 may be respectively provided at both ends of the wall surface of the second stopper 330. In this way, the first stopper 320 and the second stopper 330 may be fastened by multiple second fasteners to improve the stability and firmness of the first stopper 320 and the second stopper 330.

[0074] In addition, the first fastening hole 323 or the second fastening hole 332 may be a threaded hole, and correspondingly, the second fastening member may be a screw or a bolt to facilitate the assembly and disassembly of the first stopper 320 and the second stopper 330 .

[0075] To prevent the second fastener from affecting the environment in cavity 100 , in an embodiment of the present application, the second fastener may be located in bellows 500 , thereby preventing the second fastener from being located in cavity 100 and interfering with the environment in cavity 100 .

[0076] To ensure the position accuracy of the carrier 310, a positioning protrusion 313 may be provided on one of the surface of the carrier 310 facing the bottom wall of the cavity 100 and the bottom wall of the cavity 100. Figure 6 As shown, the other may be provided with a positioning hole or a positioning groove (not shown in the figure), and the positioning protrusion 313 is positioned and matched with the positioning hole or the positioning groove. Based on this arrangement, the position accuracy of the carrier 310 on the bottom wall of the cavity 100 can be guaranteed, and the position accuracy of the channel M formed between the first stopper 320 and the second stopper 330 installed on the carrier 310 can be further guaranteed, so as to effectively prevent the offset between the channel M and the lifting shaft 220 from being too large, causing the lifting shaft 220 to rub against the channel M or even get stuck, thereby ensuring the smooth movement of the lifting shaft 220 and the integrity of the components.

[0077] Exemplarily, the positioning protrusion 313 can be a structure such as a pin or a pin shaft. Of course, it can also be other shapes, which are not specifically limited here.

[0078] To prevent the bearing member 310 from moving randomly, the bearing member 310 may be provided with a plurality of first fixing holes 314, such as Figure 5 As shown, correspondingly, the bottom wall of the cavity 100 can be provided with a plurality of second fixing holes (not shown in the figure), the plurality of first fixing holes 314 are arranged in one-to-one correspondence with the plurality of second fixing holes, and a third fastener (not shown in the figure) is inserted through the corresponding first fixing holes 314 and the second fixing holes. Based on this arrangement, the carrier 310 can be fixed to the bottom wall of the cavity 100 by the third fastener to ensure the firmness and stability of the carrier 310 and prevent the carrier 310 from moving at will.

[0079] Exemplarily, the first fixing hole 314 may be a countersunk hole; the second fixing hole may be a threaded hole, and accordingly, the third fastener may be a screw or a bolt.

[0080] In addition, to ensure a good environment in the cavity 100 , the third fastener can be made of a nickel-based material. Compared with the third fastener made of ordinary stainless steel, the third fastener made of a nickel-based material can be free from the influence of the process environment, thereby ensuring a good process environment of the cavity 100 .

[0081] In the embodiment of the present application, there is a gap between the upper surface of the barrier assembly 300 composed of the support member 310, the first barrier member 320 and the second barrier member 330 and the bottom surface of the base 210, that is, a certain distance is maintained to avoid the situation where the distance is too small to affect the stability of the lifting and lowering of the base 210, or the distance is too large to affect the distribution of the airflow field.

[0082] refer to Fig.11 and Fig.12 In the embodiment of the present application, the installation process of the base 210, the lifting shaft 220, the baffle assembly 300 and other structures is as follows:

[0083] Assemble the first stopper 320 and the second stopper 330 onto the lifting shaft 220 and place them stably at the bottom of the lifting shaft 220;

[0084] Install the carrier 310 to the bottom wall of the cavity 100 and install the support tool 600 to the opening of the cavity 100 to prepare for subsequent docking;

[0085] The assembly of the first stopper 320, the second stopper 330, the lifting shaft 220 and the base 210 is hoisted onto the supporting tool 600. When the bottom surface of the base 210 contacts the supporting tool 600, it is supported. At this time, the corresponding relationship between the bearing member 310, the first stopper 320 and the second stopper 330 is adjusted to ensure that the first mounting hole 3121 and the second mounting hole 3221 for connection are aligned. At the same time, the first fastener 410 is installed into the first mounting hole 3121 and the second mounting hole 3221 using the screwing tool 700;

[0086] Remove the supporting tool 600, continue to hoist the base 210 downward until it reaches the base of the bellows 500, then connect the base with the lifting shaft 220, and level and align the base 210, and the installation and rotation part is completed.

[0087] During disassembly, the process is opposite to the above-mentioned installation process, and the entire process is completed outside the cavity 100. In particular, in the process of completely disengaging the base 210 from the cavity 100, it is necessary to disconnect the carrier 310, the first stopper 320 and the second stopper 330, and use the screwing tool 700 for disassembly. In this way, there is no need for personnel to enter the cavity 100 to operate because the base 210 is too large and the first fastener 410 is located at the bottom of the cavity 100. On the one hand, it can alleviate the problem of chamber contamination, and on the other hand, it can also provide convenience for operation.

[0088] After the above installation and debugging are completed, the entire semiconductor process chamber will be divided into an area within the cavity 100 and an area within the bellows 500 by the barrier assembly 300. Since the preset gap N is small, most of the reaction precursors or process by-products cannot flow into the bellows 500, and since the preset gap N is narrow and long, the gas flow resistance is increased, thereby reducing the reaction precursors or process by-products from entering the bellows 500, thereby alleviating the problem of particle contamination.

[0089] In summary, the embodiments of the present application can not only alleviate the particle contamination problem in the process and improve the product yield, but also reduce the cleaning and maintenance frequency of the equipment and reduce labor and material costs.

[0090] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A semiconductor process chamber, comprising a chamber (100) and a base (210) disposed in the chamber (100), wherein the base (210) is connected to a lifting shaft (220), and the lifting shaft (220) passes through the chamber (100) from the bottom wall of the chamber (100), characterized in that: Also included is a barrier assembly (300), the barrier assembly (300) comprising: a bearing member (310), a first barrier member (320) and a second barrier member (330); The carrier (310) is disposed on the bottom wall of the cavity (100), and the first stopper (320) and the second stopper (330) are respectively detachably disposed on the carrier (310); A channel (M) is formed between the first stopper (320) and the second stopper (330), and the lifting shaft (220) is movably arranged in the channel (M).

2. The semiconductor process chamber according to claim 1, characterized in that: The bearing member (310) is provided with a through hole (311), and the center line of the through hole (311) is colinear with the center line of the channel (M); The first stopper (320) is provided with a first assembly protrusion (321), and the second stopper (330) is provided with a second assembly protrusion (331); the first assembly protrusion (321) and the second assembly protrusion (331) are butt-jointed and inserted into the through hole (311); and the channel (M) passes through the butt-jointed first assembly protrusion (321) and the second assembly protrusion (331).

3. The semiconductor process chamber according to claim 2, characterized in that: A groove (312) is provided on the surface of the bearing member (310), the groove (312) is located at the periphery of the through hole (311), a first mounting hole (3121) is provided on the wall surface of the groove (312) adjacent to the through hole (311), and a center line of the first mounting hole (3121) is arranged obliquely relative to a center line of the through hole (311); The first stopper (320) and the second stopper (330) are each provided with a convex edge structure (322) at their respective outer edges, the convex edge structure (322) is provided with a second mounting hole (3221), the center line of the second mounting hole (3221) is colinear with the center line of the corresponding first mounting hole (3121), and a first fastener (410) is inserted into the first mounting hole (3121) and the corresponding second mounting hole (3221).

4. The semiconductor process chamber according to claim 3, characterized in that: An inclined recessed groove (3122) is provided on the wall surface of the groove (312) adjacent to the through hole (311), and the first mounting hole (3121) is provided on the bottom surface of the inclined recessed groove (3122).

5. The semiconductor process chamber according to claim 3 or 4, characterized in that: The center line of the first mounting hole (3121) is located between the outer edge of the base (210) and the side wall of the cavity (100).

6. The semiconductor process chamber according to claim 1 or 2, characterized in that: A preset gap (N) is provided between the outer wall of the lifting shaft (220) and the inner wall of the channel (M).

7. The semiconductor process chamber according to claim 6, characterized in that: The air pressure in the preset gap (N) is greater than the air pressure in the cavity (100).

8. The semiconductor process chamber according to claim 1, wherein: A first fastening hole (323) is provided on the wall surface of the first stopper (320), and a second fastening hole (332) is provided on the wall surface of the second stopper (330); When the first stopper (320) and the second stopper (330) are butted against each other, the center line of the first fastening hole (323) and the center line of the second fastening hole (332) are collinear, and a second fastening member is inserted through the first fastening hole (323) and the second fastening hole (332); The semiconductor process chamber further comprises a bellows (500) sleeved on the outside of the lifting shaft (220), one end of the bellows (500) is connected to the bottom wall of the cavity (100), and the second fastener is located inside the bellows (500).

9. The semiconductor process chamber according to claim 1, wherein: One of the surface of the carrier (310) facing the bottom wall of the cavity (100) and the bottom wall of the cavity (100) is provided with a positioning protrusion (313), and the other is provided with a positioning hole or a positioning groove, and the positioning protrusion (313) is positioned and matched with the positioning hole or the positioning groove.

10. The semiconductor process chamber according to claim 1 or 9, characterized in that: The carrier (310) is provided with a plurality of first fixing holes (314), and the bottom wall surface of the cavity (100) is provided with a plurality of second fixing holes, the plurality of second fixing holes are arranged in a one-to-one correspondence with the plurality of first fixing holes (314), and third fasteners are inserted through the corresponding first fixing holes (314) and the second fixing holes.

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