Integrated circuit board capable of dissipating heat

Abstract

The utility model relates to an integrated circuit board capable of radiating, which belongs to the field of circuit boards and comprises a substrate, a printed circuit and a circuit element are arranged on the surface of the substrate, a radiator is arranged at the lower end of the substrate and comprises a connecting support, a heat conduction bottom plate, radiating fins and a radiating fan, a through groove is arranged on the connecting support, and the radiating fins are arranged in the through groove. The heat conduction bottom plate is arranged in the through groove, the heat dissipation fins and the heat dissipation fan are arranged at the end, away from the substrate, of the heat conduction bottom plate, the heat dissipation fins are perpendicular to the heat conduction bottom plate, the heat dissipation fan is arranged in the middle of the heat conduction bottom plate, the heat dissipation fins are evenly arranged on the periphery of the heat dissipation fan, and the heat dissipation fan is electrically connected with the substrate. The edge of the connecting support is provided with more than four elastic clamping jaws, the edge of the base plate is provided with clamping grooves, the elastic clamping jaws can be meshed with the clamping grooves, the corners of the connecting support are provided with connecting columns used for fixing positions, disassembly and assembly are simpler, and the base plate can be independently taken down when needing to be overhauled.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to an integrated circuit board capable of dissipating heat. Background Art

[0002] A circuit board, also known as a "PCB" or "printed circuit board", is an integral part of electronic devices. It is an insulated plane covered with conductive copper lines. These lines are used to connect various components in electronic devices, such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc. Circuit boards are widely used in various devices, such as computers, mobile phones, televisions, stereos, etc. They are the basis for realizing the functions of electronic devices. The main functions of circuit boards in electronic devices include connecting and fixing components, transmitting electrical signals and power, realizing functions and controls, improving the performance and stability of electronic devices, signal processing, etc. With the continuous development of science and technology, the design and manufacturing technology of circuit boards are also constantly improving, providing strong support for the innovation and development of electronic devices.

[0003] Today's electrical appliances have expanded their uses to include many other functions. In order to accurately control the normal operation of various functions, various components are added to the main control circuit board, and a processing chip is set up to control the transmission of various data and the operation of programs, which causes the circuit board to generate more heat when working. High temperature environment has a significant impact on the electrical performance of the circuit board. Under high temperature, the conductivity of electronic devices will be significantly reduced. High temperature will also cause the resistance value of the circuit board to change, affecting the overall performance of the circuit.

[0004] The heat dissipation structure on the existing circuit board is usually fixedly connected to the base plate by bolts, and the circuit board is then installed in the equipment by bolts. When the circuit board needs to be removed for maintenance, the heat dissipation structure will be removed together with the circuit board, resulting in inconvenience in maintenance. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art solutions, the utility model provides an integrated circuit board capable of dissipating heat, which can effectively solve the technical problems.

[0006] The technical solution adopted by the utility model to solve its technical problems is:

[0007] A heat dissipating integrated circuit board comprises a substrate, a surface of the substrate is provided with a printed circuit and circuit elements, a radiator is provided at the lower end of the substrate, the radiator comprises a connecting bracket, a heat conducting base plate, heat dissipating fins and a heat dissipating fan, a through groove is provided on the connecting bracket, the heat conducting base plate is provided in the through groove, the heat dissipating fins and the heat dissipating fan are both provided at an end of the heat conducting base plate away from the substrate, the heat dissipating fins and the heat conducting base plate are perpendicular to each other, the heat dissipating fan is provided in the middle of the heat conducting base plate, the heat dissipating fins are evenly provided around the heat dissipating fan, the heat dissipating fan is electrically connected to the substrate, the edge of the connecting bracket is provided with more than four elastic claws, the edge of the substrate is provided with a slot, the elastic claws can be engaged with the slot, and the corner of the connecting bracket is provided with a connecting column for fixing the position.

[0008] Furthermore, a terminal interface is provided on the surface of the substrate, a wire is provided on the side wall of the heat dissipation fan, and a terminal plug is provided at one end of the wire away from the heat dissipation fan, and the terminal plug can be inserted into the terminal interface.

[0009] Furthermore, a temperature sensor for detecting the temperature of the substrate is disposed on the substrate, and the temperature sensor is electrically connected to the substrate and the cooling fan.

[0010] Furthermore, the elastic claws are evenly arranged at both ends of the connecting bracket, and both ends of the base plate are provided with slots, and the elastic claws at both ends of the connecting bracket are aligned with the two slots respectively.

[0011] Furthermore, protective sleeves are provided at both ends of the base plate, the card slots are provided in the protective sleeves, and the end of the elastic claw away from the connecting bracket can pass through the protective sleeves and bite therewith.

[0012] Furthermore, thermal conductive silicone grease is applied on one end of the thermal conductive bottom plate close to the base plate.

[0013] Compared with the prior art, the utility model has the following beneficial effects: a card slot is provided on the substrate, an elastic card claw is provided on the edge of the connecting bracket, a heat-conducting base plate, heat-dissipating fins and a heat-dissipating fan for heat dissipation are provided on the connecting bracket, the connecting bracket is fixedly connected to the interior of the device through a connecting column, the substrate and the connecting bracket are detachably connected, the substrate is pressed toward the connecting bracket so that the elastic card claw passes through the card slot, the substrate and the connecting bracket can be fixedly connected, the substrate is lifted away from the connecting bracket so that the elastic card claw is disengaged from the card slot, the substrate can be removed from the connecting bracket, the disassembly and assembly is simpler, and the substrate can be removed separately when it needs to be repaired. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of an integrated circuit board capable of dissipating heat according to the utility model;

[0015] Figure 2 This is a bottom view of an integrated circuit board capable of dissipating heat according to the utility model;

[0016] Figure 3 It is a top view of an integrated circuit board capable of dissipating heat according to the utility model;

[0017] Figure 4 It is a cross-sectional view of an integrated circuit board capable of dissipating heat according to the utility model;

[0018] Numbers in the figure: 1-base plate, 2-connecting bracket, 3-heat-conducting bottom plate, 4-heat sink fins, 5-cooling fan, 6-terminal interface, 7-temperature sensor, 8-elastic claw, 9-slot, 10-protective cover, 11-connecting column. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Combine the following Figure 1-Figure 4 A detailed description of an integrated circuit board capable of dissipating heat of the utility model is given below:

[0021] A heat dissipating integrated circuit board comprises a substrate 1, a printed circuit and circuit elements are arranged on the surface of the substrate 1, a heat sink is arranged at the lower end of the substrate 1, the heat sink comprises a connecting bracket 2, a heat conductive base plate 3, heat dissipating fins 4 and a heat dissipating fan 5, a through groove is arranged on the connecting bracket 2, the heat conductive base plate 3 is arranged in the through groove, the heat dissipating fins 4 and the heat dissipating fan 5 are both arranged at the end of the heat conductive base plate 3 away from the substrate 1, the heat dissipating fins 4 and the heat conductive base plate 3 are perpendicular to each other, the heat dissipating fan 5 is arranged in the middle of the heat conductive base plate 3, the heat dissipating fins 4 are evenly arranged around the heat dissipating fan 5, the end of the heat conductive base plate 3 close to the substrate 1 is coated with heat conductive silicone grease, the heat dissipating fan 5 is electrically connected to the substrate 1, a terminal interface 6 is arranged on the surface of the substrate 1, a wire is arranged on the side wall of the heat dissipating fan 5, a terminal plug is arranged at the end of the wire away from the heat dissipating fan 5, and the terminal plug can be inserted into the terminal interface 6, a temperature sensor 7 for detecting the temperature of the substrate 1 is arranged on the substrate 1, and the temperature sensor 7 is electrically connected to the substrate 1 and the heat dissipating fan 5.

[0022] Four elastic claws 8 are provided on the edge of the connecting bracket 2, and a slot 9 is provided on the edge of the substrate 1. The elastic claws 8 can engage with the slot 9. The elastic claws 8 are evenly arranged at both ends of the connecting bracket 2, and slots 9 are provided at both ends of the substrate 1. The elastic claws 8 at both ends of the connecting bracket 2 are aligned with the two slots 9 respectively. Protective sleeves 10 are provided at both ends of the substrate 1, and the slots 9 are provided in the protective sleeve 10. The end of the elastic claw 8 away from the connecting bracket 2 can pass through the protective sleeve 10 and engage with it. A connecting column 11 for fixing the position is provided at the corner of the connecting bracket 2.

[0023] The present embodiment is an integrated circuit board capable of dissipating heat, wherein a card slot 9 is provided on a substrate 1, an elastic card claw 8 is provided on the edge of a connecting bracket 2, a heat-conducting base plate 3, a heat-dissipating fin 4 and a heat-dissipating fan 5 for dissipating heat are provided on the connecting bracket 2, and the connecting bracket 2 is fixedly connected to the inside of the device through a connecting column 11, and the substrate 1 and the connecting bracket 2 are detachably connected, and the substrate 1 is pressed toward the connecting bracket 2 so that the elastic card claw 8 passes through the card slot 9 to achieve a fixed connection between the substrate 1 and the connecting bracket 2, and the substrate 1 is lifted in a direction away from the connecting bracket 2 so that the elastic card claw 8 is disengaged from the card slot 9 to achieve the removal of the substrate 1 from the connecting bracket 2, and the disassembly and assembly is simpler, and the substrate 1 can be removed separately when it needs to be repaired.

[0024] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. An integrated circuit board capable of dissipating heat, comprising a substrate, a printed circuit and circuit elements being arranged on the surface of the substrate, characterized in that: A radiator is arranged at the lower end of the substrate, and the radiator includes a connecting bracket, a heat-conducting base plate, heat dissipation fins and a heat dissipation fan. A through groove is arranged on the connecting bracket, and the heat-conducting base plate is arranged in the through groove. The heat dissipation fins and the heat dissipation fan are both arranged at an end of the heat-conducting base plate away from the substrate. The heat dissipation fins and the heat dissipation fan are perpendicular to each other. The heat dissipation fan is arranged in the middle of the heat-conducting base plate. The heat dissipation fins are evenly arranged around the heat dissipation fan. The heat dissipation fan is electrically connected to the substrate. More than four elastic claws are arranged at the edge of the connecting bracket, and a slot is arranged at the edge of the substrate. The elastic claw can bite into the slot, and a connecting column for fixing the position is arranged at the corner of the connecting bracket.

2. The integrated circuit board capable of dissipating heat according to claim 1, characterized in that: The surface of the substrate is provided with a terminal interface, the side wall of the heat dissipation fan is provided with a wire, and one end of the wire away from the heat dissipation fan is provided with a terminal plug, which can be inserted into the terminal interface.

3. The integrated circuit board capable of dissipating heat according to claim 1, characterized in that: A temperature sensor for detecting the temperature of the substrate is arranged on the substrate, and the temperature sensor is electrically connected to the substrate and the cooling fan.

4. An integrated circuit board capable of dissipating heat according to any one of claims 1 to 3, characterized in that: The elastic claws are evenly arranged at the two ends of the connecting bracket, and the two ends of the base plate are provided with slots, and the elastic claws at the two ends of the connecting bracket are aligned with the two slots respectively.

5. An integrated circuit board capable of dissipating heat according to any one of claims 1 to 3, characterized in that: Protective sleeves are arranged at both ends of the base plate, and the clamping groove is arranged in the protective sleeve. The end of the elastic clamping claw away from the connecting bracket can pass through the protective sleeve and bite with the protective sleeve.

6. An integrated circuit board capable of dissipating heat according to any one of claims 1 to 3, characterized in that: One end of the heat-conducting bottom plate close to the base plate is coated with heat-conducting silicone grease.

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