FPC (Flexible Printed Circuit) structure for improving corrosion resistance of golden finger

Abstract

The utility model discloses an FPC structure for improving the corrosion resistance of a golden finger, which comprises an FPC body, the FPC body comprises an FPC base material layer, the golden finger is formed on the FPC base material layer, the golden finger comprises a corrosion-resistant alloy layer, a nickel-gold plating layer and a copper plating layer, and the corrosion-resistant alloy layer, the nickel-gold plating layer, the copper plating layer and the FPC base material layer are sequentially stacked. According to the FPC structure for improving the corrosion resistance of the golden finger, the structure of the golden finger comprises the corrosion-resistant alloy layer, the nickel-gold plating layer and the copper plating layer, so that better corrosion resistance and oxidation resistance are achieved through the corrosion-resistant alloy layer; therefore, the golden finger on the FPC can play a better protection role in testing in a high-temperature and high-humidity environment and a sweat and salt mist environment.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC production and manufacturing, in particular to an FPC structure for improving the corrosion resistance of gold fingers. Background Art

[0002] FPC (flexible circuit board) is widely used in various electronic products due to its flexible properties of being able to be bent, rolled and folded, such as smart wearable products. FPC is one of the important components in smart wearable display modules. Currently, during reliability or whole machine testing, the gold fingers of FPC are prone to corrosion, which eventually leads to functional problems.

[0003] In view of the above, an FPC structure for improving the corrosion resistance of gold fingers is proposed. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide an FPC structure for improving the corrosion resistance of gold fingers.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] An FPC structure for improving the corrosion resistance of a gold finger comprises: an FPC body, the FPC body comprises an FPC substrate layer, a gold finger is formed on the FPC substrate layer, the gold finger comprises an anti-corrosion alloy layer, a nickel-gold plated layer and a copper-plated layer, the anti-corrosion alloy layer, the nickel-gold plated layer, the copper-plated layer and the FPC substrate layer are stacked in sequence.

[0007] In one embodiment, the corrosion-resistant alloy layer is one of copper alloy, iron alloy or cobalt alloy.

[0008] In one of the embodiments, a connection area is provided on the FPC substrate layer, a gold finger is formed on the connection area, and a reinforcing plate is provided on the back side of the connection area.

[0009] In one of the embodiments, a white alignment line is disposed on the back side of the connection area.

[0010] In one embodiment, the reinforcement plate is a PI reinforcement plate.

[0011] In one embodiment, the reinforcement plate is a reinforcement steel plate.

[0012] In one embodiment, the FPC substrate layer is a polyimide film layer.

[0013] In one embodiment, the FPC substrate layer is a polyester film layer.

[0014] In one of the embodiments, a front electromagnetic shielding film and a back electromagnetic shielding film are respectively disposed on the front and back sides of the FPC body.

[0015] In one of the embodiments, the thickness of the front electromagnetic shielding film is 15 μm.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The FPC structure for improving the corrosion resistance of the gold finger of the utility model is configured with a structure of the gold finger as a corrosion-resistant alloy layer, a nickel-gold-plated layer and a copper-plated layer, so that the corrosion-resistant alloy layer has better corrosion resistance and oxidation resistance, so that the gold finger on the FPC can play a better protective role in high temperature and high humidity environment, sweat and salt spray environment tests. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 This is a schematic diagram of the front structure of an FPC structure for improving the corrosion resistance of a gold finger in an embodiment of the utility model;

[0020] Figure 2 This is a schematic diagram of the back structure of an FPC structure for improving the corrosion resistance of a gold finger in one embodiment of the utility model;

[0021] Figure 3 for Figure 1 A schematic diagram of the structure of the gold finger of the FPC structure for improving the corrosion resistance of the gold finger; DETAILED DESCRIPTION

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0023] See also Figure 1 , Figure 2 and Figure 3 As shown, an FPC structure for improving the corrosion resistance of gold fingers includes: an FPC (flexible circuit board) body 100, the FPC body 100 includes an FPC substrate layer 110, a gold finger 120 is formed on the FPC substrate layer 110, the gold finger 120 includes an anti-corrosion alloy layer 121, a nickel-plated gold layer 122 and a copper-plated layer 123, and the anti-corrosion alloy layer 121, the nickel-plated gold layer 122, the copper-plated layer 123 and the FPC substrate layer 110 are stacked in sequence.

[0024] It should be noted that the copper-plated layer, the nickel-gold-plated layer and the anti-corrosion alloy layer all have good electrical conductivity. The nickel-gold-plated layer not only has certain corrosion resistance, but also has certain wear resistance, so it can form protection for the copper-plated layer. However, the corrosion resistance of the single nickel-gold-plated layer is poor. When performing reliability or whole machine testing operations, the gold fingers on the FPC still have corrosion problems. Therefore, by plating another layer of anti-corrosion alloy material on the surface of the nickel-gold-plated layer, the anti-corrosion alloy material has the advantages of high hardness, good corrosion resistance, good oxidation resistance, stable contact resistance, and good wire performance, so that the gold fingers can be protected in high temperature and high humidity environments, sweat and salt spray environment tests. The problem of corrosion will not occur in the gold fingers. In addition, it should be noted that when a pad is provided on the FPC body 100, the stacking structure of the pad is the same as the stacking structure of the gold finger, thereby improving the corrosion resistance of the pad.

[0025] Preferably, the corrosion-resistant alloy layer is one of copper alloy, iron alloy or cobalt alloy, which has the best effect in protecting the gold finger.

[0026] In one embodiment, a connection area is provided on the FPC substrate layer 110, a gold finger 120 is formed on the connection area, and a reinforcing plate 130 is provided on the back of the connection area. Since the material of the FPC is relatively soft, deformation or failure to insert the FPC may occur during the plugging process. Therefore, by providing the reinforcing plate 130 on the back of the connection area, the thickness and hardness of the connection area are increased by the reinforcing plate 130, thereby facilitating the plugging operation of the FPC. In this embodiment, a white alignment line 140, such as an alignment line of white ink, is provided on the back of the connection area. When the gold finger is connected to other components, the white alignment line can be used to achieve the alignment effect.

[0027] Preferably, the reinforcing plate 130 is a PI (polyimide) reinforcing plate.

[0028] Preferably, the reinforcement plate 130 is a reinforcement steel plate.

[0029] Preferably, the FPC substrate layer 110 is a polyimide film layer.

[0030] Preferably, the FPC substrate layer 110 is a polyester film layer.

[0031] In one embodiment, a front electromagnetic shielding film 170 and a back electromagnetic shielding film 180 are respectively disposed on the front and back sides of the FPC body 100. In this way, the FPC can be prevented from being subjected to electromagnetic interference and causing signal distortion. Preferably, the thickness of the front electromagnetic shielding film is 15 μm; preferably, the thickness of the back electromagnetic shielding film is 15 μm.

[0032] It should also be noted that a foam double-sided adhesive 150 is also provided on the FPC body 100. Through the foam double-sided adhesive 150, the FPC body and other components can be bonded and fixed during assembly to facilitate the assembly of the FPC body. In addition, when the foam double-sided adhesive has not been used, a release film 160 is required to be provided on the surface of the foam double-sided adhesive to isolate and protect the foam double-sided adhesive. In order to facilitate tearing off the release film 160, a tear handle is also provided on the release film 160.

[0033] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An FPC structure for improving the corrosion resistance of gold fingers, characterized in that: include: The FPC body comprises an FPC substrate layer, a gold finger is formed on the FPC substrate layer, the gold finger comprises an anti-corrosion alloy layer, a nickel-gold plated layer and a copper-plated layer, and the anti-corrosion alloy layer, the nickel-gold plated layer, the copper-plated layer and the FPC substrate layer are stacked in sequence.

2. The FPC structure for improving the corrosion resistance of the gold finger according to claim 1, characterized in that: The corrosion-resistant alloy layer is one of copper alloy, iron alloy or cobalt alloy.

3. The FPC structure for improving the corrosion resistance of gold fingers according to claim 1, characterized in that: A connection area is arranged on the FPC substrate layer, a gold finger is formed on the connection area, and a reinforcing plate is arranged on the back of the connection area.

4. The FPC structure for improving the corrosion resistance of gold fingers according to claim 3, characterized in that: A white alignment line is arranged on the back side of the connection area.

5. The FPC structure for improving the corrosion resistance of gold fingers according to claim 3, characterized in that: The reinforcing plate is a PI reinforcing plate.

6. The FPC structure for improving the corrosion resistance of gold fingers according to claim 3, characterized in that: The reinforcing plate is a reinforcing steel plate.

7. The FPC structure for improving the corrosion resistance of gold fingers according to claim 1, characterized in that: The FPC substrate layer is a polyimide film layer.

8. The FPC structure for improving the corrosion resistance of gold fingers according to claim 1, characterized in that: The FPC substrate layer is a polyester film layer.

9. The FPC structure for improving the corrosion resistance of gold fingers according to claim 1, characterized in that: The front and back sides of the FPC body are respectively provided with a front electromagnetic shielding film and a back electromagnetic shielding film.

10. The FPC structure for improving the corrosion resistance of gold fingers according to claim 9, characterized in that: The thickness of the front electromagnetic shielding film is 15 μm.

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