Sensor control circuit and automatic test equipment

Abstract

The utility model belongs to the field of semiconductor test equipment, and provides a sensor control circuit and automatic test equipment. The sensor control circuit is applied to the automatic test equipment and comprises a control module and a switching module, the control module is connected with the switching module, and the switching module is respectively connected with a plurality of sensors on a main control board and a plurality of sensors on each service board in the automatic test equipment. And the control module outputs a control signal to the switching module to control the switching module to be switched to the target sensor, so that the target sensor is conducted with the control module. According to the sensor control circuit, monitoring of all the sensors is achieved only through one control module, the whole circuit is easy to achieve and low in cost, meanwhile, the control module can obtain data information of a certain sensor through the switching module, the control module can read the data information of the sensor conveniently, and the control efficiency is improved. And meanwhile, a user can conveniently know the change of each state variable in the automatic test equipment, so that the reliability and the safety of the automatic test equipment are improved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor testing equipment technology, and in particular relates to a sensor control circuit and an automatic testing device. Background Technology

[0002] ATE (Automatic Test Equipment) is a crucial component of semiconductor testing, working in conjunction with robotic arms to perform pre- and post-packaging chip testing. This includes electrical and functional testing of chips. Due to the need for parallel testing, ATE equipment typically has many channels, capable of testing multiple chips simultaneously to improve efficiency. These channels can range from hundreds to thousands. Therefore, ATE equipment is a complex and precise testing device, requiring numerous sensors and fans to ensure its proper operation. These sensors are distributed across the ATE equipment's main control board and various functional boards. The large number and variety of sensors, along with the numerous variables that need to be monitored, present a significant challenge to the design of the sensor control circuitry. Improper design can lead to ATE equipment malfunction, overheating, or even chip burnout.

[0003] Traditional sensor control circuits typically employ an MCU (Microcontroller Unit) on both the main control board and each service board of the ATE equipment to monitor the sensors on these boards. However, the large number of MCUs results in a complex and costly circuit; furthermore, acquiring data from multiple sensors can be challenging. Utility Model Content

[0004] This application provides a sensor control circuit and an automatic testing device, which can solve the problems of excessive number of MCUs in traditional sensor control circuits and the difficulty of MCUs acquiring data from multiple sensors.

[0005] In a first aspect, embodiments of this application provide a temperature control circuit, including a control module and a switching module. The control module is electrically connected to the switching module, and the switching module is respectively used to electrically connect to multiple sensors on the main control board and multiple sensors on each service board in the automatic testing equipment.

[0006] The control module is used to output a control signal to the switching module to control the switching module to switch to the target sensor, so that the target sensor is connected to the control module.

[0007] In one possible implementation of the first aspect, the switching module includes a first switching unit and a plurality of second switching units. The input terminal of the first switching unit is electrically connected to the control module, and the plurality of output terminals of the first switching unit are respectively electrically connected to the input terminals of the plurality of second switching units and to a plurality of sensors on the main control board. The plurality of output terminals of each second switching unit are used to be electrically connected to a plurality of sensors on a service board.

[0008] The first switching unit is used to switch to the target sensor on the main control board according to the first sub-control signal in the control signal, or to switch to the second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the service board according to the second sub-control signal in the control signal.

[0009] In one possible implementation of the first aspect, the first switching unit includes a first FPGA (Field Programmable Gate Array) chip, the input terminal of the first FPGA chip is electrically connected to the control module, and the multiple output terminals of the first FPGA chip are respectively electrically connected to the input terminals of multiple second switching units and multiple sensors on the main control board.

[0010] In one possible implementation of the first aspect, the second switching unit includes a second FPGA chip, the input terminal of the second FPGA chip is electrically connected to the output terminal of the first switching unit, and multiple output terminals of the second FPGA chip are used to be electrically connected to multiple sensors on the service board.

[0011] In one possible implementation of the first aspect, the switching module includes a first switching unit and a plurality of second switching units. The control terminals of the first switching unit and the plurality of second switching units are electrically connected to the control module. The first conducting terminal of the first switching unit is electrically connected to the control module. The plurality of second conducting terminals of the first switching unit are respectively electrically connected to the first conducting terminals of the plurality of second switching units and to a plurality of sensors on the main control board. The plurality of second conducting terminals of the second switching units are used to be electrically connected to a plurality of sensors on the service board.

[0012] The first switching unit is used to switch to the target sensor on the main control board according to the first sub-control signal in the control signal, or to switch to the second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the service board according to the second sub-control signal in the control signal.

[0013] In one possible implementation of the first aspect, the first switching unit includes a first multiplexer, the control terminal of the first multiplexer is electrically connected to the control module, the first conducting terminal of the first multiplexer is electrically connected to the control module, and the plurality of second conducting terminals of the first multiplexer are respectively electrically connected to the first conducting terminals of the plurality of second switching units and the plurality of sensors on the main control board.

[0014] In one possible implementation of the first aspect, the second switching unit includes a second multiplexer, the control terminal of the second multiplexer is electrically connected to the control module, the first conducting terminal of the second multiplexer is electrically connected to the second conducting terminal of the first switching unit, and the plurality of second conducting terminals of the second multiplexer are used to be electrically connected to a plurality of sensors on the service board.

[0015] In one possible implementation of the first aspect, the second switching unit further includes a plurality of signal conversion subunits, the first ends of the plurality of signal conversion subunits being electrically connected to a plurality of second conducting ends of the second multiplexer, and the second ends of the plurality of signal conversion subunits being electrically connected to a plurality of functional chips.

[0016] The signal conversion subunit is used to convert the signal output by the functional chip into a target signal and transmit the target signal to the second multiplexer.

[0017] In one possible implementation of the first aspect, the sensor control circuit further includes a heat dissipation module electrically connected to the control module.

[0018] Secondly, embodiments of this application provide an automatic testing device, including a main control board, multiple service boards, and a sensor control circuit as described in any of the first aspects. The main control board is provided with multiple sensors, and each of the service boards is provided with multiple sensors. The control module in the sensor control circuit is disposed on the main control board, and the switching module in the sensor control circuit is electrically connected to the multiple sensors on the main control board and the multiple sensors on each of the service boards, respectively.

[0019] The beneficial effects of the embodiments in this application compared with the prior art are:

[0020] This application provides a sensor control circuit for use in an automated testing equipment. The circuit includes a control module and a switching module, which are electrically connected. The switching module is used to electrically connect to multiple sensors on the main control board and multiple sensors on each service board of the automated testing equipment. When a user wants to know a certain state variable (e.g., temperature) of the automated testing equipment, the control module outputs a control signal to the switching module, controlling the switching module to switch to the target sensor, i.e., the temperature sensor. This connects the temperature sensor to the control module, while disconnecting other sensors. The control module can then directly read the data signal from the temperature sensor, allowing the user to know the temperature of the automated testing equipment.

[0021] As can be seen from the above, the sensor control circuit provided in this application embodiment uses only one control module to monitor all sensors. The entire circuit is simple to implement and low in cost. At the same time, the control module can obtain data information of a certain sensor by switching modules, which makes it convenient for the control module to read the sensor data information. It also makes it convenient for users to understand the changes of various state variables in the automatic testing equipment, so as to improve the reliability and safety of the automatic testing equipment and extend the service life of the automatic testing equipment.

[0022] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic block diagram of a sensor control circuit provided in one embodiment of this application;

[0025] Figure 2 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0026] Figure 3 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0027] Figure 4 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0028] Figure 5 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0029] Figure 6 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0030] Figure 7 This is a schematic block diagram of a sensor control circuit provided in another embodiment of this application;

[0031] Figure 8 This is a schematic block diagram of an automatic testing device provided in one embodiment of this application.

[0032] In the diagram: 10, Sensor control circuit; 11, Control module; 12, Switching module; 121, First switching unit; 1211, First FPGA chip; 1212, First multiplexer; 122, Second switching unit; 1221, Second FPGA chip; 1222, Signal conversion subunit; 1223, Second multiplexer; 13, Heat dissipation module; 20, Main control board; 30, Service board; 40, Functional chip; 50, Sensor. Detailed Implementation

[0033] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0034] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0035] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [the described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [the described condition or event] is detected," or "in response to detection of [the described condition or event]."

[0036] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0038] Traditional sensor control circuits involve setting up an MCU on the main control board and each service board of the ATE equipment to monitor the sensors on the main control board and each service board. Due to the large number of MCUs, the entire circuit is complex and costly; at the same time, the MCU has difficulty acquiring data from multiple sensors.

[0039] To address the aforementioned problems, embodiments of this application provide a sensor control circuit applied to automatic testing equipment, such as... Figure 1 As shown, the sensor control circuit 10 includes a control module 11 and a switching module 12. The control module 11 is electrically connected to the switching module 12. The switching module 12 is used to electrically connect to multiple sensors 50 on the main control board 20 and multiple sensors 50 on each business board 30 in the automatic test equipment.

[0040] Specifically, when a user wants to know a certain state variable (such as temperature) of the automatic testing equipment, the control module 11 outputs a control signal to the switching module 12 to control the switching module 12 to switch to the target sensor, namely the temperature sensor, so that the temperature sensor is connected to the control module 11 and other sensors are disconnected from the control module 11. Then the control module 11 can directly read the data signal of the temperature sensor so that the user can know the temperature of the automatic testing equipment.

[0041] As can be seen from the above, the sensor control circuit 10 provided in this application embodiment only uses one control module 11 to realize the monitoring of all sensors 50. The entire circuit is simple to implement and low in cost. At the same time, the control module 11 can obtain the data signal of a certain sensor 50 through the switching module 12, which makes it convenient for the control module 11 to read the data information of the sensor. It also makes it convenient for users to understand the changes of various state variables in the automatic testing equipment, so as to improve the reliability and safety of the automatic testing equipment and extend the service life of the automatic testing equipment.

[0042] For example, the control module 11 includes an MCU chip, which is electrically connected to the CPU (Central Processing Unit) chip on the main control board 20 via an IIC (Inter-Integrated Circuit) interface. An interrupt signal line is also provided between the MCU chip and the CPU chip. The MCU chip is electrically connected to the switching module 12 via the IIC interface.

[0043] Specifically, the MCU chip is used to monitor multiple sensors 50 on the main control board 20 and multiple sensors 50 on each service board 30. When abnormal information occurs, the MCU chip will trigger the interrupt of the CPU chip. The CPU chip obtains the abnormal information by reading the status information in the MCU chip and performs corresponding operations based on the abnormal information to ensure the safety of the automatic testing equipment.

[0044] This application uses an MCU chip as the main control chip for the sensor control circuit 10. The advantages are that it does not occupy CPU chip resources, does not affect the CPU chip's testing efficiency, and can work in parallel with the CPU chip. The CPU chip is used for chip testing, while the MCU chip is used for monitoring the sensor 50. Furthermore, the MCU chip has a very fast power-on startup speed, and can promptly monitor the status of the automatic testing equipment upon startup. If any abnormality is detected, it can promptly report it to the CPU chip, enabling the CPU chip to take appropriate actions based on the abnormality information, thus ensuring the safety of the automatic testing equipment.

[0045] For example, sensor 50 includes a temperature sensor, a humidity sensor, a pressure sensor, a speed sensor, etc.

[0046] It should be noted that since sensor 50 generally supports IIC interface, the switching module 12 and sensor 50 can be connected via IIC interface.

[0047] In some embodiments, such as Figure 2 As shown, the switching module 12 includes a first switching unit 121 and a plurality of second switching units 122. The input terminal of the first switching unit 121 is electrically connected to the control module 11. The plurality of output terminals of the first switching unit 121 are respectively electrically connected to the input terminals of the plurality of second switching units 122 and to the plurality of sensors 50 on the main control board 20. The plurality of output terminals of each second switching unit 122 are used to be electrically connected to the plurality of sensors 50 on a service board 30.

[0048] Specifically, the first switching unit 121 is used to switch to the target sensor on the main control board 20 according to the first sub-control signal in the control signal, or to switch to the corresponding second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the service board 30 according to the second sub-control signal in the control signal.

[0049] For example, when a user wants to know the temperature on the main control board 20, the control module 11 outputs a control signal to the switching module 12. The first switching unit 121 switches to the temperature sensor on the main control board 20 according to the first sub-control signal in the control signal, so that the temperature sensor on the main control board 20 is connected to the control module 11, and the other sensors 50 on the main control board 20 and the second switching unit 122 are disconnected from the control module 11. Then the control module 11 can directly read the data information of the temperature sensor on the main control board 20 so that the user can know the temperature on the main control board 20.

[0050] When a user wants to know the temperature on the service board 30, the control module 11 outputs a control signal to the switching module 12. The first switching unit 121 switches to the second target switching unit according to the first sub-control signal in the control signal. The second target switching unit then switches to the temperature sensor on the service board 30 according to the second sub-control signal in the control signal. This connects the temperature sensor on the service board 30 to the control module 11, while disconnecting the other sensors 50 on the service board 30 from the control module 11. The control module 11 can then directly read the data from the temperature sensor on the service board 30 so that the user can know the temperature on the service board 30.

[0051] It should be noted that the first switching unit 121 is set on the main control board 20, and the multiple second switching units 122 are respectively set on multiple service boards 30.

[0052] In some embodiments, such as Figure 3 As shown, the first switching unit 121 includes a first FPGA chip 1211. The input terminal of the first FPGA chip 1211 is electrically connected to the control module 11. The multiple output terminals of the first FPGA chip 1211 are respectively electrically connected to the input terminals of multiple second switching units 122 and multiple sensors 50 on the main control board 20.

[0053] Specifically, the first FPGA chip 1211 has an internal IIC switch circuit. When the user wants to know the temperature on the main control board 20, the control module 11 outputs a control signal to the switching module 12. The IIC switch circuit inside the first FPGA chip 1211 switches to the temperature sensor on the main control board 20 according to the first sub-control signal in the control signal, so that the temperature sensor on the main control board 20 is connected to the control module 11, and the other sensors 50 and the second switching unit 122 on the main control board 20 are disconnected from the control module 11. Then the control module 11 can directly read the data information of the temperature sensor on the main control board 20 so that the user can know the temperature on the main control board 20.

[0054] In some embodiments, such as Figure 3 As shown, the second switching unit 122 includes a second FPGA chip 1221. The input terminal of the second FPGA chip 1221 is electrically connected to the output terminal of the first switching unit 121. Multiple output terminals of the second FPGA chip 1221 are respectively used for electrical connection to multiple sensors 50 on the service board 30. According to... Figure 3 It can be seen that the input terminal of the second FPGA chip 1221 is electrically connected to the output terminal of the first FPGA chip 1211.

[0055] Specifically, the second FPGA chip 1221 has an internal IIC switch circuit. When a user wants to know the temperature on the service board 30, the control module 11 outputs a control signal to the switching module 12. The IIC switch circuit inside the first FPGA chip 1221 switches to the second target FPGA chip according to the first sub-control signal in the control signal. This causes the IIC switch circuit inside the second target FPGA chip to switch to the temperature sensor on the service board 30 according to the second sub-control signal in the control signal. This connects the temperature sensor on the service board 30 to the control module 11, while disconnecting the other sensors 50 on the service board 30 from the control module 11. The control module 11 can then directly read the data from the temperature sensor on the service board 30, allowing the user to know the temperature on the service board 30.

[0056] It should be noted that, in order to clearly illustrate the connections between the various parts, Figure 3 This only shows the case where there is one business board 30.

[0057] In some embodiments, such as Figure 4 As shown, multiple output terminals of the second FPGA chip 1221 are also used for electrical connection with multiple functional chips 40.

[0058] Specifically, the automatic test equipment also includes functional chips 40, which are used to implement the functions required in the test. These functional chips include PE chips (Programmable Logic Devices) and ADC chips (Analog-to-Digital Converters). The PE chip is used to implement the pin electrical connections in the test, and the ADC chip is used to measure analog quantities. Each of these functional chips 40 has its own communication interface (the PE chip supports the SPI interface (Serial Peripheral Interface), and the ADC chip supports the LVDS (Low Voltage Differential Signaling) interface). When the communication interfaces are mismatched, the control module 11 cannot read the internal status information of the functional chip 40. To solve this problem, the second FPGA chip 1221 has an interface conversion circuit inside to convert signals and facilitate the reading of the internal status information of the functional chip 40 (such as current information, voltage information, measurement range information, etc.). The interface conversion circuit inside the second FPGA chip 1221 also has a function of actively reporting anomalies, which can improve the timeliness of the CPU chip in handling anomalies.

[0059] It should be noted that, in order to clearly illustrate the connection relationships between the various parts, Figure 4 This only shows the case where there is one business board 30.

[0060] In some embodiments, such as Figure 5 As shown, the switching module 12 includes a first switching unit 121 and a plurality of second switching units 122. The control terminals of the first switching unit 121 and the plurality of second switching units 122 are electrically connected to the control module 11. The first conducting terminal of the first switching unit 121 is electrically connected to the control module 11. The plurality of second conducting terminals of the first switching unit 121 are respectively electrically connected to the first conducting terminals of the plurality of second switching units 122 and to the plurality of sensors 50 on the main control board 20. The plurality of second conducting terminals of the second switching units 122 are used to be electrically connected to the plurality of sensors 50 on the service board 30.

[0061] Specifically, the first switching unit 121 is used to switch to the target sensor on the main control board 20 according to the first sub-control signal in the control signal, or to switch to the second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the service board 30 according to the second sub-control signal in the control signal.

[0062] For example, when a user wants to know the temperature on the main control board 20, the control module 11 outputs a control signal to the switching module 12. The first switching unit 121 switches to the temperature sensor on the main control board 20 according to the first sub-control signal in the control signal, so that the temperature sensor on the main control board 20 is connected to the control module 11, and the other sensors 50 on the main control board 20 and the second switching unit 122 are disconnected from the control module 11. Then the control module 11 can directly read the data information of the temperature sensor on the main control board 20 so that the user can know the temperature on the main control board 20.

[0063] When a user wants to know the temperature on the service board 30, the control module 11 outputs a control signal to the switching module 12. The first switching unit 121 switches to the second target switching unit according to the first sub-control signal in the control signal. The second target switching unit then switches to the temperature sensor on the service board 30 according to the second sub-control signal in the control signal. This connects the temperature sensor on the service board 30 to the control module 11, while disconnecting the other sensors 50 on the service board 30 from the control module 11. The control module 11 can then directly read the data from the temperature sensor on the service board 30 so that the user can know the temperature on the service board 30.

[0064] In some embodiments, such as Figure 6 As shown, the first switching unit 121 includes a first multiplexer 1212. The control terminal of the first multiplexer 1212 is electrically connected to the control module 11. The first conducting terminal of the first multiplexer 1212 is electrically connected to the control module 11. The multiple second conducting terminals of the first multiplexer 1212 are respectively electrically connected to the first conducting terminals of multiple second switching units 122 and multiple sensors 50 on the main control board 20.

[0065] Specifically, when a user wants to know the temperature on the main control board 20, the control module 11 outputs a control signal to the switching module 12. The first multiplexer 1212 switches to the temperature sensor on the main control board 20 according to the first sub-control signal in the control signal, so that the temperature sensor on the main control board 20 is connected to the control module 11, and the other sensors 50 on the main control board 20 and the second switching unit 122 are disconnected from the control module 11. Then the control module 11 can directly read the data information of the temperature sensor on the main control board 20 so that the user can know the temperature on the main control board 20.

[0066] In some embodiments, such as Figure 6 As shown, the second switching unit 122 includes a second multiplexer 1223. The control terminal of the second multiplexer 1223 is electrically connected to the control module 11. The first conducting terminal of the second multiplexer 1223 is electrically connected to the second conducting terminal of the first switching unit 121. Multiple second conducting terminals of the second multiplexer 1223 are used for corresponding electrical connections with multiple sensors 50 on the service board 30. According to... Figure 6 As shown, the first conducting terminal of the second multiplexer 1223 is electrically connected to the second conducting terminal of the first multiplexer 1212.

[0067] Specifically, when a user wants to know the temperature on the service board 30, the control module 11 outputs a control signal to the switching module 12. The first multiplexer 1212 switches to the second target multiplexer according to the first sub-control signal in the control signal. The second target multiplexer then switches to the temperature sensor on the service board 30 according to the second sub-control signal in the control signal. This connects the temperature sensor on the service board 30 to the control module 11, while disconnecting the other sensors 50 on the service board 30 from the control module 11. The control module 11 can then directly read the data from the temperature sensor on the service board 30 so that the user can know the temperature on the service board 30.

[0068] It should be noted that the first multiplexer 1212 and the second multiplexer 1223 are multiplexer chips or multiplexer circuits built from integrated circuits.

[0069] It should be noted that, in order to clearly illustrate the connections between the various parts, Figure 6 This only shows the case where there is one business board 30.

[0070] In this embodiment of the application, the automatic testing equipment is further provided with a functional chip 40. The functional chip 40 is used to implement the functions required in the test. Each of these functional chips 40 has its own communication interface. When the communication interface is mismatched, the internal status information of the functional chip 40 cannot be read. Therefore, signal conversion is required. In order to achieve the above functions, a signal conversion subunit 1222 is also provided in the second switching unit 122.

[0071] like Figure 7 As shown, the second switching unit 122 also includes multiple signal conversion subunits 1222. The first end of the multiple signal conversion subunits 1222 is electrically connected to the multiple second conducting ends of the second multiplexer 1223, and the second end of the multiple signal conversion subunits 1222 is used to be electrically connected to the multiple functional chips 40.

[0072] Specifically, the signal conversion subunit 1222 is used to convert the signal output by the functional chip 40 into a target signal and transmit the target signal to the second multiplexer 1223. The target signal is a signal that supports the IIC interface.

[0073] It should be noted that, in order to clearly illustrate the connections between the various parts, Figure 7 This only shows the case where there is one business board 30.

[0074] In some embodiments, such as Figure 7As shown, the sensor control circuit 10 also includes a heat dissipation module 13, which is electrically connected to the control module 11.

[0075] Specifically, the control module 11 is used to output a PWM signal to the heat dissipation module 13, so that the heat dissipation module 13 adjusts its heat dissipation effect according to the PWM signal.

[0076] For example, the heat dissipation module 13 includes a fan.

[0077] Specifically, when the automatic testing equipment is first powered on, the control module 11 initially controls the fan to run at 50% speed. After the automatic testing equipment is operating normally, the control module 11 dynamically adjusts the fan speed according to the temperature of the automatic testing equipment to prevent overheating. The control module 11 can also monitor the fan speed to determine whether it matches the desired controlled speed, preventing fan malfunction.

[0078] This application also provides an automatic testing device, such as... Figure 8 As shown, the automatic testing equipment includes a main control board 20, multiple service boards 30, and the aforementioned sensor control circuit 10. The main control board 20 is equipped with multiple sensors 50, and each service board 30 is equipped with multiple sensors 50. The control module 11 in the sensor control circuit 10 is mounted on the main control board 20, and the switching module 12 in the sensor control circuit 10 is electrically connected to the multiple sensors 50 on the main control board 20 and the multiple sensors 50 on each service board 30. Since the automatic testing equipment provided in this application adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0079] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A sensor control circuit, applied to automatic test equipment, characterized in that: It includes a control module and a switching module, the control module is electrically connected to the switching module, and the switching module is used to electrically connect to multiple sensors on the main control board and multiple sensors on each business board in the automatic test equipment respectively; The control module is used to output a control signal to the switching module to control the switching module to switch to the target sensor so that the target sensor is connected to the control module.

2. The sensor control circuit according to claim 1, characterized in that: The switching module includes a first switching unit and a plurality of second switching units, the input end of the first switching unit is electrically connected to the control module, the plurality of output ends of the first switching unit are respectively electrically connected to the input ends of the plurality of second switching units and the plurality of sensors on the main control board, and the plurality of output ends of each second switching unit are used to be electrically connected to the plurality of sensors on one of the business boards; The first switching unit is used to switch to the target sensor on the main control board according to the first sub-control signal in the control signal, or to switch to the second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the business board according to the second sub-control signal in the control signal.

3. The sensor control circuit according to claim 2, characterized in that: The first switching unit includes a first FPGA chip, an input end of the first FPGA chip is electrically connected to the control module, and multiple output ends of the first FPGA chip are respectively electrically connected to multiple input ends of the second switching units and multiple sensors on the main control board.

4. The sensor control circuit according to claim 2, characterized in that: The second switching unit includes a second FPGA chip, an input end of the second FPGA chip is electrically connected to an output end of the first switching unit, and multiple output ends of the second FPGA chip are used to electrically connect to corresponding multiple sensors on the business board.

5. The sensor control circuit according to claim 1, characterized in that: The switching module includes a first switching unit and a plurality of second switching units, the control end of the first switching unit and the control ends of the plurality of second switching units are electrically connected to the control module, the first conduction end of the first switching unit is electrically connected to the control module, the plurality of second conduction ends of the first switching unit are respectively electrically connected to the first conduction ends of the plurality of second switching units and the plurality of sensors on the main control board, and the plurality of second conduction ends of the second switching units are used to be electrically connected to the plurality of sensors on the business board; The first switching unit is used to switch to the target sensor on the main control board according to the first sub-control signal in the control signal, or to switch to the second target switching unit according to the first sub-control signal in the control signal, so that the second target switching unit switches to the target sensor on the business board according to the second sub-control signal in the control signal.

6. The sensor control circuit according to claim 5, characterized in that: The first switching unit includes a first multi-way switch, a control end of the first multi-way switch is electrically connected to the control module, a first conduction end of the first multi-way switch is electrically connected to the control module, and multiple second conduction ends of the first multi-way switch are respectively electrically connected to the first conduction ends of multiple second switching units and multiple sensors on the main control board.

7. The sensor control circuit according to claim 5, characterized in that: The second switching unit includes a second multi-way switch, a control end of the second multi-way switch is electrically connected to the control module, a first conduction end of the second multi-way switch is electrically connected to the second conduction end of the first switching unit, and multiple second conduction ends of the second multi-way switch are used to electrically connect to corresponding multiple sensors on the business board.

8. The sensor control circuit according to claim 7, characterized in that: The second switching unit further includes a plurality of signal conversion subunits, wherein the first ends of the plurality of signal conversion subunits are electrically connected to the plurality of second conduction ends of the second multi-way switch, and the second ends of the plurality of signal conversion subunits are electrically connected to the plurality of function chips; The signal conversion subunit is used to convert the signal output by the functional chip into a target signal, and transmit the target signal to the second multi-way switch.

9. The sensor control circuit according to any one of claims 1 to 8, characterized in that: The sensor control circuit further includes a heat dissipation module, and the heat dissipation module is electrically connected to the control module.

10. An automatic testing device, characterized in that: It includes a main control board, multiple business boards and the sensor control circuit described in any one of claims 1-9, the main control board is provided with multiple sensors, each of the business boards is provided with multiple sensors, the control module in the sensor control circuit is arranged on the main control board, and the switching module in the sensor control circuit is electrically connected to the multiple sensors on the main control board and the multiple sensors on each of the business boards, respectively.

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