Automatic thick sheet picking device

Abstract

The utility model relates to the technical field of automation equipment, and particularly discloses an automatic thick sheet picking device. The automatic thick sheet picking device is used for picking thick sheets of a crystal support assembly clamped by a mechanical arm and comprises a rack, and a movable plate capable of moving up and down and a lifting driving assembly driving the movable plate to move up and down are arranged on the rack; the top face of the movable plate is horizontally connected with a sliding base in a sliding mode, and the sliding base is provided with a clamping assembly used for clamping a thick sheet to be picked and a rotation driving piece used for driving the clamping assembly to rotate. The movable plate is provided with a linear driving piece for driving the sliding base to slide in the horizontal direction. A blanking port is formed in the movable plate, and a recycling frame is arranged below the blanking port; and the removed thick sheets fall into the recovery frame in an inclined state through the material falling opening after being loosened by the clamping assembly. According to the automatic thick sheet picking device, the picked thick sheets can be recycled, the device cost is low, and the sheets are not prone to being broken.

Description

Technical Field

[0001] The utility model relates to the field of automation equipment, in particular to an automatic thick sheet picking device. Background Art

[0002] In the prior art, there are two main ways to remove thick slices from the wafer support assembly. One is to manually break or knock off the thick slices from the wafer support assembly, and the other is to use a robot to remove the thick slices from the wafer support assembly and then move them to a recycling conveyor line for recycling. For example, the patent with publication number CN217476320U adopts this removal method. However, the problem with the former method is that the thick slices that are broken or knocked off are easy to form fragments, which is not conducive to recycling. Although the latter method can realize the recycling of thick slices, the cost of the entire equipment is relatively high because a robot with multiple degrees of freedom is required. Summary of the invention

[0003] The utility model aims to provide an automatic thick slice picking device, which can realize the recycling of the thick slices after picking, has low device cost and is not easy to break.

[0004] To achieve this purpose, the utility model adopts the following technical solutions:

[0005] An automatic thick slice removing device is used to remove the thick slice of the wafer support assembly clamped by a robot, and the automatic thick slice removing device comprises a frame, and a movable plate that can move up and down and a lifting drive assembly that drives the movable plate to move up and down are arranged on the frame;

[0006] The top surface of the movable plate is horizontally slidably connected to a slide seat, and the slide seat is provided with a clamping assembly for clamping the thick slice to be picked and a rotating driving member for driving the clamping assembly to rotate; the movable plate is provided with a linear driving member for driving the slide seat to slide in the horizontal direction;

[0007] The movable plate is provided with a material dropping opening, and a recovery rack is arranged below the material dropping opening; after the clamping assembly releases the clamping, the removed thick slice falls into the recovery rack in an inclined state through the material dropping opening.

[0008] Furthermore, the clamping assembly includes a rotating plate rotatably connected to the slide seat, the top surface of the rotating plate is slidably connected to two opposite clamping members, and the clamping members are connected to a clamping driving member that drives them to slide; the rotating plate is connected to the rotating driving member and is provided with a second air avoidance hole.

[0009] Furthermore, a group of buffers is arranged between the two clamping members.

[0010] Furthermore, the opposite clamping sides of the two clamping members are respectively connected with rubber pads.

[0011] Furthermore, the lifting drive assembly includes two vertically arranged screw rods, two screw rod nuts, a pulley assembly and a motor; the screw rod is rotatably connected to the frame and is threadedly connected with the screw rod nut; the lower ends of the two screw rods are transmission connected to the output end of the motor through the pulley assembly; the two screw rod nuts are connected to the movable plate.

[0012] Furthermore, the rotary drive component is a rotary cylinder; and the linear drive component is an electric linear slide.

[0013] Furthermore, a plurality of vertical guide posts are arranged on the frame, a guide sleeve is arranged on the sliding sleeve of the guide post, and the guide sleeve is connected to the movable plate.

[0014] Furthermore, two upper and lower baffles are provided on one end side of the recovery rack, and the width of the lower baffle is greater than the width of the upper baffle.

[0015] Furthermore, the frame is slidably connected to a pull-out plate, and a group of limit blocks for clamping the recovery rack are provided on the top surface of the pull-out plate.

[0016] Furthermore, a distance measuring sensor for measuring the distance of the thick slice of the wafer support assembly clamped by the robot is arranged on the frame.

[0017] Furthermore, a detection sensor for detecting whether the recovery rack is full of slabs is provided on the rack.

[0018] The beneficial effects of the utility model are as follows: the utility model is an automatic thick slice removing device, after the robot clamps the crystal support assembly and moves into position, the thick slice to be removed is clamped and fixed by the clamping assembly, the movable plate is driven to move downward by the lifting drive assembly, and the clamping assembly is driven to move downward to clamp the thick slice, thereby removing the thick slice from the crystal support assembly; the clamping assembly is driven to rotate by the rotating drive member to rotate the thick slice to an inclined state; after the clamping assembly releases the clamping, the thick slice falls into the recovery rack in an inclined state, thereby realizing the recovery of the thick slice, the structure is simple, the device cost is low, and it is not easy to be broken. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The utility model is a structural schematic diagram of an automatic thick sheet picking device provided by the utility model.

[0020] Figure 2 It is a front view of an automatic thick sheet picking device provided by the utility model.

[0021] Figure 3 yes Figure 1 Schematic diagram of the structure of the clamping assembly.

[0022] Figure 4 yes Figure 1Schematic diagram of the structure of the recycling rack in .

[0023] In the figure: 1-frame; 11-movable plate; 111-feeding port; 12-slide seat; 121-sliding plate; 122-support; 123-first avoidance hole; 13-guide column; 14-guide sleeve; 2-lifting drive assembly; 21-screw; 22-screw nut; 3-clamping assembly; 31-rotating plate; 311-second avoidance hole; 32-clamping member; 33-clamping drive member; 34-buffer; 35-rubber pad; 4-rotating drive member; 5-linear drive member; 6-recovery frame; 61-baffle; 62-pull-out plate; 63-limiting block; 64-handle; 65-mounting table; 7-distance sensor; 100-crystal support assembly; 110-thick sheet. DETAILED DESCRIPTION

[0024] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0025] like Figures 1 to 3 As shown, an automatic thick slice picking device is used to pick the thick slice 110 of the crystal support assembly 100 clamped by a robot, and the automatic thick slice picking device includes a frame 1, on which is provided a movable plate 11 which can move up and down and a lifting drive assembly 2 for driving the movable plate 11 to move up and down; the top surface of the movable plate 11 is horizontally slidably connected to a slide 12, on which is provided a clamping assembly 3 for clamping the thick slice 110 to be picked and a rotating drive member 4 for driving the clamping assembly 3 to rotate; the movable plate 11 is provided with a linear drive member 5 for driving the slide 12 to slide in a horizontal direction; the movable plate 11 is provided with a drop opening 111, and a recovery rack 6 is provided below the drop opening 111; the removed thick slice 110 falls into the recovery rack 6 in an inclined state through the drop opening 111 after the clamping assembly 3 releases the clamping.

[0026] In this embodiment, the manipulator fixes the wafer support assembly 100 by means of clamping with a clamping claw or clamping with a clamping claw, and the two thick slices 110 are respectively located at the two ends of the bottom surface of the wafer support assembly 100. Among them, a distance sensor 7 for measuring the distance of the thick slice 110 of the wafer support assembly 100 clamped by the manipulator is provided on the frame 1. The distance sensor 7 is preferably an infrared distance sensor. When in use, the distance sensor 7 is used to measure the distance of the thick slice 110, so that the clamping assembly 3 is accurately moved to the right below the thick slice 110 to be removed, so as to accurately clamp the thick slice 110 to be removed.

[0027] In this embodiment, the slide 12 includes a sliding plate 121 and two supports 122. The sliding plate 121 is slidably connected to the movable plate 11 through two slide rails disposed on both sides of the blanking port 111, and is provided with a first air-avoiding hole 123; the two supports 122 are disposed on both sides of the first air-avoiding hole 123 and connected to the top surface of the sliding plate 121. In this embodiment, the linear drive member 5 is preferably an electric linear slide.

[0028] like Figure 3 As shown, the clamping assembly 3 includes a rotating plate 31 rotatably connected to the two supports 122 of the slide seat 12, and the top surface of the rotating plate 31 is slidably connected to two opposite clamping members 32 through two slide rails. The clamping members 32 are connected to a clamping driving member 33 that drives them to slide, and the clamping driving member 33 is preferably a cylinder; wherein the rotating plate 31 is connected to the rotating driving member 4 and is provided with a second air avoidance hole 311.

[0029] In this embodiment, the clamping member 32 can be a clamping plate or a plurality of spaced and connected clamping blocks, which can be provided in one piece or in separate pieces. The contact between the clamping member 32 and the thick sheet 110 can be surface contact or multi-point contact.

[0030] Furthermore, rubber pads 35 are respectively connected to the opposite clamping sides of the two clamping members 32. A set of buffers 34 is arranged between the two clamping members 32. By arranging the buffers 34 and the rubber pads 35, the thick sheet 110 can be effectively prevented from being crushed during the process of removing the thick sheet 110.

[0031] In this embodiment, the rotary driving member 4 is preferably a rotary cylinder.

[0032] In this embodiment, the lifting drive assembly 2 includes two vertically arranged screw rods 21, two screw rod nuts 22, a pulley assembly and a motor. The screw rod 21 is rotatably connected to the frame 1 and is threaded with the screw rod nut 22; the lower ends of the two screw rods 21 are transmission-connected to the output end of the motor through the pulley assembly; the two screw rod nuts 22 are connected to the movable plate 11. When in use, the power output by the motor is transmitted to the two screw rods 21 through the pulley assembly, so that the two screw rods 21 rotate synchronously relative to the frame 1, thereby driving the movable plate 11 to move up and down.

[0033] Furthermore, the frame 1 is provided with a plurality of vertical guide posts 13, on which a guide sleeve 14 is slidably sleeved, and the guide sleeve 14 is connected to the movable plate 11. In this embodiment, the guide sleeve 14 and the guide post 13 are slidably matched to prevent the movable plate 11 from deflecting during the up and down movement.

[0034] like Figure 4As shown, the recovery rack 6 includes two side plates, the bottom ends of the two side plates are connected by a bottom plate, two limiting support rods and two side limiting rods are connected between the two side plates, and a space for storing a plurality of thick slices 110 is formed between the two limiting support rods and the two side limiting rods. Among them, two upper and lower baffles 61 are arranged on one end side of the recovery rack 6, and the width of the lower baffle 61 is greater than that of the upper baffle 61, so that the thick slices 110 can be placed obliquely.

[0035] Furthermore, the frame 1 is slidably connected with a pull-out plate 62, and a group of limit blocks 63 are provided on the top surface of the pull-out plate 62 for clamping the recycling rack 6. A handle 64 is provided on one side of the pull-out plate 62. When the recycling rack 6 is full of thick slices 110, the pull-out plate 62 is first pulled out to take out the recycling rack 6 full of thick slices 110, and then the empty recycling rack 6 is clamped on the pull-out plate 62 through a group of limit blocks 63, and then the pull-out plate 62 is pushed in to continue collecting the removed thick slices 110.

[0036] A mounting platform 65 may be provided on the frame 1 to elevate the pull-out plate 62 and the recovery frame 6 for easy operation.

[0037] Furthermore, the frame 1 is provided with a detection sensor 8 for detecting whether the thick slices 110 in the recovery frame 6 are full. The detection sensor 8 is preferably an infrared sensor.

[0038] In this embodiment, side panels can be installed on the four sides of the frame 1, and a bottom panel and a top panel can be installed on the bottom and top surfaces respectively. The four side panels, the bottom panel and the top panel enclose a working space for removing the thick slice 110, and an opening is provided on the top panel to facilitate the robot to clamp the crystal support assembly 100 in and out. By setting a relatively closed working space, interference from external light can be minimized, thereby improving the measurement accuracy of the distance sensor 7 and the detection accuracy of the detection sensor 8.

[0039] The utility model discloses an automatic thick slice removing device. After the crystal support assembly 100 held by the manipulator moves into position, the distance sensor 7 is used to measure the distance of the thick slice 110 to be removed; the linear driving member 5 drives the slide 12 to move horizontally according to the distance measurement result, so that the clamping assembly 3 moves accurately to the bottom of the thick slice 110 to be removed; under the drive of the lifting driving member 2, the movable plate 11 moves upward, driving the clamping assembly 3 to move upward to the clamping position; under the drive of the two clamping driving members 33, the two clamping members 31 move toward each other to clamp and fix the thick slice 110 to be removed. The thick slice 110 is removed from the wafer support assembly 100; the movable plate 11 moves downward under the driving of the lifting drive assembly 2, driving the clamping assembly 3 to clamp the thick slice 110 and move downward, thereby removing the thick slice 110 from the wafer support assembly 100; the clamping assembly 3 rotates the thick slice 110 under the driving of the rotating drive member 4, so that the thick slice 110 rotates to an inclined state; the two clamping members 31 move back to back under the driving of the two clamping drive members 33, thereby releasing the clamping of the thick slice 110; finally, the thick slice 110 falls into the recovery rack 6 in an inclined state through the drop opening 111. After the thick slice 110 is removed, the clamping assembly 3 is driven to move in the horizontal direction by the linear drive member 5, and the drop position of the thick slice 110 can be adjusted, so that the thick slices 110 entering the recovery rack 6 are arranged in sequence.

[0040] The utility model provides an automatic thick slice removing device, which can automatically remove the thick slices on the wafer support assembly 100 and recycle the removed thick slices. The device has a simple structure, low device cost, and is not prone to fragmentation.

[0041] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. An automatic thick slice removing device, used for removing a thick slice (110) from a wafer support assembly (100) held by a robot, characterized in that: The automatic thick sheet picking device comprises a frame (1), on which a movable plate (11) which can move up and down and a lifting drive component (2) which drives the movable plate (11) to move up and down are arranged; The top surface of the movable plate (11) is horizontally slidably connected to a slide seat (12), and the slide seat (12) is provided with a clamping assembly (3) for clamping the thick slice (110) to be removed and a rotating driving member (4) for driving the clamping assembly (3) to rotate; the movable plate (11) is provided with a linear driving member (5) for driving the slide seat (12) to slide in a horizontal direction; The movable plate (11) is provided with a material dropping opening (111), and a recovery rack (6) is arranged below the material dropping opening (111); after the clamping assembly (3) releases the clamping, the removed thick slice (110) falls into the recovery rack (6) in an inclined state through the material dropping opening (111).

2. The automatic thick sheet picking device according to claim 1, characterized in that: The clamping assembly (3) comprises a rotating plate (31) rotatably connected to the sliding seat (12); the top surface of the rotating plate (31) is slidably connected to two opposite clamping members (32); the clamping members (32) are connected to a clamping driving member (33) for driving them to slide; the rotating plate (31) is connected to the rotating driving member (4) and is provided with a second air avoidance hole (311).

3. The automatic thick sheet picking device according to claim 2, characterized in that: A group of buffers (34) is arranged between the two clamping members (32).

4. The automatic thick sheet picking device according to claim 2, characterized in that: The opposite clamping sides of the two clamping members (32) are respectively connected with rubber pads (35).

5. The automatic thick sheet picking device according to claim 1, characterized in that: The lifting drive assembly (2) comprises two vertically arranged screw rods (21), two screw rod nuts (22), a pulley assembly and a motor; the screw rod (21) is rotatably connected to the frame (1) and is threadedly connected to the screw rod nut (22); the lower ends of the two screw rods (21) are transmission-connected to the output end of the motor through the pulley assembly; and the two screw rod nuts (22) are connected to the movable plate (11).

6. The automatic thick sheet picking device according to claim 1 or 5, characterized in that: A plurality of vertical guide posts (13) are arranged on the frame (1), a guide sleeve (14) is provided on the sliding sleeve of the guide post (13), and the guide sleeve (14) is connected to the movable plate (11).

7. The automatic thick sheet picking device according to claim 1, characterized in that: An upper and lower baffle plates (61) are arranged on one end side of the recovery frame (6), and the width of the lower baffle plate (61) is greater than the width of the upper baffle plate (61).

8. The automatic thick sheet picking device according to claim 1 or 7, characterized in that: The frame (1) is slidably connected to a pull-out plate (62), and a group of limit blocks (63) for clamping the recovery rack (6) are provided on the top surface of the pull-out plate (62).

9. The automatic thick sheet picking device according to claim 1, characterized in that: The frame (1) is provided with a distance measuring sensor (7) for measuring the distance of the thick slice (110) of the wafer support assembly (100) clamped by the robot.

10. The automatic thick sheet picking device according to claim 1, characterized in that: The frame (1) is provided with a detection sensor (8) for detecting whether the thick sheets (110) in the recovery frame (6) are full.

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