Dustproof heat dissipation integrated circuit chip

Abstract

The utility model relates to the technical field of integrated circuit chips, in particular to a dustproof heat dissipation integrated circuit chip, which comprises a chip main body, an aluminum cover is sleeved outside the chip main body, a heat dissipation cavity is integrated and fixed at the top of the aluminum cover, air inlets are formed in four sides of the bottom of the heat dissipation cavity, an air outlet is formed in the center of the top of the heat dissipation cavity, and the air inlet is communicated with the air outlet. The air inlet and the air outlet are filled and fixed with air filter elements, a connecting pipe is integrated on the inner side of the air outlet, a micro motor is fixedly connected to the center of the mounting frame, and blades are fixedly connected to the output end of the micro motor. The purpose of the utility model is to provide the dustproof heat dissipation integrated circuit chip so as to solve the problems that the existing integrated circuit chip is installed in an exposed manner, dust is easy to accumulate on the surface of the chip after long-term use, the heat dissipation of the chip is influenced, the heat loss of the chip is increased, the service life of the chip is shortened, and a circuit board is scrapped due to direct damage if the chip is seriously used.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chips, in particular to a dust-proof and heat-dissipating integrated circuit chip. Background Art

[0002] An integrated circuit chip is an electronic component including a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring. Its structure is that the circuit is formed on the silicon substrate, and the circuit has at least one output / input pad. The fixed sealing ring is formed on the silicon substrate and surrounds the circuit and the output / input pad. The grounding ring is formed between the silicon substrate and the output / input pad and is electrically connected to the fixed sealing ring. The guard ring is arranged on the silicon substrate and surrounds the output / input pad to be electrically connected to the fixed sealing ring.

[0003] Existing integrated circuit chips are all installed naked, and long-term use can easily cause dust to accumulate on their surfaces, affecting their heat dissipation, increasing chip heat loss, shortening their service life, and in severe cases directly damaging the circuit board and causing it to be scrapped. Utility Model Content

[0004] The utility model aims to provide a dustproof and heat-dissipating integrated circuit chip to solve the problem that the existing integrated circuit chips are all exposedly installed, and long-term use easily causes dust to accumulate on the surface, thereby affecting the heat dissipation, increasing the heat loss of the chip, shortening its service life, and in severe cases directly damaging it and thus causing the circuit board to be scrapped.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A dustproof and heat-dissipating integrated circuit chip comprises a chip body, the outside of the chip body is sleeved with an aluminum cover, a heat dissipation cavity is integrated and fixed on the top of the aluminum cover, air inlets are opened on the four sides of the bottom of the heat dissipation cavity, an air outlet is opened in the top center of the heat dissipation cavity, the insides of the air inlet and the air outlet are filled and fixed with air filter elements, a connecting pipe is integrated on the inside of the air outlet, the inside of the connecting pipe is fixedly connected to a mounting frame, the center of the mounting frame is fixedly connected to a micro motor, and the output end of the micro motor is fixedly connected to a blade.

[0007] Preferably, heat dissipation silicone grease is filled between the top of the chip body and the bottom of the aluminum cover.

[0008] Preferably, the interior of the heat dissipation cavity is divided into a plurality of guide grooves by a guide plate, and the direction of the guide grooves is from the air inlet to the air outlet.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] 1. In the utility model, an aluminum cover is added to the outside of the chip body to ensure the strength of the chip's external structure, and with the heat dissipation silicone grease filled inside the aluminum cover, the heat generated by the chip operation can be quickly transferred to the outside and the heat dissipation cavity, and then the micro motor arranged in the connecting pipe in the heat dissipation cavity can drive the blades to rotate to achieve fan air cooling and heat dissipation, so as to improve the heat dissipation capacity of the chip itself.

[0011] 2. In the utility model, by opening air inlets on the four sides of the bottom of the heat dissipation cavity and opening an air outlet in the center of the top, and adding air filter elements at the air inlet and outlet, the air flowing through the air inlet and outlet can be filtered to achieve the purpose of dust prevention. At the same time, the bottom-in and top-out structural design can prevent dust from accumulating on the chip, ensure its good heat dissipation capacity, reduce its thermal damage, and thus ensure the chip life and safety of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is an upper axis view of a dust-proof and heat-dissipating integrated circuit chip of the utility model;

[0013] Figure 2 This is a lower axis view of a dust-proof and heat-dissipating integrated circuit chip of the utility model;

[0014] Figure 3 The utility model is a structural cross-sectional view of a dust-proof and heat-dissipating integrated circuit chip.

[0015] In the figure: 1. Chip body; 2. Aluminum cover; 3. Heat dissipation cavity; 4. Air inlet; 5. Air outlet; 6. Air filter element; 7. Connecting pipe; 8. Mounting frame; 9. Micro motor; 10. Blades; 11. Heat dissipation silicone grease; 12. Guide plate; 13. Guide groove. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0017] See also Figure 1-3 , the utility model provides a technical solution:

[0018] A dustproof and heat-dissipating integrated circuit chip comprises a chip body 1, the outside of the chip body 1 is sleeved with an aluminum cover 2 to realize the outer wrapping of the chip, so as to improve its structural strength, prevent bumping and extrusion, and also conduct heat quickly to improve the heat dissipation effect of the chip; a heat dissipation cavity 3 is integrated and fixed on the top of the aluminum cover 2, air inlets 4 are opened on the four sides of the bottom of the heat dissipation cavity 3, and an air outlet 5 is opened at the top center of the heat dissipation cavity 3, and the inside of the air inlet 4 and the air outlet 5 are filled and fixed with an air filter element 6 for filtering dust in the air; a connecting pipe 7 is integrated on the inside of the air outlet 5, and a mounting frame 8 is fixedly connected to the inside of the connecting pipe 7, a micro motor 9 is fixedly connected to the center of the mounting frame 8, and a blade 1 is fixedly connected to the output end of the micro motor 9 0, the micro motor 9 can be used to drive the blades 10 to rotate, thereby forming a heat dissipation fan, and then the air outside the air inlet 4 at the bottom of the heat dissipation cavity 3 can be sucked in, and the air filter 6 is used to filter the air to prevent dust, and then the air entering the heat dissipation cavity 3 is used for heat exchange, and the heat generated by the operation of the chip body 1 is taken out from the air outlet 5, thereby realizing the use of air cooling cycle to carry out efficient and active heat dissipation of the chip, so as to reduce thermal damage to the chip and extend the service life of the chip; at the same time, the closed top heat dissipation cavity design can prevent dust from directly contacting the chip, thereby reducing the influence of dust on the heat dissipation of the chip, and the heat dissipation cavity is designed for bottom-in and top-out air circulation, which can prevent dust accumulation on the top of the heat dissipation cavity, thereby completely realizing dust prevention of the chip.

[0019] In this embodiment, please refer to Figure 3 The top of the chip body 1 and the bottom of the aluminum cover 2 are filled with heat dissipation silicone grease 11 to improve the heat conduction efficiency between the chip body and the aluminum cover.

[0020] In this embodiment, please refer to Figure 3 The interior of the heat dissipation cavity 3 is divided into a plurality of guide grooves 13 by a guide plate 12. The direction of the guide groove 13 is from the air inlet 4 to the air outlet 5. The guide plate is used to guide the air to prevent the air intakes on the four sides from interfering with each other. A plurality of equally spaced fixed guide plates can serve as structural plates for strengthening the heat dissipation cavity structure. At the same time, the integrated fixing method can also serve as heat dissipation fins to increase the heat exchange contact area in the heat dissipation cavity and ensure its heat exchange efficiency, so as to further improve its heat dissipation effect.

[0021] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions. The sentence "includes an element defined by ... does not exclude the existence of other identical elements in the process, method, article or device including the element".

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dust-proof and heat-dissipating integrated circuit chip, comprising a chip body (1), characterized in that: The chip body (1) is sleeved with an aluminum cover (2) on the outside, a heat dissipation cavity (3) is integrated and fixed on the top of the aluminum cover (2), air inlets (4) are provided on the four sides of the bottom of the heat dissipation cavity (3), an air outlet (5) is provided at the center of the top of the heat dissipation cavity (3), the air inlets (4) and the air outlets (5) are filled and fixed with air filters (6), a connecting pipe (7) is integrated on the inner side of the air outlet (5), a mounting frame (8) is fixedly connected to the inside of the connecting pipe (7), a micro motor (9) is fixedly connected to the center of the mounting frame (8), and a blade (10) is fixedly connected to the output end of the micro motor (9).

2. The dust-proof and heat-dissipating integrated circuit chip according to claim 1, characterized in that: Heat dissipation silicone grease (11) is filled between the top of the chip body (1) and the bottom of the aluminum cover (2).

3. The dust-proof and heat-dissipating integrated circuit chip according to claim 1, characterized in that: The interior of the heat dissipation cavity (3) is divided into a plurality of guide grooves (13) by a guide plate (12), and the direction of the guide grooves (13) is from the air inlet (4) to the air outlet (5).

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