Heat dissipation copper foil adhesive tape for heat dissipation of mobile phone

Abstract

The utility model discloses a heat dissipation copper foil adhesive tape for heat dissipation of a mobile phone, which belongs to the technical field of copper foil adhesive tapes and is characterized by comprising a copper foil adhesive tape main body, the copper foil adhesive tape main body comprises a copper foil layer, a connecting adhesive layer is arranged at the bottom of the copper foil layer, and a release film layer is arranged at the bottom of the connecting adhesive layer. The heat dissipation copper foil tape comprises a copper foil layer, a connecting layer is arranged at the top of the copper foil layer, a heat dissipation layer is arranged at the top of the connecting layer, and an insulating layer is arranged at the top of the heat dissipation layer. The copper foil is exposed at the outer side, and the metal base material has conductivity, so that the copper foil is inevitably contacted with other external objects, that is, the copper foil is easily contacted with a conductive circuit or a metal shell, interference on the circuit is caused, and the use effect is influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of copper foil tapes, in particular to a heat dissipation copper foil tape used for heat dissipation of mobile phones. Background Art

[0002] Copper foil tape is a metal tape, mainly used for electromagnetic shielding, which is divided into electrical signal shielding and magnetic signal shielding. Electrical signal shielding mainly relies on the excellent electrical conductivity of copper itself, and copper foil tape also has good thermal conductivity, which can effectively dissipate the heat generated in electronic equipment. Sticking copper foil tape on heat dissipation components can improve the heat dissipation effect and protect the normal operation of electronic equipment. Therefore, it is widely used in mobile phones, notebooks and other digital products.

[0003] The existing copper foil tape used for heat dissipation of mobile phones has a base metal copper foil that is conductive. When the copper foil tape is attached to the surface of the application device that needs heat dissipation, the copper foil will be exposed on the outside. Since the metal base material is conductive, it will inevitably come into contact with other external objects, that is, it is easy to come into contact with conductive circuits or metal shells, which will cause interference in the circuit. Utility Model Content

[0004] The utility model provides a heat dissipation copper foil tape for mobile phone heat dissipation, aiming to solve the problem that the base metal copper foil of the existing heat dissipation copper foil tape for mobile phone heat dissipation is conductive, when the heat dissipation copper foil tape is attached to the surface of the application equipment that needs heat dissipation, the copper foil will be exposed on the outside, and because the metal base material is conductive, it will inevitably contact other external objects, that is, it is easy to contact the conductive circuit or metal shell, which will cause interference in the circuit, thereby affecting the use effect.

[0005] The utility model is implemented as follows: a heat dissipation copper foil tape for mobile phone heat dissipation comprises a copper foil tape body, wherein the copper foil tape body comprises a copper foil layer, a connecting adhesive layer is arranged at the bottom of the copper foil layer, and a release film layer is arranged at the bottom of the connecting adhesive layer, a connecting layer is arranged at the top of the copper foil layer, and a heat dissipation layer is arranged at the top of the connecting layer, and an insulating layer is arranged at the top of the heat dissipation layer.

[0006] In order to achieve the effect of improving the thermal conductivity between the copper foil layer and the heat dissipation layer, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, a thermal conductive column is arranged on the top of the copper foil layer, and the top of the thermal conductive column passes through the top of the connecting layer and is connected to the heat dissipation layer.

[0007] In order to achieve the effect of improving heat conduction, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, the heat conductive columns are made of heat conductive silica gel and are evenly arranged on the top of the copper foil layer.

[0008] In order to achieve the effect of improving the heat dissipation of the copper foil tape body, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, the heat dissipation layer is made of graphite material and is bonded to the top of the copper foil layer through a connecting layer.

[0009] In order to achieve the effect of improving the heat dissipation of the heat dissipation layer, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, aerogel particles are evenly arranged inside the heat dissipation layer, and the aerogel particles are hydrophobic silica aerogel or graphene aerogel.

[0010] In order to achieve the effect of enhancing the bonding strength of the copper foil tape body at high temperatures, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, the connecting adhesive layer and the connecting layer are both composed of silicone pressure-sensitive adhesive and are evenly coated on the top and bottom of the copper foil layer respectively.

[0011] In order to make the copper foil tape body have insulation properties, so that the copper foil tape is not easy to conduct electricity and affect the heat dissipation effect of the mobile phone, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, the insulating layer is made of silicone rubber and is bonded to the top of the heat dissipation layer.

[0012] In order to achieve the effect that the insulating layer can quickly dissipate heat, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, a plurality of heat dissipation holes are opened inside the insulating layer, and the heat dissipation holes are arranged in a columnar shape.

[0013] In order to achieve the effect of conducting heat away, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, a plurality of connection holes are opened at the bottom of the insulating layer, and the top and bottom of the connection holes are respectively connected to the heat dissipation holes and in contact with the heat dissipation layer.

[0014] In order to achieve the effect of enhancing the heat dissipation of the insulating layer, as a preferred heat dissipation copper foil tape for mobile phone heat dissipation of the utility model, a through hole is opened between two adjacent heat dissipation holes, and the two adjacent heat dissipation holes are connected through the through hole.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] The heat dissipation copper foil tape used for heat dissipation of mobile phones is provided with a copper foil layer, and the copper foil layer has good thermal conductivity, and can effectively dissipate the heat generated in the electronic equipment. The copper foil tape body is attached to the heat dissipation element, and the heat dissipation effect can be improved to protect the normal operation of the electronic equipment. The copper foil layer and the heat dissipation layer are used in combination to enhance the heat dissipation effect of the copper foil tape body, and the heat dissipation effect of the copper foil tape body on the mobile phone is greatly improved. Moreover, the compositely provided insulating layer can make the copper foil tape body have a certain insulating layer, and avoid the interference on the circuit generated when the copper foil tape body contacts the conductive circuit or the metal shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is the overall structure diagram of the heat dissipation copper foil tape used for mobile phone heat dissipation of the utility model;

[0018] Figure 2 This is an exploded schematic diagram of the copper foil tape body in the utility model;

[0019] Figure 3 It is a schematic diagram of the connection between the copper foil layer and the heat dissipation layer in the utility model;

[0020] Figure 4 It is a schematic diagram of the connection between the heat dissipation layer and the insulation layer in the utility model;

[0021] Figure 5 It is a top view schematic diagram of the insulating layer in the utility model.

[0022] In the figure, 1. copper foil tape body; 101. copper foil layer; 102. connecting adhesive layer; 103. release film layer; 104. connecting layer; 105. heat dissipation layer; 106. insulation layer; 2. thermal conductive column; 3. heat dissipation hole; 4. connecting hole. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, in the description of the present invention, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0025] See also Figure 1-5 The utility model provides a technical solution: a heat dissipation copper foil tape for mobile phone heat dissipation, comprising a copper foil tape body 1, the copper foil tape body 1 comprising a copper foil layer 101, a connecting adhesive layer 102 is arranged at the bottom of the copper foil layer 101, and a release film layer 103 is arranged at the bottom of the connecting adhesive layer 102, a connecting layer 104 is arranged at the top of the copper foil layer 101, and a heat dissipation layer 105 is arranged at the top of the connecting layer 104, and an insulating layer 106 is arranged at the top of the heat dissipation layer 105.

[0026] In this embodiment: by setting the copper foil layer 101, the copper foil layer 101 has good thermal conductivity and can effectively dissipate the heat generated in the electronic device. The copper foil tape body 1 is attached to the heat dissipation element to improve the heat dissipation effect and protect the normal operation of the electronic device. The copper foil layer 101 and the heat dissipation layer 105 are used in conjunction to enhance the heat dissipation effect of the copper foil tape body 1, which greatly improves the heat dissipation effect of the copper foil tape body 1 on the mobile phone. Moreover, by the composite insulating layer 106, the copper foil tape body 1 can have a certain insulating layer 106, thereby avoiding the circuit interference generated when the copper foil tape body 1 contacts the conductive circuit or the metal casing.

[0027] As a technical optimization solution of the present invention, a heat-conducting column 2 is provided on the top of the copper foil layer 101 , and the top of the heat-conducting column 2 passes through the top of the connecting layer 104 and is connected to the heat dissipation layer 105 .

[0028] In this embodiment, by providing a heat-conducting column 2 and connecting the heat-conducting column 2 to the heat-dissipating layer 105 , the thermal conductivity between the copper foil layer 101 and the heat-dissipating layer 105 can be improved, so that the heat can be quickly conducted out and dissipated through the heat-dissipating layer 105 .

[0029] As a technical optimization solution of the present invention, the heat-conducting pillars 2 are made of heat-conducting silica gel and are evenly arranged on the top of the copper foil layer 101 .

[0030] In this embodiment, the thermal conductivity can be improved by setting the thermally conductive column 2 to be made of thermally conductive silicone.

[0031] As a technical optimization solution of the present invention, the heat dissipation layer 105 is made of graphite material and is bonded to the top of the copper foil layer 101 through the connection layer 104 .

[0032] In this embodiment: by setting the heat dissipation layer 105 to be composed of graphite material, it can be used in conjunction with the copper foil layer 101 to enhance the heat dissipation effect of the copper foil tape body 1, and greatly improve the heat dissipation effect of the copper foil tape body 1 on the mobile phone.

[0033] As a technical optimization solution of the present invention, aerogel particles are uniformly arranged inside the heat dissipation layer 105, and the aerogel particles are hydrophobic silica aerogel or graphene aerogel.

[0034] In this embodiment, by providing aerogel particles, the heat dissipation performance of the heat dissipation layer 105 can be improved.

[0035] As a technical optimization solution of the present invention, the connecting adhesive layer 102 and the connecting layer 104 are both made of silicone pressure-sensitive adhesive and are evenly coated on the top and bottom of the copper foil layer 101 respectively.

[0036] In this embodiment, by setting the adhesive layer and the connecting layer 104 to be composed of organic silicone pressure-sensitive adhesive, the bonding strength of the strong copper foil tape body 1 at high temperature can be ensured.

[0037] As a technical optimization solution of the present invention, the insulating layer 106 is made of silicone rubber and is bonded to the top of the heat dissipation layer 105 .

[0038] In this embodiment, the insulating layer 106 is made of silicone rubber to make the copper foil tape body 1 insulating, so that the copper foil tape is not easy to conduct electricity and affect the heat dissipation effect of the mobile phone, and it also has good thermal conductivity and heat dissipation effect.

[0039] As a technical optimization solution of the present invention, a plurality of heat dissipation holes 3 are provided inside the insulating layer 106 , and the heat dissipation holes 3 are arranged in a columnar shape.

[0040] In this embodiment, the heat dissipation holes 3 are provided to dissipate the heat inside the insulating layer 106 .

[0041] As a technical optimization solution of the present invention, a plurality of connection holes 4 are opened at the bottom of the insulating layer 106 , and the top and bottom of the connection holes 4 are respectively connected to the heat dissipation holes 3 and in contact with the heat dissipation layer 105 .

[0042] In this embodiment, by providing the connection hole 4 , the heat inside the heat dissipation layer 105 can be conducted out through the insulation layer 106 again.

[0043] As a technical optimization solution of the present invention, a through hole is provided between two adjacent heat dissipation holes 3 , and the two adjacent heat dissipation holes 3 are connected through the through hole.

[0044] In this embodiment, two adjacent heat dissipation holes 3 are arranged to be connected through a through hole, so that the heat dissipation effect of the insulating layer 106 can be enhanced.

[0045] Working principle: By setting the copper foil layer 101, the copper foil layer 101 has good thermal conductivity and can effectively dissipate the heat generated in the electronic device. The copper foil tape body 1 is attached to the heat dissipation element to improve the heat dissipation effect and protect the normal operation of the electronic device. The copper foil layer 101 and the heat dissipation layer 105 are used in conjunction to enhance the heat dissipation effect of the copper foil tape body 1, which greatly improves the heat dissipation effect of the copper foil tape body 1 on the mobile phone. Moreover, through the composite insulating layer 106, the copper foil tape body 1 can have a certain insulating layer 106, thereby avoiding the circuit interference generated when the copper foil tape body 1 contacts the conductive circuit or the metal casing.

[0046] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation copper foil tape for mobile phone heat dissipation, comprising a copper foil tape body (1), characterized in that: The copper foil tape body (1) comprises a copper foil layer (101), a connecting adhesive layer (102) is arranged at the bottom of the copper foil layer (101), and a release film layer (103) is arranged at the bottom of the connecting adhesive layer (102), a connecting layer (104) is arranged at the top of the copper foil layer (101), and a heat dissipation layer (105) is arranged at the top of the connecting layer (104), and an insulating layer (106) is arranged at the top of the heat dissipation layer (105).

2. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: A heat-conducting column (2) is provided on the top of the copper foil layer (101), and the top of the heat-conducting column (2) penetrates the top of the connecting layer (104) and is connected to the heat dissipation layer (105).

3. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 2, characterized in that: The heat-conducting columns (2) are made of heat-conducting silica gel and are evenly arranged on the top of the copper foil layer (101).

4. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: The heat dissipation layer (105) is made of graphite material and is bonded to the top of the copper foil layer (101) via a connecting layer (104).

5. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: Aerogel particles are evenly arranged inside the heat dissipation layer (105), and the aerogel particles are hydrophobic silica aerogel or graphene aerogel.

6. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: The connecting adhesive layer (102) and the connecting layer (104) are both made of organic silicone pressure-sensitive adhesive and are evenly coated on the top and bottom of the copper foil layer (101), respectively.

7. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: The insulating layer (106) is made of silicone rubber and is bonded to the top of the heat dissipation layer (105).

8. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 1, characterized in that: A plurality of heat dissipation holes (3) are provided inside the insulating layer (106), and the heat dissipation holes (3) are arranged in a columnar shape.

9. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 8, characterized in that: A plurality of connection holes (4) are provided at the bottom of the insulating layer (106), and the top and bottom of the connection holes (4) are respectively connected to the heat dissipation holes (3) and in contact with the heat dissipation layer (105).

10. The heat dissipation copper foil tape for mobile phone heat dissipation according to claim 8, characterized in that: A through hole is provided between two adjacent heat dissipation holes (3), and the two adjacent heat dissipation holes (3) are connected via the through hole.

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