Servo driver shell with efficient heat dissipation

Abstract

The utility model discloses an efficient heat dissipation servo driver housing, which comprises an installation housing, the interior of the installation housing is provided with a heat dissipation cavity, the cross section of the heat dissipation cavity is U-shaped, the inner walls of the two sides of the installation housing are provided with heat dissipation holes distributed in a linear array, one ends of the plurality of heat dissipation holes are communicated with the inner wall of the heat dissipation cavity, and the other ends of the plurality of heat dissipation holes are communicated with the inner wall of the heat dissipation cavity. The lower surface of the installation shell is fixedly connected with a base, the upper surface of the installation shell is fixedly communicated with an exhaust pipe, through the cooling device, air flow entering the installation shell is cooled, so that the effect of cooling the interior of the installation shell is improved, and the problem that when the outside temperature is high, the air flow enters the installation shell is solved. And after high-temperature gas enters the mounting shell, the heat dissipation effect cannot be achieved, and the temperature rise in the mounting shell can be aggravated.

Description

Technical Field

[0001] The utility model relates to the technical field of servo drivers, in particular to a servo driver housing with high-efficiency heat dissipation. Background Art

[0002] A servo drive is a controller used to control a servo motor. Its function is similar to that of a frequency converter on an ordinary AC motor. It is a part of a servo system and is mainly used in high-precision positioning systems. It generally controls the servo motor in three ways: position, speed, and torque to achieve high-precision transmission system positioning. It is a high-end product of transmission technology. Servo drives are an important part of modern motion control and are widely used in automation equipment such as industrial robots and CNC machining centers. In particular, servo drives used to control AC permanent magnet synchronous motors have become a research hotspot at home and abroad. The existing servo drive housing has a simple structure, and the internal structural components are prone to high internal temperatures during operation, which affects the long-term use of the overall device and reduces its service life.

[0003] For example, a servo drive housing with high heat dissipation efficiency disclosed in a Chinese patent document (publication number: CN212970315U) has a quick disassembly effect of the overall device through the provision of a movable push plate. When the user moves the movable push plate toward the inside of the mounting sleeve, the movable push plate shrinks the movable block to the inside of the mounting slot through the push rod, so that the plug rod can be pulled out from the inside of the slot, which is convenient for quick disassembly between the upper housing and the lower housing. However, the heat dissipation of the housing is only achieved through the rotation of multiple sets of heat dissipation fan blades. This passive heat dissipation efficiency is low, and when the outside temperature is high, the high-temperature gas from the outside will be sucked into the inside of the housing, which not only fails to dissipate the heat of the housing, but also aggravates the problem of rising temperature inside the housing. Utility Model Content

[0004] The purpose of the utility model is to provide a servo drive housing with high efficiency in heat dissipation, so as to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a servo drive housing with high efficiency in heat dissipation, comprising a mounting housing, a heat dissipation cavity is provided inside the mounting housing, the cross section of the heat dissipation cavity is in a U-shaped shape, heat dissipation holes distributed in a linear array are provided on the inner walls of both sides of the mounting housing, one end of each of the heat dissipation holes is connected to the inner wall of the heat dissipation cavity, a base is fixedly connected to the lower surface of the mounting housing, and an exhaust pipe is fixedly connected to the upper surface of the mounting housing;

[0006] A cooling device is provided at one end of the exhaust pipe, and the cooling device includes an air guide block, and a side surface of the air guide block is fixedly connected to one end of the exhaust pipe.

[0007] Preferably, the upper surface of the air guide block is fixedly connected to the lower surface of the base, the other side surface of the air guide block is provided with air outlet holes distributed in a linear array, and the interior of the base is provided with a mounting groove.

[0008] Preferably, the upper end of the mounting groove is connected to the inner bottom wall of the heat dissipation cavity, a refrigeration cavity is opened inside the base, a suction fan is fixedly installed on the inner wall of the mounting groove, and the inner bottom wall of the mounting groove is fixedly connected to an air guide tube.

[0009] Preferably, one end of the air guide tube penetrates and extends to the interior of the refrigeration cavity, the outer surface of the air guide tube is fixedly connected to a coil, and one end of the coil penetrates and extends to a side surface of the base.

[0010] Preferably, one end of the coil is fixedly connected to a dustproof box, and one side surface of the dustproof box is fixedly connected to one side surface of the base.

[0011] Preferably, a filter screen is fixedly sleeved on the inner bottom wall of the dustproof box, and a mounting opening is provided on the inner bottom wall of the refrigeration cavity.

[0012] Preferably, a semiconductor refrigeration plate is fixedly mounted on the inner wall of the mounting opening, and a heat dissipation end of the semiconductor refrigeration plate is fixedly connected with heat dissipation fins distributed in a linear array.

[0013] Compared with the prior art, the beneficial effect of the utility model is that the cooling device can cool the airflow entering the interior of the installation shell, thereby improving the cooling effect on the interior of the installation shell, and solves the problem that when the external temperature is high, the high-temperature gas not only fails to dissipate heat after entering the installation shell, but also aggravates the problem of the temperature increase inside the installation shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 A three-dimensional diagram of the installation housing structure of a servo drive housing with high efficiency heat dissipation proposed by the utility model;

[0016] Figure 3 A three-dimensional diagram of the coil structure of a servo drive housing with high efficiency heat dissipation proposed by the utility model;

[0017] Figure 4 This is a three-dimensional diagram of the base structure of a servo drive housing with high efficiency heat dissipation proposed by the utility model.

[0018] In the figure: 1. Installation shell; 2. Heat dissipation cavity; 3. Heat dissipation hole; 4. Base; 5. Exhaust pipe; 6. Air guide block; 61. Air outlet hole; 62. Installation slot; 63. Refrigeration cavity; 64. Suction fan; 65. Air guide tube; 66. Coil; 67. Dust box; 68. Filter; 69. Installation port; 610. Semiconductor refrigeration plate; 611. Heat dissipation fins. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-Figure 4 The utility model provides a technical solution: a servo drive housing with high efficiency in heat dissipation, comprising a mounting housing 1, a heat dissipation cavity 2 is provided inside the mounting housing 1, the cross section of the heat dissipation cavity 2 is in a U-shaped shape, heat dissipation holes 3 distributed in a linear array are provided on the inner walls of both sides of the mounting housing 1, one end of each of the plurality of heat dissipation holes 3 is connected to the inner wall of the heat dissipation cavity 2, a base 4 is fixedly connected to the lower surface of the mounting housing 1, and an exhaust pipe 5 is fixedly connected to the upper surface of the mounting housing 1;

[0021] A cooling device is provided at one end of the exhaust pipe 5 , and the cooling device includes an air guide block 6 , and a side surface of the air guide block 6 is fixedly connected to one end of the exhaust pipe 5 .

[0022] Furthermore, the upper surface of the air guide block 6 is fixedly connected to the lower surface of the base 4, and the other side surface of the air guide block 6 is provided with air outlet holes 61 distributed in a linear array. The interior of the base 4 is provided with a mounting groove 62, and the heat dissipation holes 3 are arranged at an angle, so as to facilitate the rapid upward flow of the airflow after heat exchange. Through the arrangement of the exhaust pipe 5, the air guide block 6 and the air outlet holes 61, the airflow after heat exchange can be quickly discharged.

[0023] Furthermore, the upper end of the mounting groove 62 is connected to the inner bottom wall of the heat dissipation cavity 2, a refrigeration cavity 63 is opened inside the base 4, a suction fan 64 is fixedly installed on the inner wall of the mounting groove 62, and an air guide tube 65 is fixedly connected to the inner bottom wall of the mounting groove 62. The suction fan 64 sucks the external airflow into the heat dissipation cavity 2 through the air guide tube 65 for heat dissipation.

[0024] Furthermore, one end of the air guide tube 65 passes through and extends to the interior of the refrigeration cavity 63, and the outer surface of the air guide tube 65 is fixedly connected to a coil 66, and one end of the coil 66 passes through and extends to a side surface of the base 4. The coil 66 can be made of pure copper material. Through the high thermal conductivity of pure copper, the airflow in the coil 66 can be quickly cooled, and a plurality of heat exchange rods can be arranged inside the coil 66 to increase the contact area with the airflow and improve the cooling efficiency.

[0025] Furthermore, one end of the coil 66 is fixedly connected to a dustproof box 67, and one side surface of the dustproof box 67 is fixedly connected to one side surface of the base 4. The dustproof box 67 prevents dust from being mixed into the coil 66 when it inhales external air.

[0026] Furthermore, a filter screen 68 is fixedly sleeved on the inner bottom wall of the dustproof box 67, and a mounting opening 69 is provided on the inner bottom wall of the refrigeration cavity 63. The filter screen 68 is arranged at the bottom of the dustproof box 67 to prevent the filter screen 68 from being easily adsorbed and accumulated by dust and thus becoming clogged.

[0027] Furthermore, a semiconductor refrigeration plate 610 is fixedly installed on the inner wall of the installation opening 69, and the heat dissipation end of the semiconductor refrigeration plate 610 is fixedly connected with heat dissipation fins 611 distributed in a linear array. The heat dissipation fins 611 accelerate the heat dissipation of the heat dissipation end of the semiconductor refrigeration plate 610, thereby improving the cooling efficiency of the cooling end of the semiconductor refrigeration plate 610.

[0028] Through the cooling device, the airflow entering the installation shell 1 is cooled, thereby improving the cooling effect inside the installation shell 1, and solving the problem that when the external temperature is high, the high-temperature gas not only fails to dissipate heat after entering the installation shell 1, but also aggravates the increase in the temperature inside the installation shell 1.

[0029] Working principle: Step 1, the cold air emitted from the cooling end of the semiconductor refrigeration sheet 610 is used to pre-cool the coil 66 inside the refrigeration cavity 63, and the suction fan 64 is started to work. The suction fan 64 sucks the outside air into the heat dissipation cavity 2 through the cooperation of the air guide tube 65 and the coil 66. When sucking, the dust in the sucked air is filtered and blocked through the cooperation of the dust box 67 and the filter 68, and then the airflow is heat exchanged and cooled when passing through the coil 66, and the temperature of the airflow is reduced;

[0030] Step two, after the cooled airflow enters the heat dissipation cavity 2, it is blown out obliquely through multiple groups of heat dissipation holes 3, and the low-temperature airflow is used to quickly cool down and exchange heat for the inside of the installation shell 1. Since the heat dissipation holes 3 are arranged at an angle, the airflow after heat exchange moves upward, and the heated airflow is discharged from the inside of the installation shell 1 through the exhaust pipe 5, and is transported to the inside of the air guide block 6, and blown out through multiple air outlet holes 61, so that the flowing wind generated when it is blown out can accelerate the heat exchange of the heat dissipation fins 611, and the heat dissipation efficiency of the heat dissipation end of the semiconductor refrigeration plate 610 is improved by the accelerated heat exchange of the heat dissipation fins 611, thereby improving the cooling effect of its cooling end, and then improving the heat dissipation effect of the installation shell 1.

[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A servo drive housing with high heat dissipation efficiency, comprising a mounting housing (1), characterized in that: A heat dissipation cavity (2) is provided inside the installation shell (1), the cross section of the heat dissipation cavity (2) is in a U-shape, heat dissipation holes (3) distributed in a linear array are provided on the inner walls of both sides of the installation shell (1), one end of each of the plurality of heat dissipation holes (3) is connected to the inner wall of the heat dissipation cavity (2), the lower surface of the installation shell (1) is fixedly connected to a base (4), and the upper surface of the installation shell (1) is fixedly connected to an exhaust pipe (5); A cooling device is provided at one end of the exhaust pipe (5), and the cooling device comprises an air guide block (6), and a side surface of the air guide block (6) is fixedly connected to one end of the exhaust pipe (5).

2. The servo drive housing with high heat dissipation according to claim 1, characterized in that: The upper surface of the air guide block (6) is fixedly connected to the lower surface of the base (4), the other side surface of the air guide block (6) is provided with air outlet holes (61) distributed in a linear array, and the base (4) is provided with a mounting groove (62) inside.

3. A servo drive housing with high heat dissipation according to claim 2, characterized in that: The upper end of the mounting groove (62) is in communication with the inner bottom wall of the heat dissipation cavity (2); a refrigeration cavity (63) is provided inside the base (4); a suction fan (64) is fixedly mounted on the inner wall of the mounting groove (62); and an air guide tube (65) is fixedly connected to the inner bottom wall of the mounting groove (62).

4. The servo drive housing with high heat dissipation according to claim 3, characterized in that: One end of the air guide tube (65) penetrates and extends into the interior of the refrigeration cavity (63); the outer surface of the air guide tube (65) is fixedly connected to a coil (66); one end of the coil (66) penetrates and extends to a side surface of the base (4).

5. The servo drive housing with high heat dissipation according to claim 4, characterized in that: One end of the coil (66) is fixedly connected to a dustproof box (67), and one side surface of the dustproof box (67) is fixedly connected to one side surface of the base (4).

6. The servo drive housing with high heat dissipation according to claim 5, characterized in that: A filter screen (68) is fixedly sleeved on the inner bottom wall of the dustproof box (67), and a mounting opening (69) is provided on the inner bottom wall of the refrigeration cavity (63).

7. The servo drive housing with high heat dissipation according to claim 6, characterized in that: A semiconductor cooling plate (610) is fixedly mounted on the inner wall of the mounting opening (69), and a heat dissipation end of the semiconductor cooling plate (610) is fixedly connected to heat dissipation fins (611) distributed in a linear array.

Images