Scribing mechanism and laser scribing equipment
By designing a sharding mechanism including guides and mobile seats, the complex structure and control problems during the process of sub-chip splitting after silicon wafer splitting are solved, and higher reliability and smaller footprint are achieved.
Patent Information
- Application Number
- CN202420962468.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-06
AI Technical Summary
In the prior art, the splitting method of the sub-chip after the silicon wafer is split has complex structure and control procedures, resulting in high failure rate and large space occupancy.
A piecewise mechanism is designed, including mounting parts, guide parts, moving seats, adsorption parts and driving parts. The guide parts move along the longitudinal slide rail, and the chute limits are used to keep the moving seats away, so as to realize the separation of the sub-pieces. .
The structure and control of the sharding mechanism is simplified, the failure rate is reduced, the reliability is improved, and the equipment is reduced in size and space.
Smart Images
Figure CN222448819U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of silicon wafer separation, and specifically to a slicing mechanism and a laser slicing device. Background Art
[0002] In the photovoltaic industry, in order to improve utilization or reduce costs, it is sometimes necessary to cut a whole silicon wafer into multiple pieces by laser for use, such as cutting a whole silicon wafer into two halves. At this time, in the transportation link, after the whole silicon wafer is cut, the cut sub-wafers need to be split, and then each sub-wafer is transported back separately for the next process.
[0003] Currently, in the relevant technology, the commonly used automated splitting method is to use multiple sets of independent mechanisms to absorb a sub-piece respectively and transmit it to the back end. However, this method has the problem of complex structure and control procedures, resulting in a high failure rate and a large space volume. Utility Model Content
[0004] In view of this, the present application provides a simpler slicing mechanism and laser scribing equipment to reduce the complexity of the structure and control, thereby improving reliability and reducing occupied space.
[0005] In one embodiment of the present application, a slicing mechanism is provided, which is used to split the sub-chips formed after the silicon wafer is cut, and includes a mounting member, a guide member, at least two moving seats, at least two adsorbing members and a driving member. The mounting member is provided with a transverse slide rail and a longitudinal slide rail. The guide member is connected to the longitudinal slide rail and moves along the longitudinal slide rail, and the guide member is provided with at least two non-parallel inclined grooves. Each moving seat has a first extension portion and a second extension portion connected to each other, and the first extension portion and the second extension portion are respectively located on opposite sides of the guide member, and the first extension portion is connected to the transverse slide rail and moves along the transverse slide rail. Each first extension portion is provided with a slide member, and each slide member is arranged in a corresponding inclined groove, and an avoidance space is formed between the first extension portion and the second extension portion, and the moving seat avoids the guide member through the avoidance space. Each adsorbing member is arranged at a corresponding second extension portion, and each adsorbing member is configured to adsorb a corresponding sub-chip. The driving member is arranged on the mounting member and connected to the guide member, and the driving member drives the guide member to move along the longitudinal slide rail, and limits the slide member through the groove wall of the inclined groove, so that at least two moving seats are separated from each other along the transverse slide rail to split the sub-chip adsorbed by the adsorbing member.
[0006] In the slice splitting mechanism provided by the present application, when the driving member drives the guide member to move along the longitudinal slide rail, the guide member limits the slide member through the groove wall of the inclined groove, so that at least two moving seats can be moved away from each other along the transverse slide rail to split the sub-sheets adsorbed by the adsorption member, that is, only one driving member is needed to achieve the splitting of at least two sub-sheets, so that the slice splitting mechanism can replace multiple sets of independent mechanisms, thereby simplifying the complexity of the structure and control, reducing the failure rate, and improving reliability. In addition, the moving seat avoids the guide member by forming an avoidance space between the first extension part and the second extension part, so that the adsorption member does not need to avoid the moving range of the guide member in the longitudinal direction, and there is no need to consider whether the adsorption member will interfere with the guide member when installing, thereby saving space in the longitudinal direction to reduce the volume of the slice splitting mechanism and reduce the occupied space.
[0007] In some embodiments, the slicing mechanism further includes a shell, which is disposed on the mounting member, and the shell is located between the guide member and the second extension portion. The movable seat avoids the shell through the avoidance space, and the shell blocks the side of the guide member facing away from the mounting member.
[0008] In some embodiments, the slicing mechanism also includes a sensor, which is disposed on the shell or the mounting member. The guide member has a triggering portion. When the triggering portion moves with the guide member to the position of the triggering sensor, the driving member stops driving the guide member to position the movable seat.
[0009] In some embodiments, the sensor is disposed on a side of the shell facing away from the guide member, the shell is provided with an opening, the trigger portion is exposed through the opening on the side of the shell facing away from the guide member, the sensor is provided with a slot, and the trigger portion is inserted into the slot to trigger the sensor.
[0010] In some embodiments, the driving member includes a driver, a rotating member and a connecting member. The driver and the rotating member are arranged on the mounting member. The driver drives the rotating member to rotate around an axis parallel to the longitudinal slide rail. The connecting member connects the rotating member and the guide member. The rotating rotating member drives the connecting member and the guide member to move along the longitudinal slide rail.
[0011] In some embodiments, the driving member also includes a driving wheel, a driven wheel and a transmission belt. The driving wheel is connected to the driver, the driven wheel is coaxially connected to the rotating member, the transmission belt connects the driving wheel and the driven wheel, the driving member drives the driving wheel to rotate, and the driving wheel drives the driven wheel and the rotating member to rotate through the transmission belt.
[0012] In some embodiments, the guide member has at least one weight-reducing groove.
[0013] In some embodiments, the weight reducing grooves and the inclined grooves are arranged in parallel with each other in the transverse direction, and the length of the weight reducing grooves extends longitudinally or extends obliquely, so that each weight reducing groove can accommodate a sliding member. When the guide member moves along the longitudinal slide rail, the groove wall of the weight reducing groove limits the sliding member, so that the corresponding moving seat moves along the transverse slide rail.
[0014] In some embodiments, the mounting member is provided with more than two transverse slide rails arranged longitudinally, each first extension portion is connected to at least one transverse slide rail through a slider, the transverse slide rails connected to each first extension portion are different, the transverse width of the first extension portion is smaller than the transverse width of the slider, each first extension portion has a gap between it and the unconnected transverse slide rail, and each first extension portion avoids the slider of the adjacent first extension portion through the gap.
[0015] In one embodiment of the present application, a laser scribing device is also provided, which includes a main conveying mechanism, at least two sub-conveying mechanisms, a transfer mechanism and the slicing mechanism of any of the above embodiments. The main conveying mechanism conveys the cut silicon wafer, and each sub-conveying mechanism conveys a sub-wafer split by the slicing mechanism. The slicing mechanism is arranged on the transfer mechanism, and the transfer mechanism drives the slicing mechanism to move so that the slicing mechanism absorbs the silicon wafer and places each split sub-wafer on the corresponding sub-conveying mechanism.
[0016] In the laser scribing equipment provided by the present application, when the driving member drives the guide member to move along the longitudinal slide rail, the guide member limits the slide member through the groove wall of the inclined groove, so that at least two movable seats can be moved away from each other along the transverse slide rail to split the sub-sheets adsorbed by the adsorption member, that is, only one driving member is needed to achieve the splitting of at least two sub-sheets, so that the slice splitting mechanism can replace multiple sets of independent mechanisms, thereby simplifying the complexity of the structure and control, reducing the failure rate, and improving reliability. In addition, the movable seat avoids the guide member by forming an avoidance space between the first extension part and the second extension part, so that the adsorption member does not need to avoid the moving range of the guide member in the longitudinal direction, and there is no need to consider whether the adsorption member will interfere with the guide member when installing, thereby saving space in the longitudinal direction to reduce the volume of the laser scribing equipment and reduce the occupied space. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a three-dimensional diagram of a laser scribing device in one embodiment of the present application.
[0018] Figure 2 for Figure 1 A three-dimensional diagram of the middle segmentation mechanism.
[0019] Figure 3 for Figure 2 A three-dimensional diagram of the middle splitting mechanism without the shell, wherein the movable seat and the adsorption member are in close positions.
[0020] Figure 4 for Figure 3 A three-dimensional diagram of another state of the middle slice-splitting mechanism, wherein the movable seat and the adsorbent are in positions far away from each other.
[0021] Figure 5 for Figure 3 The main view of the middle sharding mechanism.
[0022] Figure 6 for Figure 4 The main view of the middle sharding mechanism.
[0023] Figure 7 for Figure 3 A three-dimensional diagram of the middle splitting mechanism without the guide parts.
[0024] Main component symbols
[0025] Sharding mechanism 100
[0026] Mounting 10
[0027] Horizontal slide rail 11
[0028] Slider 111
[0029] Longitudinal slide rail 12
[0030] Guide 20
[0031] Chute 21
[0032] Trigger unit 22
[0033] Weight reduction slot 23
[0034] Mobile seat 30
[0035] The first extension portion 31
[0036] Gap 311
[0037] The second extension portion 32
[0038] Slide 33
[0039] Avoidance space 34
[0040] Adsorption parts 40
[0041] Driving member 50
[0042] Drive 51
[0043] Rotating member 52
[0044] Connector 53
[0045] Driving wheel 54
[0046] Driven wheel 55
[0047] Transmission belt 56
[0048] Housing 60
[0049] Opening 61
[0050] Sensor 70
[0051] Slot 71
[0052] Silicon wafer 200
[0053] Sub-film 201
[0054] Laser scribing equipment 300
[0055] Main conveying mechanism 301
[0056] Sub-conveying mechanism 302
[0057] Transfer mechanism 303 DETAILED DESCRIPTION
[0058] The technical solution of the present application will be described below in conjunction with the drawings in the implementation modes of the present application. Obviously, the described implementation modes are only part of the implementation modes of the present application, rather than all the implementation modes.
[0059] It should be noted that when a component is referred to as being "provided on", "connected to" or "fixed to" another component, it may be directly on the other component or there may be a central component. The terms "vertical" and "horizontal" used in this article refer to the vertical or horizontal state within a certain error range, not vertical or horizontal in an absolute sense. The terms "first", "second", "third", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance. The terms "X-axis", "Y-axis" or "Z-axis" refer to all directions parallel to the coordinate axes X, Y, and Z in the accompanying drawings, including positive and negative directions. The three axes of coordinates X, Y, and Z in the accompanying drawings are perpendicular to each other.
[0060] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "or / and" used herein includes any and all combinations of one or more of the related listed items.
[0061] In the photovoltaic industry, in order to improve utilization or reduce costs, it is sometimes necessary to cut a whole silicon wafer into multiple pieces by laser, such as cutting a whole silicon wafer into two halves. At this time, in the transportation link, after the whole silicon wafer is cut, the cut sub-pieces need to be split, and then each sub-piece is transported back to the next process. Currently, in the relevant technology, the commonly used automated splitting method is to use multiple sets of independent mechanisms to absorb a sub-piece and transmit it to the back end, but this method has the problem of complex structure and control procedures, resulting in a high failure rate and large space occupied.
[0062] In view of this, the present application provides a more simplified slicing mechanism and laser scribing equipment to reduce the complexity of structure and control, thereby improving reliability and reducing occupied space. The slicing mechanism is used to split the sub-chips formed after the silicon wafer is cut. The slicing mechanism includes a mounting member, a guide member, at least two movable seats, at least two adsorption members and a driving member. The mounting member is provided with a transverse slide rail and a longitudinal slide rail. The guide member is connected to the longitudinal slide rail and moves along the longitudinal slide rail, and the guide member is provided with at least two inclined grooves. Each movable seat has a first extension portion and a second extension portion connected to each other, and the first extension portion and the second extension portion are respectively located on opposite sides of the guide member. The first extension portion is connected to the transverse slide rail and moves along the transverse slide rail. Each first extension portion is provided with a slide member, and each slide member is arranged in a corresponding inclined groove. An avoidance space is formed between the first extension portion and the second extension portion, and the movable seat avoids the guide member through the avoidance space. Each adsorption member is arranged at a corresponding second extension portion, and each adsorption member is configured to adsorb a corresponding sub-chip. The driving member is arranged on the mounting member and connected to the guide member. The driving member drives the guide member to move along the longitudinal slide rail and limits the slide member through the groove wall of the inclined groove, so that at least two moving seats move away from each other along the transverse slide rail to separate the sub-pieces adsorbed by the adsorption member.
[0063] In the slice splitting mechanism provided by the present application, when the driving member drives the guide member to move along the longitudinal slide rail, the guide member limits the slide member through the groove wall of the inclined groove, so that at least two moving seats can be moved away from each other along the transverse slide rail to split the sub-sheets adsorbed by the adsorption member, that is, only one driving member is needed to achieve the splitting of at least two sub-sheets, so that the slice splitting mechanism can replace multiple sets of independent mechanisms, thereby simplifying the complexity of the structure and control, reducing the failure rate, and improving reliability. In addition, the moving seat avoids the guide member by forming an avoidance space between the first extension part and the second extension part, so that the adsorption member does not need to avoid the moving range of the guide member in the longitudinal direction, and there is no need to consider whether the adsorption member will interfere with the guide member when installing, thereby saving space in the longitudinal direction to reduce the volume of the slice splitting mechanism and reduce the occupied space.
[0064] Combine the following Figures 1 to 7 , some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.
[0065] like Figures 2 to 6In an embodiment of the present application, a slicing mechanism 100 is provided, which is used to split the sub-chips 201 formed after the silicon wafer 200 is cut. The slicing mechanism 100 includes a mounting member 10, a guide member 20, a movable seat 30, an adsorption member 40 and a driving member 50. A transverse slide rail 11 and a longitudinal slide rail 12 are provided on the same side of the mounting member 10. The transverse slide rail 11 extends along the X-axis in the figure, and the longitudinal slide rail 12 extends along the Z-axis in the figure. The guide member 20 is connected to the longitudinal slide rail 12 and can move along the longitudinal slide rail 12. The guide member 20 is provided with at least two non-parallel inclined grooves 21, and the length of each inclined groove 21 extends along the XZ plane and is inclined relative to the Z-axis. The movable seat 30 has at least two, each movable seat 30 is connected to the transverse slide rail 11 and can move along the transverse slide rail 11. Each movable seat 30 is provided with a slide 33, and each slide 33 is arranged in a corresponding inclined groove 21 and can move along the inclined groove 21. There are at least two adsorbing members 40, each of which is disposed on a corresponding moving seat 30, and each of which is used to adsorb a corresponding sub-wafer 201 in the silicon wafer 200. The driving member 50 is disposed on the mounting member 10 and connected to the guide member 20, and the driving member 50 is used to drive the guide member 20 to move along the longitudinal slide rail 12. When the guide member 20 moves, it can limit the slide member 33 through the groove wall of the inclined groove 21, thereby driving each moving seat 30 to move along the transverse slide rail 11, so that each moving seat 30 is moved away from each other to separate the sub-wafer 201 adsorbed by each adsorbing member 40, or each moving seat 30 is moved close to each other to reset, in preparation for adsorbing another silicon wafer 200.
[0066] As an illustrative example, the longitudinal slide rail 12 is vertically arranged, and the transverse slide rail 11 is horizontally arranged. When the guide member 20 descends, the various moving seats 30 are driven to move away from each other, and when the guide member 20 rises, the various moving seats 30 are driven to move closer to each other.
[0067] Since the slicing mechanism 100 only needs to control one driving member 50 to drive each movable seat 30 to move, compared with multiple sets of independent mechanisms in the related technology, the slicing mechanism 100 does not need to regulate the coordination between multiple sets of power sources, which simplifies both the structure and the control procedure, thereby reducing the failure rate and improving the overall reliability.
[0068] In some embodiments, each movable seat 30 has a first extension portion 31 and a second extension portion 32 connected to each other. The first extension portion 31 and the second extension portion 32 are respectively located on opposite sides of the guide member 20. The first extension portion 31 is connected to the transverse slide rail 11 and moves along the transverse slide rail 11. The slide 33 is arranged on the first extension portion 31, and the adsorption member 40 is arranged on the second extension portion 32. An avoidance space 34 is formed between the first extension portion 31 and the second extension portion 32. The avoidance space 34 is provided for the guide member 20 to enter and exit, so that the movable seat 30 can avoid the guide member 20 through the avoidance space 34 to avoid interference between the movable seat 30 and the guide member 20. Due to the existence of the avoidance space 34, the adsorption member 40 does not need to avoid the moving range of the guide member 20 in the longitudinal direction. When installing the adsorption member 40, there is no need to consider whether it will interfere with the guide member 20, thereby saving space in the longitudinal direction to reduce the volume of the slice mechanism 100 and reduce the occupied space. Otherwise, if the avoidance space 34 is not provided, since the guide member 20 has a lifting and lowering range, the adsorbent 40 needs to be provided below the lowest height of the guide member 20 to avoid the guide member 20, which will inevitably increase the longitudinal size of the slice mechanism 100. However, by providing the adsorbent 40 on the second extension portion 32, the adsorbent can be provided above the lowest height of the guide member 20, thereby reducing the longitudinal size of the slice mechanism 100.
[0069] In some embodiments, the slicer mechanism 100 also includes a shell 60, which is disposed on the mounting member 10. The shell 60 is located between the guide member 20 and the second extension portion 32. The movable seat 30 avoids the shell 60 through the avoidance space 34. The shell 60 blocks the side of the guide member 20 facing away from the mounting member 10 to protect the slicer mechanism 100.
[0070] Optionally, the housing 60 is in the shape of a bent plate and is made by a sheet metal process to facilitate processing and reduce costs. It is understandable that the housing 60 may also be in other styles as long as it can play a protective role.
[0071] In some embodiments, the slicer mechanism 100 also includes a sensor 70, which is disposed on the shell 60 or the mounting member 10. The guide member 20 has a trigger portion 22. When the trigger portion 22 moves with the guide member 20 to the position of the trigger sensor 70, the driving member 50 stops driving the guide member 20 to position the movable seat 30 and the adsorption member 40 to prevent the movable seat 30 and the adsorption member 40 from excessively moving in the lateral direction, so as to improve the position accuracy of the adsorption member 40, so that the adsorption member 40 can more accurately adsorb the sub-sheet 201 and more accurately split the sub-sheet 201 to a preset distance, thereby improving the splitting accuracy of the slicer mechanism 100.
[0072] For example, during the rising process of the guide member 20, the various moving seats 30 are close to each other. When the trigger part 22 triggers the sensor 70, the moving seat 30 and the adsorption member 40 are positioned so that each adsorption member 40 can correspond to the center of each sub-piece 201, so that each adsorption member 40 can more accurately adsorb the sub-piece 201 and improve stability; or for example, during the descending process of the guide member 20, the various moving seats 30 are separated from each other. When the trigger part 22 triggers the sensor 70, the moving seat 30 and the adsorption member 40 are positioned so that the sub-piece 201 adsorbed by each adsorption member 40 can correspond to the carrier below, so as to accurately transport the sub-piece 201 to the next process.
[0073] In some embodiments, the sensor 70 is disposed on the side of the shell 60 facing away from the guide member 20, and the shell 60 is provided with an opening 61. The trigger part 22 is exposed on the side of the shell 60 facing away from the guide member 20 through the opening 61, so that the sensor 70 is exposed on the outside of the shell 60, which is convenient for the installation and maintenance of the sensor 70, and does not occupy the space inside the shell 60, so as to reduce the volume of the slice mechanism 100.
[0074] Optionally, the sensor 70 is provided with a slot 71, and the triggering part 22 is inserted into the slot 71 to trigger the sensor 70. For example, the sensor 70 is a photoelectric switch. It is understandable that the sensor 70 can also be other types, such as a metal detector.
[0075] In some embodiments, the driving member 50 includes a driver 51, a rotating member 52 and a connecting member 53. The driver 51 and the rotating member 52 are disposed on the mounting member 10. The rotating member 52 can rotate relative to the mounting member 10 about the Z axis. The driver 51 is used to drive the rotating member 52 to rotate. The connecting member 53 connects the rotating member 52 and the guide member 20. The rotating rotating member 52 can drive the connecting member 53 and the guide member 20 to move along the longitudinal slide rail 12. The driving member 50 converts the rotational motion into the translational motion to improve the moving accuracy of the guide member 20. Compared with the cylinder drive, the driving member 50 has higher accuracy.
[0076] Optionally, the driver 51 is a motor, the rotating member 52 is a lead screw, the connecting member 53 is sleeved on the rotating member 52 and is connected to the rotating member 52 by a thread, and the driver 51 drives the connecting member 53 to rise or fall by forward and reverse rotation, thereby driving the guide member 20 to rise or fall.
[0077] In some embodiments, the driving member 50 further includes a driving wheel 54, a driven wheel 55 and a transmission belt 56. The driving wheel 54 is connected to the driver 51, the driven wheel 55 is coaxially connected to the rotating member 52, and the transmission belt 56 connects the driving wheel 54 and the driven wheel 55. The driving member 50 is used to drive the driving wheel 54 to rotate. The driving wheel 54 drives the driven wheel 55 to rotate through the transmission belt 56, so that the driven wheel 55 drives the rotating member 52 to rotate synchronously. Through the driving wheel 54, the driven wheel 55 and the transmission belt 56, the driver 51 and the rotating member 52 can be arranged in parallel in the horizontal direction, and the driver 51 and the rotating member 52 do not need to be arranged in parallel in the longitudinal direction, thereby reducing the longitudinal size of the driving member 50 to reduce the volume and occupied space of the slicing mechanism 100.
[0078] Optionally, the driving wheel 54, the driven wheel 55 and the transmission belt 56 may also be replaced with gears, etc., as long as they can play a transmission role.
[0079] In some embodiments, the guide member 20 has at least one weight-reducing groove 23 , and the weight-reducing groove 23 is used to reduce the weight of the guide member 20 so that the driver 51 can drive the guide member 20 .
[0080] In some embodiments, the weight reducing groove 23 and the inclined groove 21 are arranged in parallel with each other in the horizontal direction, and the length of the weight reducing groove 23 extends along the XZ plane. The weight reducing groove 23 is inclined relative to the Z axis or parallel to the Z axis, so that each weight reducing groove 23 is structurally the same as an inclined groove 21, and thus the weight reducing groove 23 can also play the function of the inclined groove 21. When more moving seats 30 need to be arranged, the weight reducing groove 23 can be directly used to cooperate with the slide 33 of the moving seat 30. The slide 33 is limited by the groove wall of the weight reducing groove 23 to drive the moving seat 30 to move horizontally, thereby eliminating the operation of opening an additional inclined groove 21 in the guide member 20, thereby improving the multi-scenario adaptability of the slicing mechanism 100.
[0081] Optionally, one weight-reducing groove 23 extends longitudinally, and the remaining weight-reducing grooves 23 and the inclined groove 21 are symmetrically arranged with the weight-reducing groove 23 extending longitudinally, so that the moving distances of the moving seats 30 symmetrical on both sides are the same, which is more convenient for structural design.
[0082] In some embodiments, Figure 7As shown, the mounting member 10 is provided with more than two transverse slide rails 11 arranged in the longitudinal direction, each first extension portion 31 is connected to at least one transverse slide rail 11 through a slider 111, and the transverse slide rails 11 connected to each first extension portion 31 are different. Each slider 111 is slidably disposed on the transverse slide rail 11 where it is located. The transverse width of the first extension portion 31 is smaller than the transverse width of the slider 111, and there is a notch 311 between each first extension portion 31 and the non-connected transverse slide rail 11. Each first extension portion 31 avoids the slider 111 of the adjacent first extension portion 31 through the notch 311, so as to allow the two adjacent first extension portions 31 to be close enough or even fit together, so that each adsorption member 40 can be adsorbed to the sub-piece 201 with a smaller width, so as to avoid the adsorption of the corresponding sub-piece 201 due to the distance between each adsorption member 40 being too far.
[0083] As an illustrative example, the mounting member 10 has four transverse slide rails 11, and has two first extension portions 31, wherein one of the first extension portions 31 is connected to the first slide rail 11 and the third slide rail 11 in the longitudinal direction through two sliders 111, and a gap 311 is formed between the second slide rail 11 and the fourth slide rail 11 in the longitudinal direction; the other first extension portion 31 is connected to the second slide rail 11 and the fourth slide rail 11 in the longitudinal direction through two sliders 111, and a gap 311 is formed between the first slide rail 11 and the third slide rail 11 in the longitudinal direction, which not only allows the two first extension portions 31 to be close enough, but also enables each first extension portion 31 to be connected to two slide rails 11 to improve stability.
[0084] In some embodiments, the adsorbent 40 is a suction cup or a suction nozzle, and the number and form of the suction cup or the suction nozzle are not limited, and it can be, for example, a Bernoulli suction cup.
[0085] like Figure 1 As shown, a laser scribing device 300 is also provided in the embodiment of the present application, and the laser scribing device 300 includes a main conveying mechanism 301, at least two sub-conveying mechanisms 302, a transfer mechanism 303 and a slicing mechanism 100. The main conveying mechanism 301 is used to convey the cut silicon wafer 200, each sub-conveying mechanism 302 is used to convey a sub-wafer 201 split by the slicing mechanism 100, and the transfer mechanism 303 is connected to the mounting plate 10, and the transfer mechanism 303 is used to drive the slicing mechanism 100 to move in space.
[0086] In some embodiments, the sub-wafer 201 in the silicon wafer 200 can be applied to a solar panel and used as a solar cell.
[0087] The operation method of the laser scribing equipment 300 is as follows: after the various adsorption components 40 in the slicing mechanism 100 are close to each other, the transfer mechanism 303 drives the slicing mechanism 100 to move, so that each adsorption component 40 is aligned with and adsorbs each sub-wafer 201 in the silicon wafer 200 on the main conveying mechanism 301; after each adsorption component 40 adsorbs each sub-wafer 201, the slicing mechanism 100 drives each adsorption component 40 to move away from each other to separate each sub-wafer 201; the transfer mechanism 303 drives the slicing mechanism 100 to move, so that each sub-wafer 201 adsorbed by each adsorption component 40 is placed on each sub-conveyor mechanism 302; after each adsorption component 40 releases each sub-wafer 201, each sub-wafer 201 moves to the next process with each sub-conveyor mechanism 302.
[0088] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.
Claims
1. A slicing mechanism for splitting sub-slices formed after a silicon wafer is cut, characterized in that: include: A mounting member, wherein the mounting member is provided with a transverse slide rail and a longitudinal slide rail; A guide member, the guide member is connected to the longitudinal slide rail and moves along the longitudinal slide rail, and the guide member is provided with at least two non-parallel inclined grooves; At least two moving seats, each of which has a first extension portion and a second extension portion connected to each other, the first extension portion and the second extension portion are respectively located on opposite sides of the guide member, the first extension portion is connected to the transverse slide rail and moves along the transverse slide rail, each of the first extension portions is provided with a slide member, each of the slide members is arranged in a corresponding inclined groove, an avoidance space is formed between the first extension portion and the second extension portion, and the moving seat avoids the guide member through the avoidance space; at least two adsorbents, each of which is disposed on a corresponding second extension portion, and each of which is configured to adsorb a corresponding sub-sheet; A driving member, wherein the driving member is arranged on the mounting member and connected to the guide member, wherein the driving member drives the guide member to move along the longitudinal slide rail, and limits the slide member through the groove wall of the inclined groove, so that at least two of the moving seats move away from each other along the transverse slide rail to separate the sub-piece adsorbed by the adsorption member.
2. The slicing mechanism according to claim 1, characterized in that: The slice mechanism also includes a shell, which is arranged on the mounting member, and the shell is located between the guide member and the second extension portion. The movable seat avoids the shell through the avoidance space, and the shell blocks the side of the guide member facing away from the mounting member.
3. The slicing mechanism according to claim 2, characterized in that: The slicing mechanism also includes a sensor, which is arranged on the shell or the mounting member. The guide member has a trigger part. When the trigger part moves with the guide member to a position that triggers the sensor, the driving member stops driving the guide member to position the movable seat.
4. The slicing mechanism according to claim 3, characterized in that: The sensor is arranged on the side of the shell facing away from the guide member, the shell is provided with an opening, the trigger part is exposed through the opening on the side of the shell facing away from the guide member, the sensor is provided with a slot, the trigger part is inserted into the slot to trigger the sensor.
5. The slicing mechanism according to any one of claims 1 to 4, characterized in that: The driving member includes a driver, a rotating member and a connecting member. The driver and the rotating member are arranged on the mounting member. The driver drives the rotating member to rotate around an axial direction parallel to the longitudinal slide rail. The connecting member connects the rotating member and the guide member. The rotating rotating member drives the connecting member and the guide member to move along the longitudinal slide rail.
6. The slicing mechanism according to claim 5, characterized in that: The driving member also includes a driving wheel, a driven wheel and a transmission belt, the driving wheel is connected to the driver, the driven wheel is coaxially connected to the rotating member, the transmission belt connects the driving wheel and the driven wheel, the driving member drives the driving wheel to rotate, and the driving wheel drives the driven wheel and the rotating member to rotate through the transmission belt.
7. The slicing mechanism according to any one of claims 1 to 4, characterized in that: The guide element has at least one weight-reducing groove.
8. The slicing mechanism according to claim 7, characterized in that: The weight-reducing groove and the inclined groove are arranged in parallel with each other in the transverse direction, and the length of the weight-reducing groove extends longitudinally or extends obliquely, so that each of the weight-reducing grooves can accommodate the sliding member, and when the guide member moves along the longitudinal slide rail, the groove wall of the weight-reducing groove limits the sliding member, so that the corresponding moving seat moves along the transverse slide rail.
9. The slicing mechanism according to any one of claims 1 to 4, characterized in that: The mounting member is provided with more than two transverse slide rails arranged in the longitudinal direction, each of the first extension parts is connected to at least one of the transverse slide rails through a slider, the transverse slide rails connected to each of the first extension parts are different, the transverse width of the first extension part is smaller than the transverse width of the slider, each of the first extension parts has a gap between it and the unconnected transverse slide rail, and each of the first extension parts avoids the slider of the adjacent first extension part through the gap.
10. A laser scribing device, characterized in that: The laser scribing equipment includes a main conveying mechanism, at least two sub-conveying mechanisms, a transfer mechanism and a slicing mechanism as described in any one of claims 1 to 9, wherein the main conveying mechanism conveys the cut silicon wafers, each of the sub-conveying mechanisms conveys one of the sub-wafers split by the slicing mechanism, the slicing mechanism is arranged on the transfer mechanism, and the transfer mechanism drives the slicing mechanism to move so that the slicing mechanism absorbs the silicon wafer and places each of the split sub-wafers on the corresponding sub-conveying mechanism.