Computer case capable of rapidly dissipating heat

Abstract

The utility model discloses a computer fast heat dissipation case which comprises a device body, the device body comprises a case base, a case frame and a case top cover, the case frame is of a rectangular structure and is fixed to the top of the case base, and the case top cover is installed on the top of the case frame; the case top cover is of a rectangular structure, four corners of the case top cover are of arc-shaped structures, a plurality of groups of air inlet holes which are transversely distributed at equal intervals are formed in the top of the case top cover, the air inlet holes are of long-strip-shaped structures, a heat dissipation mounting frame is arranged at the bottom of the case top cover, the heat dissipation mounting frame is of a rectangular structure, and the interior of the heat dissipation mounting frame is of a hollow structure. The bottom of the heat dissipation installation frame is provided with a set of heat dissipation installation openings which are transversely distributed at equal intervals, and the set of heat dissipation installation openings are provided with a first air draft fan and a second air draft fan correspondingly. According to the device, the air inlet efficiency of the computer case is improved through an air inlet mode from top to bottom, so that the heat dissipation effect of a computer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of computer chassis, in particular to a computer chassis with rapid heat dissipation. Background Art

[0002] The computer case generally includes the outer shell, bracket, various switches and indicator lights on the panel, etc. As a part of computer accessories, the main function of the computer case is to place and fix various computer accessories, and play a supporting and protective role. In addition, the computer case plays an important role in shielding electromagnetic radiation.

[0003] Existing computer cases have the following defects:

[0004] The existing computer case has poor heat dissipation effect, which easily causes the components in the case to be overheated, affecting the operating efficiency of the components and also reducing the life of the electronic components. Therefore, a solution is needed. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies of the prior art, the utility model provides a computer chassis with rapid heat dissipation to solve the problems raised in the above background technology.

[0007] (II) Technical solution

[0008] To achieve the above purpose, the utility model is implemented through the following technical solutions: a computer chassis with rapid heat dissipation, including a device body, the device body including a chassis base, a chassis frame and a chassis top cover, the chassis frame is a rectangular structure, and the chassis frame is fixed on the top of the chassis base, and the chassis top cover is installed on the top of the chassis frame; the chassis top cover is a rectangular structure, and the four corners of the chassis top cover are arc-shaped structures, a plurality of groups of air inlet holes distributed in a transversely equidistant manner are opened on the top of the chassis top cover, and the air inlet holes are in a long strip structure, a heat dissipation installation frame is provided at the bottom of the chassis top cover, the heat dissipation installation frame is a rectangular structure, and the interior is a hollow structure, a group of heat dissipation installation ports distributed in a transversely equidistant manner are opened at the bottom of the heat dissipation installation frame, the heat dissipation installation port is a circular structure, and a group of heat dissipation installation ports are respectively installed with a first exhaust fan and a second exhaust fan.

[0009] Preferably, a lifting handle is welded to the front end and the rear end of the top cover of the chassis, the lifting handle is in a concave structure, and the left and right ends of the top of the lifting handle are in an arc-shaped structure.

[0010] Preferably, a side mounting opening is opened on the right side of the chassis frame, and the side mounting opening is in a rectangular structure. A sealing cover is installed in the side mounting opening through a hinge, and a dustproof net and a small handle are provided on the surface of the sealing cover. The dustproof net is in a rectangular structure, and the small handle is in a cylindrical structure.

[0011] Preferably, a heat dissipation groove is provided at the bottom of the chassis base, and the heat dissipation groove has a rectangular structure. A plurality of groups of air outlets are provided on the surface of the heat dissipation groove and are distributed in a laterally equidistant manner, and the air outlets have a long strip structure. Support feet are provided at the four corners of the bottom of the chassis base, and the support feet have an elliptical structure. A plurality of groups of anti-sliding blocks are provided at the bottom of the support feet, and the anti-sliding blocks have a circular structure.

[0012] (III) Beneficial effects

[0013] The utility model provides a computer case for rapid heat dissipation, which has the following beneficial effects:

[0014] This computer case with rapid heat dissipation improves the air intake efficiency of the computer case by taking in air from top to bottom, thereby improving the heat dissipation effect of the computer, and when exhausting air, it can be exhausted through the air outlet holes at the bottom of the case and the side installation ports on the sides of the case, further allowing the hot air in the case to be quickly discharged. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the overall bottom of the utility model;

[0017] Figure 3 It is a schematic diagram of the overall internal structure of the utility model.

[0018] In the figure, 1. device body; 2. chassis base; 3. chassis frame; 4. chassis top cover; 5. heat dissipation mounting frame; 6. heat dissipation mounting port; 7. first exhaust fan; 8. second exhaust fan; 9. side mounting port; 10. sealing cover; 11. dust net; 12. small handle; 13. lifting handle; 14. air inlet; 15. heat dissipation groove; 16. air outlet; 17. support foot; 18. anti-sliding block. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-3 The embodiment of the utility model provides a technical solution: a computer chassis for rapid heat dissipation, comprising a device body 1, wherein the device body 1 comprises a chassis base 2, a chassis frame 3 and a chassis top cover 4, wherein the chassis frame 3 is a rectangular structure, and the chassis frame 3 is fixed on the top of the chassis base 2, and the chassis top cover 4 is installed on the top of the chassis frame 3;

[0021] The problem is that the chassis top cover 4 is in a rectangular structure, and the four corners of the chassis top cover 4 are in an arc-shaped structure. The top of the chassis top cover 4 is provided with a plurality of groups of air inlet holes 14 distributed in a transversely equidistant manner, and the air inlet holes 14 are in a long strip structure. The bottom of the chassis top cover 4 is provided with a heat dissipation mounting frame 5, and the heat dissipation mounting frame 5 is in a rectangular structure, and the interior is a hollow structure. The bottom of the heat dissipation mounting frame 5 is provided with a group of heat dissipation mounting ports 6 distributed in a transversely equidistant manner, and the heat dissipation mounting ports 6 are in a circular structure. A group of heat dissipation mounting ports 6 are respectively installed with a first exhaust fan 7 and a second exhaust fan 8. When heat dissipation treatment is performed in the chassis frame 3, the first exhaust fan 7 and the second exhaust fan 8 in the heat dissipation mounting frame 6 are started, and the first exhaust fan 7 and the second exhaust fan 8 draw external air through the plurality of air inlet holes 14 on the chassis top cover 4, and then transport it to the chassis frame 3 to dissipate heat for electronic components.

[0022] Furthermore, the chassis top cover 4 is welded with a lifting handle 13 at the top front end and the top rear end. The lifting handle 13 is a concave structure, and the left and right ends of the top of the lifting handle 13 are arc-shaped structures. When the device body 1 is rotated, the staff can transport the device body 1 by using the lifting handle 13.

[0023] Differently, a side mounting opening 9 is opened on the right side of the chassis frame 3, and the side mounting opening 9 is in a rectangular structure. A sealing cover 10 is installed in the side mounting opening 9 through a hinge. A dust net 11 and a small handle 12 are provided on the surface of the sealing cover 10. The dust net 11 is in a rectangular structure, and the small handle 12 is in a cylindrical structure. When dissipating heat, the hot air in the chassis frame 3 can be discharged through the dust net 11 on the sealing cover 10. If the heat dissipation efficiency needs to be improved, the staff can use the small handle 12 to open the sealing cover 10, so that the side mounting opening 9 of the chassis frame 3 is fully opened. In this way, the heat dissipation efficiency can be improved.

[0024] Effectively, a heat dissipation groove 15 is provided at the bottom of the chassis base 2, and the heat dissipation groove 15 is in a rectangular structure. A plurality of groups of air outlets 16 are provided on the surface of the heat dissipation groove 15 and are distributed in a laterally equidistant manner. The air outlets 16 are in a long strip structure. Support feet 17 are provided at the four corners of the bottom of the chassis base 2. The support feet 17 are in an elliptical structure. A plurality of groups of anti-sliding blocks 18 are provided at the bottom of the support feet 17. The anti-sliding blocks 18 are in a circular structure. Hot air can be discharged through the plurality of air outlets 16 on the heat dissipation groove 15, and the air outlets 16 are in a long strip structure to improve the exhaust efficiency. The support feet 17 at the four corners of the bottom of the chassis base 2 are to increase the ground clearance of the bottom of the chassis base 2 to facilitate the discharge of air, and the anti-sliding blocks 18 on the surface of the support feet 17 can reduce the displacement of the chassis base 2.

[0025] Working principle: During operation, when the chassis frame 3 is subjected to heat dissipation treatment, the first exhaust fan 7 and the second exhaust fan 8 in the heat dissipation mounting frame 6 are started, and the first exhaust fan 7 and the second exhaust fan 8 draw external air in through several groups of air inlet holes 14 on the chassis top cover 4, and then transport it to the chassis frame 3 to dissipate heat for electronic components. The hot air in the chassis frame 3 can be discharged through several groups of air outlets 16 on the heat dissipation grooves 15, and the air outlets 16 are in the shape of long strips to improve the exhaust efficiency. The hot air in the chassis frame 3 can also be discharged through the dustproof net 11 on the sealing cover 10. If the heat exhaust efficiency needs to be increased, the staff can use the small handle 12 to open the sealing cover 10, so that the side mounting port 9 of the chassis frame 3 is fully opened. In this way, the heat exhaust efficiency can be improved.

[0026] The utility model includes 1, device body; 2, chassis base; 3, chassis frame; 4, chassis top cover; 5, heat dissipation installation frame; 6, heat dissipation installation port; 7, first exhaust fan; 8, second exhaust fan; 9, side installation port; 10, sealing cover; 11, dust screen; 12, small handle; 13, lifting handle; 14, air inlet; 15, heat dissipation groove; 16, air outlet; 17, supporting foot; 18, anti-sliding block, and the components are all universal standard parts or components known to those skilled in the art, and the structures and principles thereof can be known to those skilled in the art through technical manuals or through conventional experimental methods. The utility model solves the problem that the existing computer chassis has poor heat dissipation effect, which easily causes the components in the chassis to be overheated and affects the operating efficiency of the components, and also causes the life of the electronic components to be reduced. The utility model can improve the air intake efficiency of the computer chassis through the top-down air intake method through the combination of the above components, thereby improving the heat dissipation effect of the computer.

[0027] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0028] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A computer chassis for rapid heat dissipation, characterized in that: The device comprises a device body (1), wherein the device body (1) comprises a chassis base (2), a chassis frame (3) and a chassis top cover (4), wherein the chassis frame (3) is a rectangular structure, and the chassis frame (3) is fixed on the top of the chassis base (2), and the chassis top cover (4) is installed on the top of the chassis frame (3); The chassis top cover (4) is in a rectangular structure, and the four corners of the chassis top cover (4) are in an arc-shaped structure. The top of the chassis top cover (4) is provided with a plurality of groups of air inlet holes (14) distributed in a transversely equidistant manner, and the air inlet holes (14) are in a long strip-shaped structure. The bottom of the chassis top cover (4) is provided with a heat dissipation installation frame (5), and the heat dissipation installation frame (5) is in a rectangular structure, and the interior is a hollow structure. The bottom of the heat dissipation installation frame (5) is provided with a group of heat dissipation installation openings (6) distributed in a transversely equidistant manner, and the heat dissipation installation openings (6) are in a circular structure. A group of the heat dissipation installation openings (6) are respectively installed with a first exhaust fan (7) and a second exhaust fan (8).

2. A computer chassis for rapid heat dissipation according to claim 1, characterized in that: The front end and the rear end of the top of the chassis top cover (4) are both welded with a lifting handle (13), the lifting handle (13) is a concave structure, and the left and right ends of the top of the lifting handle (13) are both arc-shaped structures.

3. A computer chassis for rapid heat dissipation according to claim 1, characterized in that: A side mounting opening (9) is provided on the right side of the chassis frame (3); the side mounting opening (9) is in a rectangular structure; a sealing cover (10) is installed in the side mounting opening (9) via a hinge; a dustproof net (11) and a small handle (12) are provided on the surface of the sealing cover (10); the dustproof net (11) is in a rectangular structure; and the small handle (12) is in a cylindrical structure.

4. A computer chassis for rapid heat dissipation according to claim 1, characterized in that: The bottom of the chassis base (2) is provided with a heat dissipation groove (15), the heat dissipation groove (15) is in a rectangular structure, the surface of the heat dissipation groove (15) is provided with a plurality of groups of air outlets (16) distributed in a transversely equidistant manner, the air outlets (16) are in a long strip structure, the four corners of the bottom of the chassis base (2) are provided with support feet (17), the support feet (17) are in an elliptical structure, and the bottom of the support feet (17) is provided with a plurality of groups of anti-sliding blocks (18), the anti-sliding blocks (18) are in a circular structure.

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