BMS protection plate heat dissipation device based on semiconductor refrigeration

Abstract

The utility model relates to a BMS (Battery Management System) protection plate heat dissipation device based on semiconductor refrigeration, which belongs to the technical field of battery management systems, and comprises a PCB (Printed Circuit Board) substrate for installing a BMS system and a heat transfer assembly, a semiconductor refrigeration sheet is arranged on the inner side of the heat transfer assembly, a refrigeration sheet driving circuit is arranged on the PCB substrate, and the semiconductor refrigeration sheet driving circuit is connected with the PCB substrate. The refrigeration sheet driving circuit is used for driving the semiconductor refrigeration sheet and transferring heat in the BMS protection plate heat dissipation device to the heat transfer assembly. The semiconductor chilling plate is driven by the chilling plate driving circuit, one end of the semiconductor chilling plate absorbs heat emitted by the heating elements, the other end of the semiconductor chilling plate transmits the heat into the heat transfer shell of the heat transfer assembly, and a heat dissipation plane shared by the heating elements is formed on the heat transfer shell. And the heat is uniformly dispersed on the heat dissipation plane, so that the heat dissipation efficiency is improved, and the heat dissipation effect is enhanced.

Description

Technical Field

[0001] The utility model belongs to the technical field of battery management systems, and in particular relates to a BMS protection plate heat dissipation device based on semiconductor refrigeration. Background Art

[0002] Battery management system (BMS) is the key to the safe and reliable operation of lithium-ion battery packs. With the growing demand for efficient energy storage systems in various fields such as automotive, energy and industrial applications, the research and application of BMS has also received increasing attention.

[0003] In China, due to the rapid development of new energy vehicles, the BMS market is also growing rapidly. BMS (Battery Management System) has gradually transformed from a monitoring system to a management system. At this stage, BMS has full-function management capabilities for battery status monitoring, battery safety analysis, battery status analysis, and battery information management, which can fully protect the safe operation of battery packs, effectively extend battery life, and thus ensure the normal operation of related equipment. The long-term detection and application of BMS further clarifies the necessity of stable operation of the BMS hardware system. Therefore, how to effectively design heat dissipation and temperature control for the BMS hardware system to ensure long-term stable operation of the BMS is a very important issue.

[0004] The current research status of BMS board-level heat dissipation mainly includes technologies such as natural conduction heat dissipation, air cooling, liquid cooling and heat pipe cooling.

[0005] ①. Natural conduction heat dissipation: Use the excellent thermal conductivity of components and heat dissipation materials to conduct heat away. This completes the passive and natural dissipation of heat. This heat dissipation method has limited effect and is slow.

[0006] ② Air cooling: Use fans and other equipment to promote air flow, which drives the rapid dissipation of heat from components. This cooling method has a limited cooling capacity due to the limited speed of air movement, and requires a stable air duct, otherwise it will greatly affect the cooling effect.

[0007] ③ Liquid cooling: Heat is transferred from components through water or special liquids, and then the heat in the liquid is dissipated through the radiator. This method has a better heat dissipation effect, but it is more expensive and requires maintenance.

[0008] ④. Heat pipe heat dissipation: Utilize the unique heat conduction mechanism of the heat pipe to quickly conduct heat to the radiator, thereby improving the overall heat dissipation efficiency. However, there are still some problems in practical applications that limit its use and development. First of all, there are two important performance limitations for heat pipe applications: capillary structure and steam chamber. Capillary limitation is the ability of the capillary structure to transport water from the condenser back to the evaporator. If the porosity and thickness of the capillary structure are not adjusted properly, the maximum heat transfer capacity and / or resistance of the heat pipe may be changed. Secondly, when the temperature of the high-temperature flue gas is greater than 30°C, the heat pipe is activated and conducts heat to the upper end. However, in this process, the high-temperature flue gas will flush the heat pipe, which may cause damage to the heat pipe. At the same time, this heat dissipation method is still a passive heat dissipation mode. Active temperature control cannot be achieved. Utility Model Content

[0009] The purpose of the utility model is to provide a BMS protection plate heat dissipation device based on semiconductor refrigeration in order to solve the above problems.

[0010] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0011] A BMS protection board heat dissipation device based on semiconductor refrigeration includes a PCB substrate for installing a BMS system and a heat transfer component, wherein the PCB is the abbreviation of a printed circuit board (Printed Circuit Board), a semiconductor refrigeration plate is arranged on the inner side of the heat transfer component, and a refrigeration plate driving circuit is arranged on the PCB substrate, and the refrigeration plate driving circuit is used to drive the semiconductor refrigeration plate to transfer the heat inside the BMS protection board heat dissipation device to the heat transfer component. The BMS protection board heat dissipation device has multiple heat sources, namely heating elements. When the BMS protection board is in working state, the BMS protection board heat dissipation device drives the semiconductor refrigeration plate to work through the refrigeration plate driving circuit, one end of the semiconductor refrigeration plate absorbs the heat emitted by the heating element, and transfers the heat to the heat transfer housing of the heat transfer component through the other end thereof, and a heat dissipation plane shared by multiple heating elements is formed on the heat transfer housing, and the heat is evenly dispersed on the heat dissipation plane to improve the heat dissipation efficiency and enhance the heat dissipation effect.

[0012] As a further optimization scheme of the utility model, the cold end of the semiconductor refrigeration sheet faces the heating element in the BMS protection plate heat dissipation device, and the hot end of the semiconductor refrigeration sheet faces the heat transfer component. A thermal conductive filling layer is provided in the gap between the cold end of the semiconductor refrigeration sheet and the heating element, and in the gap between the hot end of the semiconductor refrigeration sheet and the heat transfer component. The cold end of the semiconductor refrigeration sheet is used to absorb heat inside the BMS protection plate heat dissipation device, and the hot end of the semiconductor refrigeration sheet is used to transfer heat to the heat transfer component.

[0013] As a further optimization solution of the utility model, the thermal conductive filling layer is a silicone grease pad.

[0014] As a further optimization scheme of the utility model, a temperature sensor is provided on the PCB substrate, the temperature sensor is connected to a temperature acquisition circuit, a controller is provided on the PCB substrate, the controller is connected to the temperature sensor through the temperature acquisition circuit, and the controller is connected to the semiconductor refrigeration chip through the refrigeration chip driving circuit. The controller receives data collected by the temperature sensor through the temperature acquisition circuit, and the controller regulates the working state of the semiconductor refrigeration chip through the refrigeration chip driving circuit.

[0015] As a further optimization solution of the utility model, the PCB substrate is fixed on the bottom plate, and the bottom plate and the heat transfer component are used to encapsulate the BMS protection plate heat dissipation device.

[0016] As a further optimization solution of the present invention, the heat transfer component includes a heat transfer shell fixedly arranged on the top of the base plate, and the heat transfer shell is connected to the base plate through threaded fasteners.

[0017] As a further optimization solution of the utility model, the heat transfer component also includes a groove opened in the middle of the heat transfer shell, a side groove arranged on the side of the heat transfer shell, and a heat sink fixedly arranged inside the groove and the side groove.

[0018] As a further optimization solution of the utility model, a fan is provided above the groove.

[0019] As a further optimization solution of the utility model, a plurality of heat dissipation channels are provided between the groove and the side grooves.

[0020] The beneficial effects of the utility model are:

[0021] 1) The utility model drives the semiconductor refrigeration sheet through the controller to actively dissipate heat. The cold end of the semiconductor refrigeration sheet absorbs the heat emitted by the heating element, and the hot end transfers the heat to the heat transfer shell of the heat transfer component. A heat dissipation plane shared by multiple heating elements is formed on the heat transfer shell, which can evenly disperse the heat to the heat dissipation plane to improve the heat dissipation efficiency and enhance the heat dissipation effect. The BMS protection board heat dissipation device also has the advantages of small size and light weight.

[0022] 2) The utility model fills the tiny bumps on the contact surface of the heat dissipation structure with a silicone pad, thereby filling the gap between the heat dissipation structure and the heat source, thereby forming a very low thermal resistance interface, so that they can fit together more closely. Compared with the contact surface alone conducting air heat conduction, this bonding method enhances the heat conduction efficiency;

[0023] 3) When the utility model is provided with grooves, side grooves and heat dissipation channels, the heat dissipation of the heat sink in the grooves can be enhanced by a fan, and the heat in the side grooves can be transferred to the grooves through the heat dissipation channels, and then the heat is dissipated by the fan, thereby further improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the first embodiment of the utility model;

[0025] Figure 2 This is a schematic diagram of the internal structure of the BMS protection board heat dissipation device of the utility model;

[0026] Figure 3 This is a block diagram of the heat dissipation structure system of the utility model;

[0027] Figure 4 It is a schematic diagram of the temperature acquisition circuit structure of the utility model;

[0028] Figure 5 This is a schematic diagram of the structure of the refrigeration plate driving circuit of the utility model;

[0029] Figure 6 It is a schematic diagram of the overall structure of the second embodiment of the utility model;

[0030] Figure 7 It is a schematic diagram of the overall structure of the third embodiment of the utility model;

[0031] Figure 8 yes Figure 7 Enlarged view of point A in the middle.

[0032] In the figure: 1. PCB substrate; 2. heat transfer component; 3. semiconductor refrigeration plate; 4. refrigeration plate driving circuit; 5. thermal conductive filling layer; 6. temperature sensor; 7. temperature acquisition circuit; 8. controller; 9. bottom plate; 21. heat transfer shell; 22. groove; 23. side groove; 24. heat sink; 25. fan; 26. heat dissipation channel; M, heating element. DETAILED DESCRIPTION

[0033] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0034] First embodiment

[0035] like Figure 1-3As shown, this embodiment relates to a BMS protection board heat dissipation device based on semiconductor refrigeration, which is composed of a BMS protection board, a heat dissipation structure on the BMS protection board, and a packaging shell. The BMS protection board includes a BMS system and a PCB substrate 1 for installing the BMS system. The packaging shell includes a heat transfer component 2 and a bottom plate 9 located at the bottom of the heat transfer component 2. The PCB substrate 1 is fixedly arranged on the upper surface of the bottom plate 9. The heat transfer component 2 includes a heat transfer shell 21 connected to the bottom plate 9 through a threaded fastener. The heat transfer shell 21 should have good thermal conductivity, and its material can be copper, aluminum, graphite, etc. The above-mentioned threaded fastener is preferably a screw. The heat dissipation structure includes a semiconductor refrigeration plate 3 fixedly arranged on the inner side of the heat transfer shell 21, and a refrigeration plate driving circuit 4 is fixedly arranged on the PCB substrate 1. The refrigeration plate driving circuit 4 is used to drive the semiconductor refrigeration plate 3 to work, so that it transfers the heat inside the BMS protection board heat dissipation device to the heat transfer component 2.

[0036] The heat dissipation device of the BMS protection board has multiple heat sources, namely, heating elements M. The semiconductor cooling sheet 3 has a cold end and a hot end. The cold end of the semiconductor cooling sheet 3 is connected to the heating element M, and the hot end of the semiconductor cooling sheet 3 is connected to the inner wall of the heat transfer shell 21. A heat conductive filling layer 5 is provided between the cold end of the semiconductor cooling sheet 3 and the heating element M, and between the hot end of the semiconductor cooling sheet 3 and the heat transfer shell 21. The heat conductive filling layer 5 is a silicone pad. When the BMS protection board is in working state, the heat dissipation device of the BMS protection board starts the semiconductor cooling sheet 3 through the cooling sheet driving circuit 4. The cold end of the semiconductor cooling sheet 3 absorbs the heat emitted by the heating element M, and transfers the heat to the heat transfer shell 21 of the heat transfer component 2 through its hot end. A heat dissipation plane shared by multiple heating elements M is formed on the heat transfer shell 21, and the heat is evenly dispersed on the heat dissipation plane to improve the heat dissipation efficiency and enhance the heat dissipation effect.

[0037] The heat source of the BMS protection board circuit may come from the following aspects:

[0038] ①. Controller: As the core component of the BMS system, the controller needs to process a large amount of data and perform complex calculations and control logic, so it will generate heat during operation.

[0039] ② Battery control chip: The battery control chip will also generate a certain amount of heat during operation. For example, in the process of collecting voltage and temperature information, there will be a certain amount of power loss, which will cause the chip to heat up.

[0040] ③. MOSFET tube: MOSFET tube is a commonly used power device in BMS system, mainly used to control the charging and discharging process of the battery. Since MOSFET tube has resistance when working, it will generate a certain amount of heat. Its operating temperature is high under continuous high current, which makes MOSFET tube the main heat source of BMS protection board.

[0041] ④. Other components: In addition to the above parts, other components on the BMS board, such as power modules, will also generate a certain amount of heat during their operation.

[0042] When the BMS protection board is in working state, through the specific analysis of the heat source of the BMS protection board, it can be known that the heat source of the BMS protection board mainly comes from the heat generated by the MOSFET tube during the battery charging and discharging process. Therefore, a semiconductor cooling sheet 3 is set on each MOSFET tube on the PCB substrate 1. In addition, a semiconductor cooling sheet 3 can also be set on the controller 8, the battery control chip and other heat sources, and a certain number of semiconductor cooling sheets 3 can be set according to the actual heat dissipation requirements.

[0043] Furthermore, a temperature sensor 6 and a temperature acquisition circuit 7 are fixedly provided on the PCB substrate 1, the temperature sensor 6 is electrically connected to the temperature acquisition circuit 7, a controller 8 is fixedly provided on the PCB substrate 1, the controller 8 is connected to the temperature sensor 6 through the temperature acquisition circuit 7, and the controller 8 is connected to the semiconductor refrigeration plate 3 through the refrigeration plate driving circuit 4, the controller 8 receives data collected by the temperature sensor 6 through the temperature acquisition circuit 7, and the controller 8 regulates the working state of the semiconductor refrigeration plate 3 through the refrigeration plate driving circuit 4.

[0044] Specifically, Figure 4 As shown, the temperature acquisition circuit 7 includes a first resistor R1, a second resistor R2, a first capacitor C1 and an analog-to-digital conversion module ADC. One end of the first resistor R1 and the second resistor R2 are both connected to the temperature sensor 6. Figure 4 TEMP in the figure is the temperature sensor 6. The other end of the first resistor R1 is connected to the first power supply VCC1, the other end of the second resistor R2 is connected to the analog-to-digital conversion module ADC, one end of the first capacitor C1 is connected to the analog-to-digital conversion module ADC, and the other end of the first capacitor C1 is grounded. Figure 4 and Figure 5 The GND in the figure is the ground point.

[0045] like Figure 5As shown, the refrigeration plate driving circuit 4 includes a first MOSFET tube Q1 and a second MOSFET tube Q2, the first MOSFET tube Q1 is connected to a second capacitor C2 and a third resistor R3, the second MOSFET tube Q2 is connected to a fourth resistor R4 and a fifth resistor R5, G, S and D in the figure are the gate, source and drain of the two MOSFET tubes Q1 and Q2 respectively, the gate of the first MOSFET tube Q1 is connected to the drain of the second MOSFET tube Q2, and Refrigeration in the figure is the semiconductor refrigeration plate 3. The source of the first MOSFET tube Q1 is connected to the second power supply VCC2, one end of the second capacitor C2 and the third resistor R3 are both connected to the source of the first MOSFET tube Q1, the other end of the second capacitor C2 is grounded, and the other end of the third resistor R3 is connected to the gate of the first MOSFET tube Q1. One end of the fourth resistor R4 and the fifth resistor R5 are both connected to the gate of the second MOSFET tube Q2, the other end of the fourth resistor R4 is connected to the switch SWitch, the switch SWitch is electrically connected to the controller 8, the other end of the fifth resistor R5 is connected to the source of the second MOSFET tube Q2, the drain of the first MOSFET tube Q1 is connected to the semiconductor cooling plate 3, and the source of the second MOSFET tube Q2 is grounded.

[0046] The temperature sensor 6 is designed as an onboard thermistor, and its detection end is placed close to the charging and discharging MOSFET tube of the BMS protection board. It is mainly used to measure the temperature of the charging and discharging MOSFET tube of the BMS protection board. The model of the temperature sensor 6 is preferably MF52. The controller 8 obtains the data collected by the temperature sensor 6 in real time through the temperature acquisition circuit 7, and controls the working state of the cooling plate drive circuit 4 in real time according to the processing result, so as to indirectly control the working state of the semiconductor cooling plate 3 and realize efficient and active temperature control.

[0047] In the specific heat dissipation process, since the heat of the BMS protection board is mainly distributed in the large current loop, the highest temperature generally appears in the MOS area. Therefore, the heating element M is positioned in the BMS protection board, and the heat source control point is positioned in the charging and discharging MOS tube area of ​​the BMS protection board. According to the arrangement of the heat source control points of the BMS protection board, two or more semiconductor refrigeration sheets 3 are arranged side by side, and the cold end of each semiconductor refrigeration sheet 3 is completely in contact with the heat source area of ​​the heating element M, which is used to cool the heating element M. The hot end of each semiconductor refrigeration sheet 3 is in close contact with the heat transfer housing 21 for conduction heat dissipation. The heat transfer housing 21 is constructed to form a heat dissipation plane shared by multiple heat sources, and the heat is evenly dispersed on the heat dissipation plane to improve the heat dissipation efficiency and enhance the heat dissipation effect. The semiconductor refrigeration sheet 3 and the heating element M and the heat transfer housing 21 are all pressed and filled with silicone pads, a heat-conducting material. The main function of the silicone pad is to fill the tiny bumps on the contact surfaces of these components and make up for the gap between the heat dissipation structure and the heat source, thereby forming a very low thermal resistance interface, allowing them to fit more closely together. Compared with the air heat conduction on the contact surface alone, this bonding method enhances the heat conduction efficiency and improves the heat conduction efficiency.

[0048] Second embodiment

[0049] like Figure 6 As shown, this embodiment relates to a BMS protection plate heat dissipation device based on semiconductor refrigeration. Compared with the first embodiment, the heat transfer component 2 of this embodiment further includes a groove 22 opened in the middle of the heat transfer shell 21, a side groove 23 arranged on the side of the heat transfer shell 21, and a heat sink 24 fixed to the inner side of the groove 22 and the side groove 23. The bottom of the groove 22 fits with the heating element M in the middle of the BMS protection plate heat dissipation device, and the bottom of the side groove 23 fits with the heating element M near the inner wall of the BMS protection plate heat dissipation device. In this embodiment, the heat sink 24 cooperates with the heat transfer shell 21 to dissipate the heat source in the BMS protection plate heat dissipation device, which can improve the heat dissipation efficiency of the BMS protection plate heat dissipation device.

[0050] Third embodiment

[0051] like Figure 7 and Figure 8 As shown, this embodiment relates to a BMS protection plate heat dissipation device based on semiconductor refrigeration. Compared with the second embodiment, the heat transfer component 2 of this embodiment further includes a fan 25 fixedly arranged above the groove 22, and a plurality of heat dissipation channels 26 are provided between the groove 22 and the side groove 23. The heat dissipation of the heat sink 24 in the groove 22 is enhanced by the fan 25, and the heat in the side groove 23 can be transferred to the groove 22 through the heat dissipation channel 26, and then the heat is dissipated by the fan 25.

[0052] In summary, in the second and third embodiments, the heat dissipation efficiency of the BMS protection board heat dissipation device is stronger, but it has a larger space occupancy ratio. The heat dissipation efficiency of the first embodiment can also reach a higher level, and it also has the advantages of small size, light weight, simple structure, and easy production.

[0053] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A BMS protection board heat dissipation device based on semiconductor refrigeration, comprising a PCB substrate (1) for installing a BMS system and a heat transfer component (2), characterized in that: A semiconductor cooling plate (3) is provided on the inner side of the heat transfer component (2), and a cooling plate driving circuit (4) is provided on the PCB substrate (1). The cooling plate driving circuit (4) is used to drive the semiconductor cooling plate (3) to transfer the heat inside the BMS protection board heat dissipation device to the heat transfer component (2).

2. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 1 is characterized in that: The cold end of the semiconductor refrigeration sheet (3) faces the heating element in the BMS protection board heat dissipation device, and the hot end of the semiconductor refrigeration sheet (3) faces the heat transfer component (2). A heat conductive filling layer (5) is provided at the gap between the cold end of the semiconductor refrigeration sheet (3) and the heating element, and at the gap between the hot end of the semiconductor refrigeration sheet (3) and the heat transfer component (2).

3. The BMS protection plate heat dissipation device based on semiconductor refrigeration according to claim 2 is characterized in that: The heat-conducting filling layer (5) is a silicone grease pad.

4. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 1 is characterized in that: The PCB substrate (1) is provided with a temperature sensor (6), the temperature sensor (6) is connected to a temperature acquisition circuit (7), the PCB substrate (1) is provided with a controller (8), the controller (8) is connected to the temperature sensor (6) via the temperature acquisition circuit (7), and the controller (8) is connected to the semiconductor refrigeration chip (3) via a refrigeration chip drive circuit (4).

5. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 1 is characterized in that: The PCB substrate (1) is fixed on the bottom plate (9), and the bottom plate (9) and the heat transfer component (2) are used to encapsulate the BMS protection plate heat dissipation device.

6. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 5 is characterized in that: The heat transfer component (2) comprises a heat transfer shell (21) fixedly arranged on the top of the base plate (9); the heat transfer shell (21) is connected to the base plate (9) via threaded fasteners.

7. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 6 is characterized in that: The heat transfer component (2) further comprises a groove (22) opened in the middle of the heat transfer shell (21), a side groove (23) arranged on the side of the heat transfer shell (21), and a heat sink (24) fixedly arranged inside the groove (22) and the side groove (23).

8. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 7 is characterized in that: A fan (25) is provided above the groove (22).

9. The BMS protection board heat dissipation device based on semiconductor refrigeration according to claim 8 is characterized in that: A plurality of heat dissipation channels (26) are provided between the groove (22) and the side groove (23).

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