Miniaturized broadband coupler with hollow structure
By designing a hollow structure miniaturized broadband coupler and using stacking technology to process it as a patch component, the problem of not being able to effectively ensure broadband in limited space is solved, and the improvement of RF performance and space occupation is achieved.
Patent Information
- Application Number
- CN202421330534.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-06-11
AI Technical Summary
The problem of not being able to effectively guarantee broadband in the limited space of existing electronic devices.
A hollow structure miniaturized broadband coupler is designed, including a cuboid coupler shell, a single dielectric body, a coupler module, a hollow structure and via holes. It is processed into a patch assembly through stacking technology to achieve broadband within a very small volume. Coupler effect.
It achieves the ability to ensure RF performance while reducing space usage, has excellent performance such as small size, low profile, wide band, and high Q value, improving the working efficiency of the RF system.
Smart Images
Figure CN222483670U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of radio frequency components, and in particular relates to the design of a miniaturized broadband coupler with a hollow structure. Background Art
[0002] The current trend of microwave systems is to develop towards high integration, high performance and small size, and two or more channels are often integrated in one system. In order to reduce the size of the system and reduce the total power consumption of the system, in recent years, with the maturity of radio frequency technology, electronic devices such as mobile phones can predict the transmission power value of the antenna port through coupler technology. At this time, coupler elements are needed for power detection. However, as the functions of electronic devices such as mobile phones become more and more powerful, the space for electronic devices and radio frequency devices and electronic devices has become very limited. How to ensure broadband in the limited space of electronic devices is an important issue. The utility model provides a hollow structure miniaturized broadband coupler, which can reduce the occupied space while ensuring radio frequency performance by providing a more miniaturized coupler. Utility Model Content
[0003] The utility model aims to solve the problem that the broadband cannot be effectively guaranteed in the limited space of the existing electronic equipment, and proposes a hollow structure miniaturized broadband coupler.
[0004] The technical solution of the utility model is: a hollow structure miniaturized broadband coupler, comprising a rectangular coupler shell, a single dielectric body, a coupler module, a hollow structure and a via; the four corners at the bottom of the rectangular coupler shell are respectively provided with a coupling port, an isolation port, an input port and an output port; the single dielectric body is located inside the rectangular coupler shell, and the single dielectric body includes a first dielectric body; the coupler module is located inside the first dielectric body, and the coupler module includes a first circuit layer and a second circuit layer; the first circuit layer is located above the second circuit layer; the hollow structure includes an air dielectric body, and the hollow structure is located between the first circuit layer and the second circuit layer; the via includes a first via, a second via, a third via and a fourth via; the first via and the second via are located in the first circuit layer; the third via and the fourth via are located in the second circuit layer.
[0005] The beneficial effects of the utility model are:
[0006] 1. The coupler designed by the utility model includes two layers of circuits and is built into a single dielectric body. The volume of the coupler is only 0.65mm×0.5mm×0.35mm. It can be processed into a patch component based on the lamination technology to achieve a broadband coupler effect in a very small volume.
[0007] 2. The coupler designed by the utility model has small size, low profile and wide bandwidth, which is conducive to reducing the interference of surrounding radio frequency devices. It has excellent performances such as high Q value, small size and wide bandwidth, and further improves the working efficiency of the radio frequency system.
[0008] 3. Under the premise of ensuring that its electrical performance is not affected, the utility model maximizes the tolerance of the processing technology, achieves higher process stability and consistency, is easy to integrate with other circuit modules, and has high applicability.
[0009] Preferably, the first dielectric body (D1) is a two-layer printed circuit board or a ceramic dielectric body.
[0010] The beneficial effects of the above preferred solution are:
[0011] By manufacturing the first dielectric body based on a two-layer printed circuit board process or a low-temperature co-fired ceramic technology, higher process stability and consistency are achieved, so that the coupler has excellent performance of small size and light weight.
[0012] Preferably, the first circuit layer includes a first electrode plate, a first via and a second via; the first electrode plate is connected to the coupling port through the first via; and the first electrode plate is connected to the isolation port through the second via.
[0013] The beneficial effects of the above preferred solution are:
[0014] By connecting the electrode plates of the first circuit layer to the coupling port and the isolation port respectively, the coupler has a small size, a low profile and a wide bandwidth, which is beneficial to reducing interference from surrounding radio frequency devices and improving the working efficiency of the radio frequency system.
[0015] Preferably, the second circuit layer includes a second electrode plate, a first via, a second via, a third via and a fourth via; the second electrode plate is connected to the input port through the third via; and the second electrode plate is also connected to the output port through the fourth via.
[0016] The beneficial effects of the above preferred solution are:
[0017] By connecting the electrode plates of the second circuit layer to the input port and the output port respectively, the coupler has a small size, a low profile, and a wide bandwidth, which is beneficial to reducing interference from surrounding radio frequency devices and improving the working efficiency of the radio frequency system.
[0018] Preferably, the first electrode plate, the second electrode plate and the via hole are made of copper or palladium silver.
[0019] The beneficial effects of the above preferred solution are:
[0020] The use of high-conductivity copper or palladium-silver metal materials is beneficial to improving the quality factor of the circuit system.
[0021] Preferably, the dielectric constant of the air dielectric body is set to 1.
[0022] The beneficial effects of the above preferred solution are:
[0023] Setting the dielectric constant of the air dielectric body to 1 reduces the parasitic parameters introduced by the circuit pattern, thereby reducing the influence of the parasitic parameters on the circuit quality factor.
[0024] Preferably, an identification symbol is provided on the top of the rectangular coupler housing.
[0025] The beneficial effects of the above preferred solution are:
[0026] By setting identification symbols on the top of the rectangular coupler housing, the specific positions of each port of the coupler can be clearly identified. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 Shown is a schematic diagram of the internal complement structure of a hollow structure miniaturized broadband coupler.
[0028] Figure 2 Shown is a schematic diagram of the first circuit layer of a hollow structure miniaturized broadband coupler.
[0029] Figure 3 Shown is a schematic diagram of the second circuit layer of a hollow structure miniaturized broadband coupler.
[0030] Figure 4 Shown is the isolation response curve of a hollow structure miniaturized broadband coupler.
[0031] Figure 5 Shown is a coupling response curve of a hollow structure miniaturized broadband coupler.
[0032] Explanation of the reference numerals: D1—first dielectric body, D2—air dielectric body, P1—first electrode plate, P2—second electrode plate, H1—first via hole, H2—second via hole, H3—third via hole, H4—fourth via hole, T1—coupling port, T2—isolation port, T3—input port, T4—output port. DETAILED DESCRIPTION
[0033] Now, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the embodiments shown and described in the accompanying drawings are merely exemplary, intended to explain the principles and spirit of the present invention, rather than to limit the scope of the present invention.
[0034] like Figure 1As shown, a hollow structure miniaturized broadband coupler includes a rectangular coupler shell, a single dielectric body, a coupler module, a hollow structure and a via; the four corners at the bottom of the rectangular coupler shell are respectively provided with a coupling port T1, an isolation port T2, an input port T3 and an output port T4; the single dielectric body is located inside the rectangular coupler shell, and the single dielectric body includes a first dielectric body D1; the coupler module is located inside the first dielectric body D1, and the coupler module includes a first circuit layer and a second circuit layer; the first circuit layer is located above the second circuit layer; the hollow structure includes an air dielectric body D2, and the hollow structure is located between the first circuit layer and the second circuit layer; the via includes a first via H1, a second via H2, a third via H3 and a fourth via H4; the first via H1 and the second via H2 are located in the first circuit layer; the third via H3 and the fourth via H4 are located in the second circuit layer.
[0035] In this embodiment, the first dielectric body (D1) is a two-layer printed circuit board or a ceramic dielectric body.
[0036] In this embodiment, if Figure 2 As shown, the first circuit layer includes a first electrode plate P1, a first via hole H1 and a second via hole H2; the first electrode plate P1 is connected to the coupling port T1 through the first via hole H1; the first electrode plate P1 is connected to the isolation port T2 through the second via hole H2. The thickness from the first circuit layer to the top of the rectangular coupler housing is 60 μm.
[0037] In this embodiment, if Figure 3 As shown, the second circuit layer includes a second electrode plate P2, a first via H1, a second via H2, a third via H3 and a fourth via H4; the second electrode plate P2 is connected to the input port T3 through the third via H3; the second electrode plate P2 is connected to the output port T4 through the fourth via H4. The thickness from the second circuit layer to the first circuit layer is 60 μm, and the thickness from the second circuit layer to the bottom of the rectangular coupler housing is 200 μm.
[0038] In this embodiment, the first electrode plate P1, the second electrode plate P2 and the via hole are all made of copper or palladium silver.
[0039] In this embodiment, the dielectric constant of the air dielectric body D2 is set to 1.
[0040] In this embodiment, an identification symbol is provided on the top of the rectangular coupler housing.
[0041] The specific working principle and process of the utility model are:
[0042] The ceramic dielectric body, i.e., the first dielectric body D1, is made by low temperature co-fired ceramic technology, and its volume is 0.65mm×0.5mm×0.35mm. The coupler module is placed in the ceramic dielectric body and sintered at a temperature of 890℃±20℃, which can realize the miniaturization and broadband of the coupler on the three-dimensional circuit substrate. Palladium silver is used as the embedded metal material and placed in the first circuit layer and the second circuit layer, which is conducive to improving the quality factor of the circuit system, and no oxidation will occur during the sintering process, and no electroplating protection is required.
[0043] The dielectric constant of the dielectric material used in the broadband coupler circuit can vary within a wide range, and the physical size of the equivalent component is inversely proportional to the square root of the dielectric constant of the material, that is, the larger the dielectric constant, the smaller the required component size, but the greater the parasitic parameter impact. In order to meet the requirements of broadband and small volume of the coupler at the same time, a hollow structure can be used in the area between two circuit layers of a single dielectric material. In this embodiment, the area where the first dielectric body D1 is located is the first dielectric material. Due to the small volume requirement, a dielectric material with a dielectric constant of 32 and a dielectric loss tangent of 0.006 is used. However, the large dielectric constant increases the sensitivity to changes in the circuit pattern, and the parasitic parameters of its microstrip line have a greater impact on the circuit quality factor. Therefore, the hollow structure is located between the two circuit layers, and the air dielectric constant of the air dielectric body D2 is 1. The area where the hollow structure is located is the coupling layer, and the hollow structure can reduce the parasitic parameters introduced by the circuit pattern.
[0044] like Figure 4 As shown, the coupler of this embodiment has an isolation of more than 30dB in the working frequency bands of 2400MHz to 2500MHz and 4900MHz to 5850MHz; Figure 5 As shown, the coupling degree range of 2400MHz-2500MHz is 22dB-23dB, and the coupling degree range of 4900MHz-5850MHz is 15dB-17dB, which reflects the stability of the transmission characteristics of the coupler designed by the utility model.
[0045] In summary, the utility model includes two layers of circuits and is built into a single dielectric material. The volume of the coupler is only 0.65mm×0.5mm×0.35mm. It can be processed into a patch component based on the lamination technology, and the broadband coupler effect can be achieved in a very small volume. The coupler is small in size and low in profile, which is conducive to reducing the interference of surrounding RF devices. It has excellent performance such as high Q value, small volume, and wide bandwidth, and further improves the working efficiency of the RF system. On the premise of ensuring that its electrical performance is not affected, the tolerance of the processing technology is maximized, achieving high process stability and consistency, and it is easy to integrate with other circuit modules, with high applicability.
[0046] Those skilled in the art will appreciate that the embodiments described herein are intended to help readers understand the principles of the present invention, and should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific variations and combinations based on the technical inspirations disclosed in the present invention without departing from the essence of the present invention, and these variations and combinations are still within the protection scope of the present invention.
Claims
1. A hollow structure miniaturized broadband coupler, characterized in that: The invention comprises a rectangular coupler housing, a single dielectric body, a coupler module, a hollow structure and a via hole; the four corners at the bottom of the rectangular coupler housing are respectively provided with a coupling port (T1), an isolation port (T2), an input port (T3) and an output port (T4); the single dielectric body is located inside the rectangular coupler housing, and the single dielectric body comprises a first dielectric body (D1); the coupler module is located inside the first dielectric body (D1), and the coupler module comprises a first circuit layer and a second circuit layer; the first circuit layer is parallel to the second circuit layer, and the first circuit layer is located above the second circuit layer; the hollow structure is located between the first circuit layer and the second circuit layer, and the hollow structure comprises an air dielectric body (D2); the via hole comprises a first via hole (H1), a second via hole (H2), a third via hole (H3) and a fourth via hole (H4); the first via hole (H1) and the second via hole (H2) are located in the first circuit layer; the third via hole (H3) and the fourth via hole (H4) are located in the second circuit layer.
2. The hollow structure miniaturized broadband coupler according to claim 1, characterized in that: The first dielectric body (D1) is a two-layer printed circuit board or a ceramic dielectric body.
3. The hollow structure miniaturized broadband coupler according to claim 1, characterized in that: The first circuit layer comprises a first electrode plate (P1), a first via hole (H1) and a second via hole (H2); the first electrode plate (P1) is connected to the coupling port (T1) through the first via hole (H1); the first electrode plate (P1) is connected to the isolation port (T2) through the second via hole (H2).
4. The hollow structure miniaturized broadband coupler according to claim 3, characterized in that: The second circuit layer includes a second electrode plate (P2), a first via hole (H1), a second via hole (H2), a third via hole (H3) and a fourth via hole (H4); the second electrode plate (P2) is connected to the input port (T3) through the third via hole (H3); the second electrode plate (P2) is connected to the output port (T4) through the fourth via hole (H4).
5. The hollow structure miniaturized broadband coupler according to claim 4, characterized in that: The first electrode plate (P1), the second electrode plate (P2) and the via hole are all made of copper or palladium silver.
6. The hollow structure miniaturized broadband coupler according to claim 1, characterized in that: The dielectric constant of the air dielectric body (D2) is set to 1.
7. The hollow structure miniaturized broadband coupler according to claim 1, characterized in that: An identification symbol is arranged on the top of the rectangular coupler housing.