Silicon wafer laser cutting equipment

Abstract

The utility model relates to the technical field of silicon wafer cutting, in particular to silicon wafer laser cutting equipment, which is characterized in that a cutting mechanism for cutting a silicon wafer is arranged in a box body; a dust extraction opening is formed in the top of the box body; a bottom box is arranged at the bottom of the box body; a waste box with an upward opening is arranged in the bottom box; the waste box is slidably connected to the bottom box. An opening groove is formed in the top surface of the bottom box; the bottom end of the open slot is connected with a funnel; and the bottom end of the funnel is arranged above the waste box. When the device is used, the funnel and the waste material box can be used for collecting waste materials, the waste materials automatically fall down and are collected by gravity, manual material taking is not needed, the labor intensity is reduced, generated dust is sucked into the air purification equipment from the dust suction opening to be filtered, and accumulation of dust on the surface of a silicon wafer is reduced to a great extent.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a silicon slice laser cutting device. Background Art

[0002] During the silicon wafer processing, most of the defects exist around the silicon wafer. For defective silicon wafers, they are generally downgraded or returned to the furnace for re-melting. Whether downgrading or re-melting, the use value of the silicon wafer is greatly reduced.

[0003] Therefore, it is necessary to use cutting equipment to cut off the periphery of the silicon wafer. However, when the silicon wafer is cut, waste and dust are produced. The existing silicon wafer cutting equipment lacks equipment to collect waste and dust. After each cut, the waste needs to be cleaned up manually, which is labor-intensive. Moreover, the dust particles produced by cutting are easy to pollute other materials and air. Utility Model Content

[0004] The utility model aims to provide a silicon wafer laser cutting device in view of the defects and shortcomings of the prior art.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] The utility model discloses a silicon wafer laser cutting device, which comprises a box body; a cutting mechanism for cutting silicon wafers is arranged inside the box body; a dust extraction port is arranged on the top of the box body; a bottom box is arranged at the bottom of the box body; a waste box with an upward opening is arranged inside the bottom box; the waste box is slidably connected to the bottom box;

[0007] The top surface of the bottom box is provided with an open groove; the bottom end of the open groove is connected with a funnel; the bottom end of the funnel is placed above the waste box.

[0008] Furthermore, the cutting mechanism includes a silicon wafer separation component, a loading platform conveying module, a material picking robot, a material discharging robot and a cutting component; the loading platform conveying module is provided with a loading platform for fixing silicon wafers; the material picking robot, cutting component and material discharging robot are arranged in sequence along the conveying direction of the loading platform conveying module.

[0009] Furthermore, an air blowing assembly is fixed in the box at a position adjacent to the cutting assembly; and a brush assembly is arranged in the box.

[0010] Furthermore, a plurality of air holes are evenly distributed on the surface of the loading platform; and the air holes are all connected to the negative pressure device.

[0011] Furthermore, the silicon wafer separation component includes a material seat and positioning strips distributed on four sides of the material seat; both sides of the material seat are provided with a blowing seat; the inner surface of the blowing seat is provided with a blowing hole; and a detection component is fixed on the material seat;

[0012] A lifting device is arranged in the material seat.

[0013] Furthermore, the material-retrieving robot is composed of a second moving module and a suction cup connected to the second moving module; and the material-discharging robot is composed of a first moving module and a suction cup connected to the first moving module.

[0014] Furthermore, a tidying assembly is arranged above the material carrier conveying module; the tidying assembly comprises a first fixing seat fixed on the box body and a second fixing seat fixed on the first fixing seat; a lateral linear module is arranged on the first fixing seat; a first stopper is connected to the lateral linear module;

[0015] The first baffle is slidably connected to the first fixed seat; the first baffle is provided with a plurality of baffles perpendicular to the conveying direction of the transverse linear module; the second fixed seat is provided with a longitudinal linear module; the longitudinal linear module is connected with a sliding seat slidably connected to the second fixed seat; the second baffle is fixed on the sliding seat; the second baffle is arranged with a plurality of baffles perpendicular to the conveying direction of the longitudinal linear module.

[0016] Further, the transverse linear module includes two first pulleys rotatably connected to the first fixed seat and a first belt tensioned between the first pulleys; the first baffle is fixed to the first belt; a first motor is arranged on the first fixed seat; an output end of the first motor is connected to one of the first pulleys;

[0017] The longitudinal linear module includes two second pulleys rotatably connected to a second fixed seat and a second belt tensioned between the second pulleys; the second belt is fixed on a sliding seat; a second motor is connected to the second fixed seat; and the output end of the second motor is connected to one of the second pulleys.

[0018] Furthermore, the stopper is cylindrical.

[0019] Furthermore, the cutting assembly includes a third movable module and a cutting module connected to the third movable module; the cutting module includes a cutting head fixing block connected to the third movable module and a lifting slide slidably connected to the cutting head fixing block; a laser cutting head is fixed on the lifting slide; a screw rod is rotatably connected to the cutting head fixing block; a handwheel is fixed to one end of the screw rod; a first threaded hole matching the screw rod is provided on the lifting slide; the screw rod is threadedly connected to the first threaded hole; a second threaded hole connected to the first threaded hole is provided on the lifting slide; a handle bolt is threadedly connected to the second threaded hole.

[0020] After adopting the above structure, the beneficial effects of the utility model are as follows: the waste cut by the cutting mechanism automatically falls off from the finished product and drops from the open groove to the funnel, and slides into the waste box through the funnel; the dust extraction port is connected to an air purification device with negative pressure, and the air purification device is started to generate negative pressure in the upper box body, and the dust generated by the cutting mechanism in the upper box body during the cutting process is sucked into the air purification device from the dust extraction port for filtration; this structure, in addition to being able to use the funnel and the waste box to collect the waste, uses gravity to automatically fall downward for collection, and does not require manual material collection, thereby reducing labor intensity. The generated dust is sucked into the air purification device from the dust extraction port for filtration, thereby greatly reducing the accumulation of dust on the surface of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the utility model;

[0022] Figure 2 This is a structural diagram of the utility model after the upper box body is disassembled;

[0023] Figure 3 It is the structural diagram of the cutting module;

[0024] Figure 4 It is a structural diagram of the silicon wafer separation component;

[0025] Figure 5 It is a structural diagram of regular components;

[0026] Description of reference numerals:

[0027] 1. First moving module; 2. Box body; 201. Funnel; 202. Waste box; 203. Bottom box;

[0028] 204, dust extraction port; 3, cutting module; 301, laser cutting head; 302, hand wheel;

[0029] 303, cutting head fixing block; 304, handle bolt; 305, lifting slide; 306, screw rod;

[0030] 4. Second moving module; 5. Silicon wafer separation component; 501. Material holder; 502. Detection component;

[0031] 503, blowing seat; 503a, blowing hole; 504, positioning strip; 6, material loading platform conveying module;

[0032] 601, loading platform; 7, regularization component; 701, first pulley; 702, second pulley;

[0033] 703, first belt; 704, second belt; 705, stopper; 706, first stopper;

[0034] 707, second gear lever; 708, first fixed seat; 709, sliding seat; 7010, second motor;

[0035] 7011, second fixing seat; 7012, first motor; 8, suction cup; 9, brush assembly;

[0036] 10. Blowing assembly; 11. The third movable module. DETAILED DESCRIPTION

[0037] The utility model is further described below in conjunction with the accompanying drawings.

[0038] like Figures 1 to 5 As shown, a silicon wafer laser cutting device described in the utility model comprises a box body 2; a cutting mechanism for cutting silicon wafers is arranged inside the box body 2; a dust extraction port 204 is arranged on the top of the box body 2; a bottom box 203 is arranged on the bottom of the box body 2; a waste box 202 with an upward opening is arranged inside the bottom box 203; the waste box 202 is slidably connected to the bottom box 203;

[0039] The top surface of the bottom box 203 is provided with an open slot; the bottom end of the open slot is connected to a funnel 201; the bottom end of the funnel 201 is placed above the waste box 202;

[0040] The box body 2 is composed of two parts, the upper part is the upper box body, and the lower part is the bottom box 203; a track is fixed on the bottom box 203, which is used to form a sliding connection with the waste box 202, so that the waste box 202 can slide into the bottom of the funnel 201 in the bottom box 203 or be pulled out from the bottom box 203;

[0041] The waste material cut by the cutting mechanism automatically falls off from the finished product and drops from the opening slot into the funnel 201 , and slides into the waste material box 202 through the funnel 201 ;

[0042] The dust extraction port 204 is connected to an air purification device with negative pressure. When the air purification device is started, negative pressure is generated in the upper box.

[0043] The dust generated by the cutting mechanism in the upper box during the cutting process is sucked into the air purification device through the dust extraction port 204 for filtration;

[0044] This structure, in addition to being able to collect waste using the funnel 201 and the waste box 202, uses gravity to automatically drop and collect waste, eliminating the need for manual material collection and reducing labor intensity. The generated dust is sucked into the air purification equipment from the dust extraction port 204 for filtration, greatly reducing the accumulation of dust on the surface of the silicon wafer.

[0045] As a preferred embodiment of the utility model, the cutting mechanism includes a silicon wafer separation component 5, a loading platform conveying module 6, a material picking robot, a material discharging robot and a cutting component; a loading platform 601 for fixing silicon wafers is provided on the module of the loading platform conveying module 6; the material picking robot, the cutting component and the material discharging robot are arranged in sequence along the conveying direction of the loading platform conveying module 6; the loading platform conveying module 6 is a linear module, which has no essential difference from the prior art, so it is not described in detail; a plurality of silicon wafers to be cut are stacked on the silicon wafer separation component 5; the material picking robot takes a silicon wafer from the silicon wafer separation component 5 The wafer is placed on the loading platform 601 on the loading platform conveying module 6 and fixed by the loading platform 601; then the loading platform conveying module 6 drives the loading platform 601 and the silicon wafer to the position of the cutting component; the cutting component moves according to the preset program to cut the periphery of the silicon wafer, and the cut periphery of the silicon wafer falls into the funnel 201; after cutting, the loading platform conveying module 6 conveys the cut silicon wafer to the discharging robot for taking out; the cutting component can cut the peripheral waste into multiple sections, which is convenient for the waste to enter the funnel 201; by classifying the silicon wafer by periphery and silicon wafer theme, the economic benefit is improved.

[0046] As a preferred embodiment of the present invention, a blowing assembly 10 is fixed in the box 2 at a position adjacent to the cutting assembly; a brush assembly 9 is arranged in the box 2; the brush assembly 9 is composed of a motor and a brush roller, and the motor drives the brush roller to rotate to sweep dust from the bottom surface of the silicon wafer; the blowing assembly 10 is a plurality of air nozzles connected to positive air pressure, which is essentially the same as the prior art, so it is not described in detail;

[0047] The dust generated during cutting is blown up by the air blowing assembly to prevent the surface of the silicon wafer from being stained with dust. The blown dust is sucked away from the dust extraction port 204 by the negative pressure generated inside the box 2.

[0048] As a preferred embodiment of the utility model, a plurality of air holes are evenly distributed on the surface of the loading platform 601; the air holes are all connected to the negative pressure device; after the silicon wafer is placed on the loading platform 601, the silicon wafer is adsorbed and fixed on the loading platform 601 through the air holes connected to the negative pressure.

[0049] As a preferred embodiment of the present invention, the silicon wafer separation component 5 includes a material holder 501 and positioning strips 504 distributed on four sides of the material holder 501; both sides of the material holder 501 are provided with air blowing holders 503; the inner surface of the air blowing holder 503 is provided with air blowing holes 503a; the material holder 501 is fixed with a detection component 502;

[0050] The material holder 501 is provided with a lifting device; the lifting device is fixed on the box body 2; the lifting device is essentially the same as the prior art, so it is not described in detail; the silicon wafers are stacked on the material holder 501, and the silicon wafers on the material holder 501 are lifted and lowered by the lifting device; the detection component 502 is essentially the same as the prior art, so it is not described in detail; the detection component 502 detects whether the top silicon wafer reaches the set height;

[0051] The blowing seat 503 is provided with a pipeline for connecting with the blowing hole 503a; the lifting device drives the material seat 501 to rise to the height of a silicon wafer, and the detection component 502 generates an induction signal after passing through the silicon wafer, so that the lifting device stops working, and the blowing hole 503a generates positive air pressure, and the air flow ejected from the blowing holes 503a on both sides breaks the vacuum of the top silicon wafer and the adjacent silicon wafers and blows them up, so as to separate the top silicon wafer from the adjacent silicon wafers, making it convenient for the material taking robot to take the material.

[0052] As a preferred embodiment of the utility model, the material picking robot is composed of a second movable module 4 and a suction cup 8 connected to the second movable module 4; the material discharging robot is composed of a first movable module 1 and a suction cup 8 connected to the first movable module 1; the first movable module 1 and the second movable module 4 are both composed of a translation linear module and a lifting linear module; the translation linear module and the lifting linear module are both linear modules; the translation linear module can drive the lifting linear module to perform translational movement, and the lifting linear module can drive the suction cup 8 to perform lifting movement; the silicon wafers are transported by the coordinated movement of the translation linear module, the lifting linear module and the suction cup 8.

[0053] As a preferred embodiment of the present invention, a tidying assembly 7 is provided above the material carrier conveying module 6; the tidying assembly 7 includes a first fixing seat 708 fixed on the box body 2 and a second fixing seat 7011 fixed on the first fixing seat 708; a lateral linear module is provided on the first fixing seat 708; a first stopper 706 is connected to the lateral linear module;

[0054] The first baffle rod 706 is slidably connected to the first fixed seat 708; the first baffle rod 706 is provided with a plurality of baffles 705 along a direction perpendicular to the conveying direction of the transverse linear module; the second fixed seat 7011 is provided with a longitudinal linear module; the longitudinal linear module is connected with a sliding seat 709 slidably connected to the second fixed seat 7011; the sliding seat 709 is fixed with a second baffle rod 707; the second baffle rod 707 is arranged with a plurality of baffles 705 along a direction perpendicular to the conveying direction of the longitudinal linear module;

[0055] Before the silicon wafer is placed on the loading platform 601 and is not positioned, the transverse linear module drives the first baffle 706 to move, and the longitudinal linear module drives the second baffle 707 to move, so that the silicon wafer is positioned on the loading platform 601 through the baffles 705 on both sides respectively attached to the two side surfaces of the silicon wafer; in this way, the position of each silicon wafer on the loading platform 601 is consistent.

[0056] As a preferred embodiment of the utility model, the transverse linear module includes two first pulleys 701 rotatably connected to the first fixed seat 708 and a first belt 703 tensioned between the first pulleys 701; the first baffle 706 is fixed on the first belt 703; a first motor 7012 is provided on the first fixed seat 708; the output end of the first motor 7012 is connected to one of the first pulleys 701; after the first motor 7012 rotates, the first belt 703 is driven to move through the first pulley 701, so that the first baffle 706 performs transverse movement;

[0057] The longitudinal linear module includes two second pulleys 702 rotatably connected to a second fixed seat 7011 and a second belt 704 tensioned between the second pulleys 702; the second belt 704 is fixed to a sliding seat 709; a second motor 7010 is connected to the second fixed seat 7011; the output end of the second motor 7010 is connected to one of the second pulleys 702;

[0058] After the second motor 7010 rotates, it drives the sliding seat 709 to move longitudinally on the second fixed seat 7011 through the second pulley 702 and the second belt 704.

[0059] As a preferred embodiment of the present invention, the stopper 705 is cylindrical.

[0060] As a preferred embodiment of the present invention, the cutting assembly includes a third movable module 11 and a cutting module 3 connected to the third movable module 11; the cutting module 3 includes a cutting head fixing block 303 connected to the third movable module 11 and a lifting slide 305 slidably connected to the cutting head fixing block 303; a laser cutting head 301 is fixed on the lifting slide 305; a screw rod 306 is rotatably connected to the cutting head fixing block 303; a hand wheel 302 is fixed to one end of the screw rod 306; a first threaded hole matching the screw rod 306 is provided on the lifting slide 305; the screw rod 306 is threadedly connected to the first threaded hole; a second threaded hole connected to the first threaded hole is provided on the lifting slide 305; a handle bolt 304 is threadedly connected to the second threaded hole;

[0061] The third moving module 11 is composed of two mutually perpendicular transverse linear modules and a longitudinal linear module; the laser cutting head 301 is driven to move by the combined movement of the transverse linear module and the longitudinal linear module to control the cutting trajectory; the laser cutting head 301 is essentially the same as the prior art, so it is not described in detail;

[0062] After the handle bolt 304 is tightened against the screw rod 306, the screw rod 306 cannot rotate, so that the laser cutting head 301 is completely fixed on the cutting head fixing block 303; after loosening the handle bolt 304, the screw rod 306 is driven to rotate by turning the hand wheel 302, and the laser cutting head 301 is pushed to move up and down, so as to adjust the distance from the laser cutting head 301 to the silicon wafer.

[0063] The above description is only a preferred embodiment of the present utility model, so all equivalent changes or modifications made according to the structure, features and principles described in the scope of the present utility model patent application are included in the scope of the present utility model patent application.

Claims

1. A silicon wafer laser cutting device, characterized in that: It comprises a box body (2); a cutting mechanism for cutting silicon wafers is arranged inside the box body (2); a dust extraction port (204) is arranged on the top of the box body (2); a bottom box (203) is arranged on the bottom of the box body (2); a waste box (202) with an upward opening is arranged inside the bottom box (203); the waste box (202) is slidably connected to the bottom box (203); The top surface of the bottom box (203) is provided with an open groove; the bottom end of the open groove is connected to a funnel (201); the bottom end of the funnel (201) is placed above the waste box (202).

2. The silicon wafer laser cutting device according to claim 1, characterized in that: The cutting mechanism comprises a silicon wafer separation component (5), a loading platform conveying module (6), a material taking robot, a material discharging robot and a cutting component; a loading platform (601) for fixing silicon wafers is arranged on the loading platform conveying module (6); the material taking robot, the cutting component and the material discharging robot are arranged in sequence along the conveying direction of the loading platform conveying module (6).

3. The silicon wafer laser cutting device according to claim 2, characterized in that: An air blowing assembly (10) is fixed in the box body (2) at a position adjacent to the cutting assembly; and a brush assembly (9) is arranged in the box body (2).

4. The silicon wafer laser cutting device according to claim 2, characterized in that: A plurality of air holes are evenly distributed on the surface of the loading platform (601); the air holes are all connected to the negative pressure equipment.

5. The silicon wafer laser cutting device according to claim 2, characterized in that: The silicon wafer separation component (5) comprises a material seat (501) and positioning strips (504) distributed on four sides of the material seat (501); both sides of the material seat (501) are provided with air blowing seats (503); the inner surface of the air blowing seat (503) is provided with air blowing holes (503a); and a detection component (502) is fixed on the material seat (501); A lifting device is provided inside the material seat (501).

6. The silicon wafer laser cutting device according to claim 2, characterized in that: The material taking robot is composed of a second moving module (4) and a suction cup (8) connected to the second moving module (4); the material discharging robot is composed of a first moving module (1) and a suction cup (8) connected to the first moving module (1).

7. The silicon wafer laser cutting device according to claim 2, characterized in that: A tidying assembly (7) is arranged above the material loading platform conveying module (6); the tidying assembly (7) comprises a first fixing seat (708) fixed on the box body (2) and a second fixing seat (7011) fixed on the first fixing seat (708); a transverse linear module is arranged on the first fixing seat (708); and a first stopper (706) is connected to the transverse linear module; The first baffle rod (706) is slidably connected to the first fixed seat (708); the first baffle rod (706) is provided with a plurality of baffles (705) along a direction perpendicular to the conveying direction of the transverse linear module; the second fixed seat (7011) is provided with a longitudinal linear module; the longitudinal linear module is connected to a sliding seat (709) slidably connected to the second fixed seat (7011); the sliding seat (709) is fixed with a second baffle rod (707); the second baffle rod (707) is arranged with a plurality of baffles (705) along a direction perpendicular to the conveying direction of the longitudinal linear module.

8. The silicon wafer laser cutting device according to claim 7, characterized in that: The transverse linear module comprises two first pulleys (701) rotatably connected to a first fixed seat (708) and a first belt (703) tensioned between the first pulleys (701); the first stop rod (706) is fixed on the first belt (703); and a first motor (7012) is provided on the first fixed seat (708); The longitudinal linear module comprises two second pulleys (702) rotatably connected to a second fixed seat (7011) and a second belt (704) tensioned between the second pulleys (702); the second belt (704) is fixed on a sliding seat (709); a second motor (7010) is connected to the second fixed seat (7011); and an output end of the second motor (7010) is connected to one of the second pulleys (702).

9. The silicon wafer laser cutting device according to claim 7, characterized in that: The stopper (705) is cylindrical in shape.

10. The silicon wafer laser cutting device according to claim 2, characterized in that: The cutting assembly comprises a third movable module (11) and a cutting module (3) connected to the third movable module (11); the cutting module (3) comprises a cutting head fixing block (303) connected to the third movable module (11) and a lifting slide (305) slidably connected to the cutting head fixing block (303); a laser cutting head (301) is fixed to the lifting slide (305); a screw rod (306) is rotatably connected to the cutting head fixing block (303); a hand wheel (302) is fixed to one end of the screw rod (306); a first threaded hole matching the screw rod (306) is provided on the lifting slide (305); the screw rod (306) is threadedly connected to the first threaded hole; a second threaded hole connected to the first threaded hole is provided on the lifting slide (305); a handle bolt (304) is threadedly connected to the second threaded hole.

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