Liquid cooling module

Abstract

The utility model provides a liquid cooling module which is suitable for providing a cooling function for an electronic device. The liquid cooling module comprises a base, a cover body and a first staggered fin assembly. The cover body covers the base, a flow channel is formed between the base and the cover body, and cooling liquid is suitable for flowing in the flow channel. The first staggered fin assembly is arranged in the flow channel, and the cooling liquid is suitable for being drained by the first staggered fin assembly and takes away heat from the first staggered fin assembly.

Description

Technical Field

[0001] The utility model relates to a cooling module, in particular to a liquid cooling module. Background Art

[0002] In known liquid cooling modules, heat sink fins are installed in the flow channel of the cooling liquid to increase the heat dissipation area. However, improperly installed fins increase the fluid resistance, causing the flow rate of the cooling liquid to decrease, which is not conducive to the overall heat dissipation effect. What's more, it will cause other interference factors such as eddy currents, which will reduce the heat dissipation efficiency. Therefore, how to correctly select and install heat sink fins is an important issue in heat dissipation design. Utility Model Content

[0003] The embodiment of the utility model is a liquid cooling module provided to solve the problems of the known technology, which is suitable for providing cooling function for an electronic device. The liquid cooling module includes a base, a cover and a first offset fin assembly. The cover covers the base, wherein a flow channel is formed between the base and the cover, and a cooling liquid is suitable for flowing in the flow channel. The first offset fin assembly is arranged in the flow channel, and the cooling liquid is suitable for being drained by the first offset fin assembly and taking away heat from the first offset fin assembly.

[0004] In one embodiment, the first staggered fin assembly includes a first fin unit and a second fin unit, the first fin unit includes a plurality of first fins, the second fin unit includes a plurality of second fins, and the plurality of first fins and the plurality of second fins are staggered with each other.

[0005] In one embodiment, the first fin unit includes at least one top connecting piece and at least one bottom connecting piece, one side of each first fin is connected to the top connecting piece, and the other side of each first fin is connected to the bottom connecting piece.

[0006] In one embodiment, the first fin unit has a square wave structure, and the second fin unit has a square wave structure.

[0007] In one embodiment, the top connecting piece is connected to the cover, and the bottom connecting piece is connected to the base.

[0008] In one embodiment, the electronic device includes a heat source, the heat source is thermally connected to the liquid cooling module, and the position of the heat source corresponds to the first offset fin assembly.

[0009] In one embodiment, the liquid cooling module also includes a second offset fin assembly, wherein the base forms a partition island, which defines the flow channel as a U-shaped flow channel, and the flow channel includes an inflow section, a turning section and an outflow section, one end of the turning section is connected to the inflow section, and the other end of the turning section is connected to the outflow section, the partition island is located between the inflow section and the outflow section, the first offset fin assembly is arranged in the inflow section, and the second offset fin assembly is arranged in the outflow section.

[0010] In one embodiment, the liquid cooling module further includes a third staggered fin assembly, wherein the third staggered fin assembly is disposed in the turning section.

[0011] In one embodiment, the liquid cooling module also includes a guide plate, which is located between the first staggered fin assembly and the third staggered fin assembly in the flow channel, one end of the guide plate is connected to the partition island, and the other end of the guide plate corresponds to the entrance of the third staggered fin assembly.

[0012] In one embodiment, the liquid cooling module also includes a first drainage fin unit and a second drainage fin unit. In the flow channel, the first drainage fin unit is located between the guide plate and the first offset fin assembly, and the second drainage fin unit is located between the third offset fin assembly and the second offset fin assembly.

[0013] In an embodiment of the present utility model, a staggered fin assembly is arranged in the flow channel, and the internal component size and shape of the staggered fin assembly are used to change the direction of water flow, so as to develop a liquid cooling module with excellent pressure drop value and heat dissipation performance. In one embodiment, the staggered fin assembly can be connected to the base and the cover by brazing. The material of the staggered fin assembly can be aluminum alloy, which has a low production cost and can obtain higher economic benefits. In addition, the position selection of the staggered fin assembly of the embodiment of the present utility model, combined with components such as guide vanes and drainage fin units, can make the flow field of the cooling liquid smoother and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, wherein:

[0015] Figure 1 It is a combined diagram showing a liquid cooling module and a heat source according to an embodiment of the utility model.

[0016] Figure 2 It is an exploded view showing the liquid cooling module and the heat source of the embodiment of the utility model.

[0017] Figure 3It shows the detailed structure of the first offset fin assembly of an embodiment of the utility model.

[0018] Figure 4 It shows the detailed structure of the base of the embodiment of the utility model.

[0019] Reference numerals:

[0020] D: Electronic devices

[0021] C: Liquid cooling module

[0022] 1: The first offset fin assembly

[0023] 11: First fin unit

[0024] 111: First fin

[0025] 112: Top connecting piece

[0026] 113: Bottom connecting piece

[0027] 12: Second fin unit

[0028] 121: Second fin

[0029] 2: Second offset fin assembly

[0030] 3: The third misaligned fin assembly

[0031] 31: Entrance

[0032] 4: Base

[0033] 41: Separation Island

[0034] 5: Cover

[0035] 61: Heat Source

[0036] 62: Heat Source

[0037] 63: Heat Source

[0038] 64: Heat Source

[0039] 71: First drainage fin unit

[0040] 72: Second drainage fin unit

[0041] 73: Guide vane

[0042] 81: Water inlet pipe

[0043] 82: Water outlet pipe

[0044] 83: Exhaust valve

[0045] P: Runner

[0046] P1: Inflow section

[0047] P2: Turning section

[0048] P3: Outflow section

[0049] F: Cooling liquid DETAILED DESCRIPTION

[0050] Figure 1 It is a combined diagram showing a liquid cooling module and a heat source according to an embodiment of the utility model. Figure 2 It is an exploded view showing the liquid cooling module and heat source of an embodiment of the utility model. With reference to Figures 1 and 2, the liquid cooling module C of the embodiment of the utility model is suitable for providing a cooling function for an electronic device D. In one embodiment, the electronic device can be a server, a desktop computer or a laptop computer. The liquid cooling module C includes a base 4, a cover 5 and a first offset fin assembly 1. The cover 5 covers the base 4, wherein a flow channel P is formed between the base 4 and the cover 5, and a cooling liquid (not shown) is suitable for flowing in the flow channel P. The first offset fin assembly 1 is arranged in the flow channel P, and the cooling liquid is suitable for being drained by the first offset fin assembly 1 and taking away heat from the first offset fin assembly 1.

[0051] Figure 3 Detailed structure of the first staggered fin assembly of the present utility model is shown in FIG. Figure 3 In one embodiment, the first offset fin assembly 1 includes a first fin unit 11 and a second fin unit 12, the first fin unit 11 includes a plurality of first fins 111, the second fin unit 12 includes a plurality of second fins 121, and the plurality of first fins 111 and the plurality of second fins 121 are offset from each other.

[0052] Reference Figure 3 In one embodiment, the first fin unit 11 includes at least one top connecting piece 112 and at least one bottom connecting piece 113 , one side of each first fin 111 is connected to the top connecting piece 112 , and the other side of each first fin 111 is connected to the bottom connecting piece 113 .

[0053] Reference Figure 3 In one embodiment, the first fin unit 11 is in a square wave structure, and the second fin unit 12 is in a square wave structure. The above disclosure does not limit the present invention. In other embodiments, the fins of the staggered fin assembly may also be arranged in other forms.

[0054] Matching reference Figure 2 , 3 In one embodiment, the top connecting piece 112 is connected to the cover 5 , and the bottom connecting piece 113 is connected to the base 4 .

[0055] Matching reference Figure 1 , 2 In one embodiment, the electronic device D includes a heat source 61 , which is thermally connected to the liquid cooling module C, and the position of the heat source 61 corresponds to the first offset fin assembly 1 .

[0056] Figure 4 It shows the detailed structure of the base of the embodiment of the utility model. Figure 2 , 4 In one embodiment, the liquid cooling module C also includes a second offset fin assembly 2, wherein the base 4 is formed with a partition island 41, and the partition island 41 defines the flow channel P as a U-shaped flow channel, and the flow channel P includes an inflow section P1, a turning section P2 and an outflow section P3, one end of the turning section P2 is connected to the inflow section P1, and the other end of the turning section P2 is connected to the outflow section P3, the partition island 41 is located between the inflow section P1 and the outflow section P3, the first offset fin assembly 1 is arranged in the inflow section P1, and the second offset fin assembly 2 is arranged in the outflow section P3.

[0057] Matching reference Figure 2 , 4 In one embodiment, the liquid cooling module further includes a third offset fin assembly 3, wherein the third offset fin assembly 3 is disposed in the turning section P2.

[0058] Matching reference Figure 2 , 4 In one embodiment, the liquid cooling module further includes a guide plate 73. In the flow channel P, the guide plate 73 is located between the first offset fin assembly 1 and the third offset fin assembly 3. One end of the guide plate 73 is connected to the partition island 41, and the other end of the guide plate 73 corresponds to the entrance 31 of the third offset fin assembly 3.

[0059] Matching reference Figure 2 , 4 In one embodiment, the liquid cooling module also includes a first drainage fin unit 71 and a second drainage fin unit 72. In the flow channel P, the first drainage fin unit 71 is located between the guide plate 73 and the first offset fin assembly 1, and the second drainage fin unit 72 is located between the third offset fin assembly 3 and the second offset fin assembly 2.

[0060] Reference Figure 4 In one embodiment, after the cooling liquid F enters the inflow section P1, it passes through the first offset fin assembly 1 and the first drainage fin unit 71, is guided by the guide plate 73 and passes through the third offset fin assembly 3, then passes through the second drainage fin unit 72 and the second offset fin assembly 2, and finally flows out of the outflow section P3.

[0061] Matching reference Figure 1 , 2 In one embodiment, the electronic device further comprises a heat source 62, a heat source 63 and a heat source 64. The heat sources 61, 62 and 63 are thermally connected to the cover 5, the position of the heat source 61 corresponds to the first staggered fin assembly 1, the position of the heat source 62 corresponds to the second staggered fin assembly 2, and the position of the heat source 63 corresponds to the third staggered fin assembly 3. The heat source 64 is thermally connected to the base 4, and in one embodiment, the position of the heat source 64 corresponds to the first staggered fin assembly 1, the second staggered fin assembly 2 and the third staggered fin assembly 3.

[0062] Matching reference Figure 1 , 2 In one embodiment, the liquid cooling module C further includes a water inlet pipe 81 and a water outlet pipe 82, wherein the water inlet pipe 81 and the water outlet pipe 82 are respectively connected to the flow channel P. The liquid cooling module C further includes an exhaust valve 83, wherein the exhaust valve 83 is connected to the flow channel P.

[0063] In an embodiment of the present invention, a staggered fin assembly is arranged in the flow channel, and the internal component size and shape of the staggered fin assembly are used to change the direction of water flow, so as to develop a liquid cooling module with excellent pressure drop value and heat dissipation performance. In one embodiment, the staggered fin assembly can be connected to the base and the cover by brazing. The material of the staggered fin assembly can be aluminum alloy, which has a low production cost and can obtain higher economic benefits. In addition, the position selection of the staggered fin assembly in the embodiment of the present invention, combined with components such as guide vanes and drainage fin units, can make the flow field of the cooling liquid smoother and improve the heat dissipation efficiency.

[0064] Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the definition of the claims.

Claims

1. A liquid cooling module, characterized in that: Suitable for providing cooling function for an electronic device, comprising: a base; a cover body, covering the base, wherein a flow channel is formed between the base and the cover body, and a cooling liquid is suitable for flowing in the flow channel; and A first offset fin assembly is arranged in the flow channel, and the cooling liquid is suitable for being guided by the first offset fin assembly and taking away heat from the first offset fin assembly.

2. The liquid cooling module according to claim 1, characterized in that: The first staggered fin assembly includes a first fin unit and a second fin unit. The first fin unit includes a plurality of first fins, and the second fin unit includes a plurality of second fins. The plurality of first fins and the plurality of second fins are staggered with each other.

3. The liquid cooling module according to claim 2, characterized in that: The first fin unit includes at least one top connecting piece and at least one bottom connecting piece. One side of each first fin is connected to the top connecting piece, and the other side of each first fin is connected to the bottom connecting piece.

4. The liquid cooling module according to claim 3, characterized in that: The first fin unit has a square wave structure, and the second fin unit has a square wave structure.

5. The liquid cooling module according to claim 3, characterized in that: The top connecting piece is connected to the cover body, and the bottom connecting piece is connected to the base.

6. The liquid cooling module according to claim 2, characterized in that: The electronic device comprises a heat source, which is thermally connected to the liquid cooling module, and the position of the heat source corresponds to the first offset fin assembly.

7. The liquid cooling module according to claim 2, characterized in that: It also includes a second offset fin assembly, wherein the base forms a partition island, which defines the flow channel as a U-shaped flow channel, and the flow channel includes an inflow section, a turning section and an outflow section, one end of the turning section is connected to the inflow section, and the other end of the turning section is connected to the outflow section, and the partition island is located between the inflow section and the outflow section, the first offset fin assembly is arranged in the middle of the inflow section, and the second offset fin assembly is arranged in the outflow section.

8. The liquid cooling module according to claim 7, characterized in that: It also includes a third staggered fin assembly, wherein the third staggered fin assembly is arranged in the middle of the turning section.

9. The liquid cooling module according to claim 8, characterized in that: It also includes a guide plate, which is located between the first offset fin assembly and the third offset fin assembly in the flow channel, one end of the guide plate is connected to the separation island, and the other end of the guide plate corresponds to the inlet of the third offset fin assembly.

10. The liquid cooling module according to claim 9, characterized in that: It also includes a first drainage fin unit and a second drainage fin unit. In the flow channel, the first drainage fin unit is located between the guide plate and the first offset fin assembly, and the second drainage fin unit is located between the third offset fin assembly and the second offset fin assembly.

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