Circuit board internal buried hole filling device

Abstract

The utility model relates to the field of circuit board processing, in particular to an internal buried hole filling device for a circuit board. The utility model provides the device for filling the buried hole in the circuit board with the resin, which can fill the buried hole in the circuit board with the resin, can perform hot pressing and leveling on the resin in the buried hole, realizes function integration, reduces operation steps, reduces maintenance cost, and improves the production efficiency of the circuit board. A hole burying and filling device in a circuit board comprises a mounting frame, an air cylinder and the like, and the mounting frame is connected to the telescopic end of the air cylinder. According to the utility model, through upward movement of the sliding pipe, resin flows into the buried hole through the conduction pipe, through downward movement of the mounting rack, the resin in the buried hole is subjected to hot-pressing leveling through the heating wire, the buried hole in the circuit board can be filled with the resin, and the resin in the buried hole can be subjected to hot-pressing leveling, so that function integration is realized; the operation steps are reduced, the maintenance cost is reduced, and the production efficiency of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the field of circuit board processing, in particular to a device for burying and filling holes inside a circuit board. Background Art

[0002] Buried and filled holes inside a circuit board refers to the process of drilling holes inside a circuit board and filling them with conductive materials in order to connect circuits between different layers during the manufacturing process of a multi-layer printed circuit board (PCB). This process is usually used for multi-layer PCBs where signals or power need to be transmitted between different layers.

[0003] The existing method of filling buried holes inside circuit boards is to first fill the buried holes inside the circuit board with resin through an injection device, wait for the resin to solidify, then transfer the circuit board to a flattener, and then use the flattener to hot-press and flatten the resin in the buried holes. However, the current device cannot achieve functional integration, the operation steps are relatively cumbersome, which increases maintenance costs and affects the production efficiency of circuit boards.

[0004] Therefore, it is necessary to design a circuit board internal buried hole filling device that can fill the buried holes on the circuit board with resin and can hot-press and flatten the resin in the buried holes to achieve functional integration, reduce operating steps, reduce maintenance costs, and improve circuit board production efficiency. Utility Model Content

[0005] In order to overcome the shortcomings of existing buried via filling inside circuit boards, the current devices cannot achieve functional integration, the operation steps are relatively cumbersome, the maintenance cost is increased, and the production efficiency of circuit boards is affected. The utility model provides a buried via filling device inside a circuit board that can fill the buried vias on the circuit board with resin and can perform hot pressing and leveling on the resin in the buried vias, thereby achieving functional integration, reducing the operation steps, reducing the maintenance cost, and improving the production efficiency of the circuit board.

[0006] The technical solution is: a device for burying and filling holes inside a circuit board, including a mounting frame, a rotating rod, a feeding piece, a conducting tube, a sliding tube, a first spring and a cylinder, the telescopic end of the cylinder is connected to the mounting frame, the lower part of the mounting frame is rotatably connected to the rotating rod, the lower side of the rotating rod is connected to the feeding piece, the lower side of the rotating rod is connected to the conducting tube, the conducting tube is located inside the feeding piece, the sliding tube is slidably connected inside the feeding piece, the sliding tube is located outside the conducting tube, and the first spring is connected between the lower side of the feeding piece and the sliding tube.

[0007] As a further preferred solution, a motor is also included. The right side of the lower part of the mounting frame is connected to the motor, and the output shaft of the motor is connected to the rotating rod.

[0008] As a further preferred solution, it also includes a connecting tube and a heating wire. The upper side of the rotating rod is connected to the connecting tube, and the outer side of the upper part of the connecting tube is connected to the heating wire.

[0009] As a further preferred solution, it also includes a second spring and a pressing rod, the pressing rod is slidably connected to the connecting tube, and the second spring is connected between the pressing rod and the connecting tube.

[0010] As a further preferred solution, a mounting plate is also included, and the mounting plate is connected to the fixed end of the cylinder.

[0011] As a further preferred solution, two front and rear mounting holes are provided on both the left and right parts of the mounting plate.

[0012] The utility model has the following advantages: the utility model moves upward through the sliding tube, so that the resin flows into the buried hole through the conducting tube, moves downward through the mounting frame, and heat-presses and flattens the resin in the buried hole through the heating wire, thereby achieving the effect of being able to fill the buried hole on the circuit board with resin and heat-press and flatten the resin in the buried hole, realizing functional integration, reducing operating steps, reducing maintenance costs, and improving circuit board production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model.

[0014] Figure 2 It is a three-dimensional structural schematic diagram of the utility model.

[0015] Figure 3 It is a partial three-dimensional structural sectional view of the utility model.

[0016] Figure 4 It is a partial three-dimensional structure diagram of the utility model.

[0017] Among them: 1-mounting frame, 2-motor, 3-rotating rod, 4-feeding piece, 5-conducting tube, 6-sliding tube, 7-first spring, 8-connecting tube, 9-heating wire, 10-second spring, 11-pressing rod, 12-cylinder, 13-mounting plate. DETAILED DESCRIPTION

[0018] The present invention is further described below in conjunction with specific embodiments. It should also be noted that, unless otherwise clearly specified and limited, terms such as: setting, installing, connecting, and connecting should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0019] A device for filling and burying holes in a circuit board, such as Figure 1-Figure 4As shown, it includes a mounting frame 1, a motor 2, a rotating rod 3, a feeding piece 4, a conducting tube 5, a sliding tube 6, a first spring 7, a connecting tube 8, a heating wire 9, a second spring 10, a pressing rod 11, a cylinder 12 and a mounting plate 13. The telescopic end of the cylinder 12 is connected to the mounting frame 1, the motor 2 is connected to the right side of the lower part of the mounting frame 1, the rotating rod 3 is rotatably connected to the lower part of the mounting frame 1, the output shaft of the motor 2 is connected to the rotating rod 3, the feeding piece 4 is connected to the lower side of the rotating rod 3, the conducting tube 5 is connected to the lower side of the rotating rod 3, and the conducting tube 5 is connected to the lower side of the rotating rod 3. Tube 5 is located inside the feeding piece 4, and a sliding tube 6 is slidably connected inside the feeding piece 4. The sliding tube 6 is located outside the conducting tube 5. A first spring 7 is connected between the lower side of the feeding piece 4 and the sliding tube 6. A connecting tube 8 is connected to the upper side of the rotating rod 3. A heating wire 9 is connected to the outer side of the upper part of the connecting tube 8. A pressing rod 11 is slidably connected to the connecting tube 8. A second spring 10 is connected between the pressing rod 11 and the connecting tube 8. A mounting plate 13 is connected to the fixed end of the cylinder 12, and two front and rear mounting holes are opened on the left and right parts of the mounting plate 13.

[0020] When using the device, firstly, the mounting plate 13 is installed in the buried hole filling area inside the circuit board through the mounting hole, and then the circuit board is placed on the lower side of the device so that the sliding tube 6 is aligned with the buried hole on the circuit board, and then the resin is input into the feeding piece 4, and then the cylinder 12 is started. The operation of the cylinder 12 drives the mounting frame 1 to move downward, so that the sliding tube 6 contacts the circuit board, and drives the sliding tube 6 to move upward. The first spring 7 is squeezed and contracted, so that the resin flows into the buried hole of the circuit board through the conducting tube 5. After the filling is completed, the cylinder 12 is started in the reverse direction to drive the mounting frame 1 to move upward, so that the sliding tube 6 no longer contacts the circuit board, and the first spring 7 is restored, so that the sliding tube 6 moves and resets, and then the resin no longer flows out. When the resin solidifies in the buried hole After solidification, the motor 2 can be started, and the operation of the motor 2 drives the rotating rod 3 to rotate, and then the cylinder 12 is started to drive the mounting frame 1 to move downward, so that the pressing rod 11 contacts the solidified resin, and the pressing rod 11 moves upward on the connecting tube 8. The second spring 10 is squeezed and contracted, and the resin in the buried hole is hot-pressed and flattened through the heating wire 9, so that the buried holes on the circuit board can be filled with resin, and the resin in the buried holes can be hot-pressed and flattened, realizing functional integration, reducing operating steps, reducing maintenance costs, and improving circuit board production efficiency. After the hot pressing is completed, the cylinder 12 is started in the reverse direction to drive the mounting frame 1 to move upward, so that the pressing rod 11 no longer contacts the circuit board, and the second spring 10 is restored, driving the pressing rod 11 to move and reset.

[0021] The technical principles of the embodiments of the present utility model are described above in combination with specific embodiments. These descriptions are only for explaining the principles of the embodiments of the present utility model, and cannot be interpreted in any way as limiting the protection scope of the embodiments of the present utility model. Based on the explanations here, technicians in this field can think of other specific implementation methods of the embodiments of the present utility model without creative work, and these methods will fall within the protection scope of the embodiments of the present utility model.

Claims

1. A device for filling and burying holes inside a circuit board, characterized in that: The invention comprises a mounting frame (1), a rotating rod (3), a feeding piece (4), a conducting pipe (5), a sliding pipe (6), a first spring (7) and a cylinder (12); the telescopic end of the cylinder (12) is connected to the mounting frame (1); the lower part of the mounting frame (1) is rotatably connected to the rotating rod (3); the lower side of the rotating rod (3) is connected to the feeding piece (4); the lower side of the rotating rod (3) is connected to the conducting pipe (5); the conducting pipe (5) is located inside the feeding piece (4); the inner part of the feeding piece (4) is slidably connected to the sliding pipe (6); the sliding pipe (6) is located outside the conducting pipe (5); and the first spring (7) is connected between the lower side of the feeding piece (4) and the sliding pipe (6).

2. A circuit board internal buried hole filling device as claimed in claim 1, characterized in that: It also includes a motor (2), which is connected to the right side of the lower part of the mounting frame (1), and the output shaft of the motor (2) is connected to the rotating rod (3).

3. A circuit board internal buried hole filling device as claimed in claim 2, characterized in that: It also comprises a connecting tube (8) and a heating wire (9); the upper side of the rotating rod (3) is connected to the connecting tube (8), and the outer side of the upper part of the connecting tube (8) is connected to the heating wire (9).

4. A circuit board internal buried hole filling device as claimed in claim 3, characterized in that: It also includes a second spring (10) and a pressing rod (11); the pressing rod (11) is slidably connected to the connecting tube (8); and the second spring (10) is connected between the pressing rod (11) and the connecting tube (8).

5. A circuit board internal buried hole filling device as claimed in claim 4, characterized in that: It also includes a mounting plate (13), and the mounting plate (13) is connected to the fixed end of the cylinder (12).

6. A circuit board internal buried hole filling device as claimed in claim 5, characterized in that: The left and right parts of the mounting plate (13) are both provided with two front and rear mounting holes.

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