Device for debugging semiconductor equipment

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By designing a semiconductor equipment debugging device including a frame, XYZ three-dimensional mobile module, wafer bearing fingers and wafer bearing table, the problem of inconvenience of equipment manufacturers to complete inl ine debugging by themselves is solved, and a low-cost and efficient debugging solution is achieved.

CN222600955UActive Publication Date: 2025-03-11KINGSEMI CO LTD

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Patent Information

Application Number: CN202420617962.0
Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner
Filing Date: 2024-03-28
Publication Date: 2025-03-11
Estimated Expiration: 2034-03-28

AI Technical Summary

Technical Problem

Equipment manufacturers are not convenient to complete the inL inE debugging of semiconductor equipment and lithography machines by themselves, and the manufacturing cost of special vacuum robots is high and the loading, unloading and maintenance is inconvenient.

Method used

Design a semiconductor equipment debugging device, including a frame, XYZ three-dimensional mobile module, wafer bearing fingers and wafer bearing table. The XYZ three-dimensional mobile module can replace high-cost special robots to realize inl ine debugging in the semiconductor equipment factory.

Benefits of technology

It realizes the replacement of lithography machines in the equipment manufacturing factory to complete inline debugging. The overall structure is compact, small space occupies, simple structure, convenient loading and unloading, free combination, low manufacturing cost and convenient maintenance.

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Abstract

The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor equipment debugging device which comprises a frame, an XYZ three-dimensional moving module, a wafer bearing finger and a wafer bearing table. A plurality of wafer bearing tables used for supporting wafers are arranged at the bottom of the inner side of the frame, an XYZ three-dimensional moving module is arranged in the middle of the inner side of the frame, and a high-cost special robot can be replaced. The XYZ three-dimensional moving module is connected with a wafer receiving finger, and the wafer receiving finger is used for taking and placing a wafer. The operation logic of the device for debugging the semiconductor equipment accords with the logic of taking and feeding wafers by a manipulator of an actual photoetching machine in the photoetching process. The device can replace a photoetching machine to complete inline debugging in a semiconductor equipment factory, and is compact in overall structure, small in occupied space, capable of meeting the large-stroke requirement, simple in structure, convenient to assemble and disassemble, free in combination, low in manufacturing cost and convenient to maintain.

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Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment, in particular to a device for debugging semiconductor equipment. Background Art

[0002] At present, before semiconductor equipment such as coaters and developers are connected to photolithography machines, they must first complete their own debugging at the equipment manufacturer and then be shipped to the wafer processing plant for inline debugging with the photolithography machine. It is not convenient for equipment manufacturers to complete the debugging by themselves; although some equipment manufacturers use dedicated robots to simulate photolithography machines for inline debugging, the manufacturing cost of dedicated vacuum robots is relatively high, and loading and unloading and maintenance are also inconvenient. Utility Model Content

[0003] In view of the problem that it is inconvenient for equipment manufacturers to complete inline debugging by themselves, the purpose of the utility model is to provide a semiconductor equipment debugging device.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A semiconductor equipment debugging device comprises a frame, an XYZ three-dimensional moving module, a wafer receiving finger and a wafer receiving table;

[0006] A plurality of wafer support tables for supporting wafers are provided at the bottom of the inner side of the frame, and an XYZ three-dimensional movable module is provided at the middle of the inner side of the frame. The XYZ three-dimensional movable module is connected to the wafer receiving fingers, and the wafer receiving fingers are used to take and place wafers.

[0007] The XYZ three-dimensional mobile module includes an X-axis driver, a connecting frame A, a Y-axis driver, a connecting frame B, and a Z-axis driver. The housing of the X-axis driver is connected to the frame through a fixed base of the XYZ three-dimensional mobile module. The connecting frame A is installed on the driving end of the X-axis driver, the housing of the Y-axis driver is installed on the connecting frame A, the connecting frame B is installed on the driving end of the Y-axis driver, the Z-axis driver is connected to the bottom of the connecting frame B, and the driving end of the Z-axis driver is connected to one end of the wafer receiving finger.

[0008] The moving direction of the driving end of the X-axis driving member and the moving direction of the driving end of the Z-axis driving member are both parallel to the horizontal plane, and the projection of the moving direction of the driving end of the X-axis driving member in the horizontal plane and the projection of the moving direction of the driving end of the Y-axis driving member in the horizontal plane are perpendicular to each other.

[0009] A rotating driving member is installed on the connecting frame B, a connecting frame C is installed on the driving end of the rotating driving member, the connecting frame C is located below the connecting frame B, and the housing of the Z-axis driving member is installed on the connecting frame C.

[0010] The axial center line of the driving end of the rotary driving member and the moving direction of the driving end of the Y-axis driving member are both perpendicular to the horizontal plane.

[0011] A vacuum air duct is provided inside the wafer receiving finger, a wafer receiving fork is formed at one end of the wafer receiving finger, a plurality of vacuum adsorption holes are provided on the wafer receiving fork of the wafer receiving finger, each of the vacuum adsorption holes is respectively connected to the vacuum air duct, and the vacuum air duct is connected to the vacuum extraction device.

[0012] The wafer receiving fork of the wafer receiving finger is U-shaped.

[0013] A wafer stage mounting plate is installed at the bottom position of the inner side of the frame, and each wafer stage is installed on the wafer stage mounting plate by screws.

[0014] The axial center line of each wafer support platform is perpendicular to the horizontal plane.

[0015] A plurality of casters are arranged at the bottom end of the frame.

[0016] The advantages and positive effects of the utility model are:

[0017] The utility model adopts the coordinated arrangement of the frame, the XYZ three-dimensional mobile module, the wafer receiving fingers and the wafer receiving table. The XYZ three-dimensional mobile module can replace the high-cost special robot and can replace the photolithography machine in the semiconductor equipment factory to complete inline debugging. The overall structure is compact and occupies little space, can meet the needs of large strokes, has a simple structure, is easy to load and unload, has free combination, has low manufacturing cost and is easy to maintain. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the three-dimensional structure of the XYZ three-dimensional mobile module of the utility model;

[0020] Figure 3 This is a schematic diagram of the main structure of the XYZ three-dimensional mobile module of the utility model;

[0021] Figure 4 It is a schematic diagram of the side structure of the XYZ three-dimensional mobile module of the utility model;

[0022] Figure 5It is a schematic diagram of the top view structure of the XYZ three-dimensional mobile module of the present utility model.

[0023] In the figure: 1 is a frame, 101 is a XYZ three-dimensional mobile module fixed base, 102 is a wafer stage mounting plate;

[0024] 2 is an XYZ three-dimensional moving module, 201 is an X-axis driving component, 202 is a connecting frame A, 203 is a Y-axis driving component, 204 is a connecting frame B, 205 is a Z-axis driving component, 206 is a rotating driving component, and 207 is a connecting frame C;

[0025] 3 is a wafer receiving finger, 301 is a wafer receiving fork, and 302 is a vacuum adsorption hole;

[0026] 4 is a film support table and 5 is a caster. DETAILED DESCRIPTION

[0027] The following is combined with Figure 1-5 The utility model is further described in detail.

[0028] A semiconductor device debugging device, such as Figure 1-5 As shown, this embodiment includes a frame 1, an XYZ three-dimensional moving module 2, wafer receiving fingers 3 and a wafer holding table 4.

[0029] Two wafer stages 4 for supporting wafers are provided at the bottom of the inner side of the frame 1, and an XYZ three-dimensional moving module 2 is provided at the middle of the inner side of the frame 1. The XYZ three-dimensional moving module 2 is connected to the rear of the wafer receiving finger 3, and the wafer receiving finger 3 is used to pick up and place the wafer. In this embodiment, an outer shell for protecting the internal components is also installed on the outside of the frame 1, and a transfer port corresponding to the film taking port of the interface station robot of the glue coating and developing machine is opened on the outer shell.

[0030] Specifically, if Figure 2-5As shown, in this embodiment, the XYZ three-dimensional moving module 2 includes an X-axis driving component 201, a connecting frame A 202, a Y-axis driving component 203, a connecting frame B 204, and a Z-axis driving component 205. The shell of the X-axis driving component 201 is connected to the frame 1 through the XYZ three-dimensional moving module fixing base 101 and screws, the connecting frame A 202 is installed on the driving end of the X-axis driving component 201 through screws, the shell of the Y-axis driving component 203 is installed on the connecting frame A 202 through screws, the connecting frame B 204 is installed on the driving end of the Y-axis driving component 203 through screws, the Z-axis driving component 205 is connected to the bottom of the connecting frame B 204, and the driving end of the Z-axis driving component 205 is connected to one end of the wafer receiving finger 3. In this embodiment, a rotating driving member 206 is installed on the connecting frame B 204 by screws, and a connecting frame C 207 is installed on the driving end of the rotating driving member 206 by screws. The connecting frame C 207 is located below the connecting frame B 204, and the housing of the Z-axis driving member 205 is installed on the connecting frame C 207 by screws.

[0031] In this embodiment, the moving direction of the driving end of the X-axis driving member 201 and the moving direction of the driving end of the Z-axis driving member 205 are both parallel to the horizontal plane, and the projection of the moving direction of the driving end of the X-axis driving member 201 in the horizontal plane and the projection of the moving direction of the driving end of the Y-axis driving member 203 in the horizontal plane are perpendicular to each other, and the axial center line of the driving end of the rotating driving member 206 and the moving direction of the driving end of the Y-axis driving member 203 are both perpendicular to the horizontal plane. The X-axis driving component 201 is used to drive the wafer receiving fingers 3 connected to the XYZ three-dimensional moving module 2 to move along the X-axis direction (i.e., the left-right direction), the Y-axis driving component 203 is used to drive the wafer receiving fingers 3 connected to the XYZ three-dimensional moving module 2 to move along the Y-axis direction (i.e., the up-down direction), the Z-axis driving component 205 is used to drive the wafer receiving fingers 3 connected to the XYZ three-dimensional moving module 2 to move along the Z-axis direction (i.e., the front-back direction), and the rotating driving component 206 drives the wafer receiving fingers 3 connected to the XYZ three-dimensional moving module 2 to rotate, and the wafer receiving fingers 3 can be arbitrarily controlled to move accurately according to a predetermined program according to the requirements during debugging. In this embodiment, the X-axis drive 201, the Y-axis drive 203 and the Z-axis drive 205 are all commercially available electric cylinder products, and the rotary drive 206 is a commercially available hollow motor, which is controlled by a controller. The electric cylinder combination structure has low cost, small space occupation and large travel; the X-axis drive 201, the Y-axis drive 203 and the Z-axis drive 205 can also be replaced by other transmission mechanisms in the prior art. In this embodiment, by setting the Z-axis drive 205 below the Y-axis drive 203, and the XYZ three-dimensional moving module 2 as a whole above the wafer stage 4, the height of the wafer receiving finger 3 can be effectively reduced to reliably adapt to the equipment to be debugged.

[0032] Specifically, in this embodiment, a vacuum air duct is provided inside the wafer receiving finger 3, and a U-shaped wafer receiving fork 301 is formed at one end of the wafer receiving finger 3 (i.e., the front part of the wafer receiving finger 3), and three vacuum adsorption holes 302 are evenly provided on the wafer receiving fork 301 of the wafer receiving finger 3, and each vacuum adsorption hole 302 is respectively connected to the vacuum air duct, and the vacuum air duct is connected to the vacuum device. The U-shaped wafer receiving fork 301 can be used to take and place wafers from other equipment and the wafer stage 4; by vacuuming the vacuum air duct and each vacuum adsorption hole 302 to form a negative pressure, the wafer receiving finger 3 can be stably and accurately adsorbed on the wafer receiving fork 301. In this embodiment, the wafer receiving finger 3 can adopt the ceramic receiving finger of the prior art; the vacuum device is set as the prior art, and the action is controlled by the controller. In this embodiment, a top mounting plate can be provided at the top position of the inner side of the frame 1 to mount a controller and a vacuum device, etc., which can better save space and increase the integration of the device.

[0033] Specifically, in this embodiment, a wafer stage mounting plate 102 is installed at the bottom of the inner side of the frame 1, and each wafer stage 4 is respectively mounted on the wafer stage mounting plate 102 by screws, so that the mounting position can be adjusted according to the needs, and the disassembly and assembly are convenient. The axial center line of each wafer stage 4 is perpendicular to the horizontal plane to ensure stable support of the wafer.

[0034] Specifically, in this embodiment, a plurality of casters 5 are provided at the bottom end of the frame 1 to facilitate the staff to move the entire device.

[0035] Working principle:

[0036] During the inline debugging process of the glue coating and developing machine before leaving the factory, the utility model is moved as a whole to the back of the interface station robot of the glue coating and developing machine and corresponds to the film taking port of the interface station robot; after the robot arm of the interface station robot receives the wafer transmitted from the glue coating and developing machine, it is placed on one of the wafer holding tables 4 of the utility model; the XYZ three-dimensional mobile module 2 drives the wafer receiving finger 3 to take the wafer from the wafer holding table 4 and put it on another wafer holding table 4, and then the robot arm of the interface station robot takes away the wafer placed on the other wafer holding table 4; the operating logic of the semiconductor equipment debugging device proposed by the utility model conforms to the logic of the actual lithography machine robot arm taking and delivering the wafer during the lithography process, and the above actions are performed and the robot arm of the interface station robot is confirmed to be operating correctly and debugging is performed.

[0037] In another case, the XYZ three-dimensional mobile module 2 drives the wafer receiving finger 3 to pick up the wafer from the wafer stage of an interface station, and then places it on the wafer stage of another interface station to confirm whether there is a problem with the installation setting of the interface station wafer stage or to debug specific details as needed.

Claims

1. A semiconductor device debugging device, characterized in that: It comprises a frame (1), an XYZ three-dimensional moving module (2), a wafer receiving finger (3) and a wafer receiving table (4); A plurality of wafer support tables (4) for supporting wafers are provided at the bottom of the inner side of the frame (1), and an XYZ three-dimensional movable module (2) is provided at the middle of the inner side of the frame (1). The XYZ three-dimensional movable module (2) is connected to the wafer receiving fingers (3), and the wafer receiving fingers (3) are used to take and place wafers.

2. The semiconductor device debugging apparatus according to claim 1, characterized in that: The XYZ three-dimensional moving module (2) comprises an X-axis driving member (201), a connecting frame A (202), a Y-axis driving member (203), a connecting frame B (204), and a Z-axis driving member (205); the outer shell of the X-axis driving member (201) is connected to the frame (1) via an XYZ three-dimensional moving module fixed base (101); the connecting frame A (202) is mounted on the driving end of the X-axis driving member (201); the outer shell of the Y-axis driving member (203) is mounted on the connecting frame A (202); the connecting frame B (204) is mounted on the driving end of the Y-axis driving member (203); the Z-axis driving member (205) is connected to the bottom of the connecting frame B (204); and the driving end of the Z-axis driving member (205) is connected to one end of the wafer receiving finger (3).

3. The semiconductor device debugging apparatus according to claim 2, characterized in that: The moving direction of the driving end of the X-axis driving member (201) and the moving direction of the driving end of the Z-axis driving member (205) are both parallel to the horizontal plane, and the projection of the moving direction of the driving end of the X-axis driving member (201) in the horizontal plane and the projection of the moving direction of the driving end of the Y-axis driving member (203) in the horizontal plane are perpendicular to each other.

4. The semiconductor device debugging apparatus according to claim 2, characterized in that: A rotating driving member (206) is installed on the connecting frame B (204), a connecting frame C (207) is installed on the driving end of the rotating driving member (206), the connecting frame C (207) is located below the connecting frame B (204), and the outer shell of the Z-axis driving member (205) is installed on the connecting frame C (207).

5. The semiconductor device debugging apparatus according to claim 4, characterized in that: The axial center line of the driving end of the rotary driving member (206) and the moving direction of the driving end of the Y-axis driving member (203) are both perpendicular to the horizontal plane.

6. The semiconductor device debugging apparatus according to claim 1, characterized in that: A vacuum air duct is provided inside the wafer receiving finger (3), a wafer receiving fork (301) is formed at one end of the wafer receiving finger (3), a plurality of vacuum adsorption holes (302) are provided on the wafer receiving fork (301) of the wafer receiving finger (3), each of the vacuum adsorption holes (302) is respectively connected to the vacuum air duct, and the vacuum air duct is connected to the vacuum extraction device.

7. The semiconductor device debugging apparatus according to claim 6, characterized in that: The wafer receiving fork (301) of the wafer receiving finger (3) is U-shaped.

8. The semiconductor device debugging apparatus according to claim 1, characterized in that: A wafer support platform mounting plate (102) is installed at the bottom position of the inner side of the frame (1), and each wafer support platform (4) is respectively mounted on the wafer support platform mounting plate (102) by means of screws.

9. The semiconductor device debugging apparatus according to claim 1, characterized in that: The axial center line of each wafer support platform (4) is perpendicular to the horizontal plane.

10. The semiconductor device debugging apparatus according to claim 1, characterized in that: A plurality of casters (5) are provided at the bottom end of the frame (1).