58results about How to "Reliable coverage" patented technology

Provided is members for temporarily recovering (a lining mat (1), a nonslip pin (2), a lock pin (3), a stopper (4), a fixing pin (5)) that simplify the temporary recovering work of a road surface when pipeline construction work is performed by excavating a pavement surface (B), and also provided is a method for recovering a road surface by using the above-mentioned members. The lining mat (1) is a rectangular rubber board having a thick central portion (11) and thin side portions (12) at the opposite bases, and is provided, at appropriate positions, with pinholes (16) penetrating the front and back surfaces. The lining mat (1) is laid to cover a backfilled surface such that the side end of the lining mat is located on the pavement surface (B), and fixed by driving a tubular nonslip pin (2) into the pinhole and driving the lock pin (3) into the tubular portion of the nonslip pin, and then adjoining mats are connected by inserting the latching protrusion (42) of the stopper (4) into the pinhole.

A protective sunshade arrangement is provided for the windowpane of a motor vehicle with a frame that features two opposing longitudinal struts for guiding a cover that can be extracted in an extracting direction from a cover roller arranged between the longitudinal struts. The frame furthermore features at least one first transverse strut that extends between the longitudinal struts and is arranged on front of the cover roller referred to the extracting direction. The invention also relates to a motor vehicle with the protective sunshade arrangement.

The invention provides a method of manufacturing a self-luminous panel using a sealing structure directly covering a self-luminous element on a substrate with sealing material, in which productivity of the panel is not made worse. A self-luminous element region forming process A and a luminous element region forming process B are independently performed. A substrate having a self-luminous element region formed thereon in the self-luminous element region forming process A and a seal substrate having a layer of sealing material formed thereon in the seal member forming process B are laminated to each other in a sealing process C. In the display region forming process A, the self-luminous element forming process is performed (S2) after a pretreatment process (S1). In the luminous element region forming process B, the sealing members are formed into the sizes of the sealing substrates respectively (S3) and then the sealing material is adhered on the sealing member (S4).

A machine tool has a work space (17) in which a device (15) for accommodating workpieces (16) to be machined is arranged. The machine tool further has a work spindle (18) for machining the workpieces (16) and a slide (34) which carries the work spindle (18) and is traversable in a longitudinal direction relative to the device (15), a respective cover (25), variable in length in the longitudinal direction (x), for the work space (17) being provided on the slide (34) on each of its sides, said cover (25) being connected with its respective first end to the slide (34) and with its respective second end to a side wall (21, 22; 51) of the work space (17). Each cover (25) variable in length has a respective rear wall (26) and a respective top (27), whereby the top (27) is connected to the rear wall (26) in a detachable, push-in, manner. A further flexible cover (31) is arranged in front of the slide (34) to protect the work space (17) at the bottom. The flexible cover (31) is variable in a direction (y) orthogonal to the longitudinal direction (x) and is partly designed as a link apron (54).

By providing a hard mask layer stack including at least three different layers for patterning a gate electrode structure, constraints demanded by sophisticated lithography, as well as cap layer integrity, in a subsequent selective epitaxial growth process may be accomplished, thereby providing the potential for further device scaling of transistor devices requiring raised drain and source regions.

The object of the present invention is to provide a fertilization device, which is mounted on a traveling vehicle body, and includes: a storage part for storing fertilizer; The fertilizer in the storage part is sent out; and the residual fertilizer recovery air pipe is communicated with the recovery port of the sending mechanism, and also includes: a cover member, the cover member can be switched freely between a closed state and an open state , in the closed state, the cover member covers the residual fertilizer recovery air duct, and in the open state, the residual fertilizer recovery air duct is exposed from below the cover member. In the working state, by closing the covering member, it is possible to prevent damage to the residual fertilizer recovery duct caused by the operator’s feet or the pushing of the seedlings, and in the maintenance state, by opening the covering member, the covering member does not hinder the maintenance work.

The invention provides a circuit capable of enhancing write operation of a static random access memory. In write operation, the voltage of a bit line writing '1' is higher than the power voltage of a memory unit and the voltage of a bit line writing '0' is lower than the ground voltage of the memory unit. When the circuit is used in the write operation, the maximum voltage difference between a first bit line and a second bit line is increased, even if certain voltage loss is caused after transmission through the bit lines, multivoltage is not adopted, or only a negative voltage technical scheme is adopted to obtain higher voltage difference at the selected memory unit, so that the original data in the memory unit are rapidly and reliably covered.

The invention relates to a combined type plant pit cover plate and application of the combined type plant pit cover plate, and belongs to the technical field of border tree plant pit covering. The combined type plant pit cover plate and the application are characterized in that the combined type plant pit cover plate is formed by an adjustable cover plate surrounding a tree trunk and a peripheral adjusting cover plate in a combined mode, and the size and the shape of a plant pit hole can be changed by the combined type plant pit cover plate according to the requirement. Small square plates same in number are respectively arranged at the splicing positions of the combined type plant pit cover plate, and hollow circles different in diameters can be expanded; small square plates same in number are arranged at the splicing positions of the combined type plant pit cover plate according to the requirement in the single direction, and hollow circles can be expanded into the hollow circles different in diameters. The combined type plant pit cover plate has the advantages that materials for making the plant pit cover plate are not cast iron, and scavengers cannot be used for achieving other functions; the materials are not replaced by plastic, and the environment cannot be polluted during production; by means of the combined type plant pit cover plate, a cover plate component combination is easily changed; the combined type plant pit cover plate can be suitable for different requirements of excavated border trees, and is smooth and attractive and resistant to grinding; by means of the plant pit cover plate, reliable covering is provided for soil surfaces of the plant pits of the border trees for municipal administration sidewalks; the plant pit cover plate is durable, attractive in model and good in effect.

A fabrication process for semiconductor device, aimed to retard cracking in the lower surface of a silicon substrate subjected to grinding. A silicon substrate 1 is ground appropriately on the lower surface side. Consequently, fine and acute protrusions and recesses (crystal destruction layer of silicon) are formed on the lower surface of the silicon substrate 1. The lower surface of the silicon substrate 1 is then roughened with level difference of 1-5 [mu]m by wet etching. Subsequently, a protective film 12 is formed of epoxy based resin, or the like, on the lower surface of the silicon substrate 1. Since the lower surface of the silicon substrate 1 is roughened with level difference of 1-5 [mu]m, the rough surface is covered surely with the protective film 12 and cracking is retarded in the lower surface of the silicon substrate.