3results about How to "Uniform area" patented technology

A method for brazing an electrically conducting connecting piece, for example a cable shoe, of an electrically conducting material to a workpiece of electrically conducting material, by means of a temperature controlled brazing process in which the heat necessary for brazing is generated by striking an electric arc between a carbon electrode, and the electrically conducting connecting piece, where the voltage and current is electronically controlled by control electronics to achieve a temperature development to result in a martensite free brazing, and wherein the DC voltage applied is using the carbon electrode as the negative pole, and using the electrically conducting connecting piece as the positive pole, and wherein the carbon electrode is having a tapering, bevelled, or pointy end at the end facing the electric arc.

The present disclosure relates to a groove-type mold for coating an active material layer on a foil, an electrode manufacturing method for manufacturing an electrode using the groove-type mold, and an electrode manufactured using the groove-type mold. According to the present disclosure, a groove mold is configured to move in a width direction with respect to a foil.

This utility model discloses a radiation-hardened structure for satellite chips. First, a radiation-hardening shielding material plate is pushed into the mounting groove along the expansion platform until its edge aligns with the edge of the expansion platform. At this point, the concave portion and convex portion one of the radiation-hardening shielding material plate correspond. After applying adhesive to the bottom surface of the radiation-hardening shielding material plate, it is pushed to the left, causing the concave portion and convex portion two on the left side of the plate to fit together. Adhesive is then dotted at the connection between convex portion one and the concave portion, and adhesive is also filled between the expansion platform and the radiation-hardening shielding material plate. This utility model, through dimensional control of the components, ensures that the radiation-hardening shielding material plate can be well installed in the structural housing, held in place by convex portion one and convex portion two. The force at the insertion points is evenly distributed, reducing the body area of ​​the radiation-hardening shielding material plate by less than 1.7%. This provides sufficient fixation of the radiation-hardening shielding material plate with minimal impact on the irradiated body, thereby achieving better chip performance.