This utility model discloses a
radiation-hardened structure for
satellite chips. First, a
radiation-hardening shielding material plate is pushed into the mounting groove along the expansion platform until its edge aligns with the edge of the expansion platform. At this point, the concave portion and convex portion one of the
radiation-hardening shielding material plate correspond. After applying
adhesive to the bottom surface of the radiation-hardening shielding material plate, it is pushed to the left, causing the concave portion and convex portion two on the left side of the plate to fit together.
Adhesive is then dotted at the connection between convex portion one and the concave portion, and
adhesive is also filled between the expansion platform and the radiation-hardening shielding material plate. This utility model, through dimensional control of the components, ensures that the radiation-hardening shielding material plate can be well installed in the structural housing, held in place by convex portion one and convex portion two. The force at the
insertion points is evenly distributed, reducing the
body area of the radiation-hardening shielding material plate by less than 1.7%. This provides sufficient fixation of the radiation-hardening shielding material plate with minimal
impact on the irradiated body, thereby achieving better
chip performance.