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Double-interface card production method and equipment

A dual-interface card and production method technology, applied in the field of mobile communications, can solve the problems of low yield, low production efficiency, waste of raw materials, etc., and achieve the effects of high yield, high production efficiency, and reduced production costs

Active Publication Date: 2009-08-05
CARDMATIX
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] One of the technical problems to be solved by the present invention is to provide a dual-interface card production method with high yield, raw m

Method used

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  • Double-interface card production method and equipment
  • Double-interface card production method and equipment
  • Double-interface card production method and equipment

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Embodiment Construction

[0028] figure 1 It is a schematic diagram of the manual production process of the dual-interface card in the prior art; the dual-interface chip 301 on the dual-interface card includes a front side 100 and a back side 200, and there are predetermined solder joints 2001 on the back side 200. In the prior art, the dual interface card 300 with the antenna card base can be obtained by manually welding the dual interface chip 301 to the card base 302 with the antenna. After the dual interface card 300 with the antenna card base is packaged, the A dual interface card 303 is obtained.

[0029] figure 2 It is a structural schematic diagram of the packaging machine of the dual-interface card production equipment of the present invention; the packaging machine includes a card conveying belt 21, a card-feeding conveying arm 22, a card-feeding conveyor belt 23, a chip conveying arm 24, a chip punching die, and a chip turning group , Chip stepping group 25, chip steering group 26, antenn...

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PUM

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Abstract

The invention relates to a method for producing dual-interface cards and equipment thereof. The method comprises the following steps: S1: solder is welded on a scheduled welding spot of a dual-interface chip; S2: the excess solder on the scheduled welding spot after soldering is removed; S3: hot melt adhesive is welded on the dual-interface chip; S4: die cutting is carried out to the dual-interface chip which has the solder and the hot melt adhesive; S5: the die-cut dual-interface chip is flipped and rotated and then welded on a standard card with an antenna; S6: butt-weld, location amendment, and spot welding are carried out to the card and the dual-interface chip; and S7: heat welding is carried out to the card with the dual-interface chip so as to form a dual-interface card. The equipment comprises a solder-coating adhesive-preserving machine which conducts solder-coating and adhesive-preserving processing to the dual-interface chip and a packaging machine which is used for packaging the dual-interface chip after solder-coating and adhesive-preserving processing onto the dual-interface card. By implementing the method and equipment of the invention, the production efficiency and yielding rate in production process are high, the raw materials are conducive to being conserved and the production cost is also lowered.

Description

technical field [0001] The invention relates to the field of mobile communication, and more specifically, relates to a production method and equipment of a double-interface card. Background technique [0002] With the rapid development of information technology and economy around the world, economic and information exchanges between people are becoming more and more frequent. Cards and contact CPU cards (smart cards) that are being used in many fields now. At present, smart cards still play an irreplaceable role in people's lives. Whether it is a contact smart card or a contactless smart card, it has its own advantages and disadvantages. The wear and tear between the contact smart card and the card machine greatly shortens its service life. . The application of non-contact cards is limited in the occasions where radio frequency interference is severe; secondly, due to the energy transfer through coupling, the power consumption is required to be very low; The technology an...

Claims

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Application Information

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IPC IPC(8): H01L21/50G06K19/08B23K3/00B28D5/00
Inventor 熊曙光
Owner CARDMATIX
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