Equipment and method for testing metal electromigration

Abstract

The invention provides equipment and a method for testing metal electromigration. The equipment for testing metal electromigration comprises a chip quantity setting module, a state stopping module, a judge module and a chip moving module, wherein the chip quantity setting module is used for setting the number of tests for a chip to be tested; the judge module is used for judging whether the set number of tests for the chip to be tested are finished or not; and the chip moving module is used for moving a wafer when the judge module judges that the set number of tests for the chip to be tested are not finished, so as to enable next chip to be tested to be moved to a position for testing. The state stopping module comprises a setting component for setting stopping conditions, and a monitoring component for monitoring and testing whether a tested voltage value meets the stopping conditions or not and stops testing a current chip when the stopping conditions are met. The invention has the advantages that full automatic testing and evaluation to the phenomenon of electromigration can be achieved, the time is saved, the efficiency is improved, and errors possibly caused during a testing process are reduced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a testing device capable of quickly and effectively evaluating electromigration of electromigration metals and a corresponding metal electromigration testing method. Background technique [0002] With the continuous development of large-scale integrated circuits, the reliability problems of integrated circuits caused by electromigration are increasingly prominent. As chips become more integrated, interconnect leads become thinner, narrower, and thinner, so the current density in them increases. Under the effect of higher current density, the metal atoms in the interconnection wire will migrate along the direction of electron movement. Electromigration can cause an open circuit or a short circuit in the interconnection leads in the IC during operation, thereby causing the IC to fail. [0003] As a result, the electromigration phenomenon has gradually attracted people's...

AI Technical Summary

Problems solved by technology

Since the electromigration test requires a large amount of data to calculate, it will cause problems such as long test time, low personnel efficiency, and high error rate.

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