Pulse radiator
A radiator and pulse technology, which is applied in the field of electronic components and electrical radiators, can solve the problems of low heat dissipation efficiency and high equipment cost, and achieve the effect of low use cost and high heat dissipation efficiency
Inactive Publication Date: 2013-07-17
蔡云飞
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Problems solved by technology
The active cooling method is to use the fan to generate airflow to take away the heat of electronic components and electrical appliances. This method will generate a certain amount of power consumption and the equipment cost is high; the passive cooling method is to attach multiple heat sinks on the surface of electronic components and electrical appliances. The heat sink dissipates heat through the heat sink through heat conduction. Since there is no air flow in this way, the heat dissipation efficiency is low
Method used
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Embodiment Construction
[0011] refer to figure 1 , figure 2 , a pulse radiator of the present invention, comprising a bottom plate 1 and a heat dissipation plate 2 matched therewith, the middle part of the bottom plate 1 is provided with a through hole 3, and the bottom plate 1 is provided with a plurality of air passages connecting the through holes 3 to the outer edge of the bottom plate 5. The through hole 3 communicates with the air channel 5 through an air gap 6 whose width is smaller than that of the air channel, and the width of the air channel 5 gradually increases from the inside to the outside. Since the pulse radiator adopts the above structure, after the radiator is installed on the surface of electronic components and electrical appliances, the cooling plate will heat up with the temperature of the electronic components and electrical appliances, the air in the air passage will be heated and expanded, and the best will be discharged from the outer end of the air passage, and the externa...
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The invention discloses a pulse radiator, which comprises a baseboard and a radiating plate matched with the baseboard, wherein a through hole is formed in the middle of the baseboard; a plurality of air passages by which the through hole is communicated with the outer edge of the baseboard, are arranged on the baseboard; the through hole is communicated with the air passages through air clefts which are narrower than the air passages; and the widths of the air passages are gradually increased from interior to exterior. After the radiator is mounted on the surface of an electric element or electrical equipment, the baseboard is warmed up following the electric element or electrical equipment, the air in the air passages is expanded under the effect of being heated and is discharged from external ends of the air passages, and external cold air is replenished into the air passages from the through hole. The air clefts which are used for communicating the through hole with the air passages are smaller and the quantity of replenished air is gradually increased following the increasing of negative pressure of the air passages, so that pulse suction is formed. In a radiating process, nopower consumption exists, the use cost is lower, the higher radiating efficiency is achieved with the help of airflow radiation, and the radiating operation frequency which is adapted to the temperature of the electric element or electrical equipment can be generated.
Description
technical field [0001] The invention relates to an electronic component and an electric radiator. Background technique [0002] Electronic components and electrical appliances in electrical appliances usually generate a large amount of heat energy when they are working, causing the temperature to rise. Therefore, it is necessary to configure a suitable radiator to reduce the temperature of electronic components and electrical appliances, so as to avoid damage to the components and electrical appliances due to excessive temperature. In the prior art, active heat dissipation and passive heat dissipation are generally used to solve the heat dissipation problems of electronic components and electrical appliances. The active cooling method is to use the fan to generate airflow to take away the heat of electronic components and electrical appliances. This method will generate a certain amount of power consumption and the equipment cost is high; the passive cooling method is to att...
Claims
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IPC IPC(8): H05K7/20
Inventor 蔡云飞蔡建川
Owner 蔡云飞