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electronic device

A technology of electronic devices and electronic components, which is applied in the directions of antenna grounding devices, antenna supports/mounting devices, etc., and can solve problems such as changes in wiring lines of metal electronic components, design difficulties, and narrowing of bandwidth

Inactive Publication Date: 2016-03-02
SHENZHEN FUTAIHONG PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When designing the antenna and circuit board layout, if the installation position of the metal electronic components on the circuit board just falls on the antenna design area, one solution is to move the metal electronic components to other areas of the circuit board, so that It is bound to cause changes in the wiring of the metal electronic components on the circuit board, resulting in design difficulties
Another solution is to design the antenna on the circuit board area far away from the metal electronic components. However, if the mounting position of the antenna is changed, the radiation efficiency of the antenna will be poor and the bandwidth will be narrowed.

Method used

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Embodiment Construction

[0024] see figure 1 The electronic device 10 according to the preferred embodiment of the present invention includes a multilayer circuit board 11 , an antenna (not shown), a metal electronic component 17 and a printed circuit (not shown) electrically connected to the metal electronic component 17 . The antenna includes a main antenna portion 13 and an auxiliary antenna portion 15 . The main antenna part 13 , the auxiliary antenna part 15 , the metal electronic components 17 and the printed circuit are all disposed on the multilayer circuit board 11 .

[0025] The multi-layer circuit board 11 may be a four-layer circuit board, a six-layer circuit board or an eight-layer circuit board. The multi-layer circuit board 11 includes a surface layer 111 , a first inner layer 113 , a second inner layer 115 , a ground layer 116 and a plurality of via holes 117 which are sequentially printed together. The plurality of via holes 117 communicate with the surface layer 111 , the first inn...

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Abstract

The invention provides an electronic device. The electronic device comprises a multilayer circuit board, a main antenna portion and a metal electronic component, wherein the multilayer circuit board comprises a surface layer and a ground layer; at least a signal wire electrically connected to the metal electronic component is arranged on the multilayer circuit board; the main antenna portion is arranged on the surface layer of the multilayer circuit board and is electrically connected to the ground layer; the metal electronic component is arranged on the surface layer and is welded onto the main antenna portion; and the metal electronic component is grounded via the main antenna portion. The electronic device has the following advantage that: the main antenna portion has good radiation efficiency.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device in which metal electronic components are designed on an antenna. Background technique [0002] Generally, when designing an antenna, there must be a certain design space, and there must be no metal electronic components in this space, otherwise the radiation performance of the antenna will be affected. Especially when the metal electronic component is to be connected to the system ground through the wiring line on the circuit board, it will greatly affect the radiation performance of the antenna near it. Therefore, when designing the antenna of a traditional mobile phone, the antenna is designed to be exposed to ensure that the surrounding area of ​​the antenna will not be affected by metal electronic components. In order to pay attention to the beautiful appearance, the current antenna has been designed inside the mobile phone, and the design of the mobile phone is d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/22H01Q1/48
Inventor 马景宏刘己圣徐淑华
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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