Light and color adjustable light-emitting diode (LED) structure

Abstract

The invention relates to a light and color adjustable light-emitting diode (LED) structure, which mainly aims to solve the problems of the poor light mixing effect of an LED and the poor heat radiating effect, light emerging effect and air tightness of a packaging structure in the prior art. The LED comprises a substrate, pads and a plurality of white light modules, wherein the pads are arranged in the substrate; the white light modules are arranged on the substrate; two groups of white light modules with different color temperatures, namely first white light modules and second white light modules are arranged; and the first white light modules and the second white light modules are distributed on the substrate in a mixed mode. The invention has the advantages that: the two groups of white light modules with different color temperatures are distributed in a mixed mode, so that better color mixing effect and light mixing effect are achieved; light-emitting chips are arranged at the bottoms of tapered grooves and directly contacted with the substrate, so that a good heat radiating effect is achieved; a heat and electricity separated structure is formed, the service life of the LED is prolonged, and the stability of the LED is improved; and the air tightness and the physical strength of packaging are ensured by wall glue.

Description

technical field [0001] The invention relates to the technical field of lighting, in particular to a dimmable and color-adjustable LED structure with good light mixing effect, good heat dissipation effect, good sealing performance and wide adjustable range. Background technique [0002] The existing dimmable and color-tunable LED packaging structure is: one is the integration of multiple LED lamp beads emitting different colors of light. These LED lamp beads are generally high-power LEDs, and the entire packaging cost is high and the packaging density is low. The effect of light mixing and color mixing is poor, and the light color adjustability is poor. There are also COB packaging solutions, but it is only a simple two-dimensional plane mode. The chip is not in direct contact with the substrate, but first passes through a circuit layer with extremely low thermal conductivity. The overall heat dissipation effect is very poor, and all of them are located on the surface of the ...

AI Technical Summary

Problems solved by technology

[0003] The present invention mainly solves the problem that the arrangement of LED chips with different colors of light does not consider the effect of light mixing in the prior art, and the problem of poor dimming and toning effect and poor light output efficiency of chips, and provides a dimming and toning effect And the LED structure with good light extraction efficiency and adjustable light color

[0004] Another object of the present invention is to solve the technical problems of poor heat dissipation, light output and poor airtightness existing in the LED packaging structure in the prior art, and to provide a dimmable color adjustment LED with good heat dissipation, light output, and sealing effects. LED structure

[0005] The third object of the present invention is to solve the problems of short service life and unstable use of LEDs in the prior art, and provide a thermoelectric separation structure, long service life, and stable use of dimmable and color-adjustable LED structures

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