Thermal protection method and device, and equipment with thermal protection function

Abstract

The embodiment of the invention provides thermal protection method and device and equipment with the thermal protection function, relates to the technical field of thermal protection, and is applied to avoid over-high temperature generation of equipment under the continuous use conditions and improve the user experience. The method comprises the following steps of: arranging temperature sensors in at least one temperature measurement position of the equipment and obtaining a measured temperature in each temperature measurement position; obtaining a preset temperature in each temperature measurement position; comparing the measured temperature with the corresponding preset temperature in each temperature measurement position; if the first measured temperature is higher than the corresponding preset temperature in the first temperature measurement position, determining the abnormal temperature level of the first measured temperature; and if the first measured temperature is of the first abnormal temperature level, reducing the performance parameters of the processing unit of the equipment in the first temperature measurement position.

Description

technical field [0001] The invention relates to the technical field of thermal protection, in particular to a thermal protection method, device and equipment with thermal protection function. Background technique [0002] With the development of science and technology, there are more and more types of smart devices, and more and more people start to use smart devices. Smart devices include: smartphones, laptops, tablets, etc. With the gradual popularization and application of wireless network 3G and 4G / LTE, the transmission bandwidth continues to increase, the traffic speed continues to rise, and the speed of smart devices has been greatly improved. The applications suitable for smart devices are also being continuously improved, so that people continue to use smart devices for a long time, so that the CPU of the smart device is continuously in a working state for a long time. [0003] In the prior art, the heat dissipation problem of smart devices is generally considered ...

AI Technical Summary

Problems solved by technology

However, with the increase in the processing power and continuous use time of smart devices, only heat dissipation from the structural aspect will cause the device to generate excessively high temperatures under continuous use conditions, and the effect of heat dissipation can no longer meet actual needs, reducing user experience.

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