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Adhesive filling-free waterproof structure of LED module

A technology of LED module and waterproof structure, which is applied in the direction of instruments, identification devices, etc., can solve the problems of high cost, poor heat dissipation, high quality, etc., achieve good waterproof effect and avoid the effect of glue filling

Inactive Publication Date: 2013-02-13
段四才
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention proposes a waterproof structure without glue filling for LED modules, which solves the problems of difficult maintenance, poor heat dissipation, many consumables, high quality, and high cost of LED modules in the prior art.

Method used

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  • Adhesive filling-free waterproof structure of LED module
  • Adhesive filling-free waterproof structure of LED module
  • Adhesive filling-free waterproof structure of LED module

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0029] Such as Figure 1~3 As shown, a LED module 4 provided by the present invention has a glue-free waterproof structure, including a black mask 1, a transparent mask 2, an LED module 4, an LED template 42 and a back cover 5 stacked in sequence. The LED module 4 includes an LED template 42 and an LED lamp 41, one side of the LED template 42 is provided with the LED lamp 41, and the other side is provided with the rear cover 5, and the transparent lampshade 2 is p...

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PUM

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Abstract

The invention discloses an adhesive filling-free waterproof structure of an LED module. The structure comprises a black mask, a transparent mask, the LED module, an LED lamp plate and a rear cover which are sequentially overlapped, wherein the LED module comprises an LED template and an LED lamp; one side of the LED template is equipped with the LED lamp, and the other side of the LED template is equipped with the rear cover; corresponding to the LED lamp, a boss is arranged on a transparent lamp hood; and the black mask is provided with a black mask through hole allowing the boss to penetrate. The adhesive filling-free waterproof structure further comprises a ring-shaped waterproof rubber ring between the rear cover and the LED template; and the LED lamp plate is provided with a circulation through hole for air circulation. The adhesive filling-free waterproof structure solves the problems of the prior art, including difficulty in maintenance of the LED module, poor heat radiating, large consumption of materials and large mass, high cost and the like.

Description

technical field [0001] The invention relates to an LED module, in particular to a waterproof structure without glue filling of the LED module. Background technique [0002] In the existing technology, the non-glue waterproof technology is completely sealed in the transparent cover of the LED lamp board, the heat of the LED lamp and the PCB board cannot be conducted or dissipated, the heat dissipation effect is not good, and the electronic components contained in the lamp and the package are aging The speed is very fast, the life of the LED screen is greatly shortened, and the entire screen display is unstable due to the high temperature of the module. [0003] However, the conventional group that is waterproof by glue filling needs to dig out the glue before maintenance, which is very inconvenient and the process is very complicated. [0004] In view of this, it is necessary to develop a waterproof structure without glue filling for LED modules with high production and main...

Claims

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Application Information

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IPC IPC(8): G09F9/33
Inventor 段四才
Owner 段四才
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