PCB board surface mount system and technology

Abstract

The invention provides a printed circuit board (PCB) surface mounting system. The PCB surface mounting system comprises a split joint part, a first silk-screen printer, a second silk-screen printer and a delivery device, wherein the split joint part is used for connecting a first PCB and a second PCB into a whole, the delivery device is used for delivering the first PCB and the second PCB which are connected into a whole to the first silk-screen printer, the first silk-screen printer conducts silk screen printing to the first PCB, the delivering device is used for delivering the first PCB and the second PCB which are connected into a whole to the second silk-screen printer, and then the second silk-screen printer conducts silk screen printing to the second PCB. A steel mesh arranged in the second silk-screen printer comprises an emptying portion which corresponds to the position where the first PCB is placed when the second silk-screen printer conduct the silk screen printing to the second PCB. The invention further provides the corresponding PCB surface mounting technology. Due to the fact that two PCBs which are in spilt joint with each other are delivered to two silk-screen printers to respectively go through silk screen printing, the PCB processing efficiency is obviously improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, and more specifically relates to a PCB board surface mount system and process. Background technique [0002] With the rapid development of the electronics industry, there are a wide variety of electronic products, and accordingly, the application of PCB boards is also increasing. Because SMT has high assembly density, small size and light weight of electronic products (the volume and weight of patch components are only about 1 / 10 of traditional plug-in components, generally after using SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced. 60% to 80%), high reliability, strong shock resistance, low solder joint defect rate, good high-frequency characteristics (can reduce electromagnetic and radio frequency interference), easy automation (can improve production efficiency and reduce costs), etc., have been It has become a commonly used technology in PCB...

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