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Flexible printed circuit board and manufacturing method thereof

A flexible circuit board and manufacturing method technology, applied in the directions of printed circuit manufacturing, printed circuit, printed circuit components, etc., can solve the problems of inconsistent deformation, reduced surface flatness of FPC board, warping and other problems

Inactive Publication Date: 2013-11-20
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the subsequent manufacturing process of the FPC board, such as baking the FPC board or carrying other parts through the furnace, it is prone to inconsistent deformation and warping, resulting in a decrease in the flatness of the FPC board surface

Method used

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  • Flexible printed circuit board and manufacturing method thereof
  • Flexible printed circuit board and manufacturing method thereof
  • Flexible printed circuit board and manufacturing method thereof

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Embodiment Construction

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are explained in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific implementation disclosed below.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the ot...

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PUM

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Abstract

The invention discloses a flexible printed circuit board and a manufacturing method thereof. A routing part of a conductive layer comprises a plurality of conductive traces which are arranged at intervals; and a non-routing part is formed by intercrossing conductive wires which are arranged at intervals. The non-routing part is designed to be formed by intercrossing the conductive wires which are arranged at intervals, so that the phenomenon that a region, which is used for holding the non-routing part, of a base material layer is completely covered by the non-routing part is avoided. In a subsequent manufacturing technology, when the flexible printed circuit board is baked or passes through a furnace after being erected with other components and is then deformed, stress produced in the flexible printed circuit board is uniformly distributed, and parts of the flexible printed circuit board are deformed consistently; and the reduction of the surface flatness of the flexible printed circuit board is avoided.

Description

Technical field [0001] The invention relates to the field of printed circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] FPC (Flexible Printed Circuit) board, also known as flexible circuit board, or "soft board" for short, is a printed circuit made of a flexible insulating substrate. FPC boards provide excellent electrical performance, can meet the design needs of smaller and higher density installation, and also help reduce assembly processes and enhance reliability. The FPC board can be bent, wound, and folded freely, can be arranged arbitrarily according to the space layout requirements, and can move and expand in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC boards can greatly reduce the volume of electronic products, which is suitable for the development of electronic products in the direction of high density, miniaturization and hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H05K3/00
Inventor 郑凯
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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