38results about How to "Low surface roughness" patented technology

The metal film of the present invention is a dense film of a single crystal that has very low surface roughness and very good crystal orientation because an arithmetic mean roughness of the surface is not larger than 2 nm and a (111) peak intensity of X-ray diffraction is not less than 20 times the sum of all other peaks. Also the metal oxide film of the present invention is a dense film that includes less oxygen defects and almost no voids therein because a content of a non-oxidized metal is not higher than 1 mole % of a metal component that constitutes the metal oxide and a packing density is 0.98 or higher.

Writable-erasable surfaces prepared by a powder coating process are provided. The coatings have many desirable attributes. For example, the coatings (e.g., powder compositions) cure rapidly at elevated temperatures or under radiation, have low VOC emissions, and have reduced tendency to form ghost images, even after prolonged and repeated normal use.

A method for planarizing polysilicon comprises providing a substrate, forming a dielectric layer on the substrate, forming an amorphous silicon film on the dielectric layer, etching the amorphous silicon film to remove native oxide formed on a surface of the amorphous silicon film, exposing the surface of the amorphous silicon film to a first radiation source to polycrystallize the amorphous silicon film into a polysilicon film, etching the polysilicon film to remove weak bonded silicon formed on a surface of the polysilicon film, and exposing the surface of the polysilicon film to a second radiation source to reflow the polysilicon film.

A method for controlling the level degree on the ULSI multi-layer wiring in chamico-mechanical polishing includes such steps as diluting SiO2 hydrosol by deionized water, adding metal ion chelating agent to regulate pH=10-13, adding alcohol-ether kind of surfactant and oxidant while stirring to obtain polishing liquid, and polishing at 20-40 deg.C and 60-120 rpm under 100-250 g/sq.cm.

An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.

An image forming apparatus includes an image bearing member for carrying an electrostatic image; developing means for developing the electrostatic image with a plurality of toners having the same hue and having different densities; toner image formation means for forming on a recording material a toner image constituted by the toner having the same hue and different densities; and fixing means for fixing the toner image on the recording material, wherein a total of amounts per unit area of the toners which have the same hue and different densities and which constitute a part of the toner image, is substantially the same as a total of amounts per unit area of the toners which have the same hue and different densities and which constitute another part of the toner image having a different density.

The present invention relates to a method of preparing a positive electrode material for a lithium secondary battery including a first step of synthesizing a lithium transition metal oxide represented by Chemical Formula 1, a second step of preparing lithium transition metal oxide powder by grinding the lithium transition metal oxide, a third step of preparing a positive electrode material including an alumina coating layer by mixing as well as dispersing the lithium transition metal oxide powder in an alumina nanosol, and a fourth step of drying the positive electrode material, a positive electrode material for a lithium secondary battery prepared by the above method, and a lithium secondary battery including the positive electrode material,

Li_(1+a)(Ni_{(1−a−b−c)}Mn_bCo_c)O_n  [Chemical Formula 1]

• • where 0≦a≦0.1, 0≦b≦1, 0<c≦1, and n is an integer of 2 or 4.

The invention discloses a cathode titanium roller surface grinding and polishing technology for raw foil manufacturing, and belongs to the field of electrolytic copper foil technology preparing. The cathode titanium roller surface grinding and polishing technology comprises the following steps that firstly, preparing is conducted, a titanium roller is installed, an offline polishing and grinding machine is started, and the titanium roller runs and is flushed; secondly, grinding is conducted, the titanium roller is sequentially subjected to rough grinding, fine grinding and water grinding or the titanium roller is sequentially subjected to fine grinding and water grinding; and thirdly, polishing is conducted, the titanium roller ground in the second step is installed online, polishing is started, the polishing strength is 20%-50%, and polishing is conducted for 2-4 circles. Multifunctional and multipurpose electrolytic copper foil produced in the ground and polished cathode titanium roller electroplating process has the characteristics of being few in defect, fine in grain, low in surface roughness, high in strength, high in ductility and thinner, and is suitable for high-fineness electrolytic copper foil manufacturing.

A surface flatness measuring device and a surface flatness measuring method are disclosed. By non-contacting laser measurement, measurement precision can reach 0.001 mm so the measurement precision is high. A repetitive measurement error thereof can be controlled to be within 3 um so the measurement error is tiny, which prevent issues of low measurement precision and great measurement errors due to manual measurement in prior art. At the same time, the present invention measurement data can be automatically recorded and saved, measurement for a large batch of boards under measurement can be implemented, which prevents the issues of the conventional measurement data requiring manual recording and lacking capability of uploading the measurement data.

A magnetic recording medium having a non-magnetic support, at least one primer layer on one surface of the support, a magnetic layer on the primer layer and a back coat layer on the other surface of the non-magnetic support, in which the support has a thickness of 2 to 5 μm, the surface roughness (Ra) of the support on its surface carrying the primer layer and the magnetic layer is from 2.5 nm to 20 nm, the thickness of the primer layer is 1.5 μm or less, and the primer layer contains 2 to 30% by weight, based on the weight of all inorganic powder in the primer layer, of alumina powder having a particle size of 0.01 μm to 0.1 μm.

The invention discloses an epitaxial wafer of a light emitting diode and a manufacturing method thereof, and belongs to the technical field of photoelectrons. The manufacturing method comprises the following steps: providing a substrate; sequentially growing a buffer layer, an n-type AlGaN layer, an active layer and a p-type barrier layer on the substrate; and alternately adopting trimethyl gallium and triethyl gallium as a gallium source, and growing a p-type GaN layer on the p-type barrier layer. When trimethyl gallium serves as a gallium source for growth, the grown surface flatness is low,surface coarsening is facilitated, total reflection of light can be reduced, scattering of the light is improved, and when triethyl gallium serves as the gallium source for growth, a film formed through growth has high crystal quality, Mg doping is facilitated, the hole concentration can be improved, and the improvement of luminous efficiency is facilitated. By reducing the total reflection of light, improving the scattering of light and improving the concentration of holes, the light extraction efficiency of the deep ultraviolet light-emitting diode is improved on the whole.

The invention provides a conical powder feeding device for ultra-high-speed plasma cladding and an ultra-high-speed plasma cladding method. The conical powder feeding device comprises a central cylinder, a water-cooled inner spacer, a powder guide spacer, and a protective air spacer and a water-cooled outer spacer which are assembled to the outside from a central shaft. The entrance of the centralcylinder is axially connected with the anode of a cladding gun of a plasma cladding system; the conical powder feeding device delivers the powder to a plasma jet uniformly at a high speed, under themechanical constraint of the outlet oblique conical surface of the powder guide space, a conical powder fluid with a pre-designed angle is formed, and finally the fluid focuses on the central shaft, so as to obtain the powder jet with high concentration, high speed, uniform distribution and small divergence, and under the ultra-high-speed plasma cladding condition of above 10-200m/min relative movement speed of the plasma cladding system and a workpiece, a cladding layer with thin thickness, uniform chemical composition, low surface roughness, low dilution rate and dense microstructure can beobtained.

A polishing processing method using a CMP method for polishing a surface of a crystal material to be smooth by using a loose polishing abrasive grain type polishing pad in the presence of a polishing liquid and a plurality of polishing abrasive grains, in which the crystal material is a single crystal of GaN, and the polishing liquid is an oxidizing polishing liquid having an oxidation-reduction potential between Ehmin (determined by Eq. (1)) mV and Ehmax (determined by Eq. (2)) mV and pH between 0.1 and 6.5: Ehmin (mV)=−33.9 pH+750 . . . (1) Ehmax (mV)=−82.1 pH+1491 . . . (2).

The invention provides dry-mixed self-leveling mortar and a preparation method thereof. The glass sand in the machine-made sand is fine sand made of waste glass products, resource waste is reduced, the surface of the glass sand is modified and protected, and the glass sand has good workability in mortar. Lithium-based bentonite and sepiolite powder in the surface modifier have certain expansibility, so that the shrinkage rate of the mortar can be reduced. And the modified retarder delays the coagulation time and reduces the shrinkage phenomenon in the coagulation process. In the mortar, the effect of bonding with a base plane is also achieved, and the excellent bonding performance is achieved. A modified leveling agent is added, so that the active ingredients in the mortar are effectively prevented from being flocculated and agglomerated, the mortar can be self-leveled, meanwhile, micro-pores on the surface are sealed, the surface of the mortar is not easily polluted when encountering oil stains, and the anti-pollution capability of the surface of the mortar is improved.

The invention provides an intelligent thickness detection device of gear machining equipment and an operation method, and belongs to the technical field of gear manufacturing equipment. The problem that the thickness of an existing gear cannot be accurately calibrated under the high-precision requirement is solved. The intelligent thickness detection device of the gear machining equipment comprises a thickness detection part used for detecting whether the distance between the end faces of the two sides of a gear changes or not and two conveying parts. The two conveying parts are located at the front end and the rear end of the thickness detection part respectively and play a role in vertically aligning and conveying the gears into the thickness detection part and a role in conveying the gears subjected to thickness detection out of the thickness detection part respectively. Compared with the prior art, the intelligent thickness detection device can detect whether the thickness of the gear meets the standard or not in a full-coverage mode, and the gear with the low surface flatness is further screened out.