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3 results about "Coupling problem" patented technology

A multi-level multi-physics coupling method and system for coupling multiple programs

ActiveCN121902453BDesign optimisation/simulationSoftware reuseMultiphysics couplingClose coupling
The application discloses a kind of multilevel multi-physical coupling method and system for multiple program coupling, it is related to the field of multi-physical field coupling simulation calculation.Its system includes five hierarchical structures of coupling model module encapsulation layer, coupling problem manager encapsulation layer, coupling problem data interaction layer, coupling multilevel scene implementation layer and coupling infrastructure layer.The application can effectively solve the problems such as rigid coupling framework of existing multiple program coupling coupling technical scheme, difficult to unify coupling paradigm, lack of efficient multi-physical field coupling management, coupling decision and close coupling pedigree, poor adaptability of complex coupling scene, etc.by modularizing existing multiple program, systematizing coupling problem, standardizing coupling data interaction and hierarchical coupling management.
Owner:HUAZHONG UNIV OF SCI & TECH

Multi-level multi-physical coupling method and system for coupling multiple programs

The invention discloses a multi-level multi-physical coupling method and system for multi-program coupling, and relates to the field of multi-physical field coupling simulation calculation. The system comprises five hierarchical structures including a coupling model module packaging layer, a coupling problem manager packaging layer, a coupling problem data interaction layer, a coupling multi-level scene implementation layer and a coupling infrastructure layer. According to the invention, through modularization of existing multiple programs, systematization of coupling problems, standardization of coupling data interaction and hierarchy of coupling management, the problems that a coupling framework of an existing coupling technical scheme for coupling multiple programs is rigid, coupling normal forms are difficult to unify, efficient multi-physics field coupling management, coupling decision and tight coupling pedigree are lacked, and the coupling efficiency is low can be effectively solved. And the adaptability of complex coupling scenes is poor.
Owner:HUAZHONG UNIV OF SCI & TECH

Dual-e type variable inductance design method based on coupling index

ActiveCN115906740BBreaking through the shortcomings of qualitative analysis of magnetic couplingreduce negative impactVariable inductancesVariable transformersMagnetization curveSoftware engineering
The application discloses a double-E type variable inductance design method based on a coupling index, which comprises the following steps: 1) performing magnetic coupling analysis on the coupling problem of the main winding and the control winding of the double-E type variable inductance, and defining a coupling index reflecting the coupling degree of the double-E type variable inductance according to the analysis result; 2) designing the main winding turns according to the maximum alternating current magnetic flux density and the maximum inductance value of the double-E type variable inductance and in combination with the coupling index; 3) establishing an improved Brauer magnetization curve model, improving the accuracy of the knee point of the Brauer magnetization curve model by adopting a segmented function, determining the relationship between the minimum equivalent permeability and the maximum magnetic field strength, and designing the control winding turns in combination with the minimum inductance value; and 4) evaluating the coupling degree of the design result according to the coupling index, ensuring that the coupling degree is within an acceptable range, and completing the double-E type variable inductance design. The application solves the problem that the existing design method does not consider the winding coupling problem of the variable inductance in actual application.
Owner:SOUTH CHINA UNIV OF TECH